EP2AGZ300HF40C3N - Arria II GZ FPGA, 298K LE, 1517-BGA | Intel
Teilenummer: EP2AGZ300HF40C3N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4026.05 | $4.026,05 |
| 5 | $3925.4 | $19.627,00 |
| 10 | $3824.75 | $38.247,50 |
| 25 | $3724.1 | $93.102,50 |
| 50 | $3623.45 | $181.172,50 |
EP2AGZ300HF40C3N Übersicht
An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows hardware designers to configure digital logic, memory blocks, and I/O after manufacture. Within the broader taxonomy, the Arria II GZ family sits between the low-power Cyclone series and the high-performance Stratix series, balancing transceiver bandwidth, logic density, and power efficiency for mid-range applications such as wireless baseband, broadcast, and high-speed serial interfaces.
The EP2AGZ300HF40C3N integrates 11,920 LABs (Logic Array Blocks), 736 embedded 18x18 multipliers, 1,132,000 bits of block RAM, and 12 transceivers operating up to 6.375 Gbps. It supports PCI Express Gen1/Gen2 hard IP blocks, external memory interfaces up to DDR3-800, and offers core logic performance suitable for demanding digital signal processing tasks. The device operates at 0.9V core supply and is rated for commercial temperature (0C to +85C).
Architecturally, the Arria II GZ combines an 8-input adaptive logic module (ALM), 9 Kbit M10K memory blocks, and fractional phase-locked loops (fPLLs). The transceiver blocks support multiple protocols including CPRI, OBSAI, SATA, and Serial RapidIO, making the part well-suited to wireless infrastructure and high-speed backplane applications.
Typical applications include wireless baseband processing, high-speed data acquisition, broadcast video processing, radar signal processing, and PCI Express-based add-in cards. Designers select this part when a balance of logic capacity, transceiver count, and power efficiency is required.
When designing with this FPGA, pay close attention to power sequencing requirements, transceiver reference clock jitter, and PCB layout for high-speed serial links. Quartus II software with ModelSim-Altera provides the standard design environment.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet.
Drop-in-Alternativen für EP2AGZ300HF40C3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2AGZ300HF40C3N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature Grade, Mounting Type, RoHS Status, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2AGZ300HF40C3G
✅ Drop-In✓ Auf Lager
$5950 / Stück
Datenblatt ansehen →EP2AGZ300HF40I3N
✅ Drop-In✓ Auf Lager
$3820 / Stück
Datenblatt ansehen →EP2AGZ300HF40I3G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1995 / Stück
Datenblatt ansehen →EP2AGZ300HF40C4N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3950 / Stück
Datenblatt ansehen →EP2AGZ300FF35C3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1480 / Stück
Datenblatt ansehen →EP2AGZ300HF40C3N Grenzwerte & elektrische Eigenschaften
| Family | Arria II GZ |
| Logic Elements | 298,000 |
| Logic Array Blocks (LABs) | 11,920 |
| Total Memory Bits | 18,854,912 bits (~18.85 Mbit) |
| Embedded Multipliers (18x18) | 736 |
| Maximum User I/O | 734 |
| Transceivers | Up to 12 channels |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Betriebstemperatur | 0C to +85C (Commercial) |
| Gehäuse | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Memory Interface Support | DDR3-800, DDR2, QDR II+, RLDRAM II |
| PCIe Hard IP | PCI Express Gen1 / Gen2 |
| PLL Type | Fractional PLL + Multiplier PLL |
| RoHS-Status | Compliant |
| Lebenszyklusstatus | Obsolete (NRND/EOL per Intel) |
| Configuration Interface | JTAG, Passive Serial, Fast Passive Parallel |
| Design Software | Quartus II (legacy) |
EP2AGZ300HF40C3N 1517-bbga, fcbga (flip-chip bga) Pinbelegungsleitfaden
Pinbelegung für EP2AGZ300HF40C3N (1517-bbga, fcbga (flip-chip bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2AGZ300HF40C3N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2AGZ300HF40C3N ist geeignet für 6 Anwendungs: Wireless Baseband Processing, High-Speed Data Acquisition Systems, Broadcast Video Processing, PCI Express Gen2 Add-In Cards, Radar and Electronic Warfare Signal Processing, Industrial High-Speed Backplane Bridges.
Wireless Baseband Processing
The EP2AGZ300HF40C3N is well-suited for wireless baseband processing in 3G/4G radio units, where its 298,000 logic elements and 736 18x18 multipliers handle channel coding, rate matching, and turbo decoder blocks. The 12 transceivers support CPRI up to 4.2 and OBSAI RP3 at data rates to 6.375 Gbps, enabling direct connection to RF front-end cards over standard CPRI links. The DDR3-800 controller buffers high-throughput downlink streams. Designers should plan for ~6W typical transceiver power per quad and apply thermal relief to the 1517-BGA footprint.
Empfohlen
High-Speed Data Acquisition Systems
The EP2AGZ300HF40C3N fits high-speed DAQ systems where 12 transceivers aggregate multiple ADC data streams at 6.375 Gbps, while the 18.85 Mbit block RAM serves as on-chip FIFO buffering between the transceiver PCS and DSP pipelines. The 734 user I/O pins accommodate LVDS or parallel ADC interfaces. Engineers should place the part adjacent to the ADC on a controlled-impedance layer stack and use Quartus II TimeQuest timing analysis to close timing across PVT corners.
Empfohlen
Broadcast Video Processing
The EP2AGZ300HF40C3N targets broadcast video routers and processing engines, where 298K logic elements implement multi-channel SD/HD/3G-SDI processing and the transceivers handle 3G-SDI (SMPTE 424M) up to 2.97 Gbps or stacked SDI on 12 channels. The DDR3-800 interface buffers large video frames, while the 736 multipliers accelerate color space conversion and scaling filters. Designers should leverage Arria II GZ reference designs for SDI PHY and implement CRC/EDH insertion in logic.
Empfohlen
PCI Express Gen2 Add-In Cards
The EP2AGZ300HF40C3N integrates PCI Express Gen2 hard IP supporting x1, x2, x4, and x8 lane configurations at 5 Gbps per lane, ideal for high-bandwidth FPGA-based accelerator cards in servers or test equipment. The endpoint controller reduces BOM cost versus soft IP implementations, and the transceivers support the PCIe PMA directly. Designers must follow PCIe CEM specification for card edge fingers and AC coupling capacitor placement, with 100 MHz reference clock jitter under 300 fs RMS.
Empfohlen
Radar and Electronic Warfare Signal Processing
The EP2AGZ300HF40C3N serves defense and aerospace radar signal processing chains, where 736 18x18 multipliers implement pulse compression, FFT, and beamforming for phased-array antennas. The 12 transceivers aggregate multiple ADC inputs from radar receivers, while the 18.85 Mbit on-chip memory handles data buffering between DSP stages. The commercial temperature grade suits ground-based systems, but defense applications should select the industrial EP2AGZ300HF40I3N variant. PCB design requires controlled impedance and matched-length routing.
Empfohlen
Industrial High-Speed Backplane Bridges
The EP2AGZ300HF40C3N bridges multiple high-speed serial protocols on industrial backplanes, with transceivers supporting Serial RapidIO 2.1, 10 Gigabit Ethernet XAUI, and proprietary chip-to-chip links. The 734 user I/O interface to backplane SERDES, status LEDs, and management I2C. The DDR3-800 controller buffers protocol translation tables. Designers should leverage the Arria II GZ reference design for Serial RapidIO and validate signal integrity with HyperLynx or ANSYS SIwave for backplane channels.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2AGZ300HF40C3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2AGZ300HF40C3G | EP2AGZ300HF40I3N | EP2AGZ300HF40I3G | EP2AGZ300HF40C4N | EP2AGZ300FF35C3N |
|---|---|---|---|---|---|---|
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same footprint, different pinout |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 298,000 | 298,000 | 298,000 | 298,000 | 298,000 | 298,000 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | C3 (mid-speed) | C3 (mid-speed) | I3 (industrial speed) | I3 (industrial speed) | C4 (slower ~15% Fmax) | C3 (mid-speed) |
| Lead-Free / RoHS | Standard (SnPb optional) | Lead-Free RoHS compliant | Standard | Lead-Free RoHS compliant | Standard | Standard |
| Pinout | HF40 (40mm heat spreader) | HF40 - same | HF40 - same | HF40 - same | HF40 - same | FF35 (different ball pattern - not drop-in) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- RoHS-compliant lead-free option with identical die (vs. EP2AGZ300HF40C3G)
- Industrial temperature option for harsh environments (vs. EP2AGZ300HF40I3N)
- Slower speed grade option for lower cost (vs. EP2AGZ300HF40C4N)
- Same silicon density, different BGA pinout (vs. EP2AGZ300FF35C3N)
Designhinweise
Estimated: At full utilization (298K LE, 12 transceivers at 6.375 Gbps), the EP2AGZ300HF40C3N can dissipate 12-18W. The 1517-BGA FC-FBGA package exposes a top-side heat spreader that must be thermally bonded to a heatsink or cold plate with thermal interface material (TIM). Junction-to-ambient thermal resistance (theta_JA) with adequate airflow (200 LFM) and a 1C/W TIM is approximately 1.5 C/W. Designers should perform thermal simulation in ANSYS Icepak or Flotherm before committing to mechanical design.
The 1517-BGA package requires an 8-12 layer PCB with high-density interconnect (HDI) microvia technology. BGA pitch is 1.0mm; use 0.5mm laser-drilled microvias stacked or staggered. Route all 12 transceiver channels on stripline layers with 100 ohm differential impedance (85 ohm for PCIe), with intra-pair skew under 1 ps and inter-pair skew under 50 ps. Reference Intel AN 530: 'High-Speed Board Design Guidelines for Arria II GZ' for routing examples.
The EP2AGZ300HF40C3N requires multiple supply rails: 0.9V core, 1.1V transceiver PLL, 1.1V transceiver PMA, 2.5V/3.3V I/O, 3.3V auxiliary. Intel recommends the ISL8225MEVAL2Z or LTM4644 quad-output DC/DC module to generate these rails with proper sequencing. Power-on sequencing requires core voltage before transceiver supply; violation can cause latch-up. Use the EN6347QI or similar sequencer with PGOOD chain.
Multi-gigabit transceivers require reference clocks with RMS jitter under 300 fs (12 kHz to 20 MHz) for 6.375 Gbps operation per Intel's Arria II GZ datasheet. Recommend CDCM61002 or LMX2531 synthesizer with low-noise LDO regulator. Keep clock traces short with controlled impedance; place termination resistors at the receiver. Use TimeQuest SDC constraints to define false paths and multicycle paths for transceiver interfaces.
Common mistakes with the EP2AGZ300HF40C3N include: (1) forgetting to instantiate the ALT2GXB transceiver primitive with correct channel placement per pin assignment; (2) omitting MSEL pull-ups for configuration mode (AS/PS/FPP selection); (3) leaving JTAG TCK unterminated, causing configuration failures; (4) ignoring POR delay (~100 ms) before asserting config_done; (5) using STD_LOGIC without signed/unsigned packages causing synthesis warnings.
Compliance-Informationen
RoHS compliant per Intel product declaration. The standard C3N variant uses leaded (SnPb) balls; for lead-free option, choose C3G suffix. AEC-Q100 is not applicable for FPGAs of this density. Halogen-free package materials per Intel MSL-3 classification.