EP2S60F484I4N - Stratix II FPGA 60K LE, 484-FBGA | Intel
Teilenummer: EP2S60F484I4N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1586.16 | $1.586,16 |
| 10 | $1495 | $14.950,00 |
| 50 | $1395 | $69.750,00 |
| 100 | $1295 | $129.500,00 |
| 250 | $1195 | $298.750,00 |
EP2S60F484I4N Übersicht
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device in the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as DSP blocks, embedded RAM, and high-speed transceivers. The Stratix II family in particular introduced an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the previous Stratix generation, making Stratix II devices especially well-suited for high-performance DSP, data-path, and memory-intensive designs.
Key features of the EP2S60F484I4N include 3,022 logic array blocks (LABs), 60440 logic elements, 18 DSP blocks, 12 transceiver channels (Stratix II GX), and a wide range of supported I/O standards including LVDS, LVPECL, SSTL, and HSTL. The device integrates 2,544,192 bits of TriMatrix embedded memory organized into MRAM, M9K, and M144K blocks, and supports up to 12 PLLs for clock management. Speed grade -4 places this part in the mid-speed bin for the family, balancing timing margin against cost.
Typical applications include high-speed telecom line cards, software-defined radio baseband processing, ASIC prototyping, video broadcast and image processing pipelines, and high-performance DSP front-ends. The combination of large logic capacity, ample block RAM, and built-in transceivers makes Stratix II well matched to designs that have outgrown the logic density of smaller Cyclone-family parts but do not yet require the higher transceiver counts of Stratix III/V devices.
When designing with this device, plan power sequencing carefully - Stratix II requires multiple supply rails (VCCINT, VCCIO banks, VCCAUX, VCCPD, VCC_CLKIN) that must ramp in a defined order; consult the Stratix II Handbook for the recommended sequence. Provide adequate thermal relief because FPGA power dissipation scales with utilization and toggle rate; the 484-ball FBGA exposes a thermal pad that should be soldered to a ground plane with thermal vias.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-family alternatives from the Stratix II lineup, and practical design notes not collected in any single datasheet chapter.
Drop-in-Alternativen für EP2S60F484I4N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2S60F484I4N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Family, PLLs, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2S60F484I4
✅ Drop-In✓ Auf Lager
$138.4 / Stück
Datenblatt ansehen →EP2S60F484C5N
✅ Drop-In✓ Auf Lager
$720.5 / Stück
Datenblatt ansehen →EP2S60F484C4N
✅ Drop-In✓ Auf Lager
$920 / Stück
Datenblatt ansehen →EP2S60F484C3N
✅ Drop-In✓ Auf Lager
$1245.75 / Stück
Datenblatt ansehen →EP2S60F484C5
✅ Drop-In✓ Auf Lager
$491.55 / Stück
Datenblatt ansehen →EP2S60F484I4N Grenzwerte & elektrische Eigenschaften
| Series | Stratix II |
| Family | Stratix II (EP2S60) |
| Logic Elements (LE) | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| Total RAM Bits | 2,544,192 |
| Number of I/O | 334 |
| Number of DSP Blocks | 18 (typical) |
| Number of PLLs | 12 (typical) |
| Gehäuse | 484-BBGA, FCBGA |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial, I4) |
| Speed Grade | -4 (mid) |
| Versorgungsspannung | 1.2 V (core) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
EP2S60F484I4N 484-bbga, fcbga Pinbelegungsleitfaden
Pinbelegung für EP2S60F484I4N (484-bbga, fcbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2S60F484I4N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2S60F484I4N ist geeignet für 6 Anwendungs: Telecom Line Card Processing, ASIC Prototyping, Software Defined Radio Baseband, Video Broadcast Image Processing, High-Performance DSP Front-End, Test and Measurement Instrumentation.
Telecom Line Card Processing
The EP2S60F484I4N's 60,440 logic elements and 2,544,192 bits of TriMatrix embedded memory (MRAM/M9K/M144K blocks) make it well suited for telecom line cards that need packet classification, queue management, and traffic shaping. The 334 user I/Os allow connection to multiple SGMII/SerDes interfaces and external TCAMs without glue logic. Unlike smaller Cyclone III/IV parts that often require external SRAM, the Stratix II EP2S60 can hold large lookup tables on-chip, reducing board complexity. However, the 484-FBGA footprint needs adequate thermal relief because telecom shelves routinely run at 70C ambient.
Empfohlen
ASIC Prototyping
ASIC prototyping is one of the canonical use cases for the Stratix II EP2S60F484I4N, where the 60,440 LE density can map ASICs up to 1.5M gates when used with multi-FPGA partitioning. The 18 DSP blocks provide 18x 18-bit multipliers for arithmetic-heavy prototype verification, and the M9K/M144K memory blocks emulate ASIC SRAM/ROM with predictable timing. The I4 industrial temperature grade lets the prototype board run in chassis that exceed commercial-grade limits. Engineers commonly pair the EP2S60 with daughter-card interconnect such as HAPS-style boards from Synopsys to build multi-FPGA ASIC emulators.
Empfohlen
Software Defined Radio Baseband
Software-defined radio (SDR) baseband signal processing benefits from the EP2S60F484I4N's combination of DSP blocks, embedded memory, and LVDS I/O support. The 18 DSP blocks deliver up to 18 parallel 18x18-bit multipliers per clock, supporting FIR filtering, FFT butterflies, and channel decoding at GSM/WCDMA rates. The M9K blocks buffer I/Q samples between DSP stages with deterministic latency, while the 334 user I/Os handle multi-antenna streams. Stratix II EP2S60 is a well-documented reference design target for SDR research platforms, though newer designs should migrate to Stratix V/10 with integrated transceivers.
Empfohlen
Video Broadcast Image Processing
Broadcast video processing pipelines need large frame buffers and parallel arithmetic for motion estimation, deinterlacing, and scaling - the EP2S60F484I4N's 2.5 Mbit of TriMatrix memory and 18 DSP blocks are well matched to SD/HD video rates up to 1080p60. The 334 LVDS/SSTL/HSTL-capable I/Os accept camera link or DVI inputs directly, while the M144K blocks store 4-8 lines of 1080p video for two-dimensional filters. The industrial temperature grade suits outdoor broadcast equipment such as OB vans. For 4K workflows, plan to migrate to Stratix V or Cyclone 10 GX because the EP2S60 lacks the transceiver count and logic density.
Empfohlen
High-Performance DSP Front-End
The EP2S60F484I4N's 18 DSP blocks and 60,440 logic elements are tuned for high-throughput DSP front-ends such as radar, sonar, and medical imaging pre-processing. Each DSP block can be configured as 18x18 multiplier, 36x18 MAC, or accumulator chain, delivering up to ~36 GMACs at 200 MHz in the -4 speed bin. The 12 PLLs give flexible clock synthesis for multi-rate decimating filters, and the 2.5 Mbit TriMatrix memory holds coefficient tables without external ROM. Industrial temperature grade suits outdoor and military applications. Use the Altera DSP Builder tool to map MATLAB/Simulink designs directly to the EP2S60.
Empfohlen
Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol analyzers, and arbitrary waveform generators leverage the EP2S60F484I4N's high logic density and 334 I/Os for multi-channel capture and stimulus. The 2.5 Mbit embedded memory buffers captured samples, and the LVDS I/O pairs enable high-speed bus probing. The industrial temperature rating supports portable instruments operating in uncontrolled environments. For new designs, engineers should evaluate the Stratix 10 family, but the EP2S60 remains a viable choice when redesigning legacy instrumentation where the timing closure and Quartus II flow are well understood.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2S60F484I4N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2S60F484I4 | EP2S60F484C5N | EP2S60F484C4N | EP2S60F484C3N | EP2S60F484C5 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Logic Elements | 60,440 | 60,440 (same) | 60,440 (same) | 60,440 (same) | 60,440 (same) | 60,440 (same) |
| Total RAM Bits | 2,544,192 | 2,544,192 (same) | 2,544,192 (same) | 2,544,192 (same) | 2,544,192 (same) | 2,544,192 (same) |
| User I/O | 334 | 334 (same) | 334 (same) | 334 (same) | 334 (same) | 334 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -4 (mid) | -4 (default mid) | -5 (slower) | -4 (matches) | -3 (faster) | -5 (slower) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- True drop-in replacement within same speed bin (vs. EP2S60F484I4)
- Industrial temperature grade vs commercial (vs. EP2S60F484C4N)
- Larger embedded memory than Cyclone II predecessors (vs. EP2C70F896C6N)
- Higher logic density than smaller Stratix II SKUs (vs. EP2S30F484C3N)
Designhinweise
The EP2S60F484I4N requires multiple supply rails: VCCINT at 1.2V for core logic, VCCIO bank supplies (1.5V/1.8V/2.5V/3.3V depending on I/O standard), VCCAUX at 2.5V, and VCCPD at 2.5V or 3.3V. According to the Stratix II handbook, the power-on sequence must follow VCCINT first, then VCCPD, then VCCIO/VCCAUX to avoid device latch-up. Use a multi-rail sequencer such as the LTC2974 or UCD90120A, and budget 2-3A per rail at full utilization. Decoupling: place 0.1uF X7R capacitors every 5-10mm across VCCINT/VCCIO planes and bulk polymer capacitors (47-220uF) within 25mm of the package.
Stratix II EP2S60 power dissipation scales with toggle rate and logic utilization - a fully-utilized design can reach 5-10W, especially at the -4 speed bin. The 484-FBGA package exposes a die-attach pad that MUST be soldered to a PCB thermal pad with an array of 0.3mm thermal vias (filled or plugged with solder mask) connecting to inner ground planes. Without proper thermal relief, the junction temperature can exceed the +100C industrial limit. Use the Altera PowerPlay early power estimator and thermal model to validate the cooling solution at 70C ambient before committing to layout.
PCB layout for a 484-FBGA at 1.0mm pitch requires 4-6 routing layers with 4mil trace/space and microvia or laser-drilled via-in-pad for signal breakouts. Reference the Stratix II pin connection guidelines for bank assignments, differential pair routing, and PLL clock network placement. Keep LVDS pairs length-matched within 50 mils and route them over a continuous ground reference plane. Add 0402 decoupling capacitors on the bottom side directly beneath the BGA with via-in-pad connections. For high-speed transceivers, isolate the analog supply (VCCA_PLL) and provide a pi-filter network.
Common pitfalls when designing with the EP2S60F484I4N: (1) ignoring the power-on sequence causes device latch-up or reduced lifetime - always sequence VCCINT before VCCIO/VCCAUX. (2) Configuring unused I/O pins as outputs can cause contention with another output; tie them to input tri-state. (3) Forgetting to enable the JTAG pull-up resistors on TMS/TDI/TCK causes programming failures. (4) Driving configuration pins before the device is fully powered can damage the I/O cells. (5) Underestimating the embedded memory read latency in M144K blocks leads to mis-pipelined data paths. Always run a full functional simulation with post-fit timing models before tape-out.
Compliance-Informationen
RoHS compliant and lead-free per Altera/Intel material declaration. AEC-Q100 not applicable (industrial-grade commercial FPGA, not automotive-qualified per JEDEC Q100). REACH, halogen-free, and conflict-mineral data not explicitly stated in verified web sources.