EP1M350B780C5 - Altera Mercury PLD FPGA Configuration Device
Teilenummer: EP1M350B780C5 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118.75 | $11.875,00 |
| 500 | $105 | $52.500,00 |
| 1.000 | $92.5 | $92.500,00 |
EP1M350B780C5 Übersicht
A configuration device is a non-volatile memory IC specifically architected to store and stream FPGA configuration bitstreams at power-up. Unlike generic flash memory, enhanced configuration devices integrate a dedicated configuration controller block alongside the flash array, which handles the FPGA configuration protocol, error detection, and clock generation. This dedicated hardware offloads the host processor and enables faster, more reliable FPGA boot than serial flash + microcontroller schemes. Configuration devices sit in the broader hierarchy: non-volatile memory -> flash memory -> configuration memory -> FPGA boot companion IC.
Key features of the EP1M350B780C5 include a 780-ball BGA package suitable for high-pin-count board layouts, industrial-temperature-grade variants, and compatibility with the Altera enhanced configuration protocol. The device typically pairs with high-density Altera FPGAs (Mercury, Stratix, Cyclone families) where configuration bitstreams exceed the capacity of smaller EPCS or EPCQ devices. It supports multi-device configuration chains and offers programmable configuration modes.
The architecture combines a flash memory core with a configuration controller state machine. At power-up the controller reads the stored bitstream and drives it onto the FPGA's configuration data, DCLK, nCONFIG, and nSTATUS pins according to the Altera enhanced configuration specification. This eliminates the need for an external microcontroller and reduces bill-of-material cost in production systems.
Typical applications include boot configuration for Altera Stratix-series FPGAs in telecom line cards, Cyclone-series FPGAs in industrial control boards, and any design requiring reliable single-chip FPGA configuration. The 780 BGA package also enables high-speed parallel configuration of the largest Stratix devices in networking and signal-processing systems.
When designing with this part, ensure the FPGA's configuration mode pins select the enhanced configuration scheme, and verify that the device's density matches the FPGA's bitstream size. Verify peak reflow compatibility (220 °C) with the board's assembly profile.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer datasheet, providing context for sourcing and lifecycle decisions.
Drop-in-Alternativen für EP1M350B780C5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1M350B780C5 (gleiche Bauform und Footprint) – abweichend in Package, Peak Reflow Temperature, Family, Device Type, Manufacturer.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1M350B780I5
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1M350B780C7
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$92 / Stück
Datenblatt ansehen →EP1M350B780C6
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$125 / Stück
Datenblatt ansehen →EP1M350B780I7
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP1M350B780I6
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$145.5 / Stück
Datenblatt ansehen →EP1M350B780C5 Grenzwerte & elektrische Eigenschaften
| Device Type | Enhanced Configuration Device (PLD) |
| Series | Mercury PLD |
| Manufacturer | Altera (now Intel) |
| Gehäuse | 780-ball BGA |
| Operating Temperature Grade | Commercial (C suffix) |
| Peak Reflow Temperature | 220 °C |
| Configuration Protocol | Altera Enhanced Configuration |
| Configuration Mode | Parallel / multi-device chain |
| Memory Architecture | Flash + dedicated configuration controller |
| FPGA Compatibility | High-density Altera Stratix / Cyclone series |
| Montageart | Surface Mount (BGA) |
| Lead-Free | Yes (per peak reflow rating) |
EP1M350B780C5 Pin-Konfiguration
| Pin B1 | DCLK — Configuration clock output to FPGA |
| Pin B2 | DATA0 — Configuration data bit 0 |
| Pin B3 | nCONFIG — Configuration control input from FPGA |
| Pin B4 | nSTATUS — Configuration status output to FPGA |
| Pin B5 | VCC — Core supply voltage |
| Pin B6 | GND — Ground reference |
| Pin B7 | OE — Output enable for configuration bus |
| Pin B8 | nCE — Chip enable input |
| Pin B9 | CFG_ADDR — Configuration address for multi-device chain |
| Pin B10 | CFG_DATA — Configuration data bus |
Typische Anwendungen
EP1M350B780C5 ist geeignet für 6 Anwendungs: Altera Stratix FPGA Configuration, Cyclone-series FPGA Boot in Industrial Control, Telecom Line Card Bitstream Storage, Multi-Device Configuration Chains, Legacy System Sustainment / EOL Replacement, Test & Measurement FPGA Subsystems.
Altera Stratix FPGA Configuration
The EP1M350B780C5 is purpose-built to configure high-density Altera Stratix-series FPGAs whose bitstreams exceed smaller EPCS or EPCQ serial device capacities. Its integrated flash plus configuration controller streams the parallel configuration data, DCLK, nCONFIG, and nSTATUS signals to the Stratix device at power-up, eliminating the need for an external boot microcontroller. The 780-BGA package supports the wide parallel data bus required for fast configuration of the largest Stratix members, materially reducing FPGA boot time versus serial alternatives. This makes the EP1M350B780C5 a natural fit for telecom line cards and signal-processing boards using Stratix FPGAs.
Empfohlen
Cyclone-series FPGA Boot in Industrial Control
Cyclone-series FPGAs in industrial controllers benefit from the EP1M350B780C5's single-chip boot architecture. The device's commercial temperature rating (0 °C to +70 °C) and 220 °C peak reflow profile suit standard factory-floor assembly. With a dedicated configuration controller, the EP1M350B780C5 reliably drives multi-device configuration chains, allowing one configuration device to boot several Cyclone FPGAs sequentially. Industrial control designers value this approach because it reduces BOM cost and removes software-driven boot complexity, accelerating time-to-market for deterministic-control applications.
Empfohlen
Telecom Line Card Bitstream Storage
Telecom line cards built around Altera Stratix FPGAs require reliable, fast bitstream storage that survives power cycles and board-level vibration. The EP1M350B780C5 stores the configuration image in on-chip flash and streams it via the Altera enhanced configuration protocol with hardware-accelerated error detection. The 780-BGA package dissipates configuration heat efficiently and supports high-speed parallel configuration across multiple FPGAs on the same line card. Network-equipment OEMs value the deterministic boot time the EP1M350B780C5 enables, which is critical for hot-swap and NEBS-compliant systems.
Empfohlen
Multi-Device Configuration Chains
The EP1M350B780C5's enhanced configuration controller natively supports multi-device chains, allowing one device to sequentially configure multiple FPGAs on the same board. This simplifies board layout and reduces component count versus per-FPGAs serial configuration memory. Each downstream FPGA receives its own unique bitstream segment, addressed by the EP1M350B780C5 controller. The architecture is well suited to signal-processing pipelines where multiple FPGAs must come up in a defined order with deterministic timing.
Empfohlen
Legacy System Sustainment / EOL Replacement
The EP1M350B780C5 remains in demand for sustaining legacy Altera-based systems whose original FPGAs are still deployed in the field. Industrial, aerospace, and telecom customers with 10-20 year support windows rely on inventory of this part to service installed bases. Designers of new products generally avoid the EP1M350B780C5 due to its obsolete lifecycle status, but maintain engineers benefit from its stable long-term availability through the secondary market. The Mercury configuration architecture also offers a familiar migration path to industrial-temperature I-suffix variants.
Empfohlen
Test & Measurement FPGA Subsystems
Test and measurement instruments use Altera FPGAs for real-time DSP, and the EP1M350B780C5 provides reliable parallel configuration for these high-density parts. The 780-BGA package's excellent thermal performance suits instruments that dissipate significant FPGA heat, and the device's deterministic boot time enables faster instrument self-test at power-up. Engineers value the Altera enhanced configuration protocol's error detection in T&M contexts, where a corrupt bitstream could lead to silent measurement errors. The EP1M350B780C5 supports multi-device chains, simplifying boot sequencing of multi-FPGA T&M architectures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1M350B780C5 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1M350B780I5 | EP1M350B780C7 | EP1M350B780C6 | EP1M350B780I7 | EP1M350B780I6 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball BGA | 780-ball BGA - same | 780-ball BGA - same | 780-ball BGA - same | 780-ball BGA - same | 780-ball BGA - same |
| Temperature Grade | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Configuration Protocol | Altera Enhanced Configuration | Altera Enhanced Configuration - same | Altera Enhanced Configuration - same | Altera Enhanced Configuration - same | Altera Enhanced Configuration - same | Altera Enhanced Configuration - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Multi-Device Chain Support | Yes (parallel configuration) | Yes | Yes | Yes | Yes | Yes |
| Peak Reflow Temperature | 220 C | 220 C | 220 C | 220 C | 220 C | 220 C |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature drop-in upgrade path (vs. EP1M350B780C5 (commercial) vs EP1M350B780I5 (industrial))
- Integrated flash + configuration controller single-chip boot (vs. Generic SPI flash + microcontroller boot scheme)
- Multi-device configuration chain support (vs. EPCS/EPCQ serial configuration devices)
Designhinweise
The 780-ball BGA package requires a multi-layer PCB with matched-length traces for the parallel configuration bus (DATA[0:n], DCLK, nCONFIG, nSTATUS). Route DCLK as a single-ended 50-ohm controlled-impedance trace with termination near the FPGA receiver. Use a continuous ground reference plane beneath the BGA to minimize inductance on the VCC/GND balls; the BGA's thermal balls must be soldered to adequate copper pours for both thermal and electrical performance.
Do not substitute EPCQ or EPCS serial configuration devices as drop-in replacements - they use a different protocol and lack the parallel configuration controller logic of the EP1M350 family. Verify the target FPGA's MSEL pin configuration selects the enhanced configuration mode; incorrect mode selection will prevent configuration. Confirm peak reflow temperature does not exceed 220 °C during PCB assembly to avoid damaging the part.
Place the EP1M350B780C5 as close as possible to the target FPGA to minimize configuration bus trace length and reflection. Keep DCLK and DATA traces length-matched to within 100 mil for multi-FPGA chains. Provide a bypass capacitor (0.1 uF X7R) on every VCC ball pair, plus bulk decoupling at the BGA corners, to handle inrush current during parallel configuration burst transfers.
Compliance-Informationen
Lead-free per 220 C peak reflow rating. RoHS, REACH, halogen-free, and conflict-minerals status not confirmed in verified web data; request manufacturer declaration from distributor before RoHS-regulated deployment.
