EP3C80F780C7N - 81264 LE Cyclone III FPGA 780-FBGA | Intel / Altera
Teilenummer: EP3C80F780C7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $382.55 | $382,55 |
| 10 | $360 | $3.600,00 |
| 100 | $310 | $31.000,00 |
| 250 | $285 | $71.250,00 |
| 500 | $260 | $130.000,00 |
EP3C80F780C7N Übersicht
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O cells are configured by the user via a hardware description language such as Verilog or VHDL. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy, offering ASIC-class parallelism without NRE cost. The Cyclone III family is Intel's mid-density, low-power line positioned for industrial control, video processing, and consumer electronics.
Key features include 81,264 LEs, 2,810,880 bits of embedded memory (RAM), 429 maximum user I/O pins, 4 PLLs, and 288 embedded 18 x 18 multipliers for DSP workloads. The device supports multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL) at up to 16 global clock networks, while on-chip configuration memory retains bitstream contents without external boot ROM when configured in serial or parallel modes.
Typical applications span industrial motor control, video surveillance and image processing pipelines, automotive infotainment and driver-assistance subsystems, communication protocol bridging, and portable test-and-measurement equipment. The 65 nm process yields static power in the tens of mW, allowing fanless operation even at elevated ambient temperatures.
When designing with the EP3C80F780C7N, observe the JTAG configuration pin assignments and provide adequate decoupling (typically 0.1 uF plus 10 uF bulk per power rail) near the FBGA balls. The 780-BGA requires a multi-layer PCB with microvia or via-in-pad technology for reliable assembly.
Drop-in-Alternativen für EP3C80F780C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3C80F780C7N (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Speed Grade, Logic Elements, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3C80F780C8N
✅ Drop-In✓ Auf Lager
$240.2 / Stück
Datenblatt ansehen →EP3C80F780C6N
✅ Drop-In✓ Auf Lager
$330.2 / Stück
Datenblatt ansehen →EP3C80F780C7
✅ Drop-In✓ Auf Lager
$298.75 / Stück
Datenblatt ansehen →EP3C120F780C7N
✅ Drop-In✓ Auf Lager
$162 / Stück
Datenblatt ansehen →EP3C120F780C8N
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP3C55F780C7N
✅ Drop-In✓ Auf Lager
$138.31 / Stück
Datenblatt ansehen →EP3C80F780C7N Grenzwerte & elektrische Eigenschaften
| Series | Cyclone III |
| Family Name | Cyclone III |
| Number of Logic Elements | 81,264 |
| Number of Logic Cells / CLBs | 81,264 |
| Total RAM Bits | 2,810,880 |
| Number of I/O | 429 |
| Voltage - Supply | 1.15 V to 3.3 V (core and I/O banks) |
| Betriebstemperatur | 0C to +85C (commercial) |
| Montageart | Surface Mount |
| Gehäuse / Bauform | 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch |
| Supplier Device Package | 780-FBGA |
| Process Technology | 65 nm CMOS (TSMC low-k) |
| Number of PLLs | 4 |
| Number of Multipliers (18x18) | 288 |
| Maximum Frequency | 472.5 MHz |
| Lead Free / RoHS | Lead Free (per LCSC listing) |
| Configuration Method | JTAG, Serial, Parallel (via Quartus Prime / Quartus II) |
EP3C80F780C7N 780-fbga Pinbelegungsleitfaden
Pinbelegung für EP3C80F780C7N (780-fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3C80F780C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3C80F780C7N ist geeignet für 6 Anwendungs: Industrial Motor Control, Video Surveillance / Image Processing, Automotive Infotainment / Driver Assistance, Communication Protocol Bridging, Medical Patient Monitoring, Portable Test & Measurement.
Industrial Motor Control
The EP3C80F780C7N's 288 embedded 18x18 multipliers and 472.5 MHz max clock make it well-suited for multi-axis industrial motor control. With 81,264 logic elements, the FPGA can run a field-oriented control (FOC) loop for two to three motors simultaneously, with the 2,810,880 bits of block RAM holding state-space estimator tables and per-axis PI controller state. The 429 user I/Os accept multiple encoder and resolver feedback channels, while four PLLs synchronize the PWM generation to the system clock. The 65 nm low-power process keeps total power below 1.5 W, eliminating the need for active cooling inside sealed industrial enclosures.
Empfohlen
Video Surveillance / Image Processing
Supporting up to 429 I/O pins and 472.5 MHz operation, the EP3C80F780C7N is a strong fit for video pipeline designs that ingest parallel camera data and output processed frames to DDR memory. The 288 18x18 multipliers accelerate Sobel, Laplacian, and 2D-DCT kernels, while the 2.8 Mbit block RAM serves as line buffers between pipelined stages. Designers can implement H.264 baseline encoding for D1 or 720p streams entirely in fabric. The 780-FBGA with 1.0 mm pitch is compatible with standard 4-layer PCB plus via-in-pad manufacturing used in mid-volume IP camera boards.
Empfohlen
Automotive Infotainment / Driver Assistance
The 81,264-LE EP3C80F780C7N delivers the parallelism needed for automotive infotainment subsystems combining audio mixing, CAN/LIN bridging, and small-format video overlays. Its four PLLs allow multiple audio sample-rate domains (44.1/48/96 kHz) and a parallel RGB video stream to coexist on one die. The 780-FBGA at 29 x 29 mm fits behind a head-unit display PCB, while the commercial 0 to +85 C rating is acceptable for cabin modules; under-hood ADAS systems would instead require the I-grade EP3C80F780I7N, which is pin-compatible in the same 780-FBGA package.
Empfohlen
Communication Protocol Bridging
With 81,264 logic elements and 16 global clock networks, the EP3C80F780C7N can implement multi-protocol bridges translating between Ethernet MAC, PCIe Gen1 endpoint, UART, SPI, and I2S in a single fabric. The 2.8 Mbit block RAM holds packet buffers while the 429 I/O pins provide generous headroom for parallel bus expansion. Industrial gateway designs use it to map legacy field-bus traffic into modern TCP/IP streams, and the device's JTAG boundary-scan chain simplifies board-level bring-up of the bridge firmware.
Empfohlen
Medical Patient Monitoring
The EP3C80F780C7N is used in patient monitoring equipment where its 2.8 Mbit block RAM buffers ECG, SpO2, and respiration waveforms before display refresh, while the 288 multipliers accelerate digital filtering (bandpass, notch) on biosignals. The 429 I/Os accept parallel ADC data from multi-channel front ends, and the four PLLs derive the precise timing required for I2S audio to bedside alarm speakers. With the 0 to +85 C commercial grade, this part suits bedside monitors; portable/wearable medical devices typically migrate to lower-power Cyclone IV or Cyclone 10 devices for longer battery life.
Empfohlen
Portable Test & Measurement
Bench-top oscilloscopes, logic analyzers, and protocol testers use the EP3C80F780C7N because of its 472.5 MHz max internal clock, 288 hardware multipliers, and 16 global clock networks. The FPGA can sample multiple analog channels through external ADC front ends, perform FFT-based spectrum analysis with the embedded multipliers, and drive a high-resolution color display. The 780-FBGA at 1.0 mm pitch is compatible with 4-layer PCBs; the 2.8 Mbit block RAM holds waveform capture buffers before upload over USB or Ethernet. Industrial temperature versions (I-grade) are available in the same footprint for harsh-environment test gear.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3C80F780C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3C80F780C8N | EP3C80F780C6N | EP3C120F780C7N | EP3C55F780C7N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same | 780-FBGA (29x29 mm, 1.0 mm pitch) - same |
| Logic Elements | 81,264 | 81,264 (same) | 81,264 (same) | 119,088 (+47%) | 55,856 (-31%) |
| Total RAM Bits | 2,810,880 | 2,810,880 (same) | 2,810,880 (same) | 3,888,000 (+38%) | 2,396,160 (-15%) |
| Maximum User I/O | 429 | 429 (same) | 429 (same) | 531 | 377 |
| Number of PLLs | 4 | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
| 18x18 Multipliers | 288 | 288 (same) | 288 (same) | 288 (same) | 156 |
| Speed Grade | C7 (commercial, -2 speed grade) | C8 (faster, -1 speed grade) | C6 (slower, +1 speed grade) | C7 (same) | C7 (same) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (same) | 0C to +85C (same) | 0C to +85C (same) | 0C to +85C (same) |
| Process Technology | 65 nm CMOS | 65 nm CMOS (same) | 65 nm CMOS (same) | 65 nm CMOS (same) | 65 nm CMOS (same) |
Wichtigste Unterscheidungsmerkmale
- Drop-in Cyclone III density leader at 780-FBGA (vs. EP3C55F780C7N)
- Balanced density and cost vs Cyclone IV/V migration (vs. Cyclone IV E EP4CE80F23C8N)
- Commercial temp grade fits cost-driven industrial applications (vs. EP3C80F780I7N (industrial -40 to +100 C))
Designhinweise
Estimated: at typical 30% toggle activity and 50 MHz operation, the EP3C80F780C7N core draws roughly 0.4 to 0.6 A from a 1.15 V supply (~0.5 to 0.7 W). Decouple each VCCINT pin with a 0.1 uF X7R ceramic placed within 100 mil of the ball, plus one 100 uF bulk per supply rail. VCCIO banks must be powered to 1.2 V to 3.3 V depending on the I/O standard chosen; never float unused banks - tie them to a valid rail to avoid leakage through I/O buffers.
The 780-FBGA at 1.0 mm pitch requires 4-layer or 6-layer PCB with microvia (or via-in-pad) fabrication for reliable assembly. Fan-out escape routing should use dog-bone patterns with 0.4 mm (16 mil) via pads. Provide a continuous ground plane on layer 2 immediately beneath the BGA to control return currents, and stitch vias around the BGA perimeter for thermal dissipation and EMI suppression.
Never leave CONFIG_DONE, nCONFIG, or nSTATUS floating during configuration; pull-ups to VCCIO_3 (typically 3.3 V) are required. A missing decoupling capacitor or an incorrect MSEL pin setting (which selects configuration mode) is the most common bring-up failure. Verify all JTAG TCK, TMS, TDI, TDO pull directions match your JTAG programmer's reference design before powering the board.
Compliance-Informationen
Lead-free per LCSC distributor listing. Commercial temperature grade only - not AEC-Q100 qualified. RoHS compliant per distributor pages; REACH and halogen status not explicitly listed by vendors.
