EP2C8F256I8 FPGA - Cyclone II 8256 LE, 256-FBGA | Intel
Teilenummer: EP2C8F256I8 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $36.53 | $36,53 |
| 10 | $36.53 | $365,30 |
| 100 | $36.53 | $3.653,00 |
| 500 | $36.53 | $18.265,00 |
| 1.000 | $36.53 | $36.530,00 |
EP2C8F256I8 Übersicht
An FPGA is a semiconductor device containing programmable logic blocks, embedded memory, and programmable interconnects that can be configured after manufacturing. The Cyclone II family sits in Intel/Altera's mainstream programmable logic portfolio between MAX CPLDs and high-end Stratix devices. In product hierarchy terms, EP2C8F256I8 is an FPGA -> programmable logic device -> integrated circuit. Engineers configure the logic array using hardware description languages such as Verilog or VHDL, then download a configuration bitstream through active serial, passive serial, or JTAG interfaces.
EP2C8F256I8's 8,256 logic elements provide approximately 516 logic array blocks for custom logic functions. The 165,888 RAM bits are organized in M4K memory blocks and can implement FIFOs, small packet buffers, or dual-port memories for data path applications. The 182 user I/O balls support the flexible I/O levels commonly used for memory buses, backplane interfaces, and video data paths. The 256-ball FineLine BGA form factor keeps the design compact while preserving routing access for multiple I/O banks.
Because this is a Cyclone II low-cost family device, it is often paired with serial configuration devices and external memories rather than used as a processor-centric SoC. The industrial temperature option is valuable for equipment installed in uncontrolled environments such as factory floors, base stations, and outdoor signage. The FPGA's reconfigurability also allows field updates through secure or partial reconfiguration flows, which reduces service cost over the product lifetime.
Typical applications include industrial motor-control logic, video frame grabbers, protocol bridging between Ethernet and custom buses, and test instruments that need a flexible I/O front end. The 182 I/O pins make it practical to connect to multiple ADCs, DACs, memories, and transceivers in the same design. With 165,888 bits of on-chip RAM, moderate packet buffering and line-rate FIFO functions can be implemented without adding an external SRAM.
When designing with EP2C8F256I8, pay attention to the core and I/O power supply rails, configuration voltage requirements, and bypass capacitor placement. The FPGA must be configured from an external configuration device or host after power-up; selecting AS or JTAG mode affects the bill of materials and manufacturing test flow. Keep the configuration clock and data signals clean and short to avoid bitstream corruption during production programming.
This page synthesizes distributor inventory, verified specification snippets, drop-in Intel/Altera alternatives, and practical design notes not repeated in every datasheet. Use it as a starting point for a full Cyclone II Handbook review before production.
Drop-in-Alternativen für EP2C8F256I8 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2C8F256I8 (gleiche Bauform und Footprint) – abweichend in RoHS Status, Package, Speed Grade, Total RAM Bits, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2C8F256I8N
✅ Drop-In✓ Auf Lager
$21.95 / Stück
Datenblatt ansehen →EP2C8F256C8N
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP2C8F256C7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8.31 / Stück
Datenblatt ansehen →EP2C8F256I6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$22.85 / Stück
Datenblatt ansehen →EP2C8F256C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$31.2 / Stück
Datenblatt ansehen →EP2C8F256I8 Grenzwerte & elektrische Eigenschaften
| Series | Cyclone II |
| Logic Elements | 8,256 |
| Total RAM Bits | 165,888 |
| Number of User I/O | 182 |
| Number of LABs / CLBs | 516 |
| Gehäuse | 256-LBGA (FBGA-256) |
| Number of Terminals / Balls | 256 |
| Package Shape | Square |
| Temperature Grade | Industrial (suffix 'I') |
| Speed Grade | 8 (per suffix) |
| RoHS-Status | Unknown - no N suffix; verify in distributor data |
EP2C8F256I8 square Pinbelegungsleitfaden
Pinbelegung für EP2C8F256I8 (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2C8F256I8.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2C8F256I8 ist geeignet für 6 Anwendungs: Industrial Motor Control Logic, Video Capture and Format Conversion, Protocol Bridging and Interface Conversion, Test and Measurement Front-End Logic, Digital Signal Processing Pre-Processor, Networking and Protocol Monitoring.
Industrial Motor Control Logic
The EP2C8F256I8 is well suited for industrial motor control where a flexible FPGA implements PWM generation, encoder decoding, overcurrent detection, and safety interlock logic in parallel. Its 8,256 logic elements leave room for a soft-core controller or state machines, while 182 user I/O connect to gate drivers, current sensors, and quadrature encoders. The industrial temperature suffix I supports ambient temperatures common on factory floors, and the 256-ball FBGA package reduces PCB area in compact drive electronics. In this role, the FPGA acts as a programmable glue and real-time logic layer between a host MCU and power stage. Use the 165,888 RAM bits for speed-signal lookup tables or small production counters. Because gate-drive signals are fast and noise-sensitive, assign critical outputs to dedicated I/O banks and use clean digital grounds.
Empfohlen
Video Capture and Format Conversion
In video capture systems, EP2C8F256I8 can absorb parallel video data from CMOS sensors or ADCs, perform simple resolution scaling, timing generation, and output pixel data to a display or downstream processor. The 8,256 logic elements are enough for combinational pixel engines and sync generators, while 182 user I/O provide the required parallel bus width. Its 165,888 RAM bits can implement small line buffers for image shifting or synchronization, although full-frame storage requires external DDR or SDRAM. The industrial temperature option suits surveillance cameras, machine vision, and outdoor displays that must operate across wide temperature swings. Place the FPGA near the sensor or ADC to minimize trace skew, and constrain I/O timing using the synchronous delay circuits inside the Cyclone II device.
Empfohlen
Protocol Bridging and Interface Conversion
EP2C8F256I8 is frequently used to bridge between legacy parallel buses, SPI, UART, and simple Ethernet PHY interfaces. Its 182 user I/O pins allow a design to capture a wide parallel bus while simultaneously driving a second interface, making it a practical protocol converter for industrial PCs, test equipment, and communication modules. The 8,256 logic elements can implement FIFOs, protocol state machines, CRC blocks, and status registers, while the 165,888 RAM bits provide packet or command buffering. The FPGA can be configured in-system through JTAG, allowing field updates when the protocol specification changes. For reliable PHY-level signals, use controlled impedance traces on Ethernet and clocked I/O groups.
Empfohlen
Test and Measurement Front-End Logic
EP2C8F256I8 is well matched to test and measurement products such as data-acquisition modules, logic analyzers, and waveform generators. The 8,256 logic elements can implement acquisition triggering, sample formatting, and instrument state machines; 182 user I/O can connect to multiple ADCs, DACs, and comparator arrays. The 165,888 RAM bits are useful for waveform playback or trigger snapshot buffers. Because instruments often need calibrated analog performance, connect the FPGA to high-speed converter data buses with matched trace lengths. The industrial temperature version supports benchtop-to-rack equipment that may be stored in unconditioned areas. A soft-core CPU can be added for command parsing, but the high priority is deterministic real-time sampling and triggering in the FPGA fabric.
Empfohlen
Digital Signal Processing Pre-Processor
With 8,256 logic elements, EP2C8F256I8 can implement moderate DSP pre-processing such as digital filters, correlation, FFT front-end, or quadrature demodulation. The 165,888 RAM bits provide coefficient and sample storage for filters, while 182 user I/O connect to converter and data-path devices. Cyclone II devices are intended for low-cost logic-centric designs; for high-throughput DSP, architectures with dedicated multiply-accumulate blocks may be needed. This FPGA is best used when a moderate parallel datapath must be customized around an existing algorithm. Partition the DSP chain carefully because the RAM blocks, not logic elements, often determine the maximum filter length. Use synchronous enables to gate datapath activity and reduce dynamic power.
Empfohlen
Networking and Protocol Monitoring
EP2C8F256I8 fits in networking test and monitoring hardware where parallel processing of packet headers, counters, or status flags is needed. The 182 user I/O allow connection to multiple PHYs and memory devices, while the 165,888 RAM bits buffer small packets or statistics tables. The 8,256 logic elements can implement Ethernet MAC logic when paired with an external PHY, or simple serial-to-parallel converters for custom backplane protocols. Industrial temperature support is useful for field-deployed network probes and remote monitoring units. For low-cost packet monitoring, this FPGA provides more flexible packet classification than a fixed MCU peripheral. Add external SRAM or SDRAM when the statistics table or packet queue exceeds the internal RAM capacity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2C8F256I8 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2C8F256I8N | EP2C8F256C8N | EP2C8F256C7N | EP2C8F256I6N | EP2C8F256C6N |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 |
| Total RAM Bits | 165,888 | 165,888 | 165,888 | 165,888 | 165,888 | 165,888 |
| User I/O | 182 | 182 | 182 | 182 | 182 | 182 |
| Temperature Grade | Industrial (-40 to +100C) | Industrial (-40 to +100C) | Commercial (0 to +85C) | Commercial (0 to +85C) | Industrial (-40 to +100C) | Commercial (0 to +85C) |
| Speed Grade | 8 | 8 | 8 | 7 | 6 | 6 |
| Lead-Free Finish (N suffix) | No N suffix - verify finish | N suffix - lead-free/RoHS-oriented | N suffix - lead-free/RoHS-oriented | N suffix - lead-free/RoHS-oriented | N suffix - lead-free/RoHS-oriented | N suffix - lead-free/RoHS-oriented |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature option in the same F256 package (vs. EP2C8F256C8N)
- Drop-in compatibility with multiple Intel/Altera Cyclone II F256 variants (vs. EP2C8F256I8N)
- Higher logic density than smaller Cyclone II F256 parts (vs. EP2C5F256I8N)
Designhinweise
The EP2C8F256I8 requires a dedicated core supply, usually 1.2 V for Cyclone II devices, plus separate I/O supply rails whose voltage depends on the I/O standard. Exact core and I/O voltage limits were not included in the upstream web data, so refer to the Cyclone II datasheet power table. Estimate dynamic power using Intel/Altera's early power estimator and then validate with the power analyzer after place-and-route. Core consumption scales with toggle rate, clock frequency, and the number of LEs used, while I/O power scales with load capacitance.
Use 0.1 uF ceramic decoupling capacitors on each core supply ball and 1 uF/10 uF capacitors distributed around the 256-ball BGA. The FBGA-256 package benefits from vias-in-pad or microvia fanout to maintain low inductance power delivery. Keep the analog and digital ground planes continuous under the BGA and separate sensitive converter grounds only when the converter layout requires it. Follow Intel/Altera Board Design Guidelines for Cyclone II for correct power plane partitioning.
A common FPGA integration error is forgetting to configure the device before expecting I/O behavior. EP2C8F256I8 boots from an external configuration device or host after power-up; the CONF_DONE and nSTATUS pins should be monitored. Do not leave unused I/O floating in a way that causes oscillation. Program the unused pins as inputs with internal weak pull-ups or as outputs driven low, depending on board constraints. Also verify the JTAG chain if you are combining multiple FPGAs in one test loop.
Compliance-Informationen
EP2C8F256I8 does not carry an N suffix in the verified data, which in Intel/Altera ordering often indicates the lead-free/RoHS-oriented version. Since the source pages do not explicitly state RoHS status for this MPN, compliance should be confirmed with Intel/Altera or the distributor before claiming RoHS.
