Intel

EP1C12F256C7 - Cyclone FPGA 12,060 LEs 256-BGA | Intel / Altera

Teilenummer: EP1C12F256C7 ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
1.5 V Vdss 256-ball FineLine BGA (FBGA-256) Package 7 Speed
Ab $46.3 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-06
Mengenpreise
Menge Stückpreis Gesamt
1 $62.11 $62,11
10 $58.5 $585,00
100 $54.2 $5.420,00
500 $49.75 $24.875,00
1.000 $46.3 $46.300,00
ℹ️ Alle Preise sind in USD

EP1C12F256C7 Übersicht

The Intel (formerly Altera) EP1C12F256C7 is a member of the Cyclone FPGA family built on a 130 nm process, delivering 12,060 logic elements, 239,616 RAM bits, and 185 user I/O in a 256-ball FineLine BGA package. It targets cost-sensitive, high-volume applications where programmable logic is needed without the power and price of high-end FPGAs. The device supports up to 12060 logic cells with embedded multipliers and a PLL-based clock network.

An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined by user-supplied configuration data rather than fixed at the factory. Within the broader semiconductor hierarchy, an FPGA belongs to programmable logic devices (PLD), alongside CPLDs and programmable SoCs. FPGAs bridge the gap between fixed-function ASICs and software-defined microcontrollers, providing hardware-level parallelism with user-reconfigurable interconnect, lookup tables, block RAM, and dedicated DSP/PLL blocks.

Key features include 12,060 logic elements organized into 1,206 logic array blocks (LABs), 239,616 bits of embedded RAM (M4K blocks of 4 Kbits each plus 512-bit M512 blocks), two PLLs for clock management, and 185 user I/O pins distributed across four I/O banks. The device operates from a 1.5 V core supply with 3.3 V-tolerant I/O and supports common LVCMOS, LVTTL, SSTL, and LVDS signaling standards via per-pin configuration. Configuration is loaded through passive serial (PS), active serial (AS), or JTAG modes.

The Cyclone architecture pairs a 4-input lookup table (LUT) in each logic element with a small register file and a dedicated carry chain for arithmetic. Embedded multiplier blocks accelerate DSP tasks such as FIR filters and FFT butterflies without consuming general-purpose logic. Distributed and block RAM resources let designers implement FIFOs, shift registers, and dual-port memories directly on-chip, while the two PLLs handle frequency synthesis, phase shifting, and duty-cycle correction.

Typical applications include industrial control and factory automation interfaces, video processing and display controllers, communications glue logic, low-cost video surveillance DVRs, and ASIC prototyping. The Cyclone family is also widely used in educational platforms and evaluation kits such as the Altera Cyclone development board.

When designing with this part, pay attention to power-supply sequencing (1.5 V VCCINT must ramp before or with VCCIO), I/O bank voltage grouping, and proper decoupling. A JTAG header is strongly recommended for in-system programming and boundary-scan test. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.

Drop-in-Alternativen für EP1C12F256C7 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit EP1C12F256C7 (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Family, Speed Grade, Operating Temperature.

Intel
Package: 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch)
Process Technology: 130 nm SRAM, 1.5 V core
Speed Grade: C6 (mid-tier)
Vergleichen mit EP1C12F256C7 →
Altera
Package: 256-ball FineLine BGA (17 mm x 17 mm)
Process Technology: 0.13 µm SRAM
Family: Cyclone FPGA
Vergleichen mit EP1C12F256C7 →
Intel
Package: 256-ball FBGA (F256)
Process Technology: 0.13 µm SRAM
Family: Cyclone®
Vergleichen mit EP1C12F256C7 →
Altera
Package: 256-FBGA (F256), 17 x 17 mm, 1.0 mm pitch
Process Technology: 130 nm CMOS
Family: Cyclone
Vergleichen mit EP1C12F256C7 →
Intel
Process Technology: 130 nm SRAM
Family: Cyclone I
Operating Temperature: 0°C to +85°C (commercial grade)
Vergleichen mit EP1C12F256C7 →
Altera
Package: 256-ball FBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Process Technology: 0.13-µm, all-layer copper SRAM
Family: Cyclone I
Vergleichen mit EP1C12F256C7 →
Intel
Package: 256-ball FBGA (FineLine BGA)
Family: Cyclone (1st generation)
Vergleichen mit EP1C12F256C7 →
Intel
Package: 256-BGA FineLine
Process Technology: 0.13 μm SRAM-based
Family: Cyclone (EP1C12)
Vergleichen mit EP1C12F256C7 →
Altera
Package: 256-ball FineLine BGA (FBGA)
Process Technology: 130 nm SRAM
Family: Cyclone I
Vergleichen mit EP1C12F256C7 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

EP1C12F256C7N

✅ Drop-In
Altera
📦 256-FBGA
Cyclone · Cyclone I · 12060 · 12060 · 239616 · 185 · 1206 · 52

✓ Auf Lager

$27.95 / Stück

Datenblatt ansehen →

EP1C12F256C6

✅ Drop-In
Intel
📦 256-FBGA
Cyclone I · 12,060 · 1,206 · 239,616 bits (52 M4K blocks) · 17 · 185 · 2 · 130 nm SRAM, 1.5 V core

✓ Auf Lager

$48.29 / Stück

Datenblatt ansehen →

EP1C12F256C6N

✅ Drop-In
Intel
📦 256-FBGA
Cyclone® · 12,060 · 1,206 · 239,616 bits · 52 · Yes · 2 · 185

✓ Auf Lager

$51.9 / Stück

Datenblatt ansehen →

EP1C12F256C6AA

✅ Drop-In
Altera
📦 256-FBGA
Cyclone · Cyclone FPGA · 12,060 · 239,616 · 185 · 2

✓ Auf Lager

$21.4 / Stück

Datenblatt ansehen →

EP1C12F256I7

✅ Drop-In
Intel
📦 256-FBGA
Cyclone (1st generation) · 12,060 · 1,206 · 239,616 · M4K (4,608 bits each) · 2 · 185 · 130 nm

✓ Auf Lager

$49.95 / Stück

Datenblatt ansehen →

EP1C12F256I7N

✅ Drop-In
Intel
📦 256-FBGA
Cyclone (EP1C12) · 12,060 · 239,616 · 52 (128 x 36 bits each) · 185 · 2 · 256-BGA FineLine · -40°C to +100°C (industrial)

✓ Auf Lager

$47.85 / Stück

Datenblatt ansehen →

EP1C12F256C7 Grenzwerte & elektrische Eigenschaften

Series Cyclone
Family Cyclone I (EP1C12)
Logic Elements (LEs) 12,060
Logic Array Blocks (LABs) 1,206
Total RAM Bits 239,616
Embedded Multipliers (18x18) 52
User I/O Pins 185
Number of I/O Banks 4
PLLs 2
Process Technology 130 nm
Core Voltage (VCCINT) 1.5 V
I/O Voltage (VCCIO) 1.5 V to 3.3 V (bank-dependent)
Gehäuse 256-ball FineLine BGA (FBGA-256)
Montageart Surface Mount
Betriebstemperatur 0C to +85C (Commercial, 'C' suffix)
Speed Grade 7
Configuration Mode PS / AS / JTAG

EP1C12F256C7 256-ball fineline bga (fbga-256) Pinbelegungsleitfaden

Pinbelegung für EP1C12F256C7 (256-ball fineline bga (fbga-256)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für EP1C12F256C7 im 256-ball fineline bga (fbga-256)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für EP1C12F256C7.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

EP1C12F256C7 ist geeignet für 7 Anwendungs: Industrial Control and Factory Automation, Video Processing and Display Controllers, ASIC Prototyping and Emulation, Communications Glue Logic and Protocol Bridging, Low-Cost Video Surveillance DVR, Educational and Development Platforms, Medical Device Interface and Signal Conditioning.

🔧

Industrial Control and Factory Automation

The EP1C12F256C7's 12,060 logic elements and 185 user I/O make it a strong fit for industrial controllers that aggregate multiple fieldbuses, sensor arrays, and actuator drivers on a single board. Its four I/O banks support mixed voltage standards (LVTTL 3.3 V, LVCMOS 1.8 V/2.5 V, SSTL) so it can interface directly to legacy 5 V-tolerant buffers, modern 1.8 V PHYs, and DDR memory without external level shifters. With 52 dedicated 18x18 multipliers and 239,616 RAM bits, it can host real-time control loops (PID, state machines) and small FFT-based vibration analysis in parallel, while the two PLLs synthesize jitter-clean clocks for industrial Ethernet MACs. Use it between a 24 V-to-1.5 V regulator pair and your I/O connectors, and place a JTAG header for in-system programming.

📺

Video Processing and Display Controllers

The EP1C12F256C7 is widely deployed in low-cost video pipelines (DVRs, multi-viewer boards, kiosks) where 12,060 LEs are enough to implement de-interlacers, scalers, and on-screen-display compositors in hardware. Its 52 hardware multipliers accelerate 2D FIR filtering and motion-compensation steps at common SD/HD pixel rates, while the 239,616 RAM bits provide line buffers and frame-staging memory without external SRAM. Four I/O banks make it straightforward to receive LVDS or CMOS camera input on one bank, drive an LVDS display panel on another, and hold DDR SDRAM on the third. Use the two PLLs to derive independent video pixel clocks from a single 27 MHz reference oscillator.

🖥️

ASIC Prototyping and Emulation

Designers use the EP1C12F256C7 as a low-cost prototyping vehicle for ASIC RTL blocks, glue logic, and bus bridges. 12,060 LEs hold approximately 60-100K gates of netlist depending on mapping efficiency, and the abundant M4K RAM blocks (4 Kbit each) are useful for register-file and FIFO models. JTAG configuration and Quartus II in-system debugging let engineers iterate RTL rapidly. The 256-FBGA package is easy to fan-out onto a multi-FPGA emulation board, and the 130 nm Cyclone I architecture is well documented with stable timing models for sign-off correlation against ASIC libraries.

🌐

Communications Glue Logic and Protocol Bridging

The EP1C12F256C7 excels as a low-latency bridge between legacy parallel buses, UART/SPI/I2C peripherals, and modern high-speed serializers. Its 185 user I/O accommodate wide data buses plus numerous sideband signals, and its 4-input LUTs implement fast protocol state machines that run at hundreds of MHz in Cyclone I's 130 nm process. Designers routinely instantiate it as a glue-logic companion to ASSPs and ASICs, offloading glue that does not justify another dedicated IC. The two PLLs provide independent clock domains for asynchronous bridges, and 239,616 RAM bits are sufficient for moderate FIFOs between clock domains.

🎥

Low-Cost Video Surveillance DVR

The EP1C12F256C7 is a proven building block in cost-optimized DVR boards that capture multiple analog camera channels, perform motion detection in hardware, and stream H.264 to storage. 52 dedicated 18x18 multipliers run motion-estimation kernels in parallel, and the 256-FBGA's 185 user I/O support several video decoder outputs (BT.656) plus SATA, Ethernet, and USB host interfaces. The Cyclone I architecture's low static power (~150 mW core) and small 17x17 mm FBGA footprint suit fanless enclosures. Industrial variants (EP1C12F256I7) extend operation to outdoor cabinet temperatures.

🎓

Educational and Development Platforms

The Cyclone I family - including EP1C12F256C7 - powered the original Altera Cyclone development kit and numerous university digital-logic courses, so mature lab examples, reference designs, and Quartus II tutorials are widely available. 12,060 LEs is generous for student projects yet small enough that compile times stay under a minute on legacy laptops. The 256-FBGA breaks out to standard 0.1-inch headers on daughter cards, and the JTAG interface works with the affordable Altera USB-Blaster. New designs in education are increasingly migrating to Cyclone IV E (EP4CE) and Cyclone V boards, but Cyclone I remains common in legacy lab kits.

💊

Medical Device Interface and Signal Conditioning

The EP1C12F256C7 is found in medical instrumentation front-ends where it aggregates multiple ADC/DAC channels, performs digital filtering, and bridges to a host processor over SPI or USB. Its 52 hardware multipliers accelerate FIR/IIR filter implementations for ECG, pulse-oximeter, and patient-monitoring front-ends, while 239,616 RAM bits hold rolling sample buffers. Four I/O banks accept a mix of LVCMOS 3.3 V digital signals from sensors and 2.5 V signals from precision ADCs without level shifters. The 256-FBGA package allows compact board layouts that suit portable, battery-powered medical devices, although medical IEC 60601 qualification typically requires the industrial temperature variant.

Zusammenfassung der empfohlenen Produkte

EPCQ32SI8N Active serial configuration EEPROM for Cyclone I Verwendet in: Industrial Control and Factory Automation EP4CE6E22C8N Intel Verwendet in: Industrial Control and Factory Automation MT48LC16M16A2 SDRAM for video line/frame buffering Verwendet in: Video Processing and Display Controllers ADV7180 Video decoder for composite/HDMI capture Verwendet in: Video Processing and Display Controllers EPCS4SI8 Quad-serial configuration memory for prototype bitstreams Verwendet in: ASIC Prototyping and Emulation EP1C6Q240C8N Altera Verwendet in: ASIC Prototyping and Emulation, Educational and Development Platforms MAX3232 RS-232 line driver often paired with EP1C12 designs Verwendet in: Communications Glue Logic and Protocol Bridging FT232HL FTDI Verwendet in: Communications Glue Logic and Protocol Bridging TW2866 4-channel video decoder for surveillance capture Verwendet in: Low-Cost Video Surveillance DVR 88E1111 Marvell Verwendet in: Low-Cost Video Surveillance DVR EPCS16SI8N Altera Verwendet in: Educational and Development Platforms ADS1298 Low-noise 24-bit ADC for bio-signal acquisition Verwendet in: Medical Device Interface and Signal Conditioning EP1C12F256I7 Intel Verwendet in: Medical Device Interface and Signal Conditioning
What is the operating temperature range of EP1C12F256C7?
The EP1C12F256C7 is rated for commercial-grade operation from 0C to +85C, as indicated by the 'C' in its part number. According to the Cyclone family datasheet, the 'C' suffix denotes commercial temperature while 'I' denotes industrial (-40C to +100C). The '7' is a speed-grade designator indicating internal timing constraints for this member of the Cyclone I family.
How many logic elements and LABs does EP1C12F256C7 have?
The EP1C12F256C7 contains 12,060 logic elements (LEs) organized into 1,206 logic array blocks (LABs). Each LAB contains 10 LEs, each built around a 4-input LUT plus a programmable register. The device also provides 239,616 bits of embedded RAM distributed across M4K and M512 memory blocks, plus 52 dedicated 18x18 hardware multipliers for DSP tasks.
What is the difference between EP1C12F256C7 and EP1C12F256C7N?
The EP1C12F256C7 and EP1C12F256C7N share the same Cyclone I die, 12,060 LEs, 185 user I/O, and 256-FBGA package. According to distributor comparison data, the difference lies in lead-free / RoHS compliance - the 'N' suffix typically denotes lead-free terminal finish. Electrically and pin-for-pin they are drop-in compatible on the same PCB footprint.
Can EP1C12F256C7 be replaced by EP1C12F256C6 or C8?
Yes - the EP1C12F256C6, EP1C12F256C7, and EP1C12F256C8 share the same die and 256-FBGA footprint, differing only in speed grade (C6 = slowest, C7 = mid, C8 = fastest internal timing). They are pin-compatible drop-in alternatives. The 'N' suffix variants add lead-free finish but otherwise match electrically.
What configuration modes does EP1C12F256C7 support?
The EP1C12F256C7 supports passive serial (PS), active serial (AS), and JTAG configuration. PS mode uses an external configuration device or download cable, AS mode auto-loads from a serial configuration EEPROM, and JTAG enables in-system programming and boundary-scan test (IEEE 1149.1). Configuration data is 3.5 Mbits for a fully loaded EP1C12.
Where to buy EP1C12F256C7 online?
EP1C12F256C7 is available from authorized distributors including DigiKey, Mouser, Octopart-listed vendors, and broker inventories as of 2026-09-06. Pricing observed on Heisener shows a unit price of $62.11 for qty 1. Note that the part is marked obsolete on the Intel/Altera Cyclone I product family, so authorized-stock quantities may be limited and lead times variable.
What is the price of EP1C12F256C7 in 100-piece quantity?
At a quantity of 100 pieces, EP1C12F256C7 unit pricing is around $54.20 as of 2026-09-06 per distributor list data. At qty 500 and qty 1000 the unit price drops further to approximately $49.75 and $46.30 respectively. Because the device is end-of-life, prices can fluctuate sharply with remaining authorized-channel stock and broker supply.
What is the lead time for EP1C12F256C7?
Lead time for EP1C12F256C7 is to be confirmed per distributor listing on 2026-09-06. Heisener shows 'Can Ship Immediately' for some stock, while Intel-direct channels show 'To be Confirmed'. Because the Cyclone I family is obsolete, new production lots are not available and supply depends on remaining authorized and broker inventory, which can deplete rapidly.
EP1C12F256C7 vs EP1C12F324C7 - which is better for higher I/O count?
Choose EP1C12F324C7 if your design needs more than 185 user I/O. The EP1C12F324C7 is the same 12,060-LE Cyclone I die but in a larger 324-FBGA package with 249 user I/O pins. Both share identical logic, RAM, multiplier, and PLL resources; only the package, I/O count, and PCB land pattern differ. For designs with <=185 I/O the 256-FBGA EP1C12F256 saves PCB area and cost.
Is EP1C12F256C7 suitable for new industrial designs in 2026?
The EP1C12F256C7 is classified obsolete on the Intel product page, so it is not recommended for new designs starting in 2026. Long-term availability is not guaranteed, and PCN/EOL notifications have been issued. For new designs, migrate to Cyclone IV E (EP4CE-series) or Cyclone V E (5CE-series) FPGAs, which offer better power, higher logic density, modern IP, and active product longevity.
What is the best drop-in replacement for EP1C12F256C7?
The best drop-in replacements for EP1C12F256C7 are EP1C12F256C6 (slower speed grade, same 256-FBGA) and EP1C12F256C7N (lead-free variant). Both share the identical 12,060-LE die, 185 user I/O, and 256-ball FBGA footprint, so they solder onto the same PCB land pattern. The 'N' suffix is preferred when RoHS compliance is required.
Is EP1C12F256C7 the same as EP1C12F256I7?
No. EP1C12F256C7 (commercial, 0C to +85C) and EP1C12F256I7 (industrial, -40C to +100C) differ in operating temperature range. Both share the same 12,060-LE die, 256-FBGA package, and 185 user I/O. The industrial 'I' variant is the drop-in choice when the design must operate in extended-temperature environments.
Where to download EP1C12F256C7 datasheet PDF?
The official Cyclone family datasheet covering EP1C12F256C7 is available from Intel's Cyclone documentation archive. A third-party mirror PDF is hosted on Alldatasheet at https://www.alldatasheet.com/datasheet-pdf/pdf/131438/ALTERA/EP1C12F256C7.html. Designers should also pull the Cyclone I device handbook, pin-out file, and Quartus II device support files to compile bitstreams for this device.
Where to find EP1C12F256C7 pinout and BGA ball map?
The pinout and BGA ball map for EP1C12F256C7 are in the Cyclone I Device Handbook, the EP1C12F256 pin information file, and the Quartus II pin planner. The 256-ball FineLine BGA uses a 1.0 mm ball pitch with JTAG, configuration, clock, power, and 185 user I/O balls distributed across four I/O banks. Refer to the Intel/Altera Cyclone I datasheet for the complete signal map.
What are the key specifications of EP1C12F256C7 that engineers should know?
Engineers evaluating EP1C12F256C7 should know these headline numbers: 12,060 logic elements, 1,206 LABs, 239,616 RAM bits, 52 18x18 hardware multipliers, two PLLs, 185 user I/O, four I/O banks, 1.5 V core supply, 1.5-3.3 V I/O, 130 nm process, 256-ball FBGA at 1.0 mm pitch, commercial 0C-85C operation, and speed grade 7. The Cyclone I family is now classified obsolete by Intel.

Technische Referenzdaten für EP1C12F256C7 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose EP1C12F256C7 when you need a proven, well-documented Cyclone I FPGA with 12,060 LEs, 185 user I/O, and 256-FBGA in commercial temperature grade. Prefer EP1C12F256C7N if RoHS compliance is required - it is the lead-free drop-in on the same PCB footprint. If the design must operate below 0C or above +85C, switch to EP1C12F256I7 (industrial, -40C to +100C) without changing the PCB. When C7 stock is constrained, EP1C12F256C6 is a same-die drop-in alternative with one speed bin lower internal timing. For all new designs in 2026, however, prefer Cyclone IV E (EP4CE-series) or Cyclone V E (5CE-series) FPGAs: the Cyclone I family is obsolete and Intel no longer manufactures new lots.

Vergleich mit Alternativen

Parameter Dieses Produkt EP1C12F256C7N EP1C12F256C6 EP1C12F256C6N EP1C12F256C6AA EP1C12F256I7 EP1C12F256I7N
Package 256-FBGA (1.0 mm pitch) 256-FBGA - same 256-FBGA - same 256-FBGA - same 256-FBGA - same 256-FBGA - same 256-FBGA - same
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel Intel
Logic Elements 12,060 12,060 12,060 12,060 12,060 12,060 12,060
User I/O 185 185 185 185 185 185 185
Speed Grade 7 (mid) 7 6 (slower) 6 (slower) 6 (slower) 7 7
Operating Temperature 0C to +85C (Commercial) 0C to +85C 0C to +85C 0C to +85C 0C to +85C -40C to +100C (Industrial) -40C to +100C (Industrial)
Total RAM Bits 239,616 239,616 239,616 239,616 239,616 239,616 239,616
Embedded 18x18 Multipliers 52 52 52 52 52 52 52
PLLs 2 2 2 2 2 2 2
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Wichtigste Unterscheidungsmerkmale

  • Drop-in lead-free variant on the same 256-FBGA footprint (vs. EP1C12F256C7 (non-N))
  • Same die, lower speed grade when C7 stock is constrained (vs. EP1C12F256C7)
  • Industrial-temperature variant for harsh environments (vs. EP1C12F256C7 (commercial))

Designhinweise

The EP1C12F256C7 requires a 1.5 V VCCINT core supply and per-bank VCCIO rails that can be set independently from 1.5 V to 3.3 V. VCCINT must ramp up before or simultaneously with any VCCIO bank; reverse sequencing risks I/O latch-up. Use a dedicated LDO per VCCINT rail (a TI TPS7A4701 or equivalent) with at least 100 uF of bulk + 0.1 uF + 1 uF ceramic decoupling placed within 5 mm of the BGA balls. Estimated: at 100% utilization with all 12,060 LEs toggling, core current can exceed 1.5 A, so design the 1.5 V rail for 2 A headroom.

The 256-FineLine BGA uses a 1.0 mm ball pitch, which is compatible with conventional 0.4 mm-via PCB processes (4 mil laser vias, microvias OK on inner layers). Use a 4+ layer stack-up with continuous GND and 1.5 V power planes directly under the BGA; never route signal traces under the package. Place a 4-pin JTAG header (TCK, TMS, TDI, TDO + GND/VCC) on the same board edge for the Altera USB-Blaster. Match all four clock PLL inputs with 50 ohm controlled-impedance traces and series-termination at the FPGA pin.

Do not use legacy Quartus versions older than 13.0 for Cyclone I timing closure - the device support files were dropped after Quartus II v13.1. When migrating an EP1C12 design to a Cyclone IV E (EP4CE22F17) for new production, recompile the bitstream because I/O bank voltages and LVDS signaling differ between families. Always assert CONF_DONE and nSTATUS with pull-ups on the board; leaving nSTATUS floating causes intermittent configuration failures. Estimated: configuration bitstream size for a fully utilized EP1C12 is ~3.5 Mbits, requiring an EPCS16 (16 Mbit) configuration EEPROM at minimum.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

EP1C12F256C7 is an obsolete Cyclone I family member manufactured by Altera (now Intel). The 'N' suffix variants (e.g. EP1C12F256C7N) are the lead-free RoHS-compliant options sharing the same die. Non-N variants are likely SnPb or non-RoHS - confirmed RoHS status not provided in the verified web data and is marked [DATA_NEEDED] in specs.

Daten verifiziert am: 2026-09-06 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

Intel Altera EP1C12F256C7 EP1C12F256C7N EP1C12F256C6 EP1C12F256I7 Cyclone Cyclone I FPGA Field-Programmable Gate Array Programmable Logic Device PLD FineLine BGA FBGA 256-ball BGA Logic Element Logic Array Block LAB M4K RAM block hardware multiplier Phase-Locked Loop PLL 130 nm process node 1.5 V core voltage JTAG IEEE 1149.1 Altera USB-Blaster Quartus II EPCS configuration memory LVCMOS LVTTL SSTL LVDS RoHS lead-free AEC-Q100 industrial temperature grade commercial temperature grade
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