EFM32TG230F8-D-QFN64 - 32MHz Cortex-M3 MCU | Silicon Labs
Teilenummer: EFM32TG230F8-D-QFN64 ✓ AktivEFM32TG230F8-D-QFN64 Übersicht
A microcontroller, or MCU, is a semiconductor that integrates a processor core, memory, and peripherals into one device. The EFM32 Tiny Gecko family belongs to the 32-bit embedded-microcontroller hierarchy, combining an ARM Cortex-M3 core with low-power operating techniques, energy-saving modes, and fast wake-up behavior. These characteristics make the device particularly relevant to battery-powered sensors, compact industrial controls, portable instruments, and wearable systems where energy consumption affects service intervals.
The EFM32TG230F8-D-QFN64 includes 8 kB Flash for firmware and 2 kB RAM for working data. Its peripheral set includes two 16-bit timers and 56 digital I/O pins, providing resources for timing, signal acquisition, control outputs, and communication peripherals. The 32 MHz Cortex-M3 processor supports deterministic embedded workloads while the device’s low-power platform helps minimize active energy use between system events.
The Tiny Gecko architecture is designed around energy-sensitive operation rather than maximum processor throughput. Fast wake-up from low-energy states can reduce the time the MCU spends at higher power levels in intermittently active systems. Designers can therefore balance processing capability against duty cycle, peripheral activity, and battery capacity when establishing a system-level power budget.
Typical applications include low-power sensor nodes, industrial condition-monitoring equipment, compact motor-control interfaces, building-automation nodes, and portable measurement products. The combination of 56 digital I/O pins and two 16-bit timers is useful in designs that connect discrete sensors, indicators, switches, or actuators while avoiding a larger package.
A critical design consideration is software and firmware footprint. The 8 kB Flash and 2 kB RAM constrain the available code and data space, so applications should use a compact real-time operating system or bare-metal framework, minimize dynamic allocation, and remove unused peripheral initialization code. Firmware must also respect the device’s documented electrical and clock limits.
This product page combines manufacturer specifications, package and sourcing information, drop-in alternatives, comparison criteria, and practical design guidance. It is intended to help engineers evaluate the EFM32TG230F8-D-QFN64 against memory-graded Tiny Gecko options and plan firmware, board-layout, and power-management work before committing the device to a production design.
Drop-in-Alternativen für EFM32TG230F8-D-QFN64 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EFM32TG230F8-D-QFN64 (gleiche Bauform und Footprint) – abweichend in Architecture, Digital I/O Pins, Package, Product Type.
EFM32TG230F8-QFN64
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →EFM32TG230F16-QFN64
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →EFM32TG230F32-QFN64T
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EFM32TG230F8-D-QFN64 Grenzwerte & elektrische Eigenschaften
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| Maximum CPU Frequency | 32 MHz |
| Flash Memory | 8 kB |
| RAM | 2 kB |
| Digital I/O Pins | 56 pins |
| Timer Count | 2 timers |
| Timer Resolution | 16-bit per timer |
| Supply Voltage Range | 1.98 V to 3.8 V |
| Processor Core | ARM Cortex-M3 |
| Architecture | 32-bit |
| Series | Tiny Gecko |
| Gehäuse | 64-QFN (9 x 9 mm) |
| Montageart | Surface mount |
| Power Management Features | Energy-saving modes and fast wake-up |
| Application Profile | Energy-sensitive embedded systems |
EFM32TG230F8-D-QFN64 64-qfn (9 x 9 mm) Pinbelegungsleitfaden
Pinbelegung für EFM32TG230F8-D-QFN64 (64-qfn (9 x 9 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EFM32TG230F8-D-QFN64.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EFM32TG230F8-D-QFN64 ist geeignet für 6 Anwendungs: Battery-Powered Environmental Sensor Nodes, Industrial Condition-Monitoring Equipment, Portable Measurement Instruments, Smart Building Automation Nodes, Compact Motor-Control Interfaces, Wearable and Personal-Health Accessories.
Battery-Powered Environmental Sensor Nodes
The EFM32TG230F8-D-QFN64 fits compact environmental sensors that periodically measure temperature, humidity, gas, or motion and then sleep for extended periods. Its 32 MHz ARM Cortex-M3 core provides enough processing capability for local filtering and event handling, while the platform’s energy-saving modes and fast wake-up behavior support low-duty-cycle operation. The device operates from 1.98 V to 3.8 V, allowing use with low-energy battery rails. Its 8 kB Flash is suitable for a carefully sized bare-metal or compact RTOS application, while 2 kB RAM limits buffering and requires disciplined stack allocation.
Empfohlen
Industrial Condition-Monitoring Equipment
The EFM32TG230F8-D-QFN64 is suitable for industrial monitoring modules that collect switch, counter, or analog-related status and transmit summarized events. Its 56 digital I/O pins reduce the need for external I/O expanders in designs with multiple sensors, interlocks, and status indicators. Two 16-bit timers support periodic sampling, debouncing, or input capture without reducing the Cortex-M3 core’s 32 MHz operating speed. The 1.98 V to 3.8 V supply range supports industrial interface designs, while the compact 9 x 9 mm QFN package helps limit board area.
Empfohlen
Portable Measurement Instruments
The EFM32TG230F8-D-QFN64 can serve as the control processor in a portable meter or compact data-acquisition instrument. Its two 16-bit timers are useful for periodic sampling and elapsed-time measurement, while 56 digital I/O pins can support displays, buttons, indicators, and external interface chips. The 8 kB Flash and 2 kB RAM make code-size discipline essential, so calibration tables and buffered samples may need external memory. Fast wake-up behavior also helps a responsive instrument remain in a low-power state between operator actions or measurement intervals.
Empfohlen
Smart Building Automation Nodes
The EFM32TG230F8-D-QFN64 fits smart-building endpoints that monitor doors, occupancy controls, or simple environmental conditions and communicate summarized status over a low-power link. Its high GPIO count allows multiple digital inputs and outputs to be integrated in a small enclosure, while the 32 MHz Cortex-M3 core can handle protocol framing and local state management. Energy-saving modes are valuable in buildings where endpoint activity is intermittent. Designers should size firmware for the 8 kB Flash limit and avoid stack-heavy protocol stacks or buffering that cannot fit within 2 kB RAM.
Empfohlen
Compact Motor-Control Interfaces
The EFM32TG230F8-D-QFN64 can support compact motor or actuator-control interfaces where the application requires deterministic timing and several discrete control signals. Its two 16-bit timers can generate timing references or capture pulses, and the 56 available digital I/O pins can accommodate control inputs, status outputs, and fault signals. Because the MCU targets a 1.98 V to 3.8 V supply range, external gate drivers and level translation may be required for motors, solenoids, or isolation barriers. Firmware must include defined fault states and safe output initialization before the MCU begins controlling the load.
Empfohlen
Wearable and Personal-Health Accessories
The EFM32TG230F8-D-QFN64 can be considered for a compact wearable accessory that records simple activity or environmental events and remains active only intermittently. Its small QFN footprint preserves board area, while low-power modes and fast wake-up support responsive operation between events. The 8 kB Flash and 2 kB RAM are adequate for a focused firmware task but not a large application stack, so feature scope must be tightly controlled. For medical diagnostic equipment, qualification and regulatory requirements must be assessed separately rather than inferred from the MCU’s general-purpose feature set.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EFM32TG230F8-D-QFN64 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EFM32TG230F8-QFN64 | EFM32TG230F16-QFN64 | EFM32TG230F32-QFN64T |
|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) |
| CPU Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Flash Memory | 8 kB | 8 kB | 16 kB | 32 kB |
| Ordering Suffix | -D-QFN64 | -QFN64 | -QFN64 | -QFN64T |
Wichtigste Unterscheidungsmerkmale
- Lowest memory configuration in the compared Tiny Gecko options (vs. EFM32TG230F32-QFN64T)
- Substantial firmware expansion option within the same package family (vs. EFM32TG230F16-QFN64)
- Identical core-clock positioning across the compared family (vs. EFM32TG230F32-QFN64T)
Designhinweise
Design the 64-QFN footprint from the manufacturer package drawing and land-pattern guidance rather than from a generic QFN footprint. Confirm exposed-pad geometry, thermal-via recommendations, solder-mask limits, and whether the center pad is electrically connected. The library has no dedicated 64-QFN key, so the pinout must be assigned manually and checked pin by pin against the exact EFM32TG230 ordering code.
Follow the manufacturer’s recommended decoupling network and place the input capacitors directly between the appropriate supply and ground pins. Keep high-current return paths compact and route them independently from sensitive analog or communication traces. The stated 1.98 V to 3.8 V range is an operating constraint, not permission to use any supply network without checking startup, brownout, and all I/O voltage limits.
Do not select a memory-graded alternative until firmware impact has been reviewed. Moving from 8 kB to 16 kB or 32 kB changes available code space but may also affect startup code, device configuration, validation, and thermal behavior. Treat the different ordering suffixes as separate orderable devices and verify temperature grade, packaging format, exposed pad, and exact manufacturer part number before releasing production artwork.
Plan clock, debug, communication, and reset signals away from noisy switching nodes and preserve short return paths for high-speed or sensitive signals. Although the core operates up to 32 MHz, trace length matters when external buses, sensors, or radio interfaces are involved. Use the datasheet’s alternate-function and debug-pin guidance to prevent boot conflicts and ensure that every unused pin receives a deliberate electrical state.
Compliance-Informationen
The device specifications do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Confirm these attributes for the exact ordering code before using the component in a regulated production design.
