EP2A40F672I7N - APEX II FPGA 1.5M Gates 562MHz 672-FBGA | Intel
Teilenummer: EP2A40F672I7N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268 | $2.680,00 |
| 100 | $245 | $24.500,00 |
| 500 | $220 | $110.000,00 |
| 1.000 | $198 | $198.000,00 |
EP2A40F672I7N Übersicht
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the high integration of an ASIC with the flexibility of post-manufacture reprogrammability. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. APEX II is Intel's (formerly Altera's) high-performance, multi-volt family targeting datapath-intensive applications such as communications infrastructure, video processing, and custom ASIC prototyping. A 562 MHz internal frequency enables sustained DSP and bus-interface throughput in mid-2000s generation telecom and imaging designs.
Key features include 1.5 M system gates, 38,400 logic cells, 16 macrocells, 32 product terms per macrocell, and a 1.55 ns propagation delay (per PLA-mode characterization). The device supports in-system programmability via JTAG and configuration via passive serial, passive parallel, or synchronous modes. Multi-voltage I/O banks permit interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic without external level translation. Embedded block RAM and dedicated carry chains support arithmetic-intensive datapaths.
The APEX II architecture combines Look-Up Table (LUT)-based logic elements with a hierarchical routing fabric and embedded array blocks, delivering a balance of fine-grained logic and block-level memory. The 0.15 µm process and 1.5 V core supply reduce dynamic power versus the original 0.18 µm APEX family, while the 672-pin FC-FBGA package provides controlled-impedance signal integrity for high-speed I/O. The 'I7N' suffix denotes industrial temperature grade (-40 °C to +85 °C) and lead-free / Pb-free assembly.
Typical applications include telecommunications infrastructure (SONET/SDH framers, ATM switches, baseband processing), video and image processing (broadcast codecs, motion estimation), high-speed datapath bridging (PCI-to-PCI bridges, custom bus interfaces), and ASIC prototyping. The 1.5 M gate capacity supports designs that would otherwise require an entry-level ASIC, while preserving design revision flexibility.
When designing with this device, plan power sequencing carefully: 1.5 V core must ramp before I/O banks. Use the JTAG interface for boundary-scan test and in-field firmware updates. Decoupling requires at least 22 low-ESR 0.1 µF capacitors placed close to the package, with bulk capacitance at the regulator outputs.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same APEX II family, and practical design considerations not consolidated in the manufacturer datasheet, giving procurement and engineering teams a single source for sourcing decisions.
Drop-in-Alternativen für EP2A40F672I7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2A40F672I7N (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Process Technology, Operating Temperature, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2A40F672I9N
✅ Drop-In✓ Auf Lager
$1395 / Stück
Datenblatt ansehen →EP2A40F672I8N
✅ Drop-In✓ Auf Lager
$1145 / Stück
Datenblatt ansehen →EP2A40F672I-9
✅ Drop-In✓ Auf Lager
$165 / Stück
Datenblatt ansehen →EP2A40F672I-8
✅ Drop-In✓ Auf Lager
$125 / Stück
Datenblatt ansehen →EP2A40F672I-7
✅ Drop-In✓ Auf Lager
$285 / Stück
Datenblatt ansehen →EP2A40F672I7N Grenzwerte & elektrische Eigenschaften
| Family | APEX II |
| System Gates | 1.5 M |
| Logic Cells / Elements | 38,400 |
| Macrocells | 16 |
| Product Terms per Macrocell | 32 |
| Maximum Internal Frequency | 562 MHz |
| Propagation Delay (PLA mode) | 1.55 ns |
| User I/O Lines | 492 |
| Core Voltage | 1.5 V |
| Process Technology | 0.15 µm |
| Gehäuse | 672-pin FC-FBGA |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 °C to +85 °C (Industrial) |
| RoHS-Status | Compliant (Pb-free) |
| Configuration Interface | JTAG, Passive Serial, Passive Parallel, Synchronous |
EP2A40F672I7N 672-pin fc-fbga Pinbelegungsleitfaden
Pinbelegung für EP2A40F672I7N (672-pin fc-fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2A40F672I7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2A40F672I7N ist geeignet für 6 Anwendungs: Telecommunications Infrastructure, Video and Image Processing, ASIC Prototyping, High-Speed Datapath Bridging, Industrial Control and Automation, Test and Measurement Instrumentation.
Telecommunications Infrastructure
The EP2A40F672I7N's 1.5 M system gates and 562 MHz maximum internal frequency make it well-suited for telecom infrastructure designs of its generation, including SONET/SDH framers, ATM switching fabric controllers, and baseband signal processing units. The 492 user I/O lines permit direct interfacing to multiple T1/E1 framers, UTOPIA-II bus interfaces, and SPI/SCI links without external bridge logic. Designers historically deployed this device in mid-2000s central-office equipment where the APEX II's MultiVolt I/O banks (1.5 V / 1.8 V / 2.5 V / 3.3 V) eliminated level-translation overhead. Trade-off: the 0.15 µm process draws more power than modern 28 nm Stratix/Cyclone FPGAs, so legacy retrofits should confirm thermal budget remains acceptable.
Empfohlen
Video and Image Processing
The 1.5 M gate capacity and 38,400 logic cells of the EP2A40F672I7N support mid-complexity video pipelines such as MPEG-2/H.264 codec preprocessing, deinterlacing, and motion estimation blocks used in broadcast and surveillance equipment of its era. Embedded block RAM and dedicated carry chains accelerate FIR filter and discrete-cosine transform operations required for real-time video encoding. The 562 MHz internal clock enables pixel-rate processing at standard-definition and lower-resolution high-definition resolutions. Recommended companion components include external DDR SDRAM buffers and high-speed video ADCs/DACs; verify timing closure with Quartus II timing analysis tools since the 1.55 ns propagation delay (PLA mode) sets the baseline for critical paths.
Empfohlen
ASIC Prototyping
The EP2A40F672I7N served as a high-density prototyping platform for ASIC designs in the mid-2000s, offering 1.5 M gates sufficient for prototyping networking ASICs, custom DSP chipsets, and peripheral controllers before committing to masked silicon. The 672-pin FC-FBGA package exposes 492 user I/O for connecting to prototype daughterboards that emulate the target ASIC's pinout, while the JTAG configuration interface allows rapid design iteration. Multi-voltage I/O banks simplify emulation of mixed-voltage ASIC environments. Caveat: modern ASIC prototyping typically uses larger Cyclone V/Stratix 10 or third-party ASIC-emulation platforms; the EP2A40 remains relevant only for legacy IP re-validation flows.
Empfohlen
High-Speed Datapath Bridging
The 562 MHz internal frequency and 492 I/O count of the EP2A40F672I7N historically enabled custom bus-bridge designs such as PCI-to-PCI, PCI-X to local-bus, and proprietary high-speed serial-to-parallel converters. The 1.55 ns propagation delay provides comfortable timing margin for 66 MHz PCI and 100 MHz PCI-X bridging, while the abundant embedded block RAM supports deep FIFOs required for crossing clock domains. The dedicated clock management blocks (PLLs) allow multiple clock domains to coexist on a single device, simplifying multi-protocol bridge designs. Modern alternatives should be evaluated for new bridge designs since PCIe is now the dominant interconnect.
Empfohlen
Industrial Control and Automation
The EP2A40F672I7N's industrial temperature grade (-40 °C to +85 °C) and 1.5 V core supply make it suitable for industrial control chassis, motor-control signal preprocessing, and programmable logic controller (PLC) backplane interfacing. The 38,400 logic cells support custom encoder interface logic, quadrature decoder channels, and high-speed serial protocol implementations (RS-485, CAN, Modbus bridging) commonly required in factory automation. The 672-pin FC-FBGA package, while larger than typical industrial designs, provides the I/O headroom to consolidate multiple discrete logic ICs into a single programmable device. For new industrial designs, lower-cost Cyclone IV/V devices are now preferred.
Empfohlen
Test and Measurement Instrumentation
The 1.5 M gates and 562 MHz operation of the EP2A40F672I7N support custom logic-analyzer pattern generation, protocol-analyzer state machines, and arbitrary waveform generator datapaths used in test and measurement equipment of the 2000s generation. The 492 I/O permit direct connection to high-pin-count DUT (device under test) boards via high-density probe fixtures. Embedded block RAM can store deep capture buffers and pattern sequences, reducing external memory cost. The JTAG interface simplifies in-field firmware updates for evolving test protocols. Performance-per-watt has improved dramatically on modern FPGAs, so new T&M designs typically target Cyclone V or Arria 10 families.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2A40F672I7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2A40F672I9N | EP2A40F672I8N | EP2A40F672I-9 | EP2A40F672I-8 | EP2A40F672I-7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Propagation Delay (PLA mode) | 1.55 ns | 1.25 ns (faster) | 1.40 ns (faster) | ~1.30 ns (faster) | ~1.45 ns (faster) | ~1.55 ns (equivalent) |
| Maximum Internal Frequency | 562 MHz | 562 MHz | 562 MHz | 562 MHz | 562 MHz | 562 MHz |
| User I/O Lines | 492 | 492 | 492 | 492 | 492 | 492 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) | Industrial (-40 °C to +85 °C) |
Wichtigste Unterscheidungsmerkmale
- Lowest speed-grade option in the EP2A40F672 family for cost-sensitive applications (vs. EP2A40F672I9N)
- Industrial temperature grade for harsh-environment deployment (vs. EP2A40F672C7N (commercial temperature))
- Same 672-pin FC-FBGA footprint enables direct upgrade path to higher speed grades (vs. EP2A40F1020I7N (1020-pin BGA))
Designhinweise
The EP2A40F672I7N requires a tightly regulated 1.5 V core supply with sub-3 % tolerance during transients to avoid configuration memory corruption and PLL unlock events. Place at least 22 low-ESR 0.1 µF ceramic decoupling capacitors distributed evenly beneath the 672-BGA footprint, plus four 10 µF bulk capacitors near the four package corners. Estimate: at 562 MHz with typical toggle activity the core draws approximately 1.2 A; derate the regulator for 50 % headroom to handle worst-case simultaneous-switching noise.
The 0.15 µm process and 672-pin FC-FBGA package dissipate significant heat under high toggle rates. Estimate: junction-to-ambient thermal resistance θJA is approximately 12 °C/W with proper 8-layer PCB layout (inner ground/power planes), giving a 1.5 W power budget for an 85 °C ambient. For designs approaching 2 W, add a heatsink or forced-air cooling. Use the device's internal temperature-sensing diode with the Quartus II thermal analyzer to verify margins in production.
The 672-ball FC-FBGA pitch is 1.0 mm; PCB breakout requires HDI (High-Density Interconnect) design with laser-drilled microvias or staggered via-in-pad construction. Maintain a continuous reference plane (ground for signal layers) directly beneath signal traces to control impedance to 50 Ω single-ended or 100 Ω differential. Use the manufacturer's reference design stack-up (typically 8-12 layers) for first-pass success, and avoid routing signals across plane splits near the BGA.
Do not confuse the 'I' (Industrial temperature) suffix with the 'C' (Commercial) suffix: the C-grade variants are 0 °C to +70 °C and are NOT drop-in for industrial environments. Also, the EP2A40F672I7N's configuration interface requires a 1.5 V-compatible PROM or controller; older 5 V EPC configurations will not work without a level translator. Finally, route all four PLL analog supply pins (separate from digital core) and decouple them with their own dedicated 1.5 V LDO; sharing the digital supply causes jitter degradation.
Compliance-Informationen
Pb-free assembly per Altera/Intel product marking 'N' suffix. RoHS compliance confirmed via Intel product page. Halogen-free status not explicitly stated in available data - marked unknown. AEC-Q100 not applicable as this is a commercial/industrial FPGA not automotive-qualified per the verified data.
