EP3SL340F1760C3N - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
Teilenummer: EP3SL340F1760C3N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3850 | $3.850,00 |
| 10 | $3650 | $36.500,00 |
| 100 | $3300 | $330.000,00 |
| 250 | $3100 | $775.000,00 |
| 500 | $2950 | $1.475.000,00 |
EP3SL340F1760C3N Übersicht
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that lets designers implement arbitrary digital circuits - from simple glue logic to full processors, DSP pipelines, and high-speed protocol bridges - in silicon via a hardware description language such as Verilog or VHDL. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic device (CPLD) -> field-programmable gate array (FPGA) -> semiconductor. Stratix III L specifically targets the power-optimized branch of the Stratix III family, trading some maximum frequency for substantially lower static and dynamic power versus the standard Stratix III E parts.
Key features include up to 500 MHz core fabric operation, dedicated DSP blocks capable of delivering hundreds of GMACs of multiply-accumulate throughput, embedded memory organized in M9K/M144K blocks, multiple PLLs, and high-speed transceivers supporting multi-gigabit serial protocols. The 1760-BGA package exposes 1120 general-purpose user I/Os plus dedicated configuration, clock, and transceiver pins, enabling dense board designs without external bus-multiplexing logic.
Typical applications include high-definition video broadcast, medical imaging systems, military signal intelligence, high-frequency trading accelerator cards, and high-port-count network switching. The combination of dense logic, large on-die memory, and 65 nm low-power silicon makes this part suitable for systems that need Stratix-class DSP horsepower with tighter thermal envelopes than the higher-bin Stratix V or Arria 10 families.
When designing with the EP3SL340F1760C3N, verify the FBGA ball pattern against your PCB footprint - the 1760-ball package is unique to this device family. Quartus II software is required for synthesis, place-and-route, and configuration bitstream generation; legacy designs may also use the older Quartus subscription. Provide at least eight PCB decoupling capacitors around the device and follow Intel's Stratix III L Hardware Reference Manual for power-sequencing requirements.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations that go beyond the manufacturer datasheet, giving engineers a one-stop reference for selecting, sourcing, and laying out the EP3SL340F1760C3N.
Drop-in-Alternativen für EP3SL340F1760C3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SL340F1760C3N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Speed Grade, Package, Embedded Memory Bits, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SL340F1760C3
✅ Drop-In✓ Auf Lager
$12480 / Stück
Datenblatt ansehen →EP3SL340F1760C2
✅ Drop-In✓ Auf Lager
$18500 / Stück
Datenblatt ansehen →EP3SL340F1760I3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3150 / Stück
Datenblatt ansehen →EP3SL340F1760C4N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1820 / Stück
Datenblatt ansehen →EP3SL340F1517C3N
✅ Drop-In✓ Auf Lager
$3750 / Stück
Datenblatt ansehen →EP3SL340F1760C3G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP3SL340F1760C3N Grenzwerte & elektrische Eigenschaften
| Family | Stratix III L |
| Series | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory (bits) | 18,822,144 |
| Total Memory Bits | 18,822,144 |
| Number of LABs/CLBs | 13,500 |
| Number of I/O | 1120 |
| Gehäuse | 1760-BBGA, FCBGA |
| Montageart | Surface Mount |
| Betriebstemperatur | 0C to +85C |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Maximum Operating Frequency | 500 MHz |
| RoHS-Status | Compliant |
| Manufacturer | Intel / Altera |
EP3SL340F1760C3N 1760-bbga, fcbga Pinbelegungsleitfaden
Pinbelegung für EP3SL340F1760C3N (1760-bbga, fcbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SL340F1760C3N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SL340F1760C3N ist geeignet für 6 Anwendungs: High-Definition Video Broadcast, Medical Imaging Systems, Military Signal Intelligence (SIGINT), High-Frequency Trading Accelerator, Multi-Port Network Switching / NPUs, Industrial Test & Measurement.
High-Definition Video Broadcast
The EP3SL340F1760C3N's 337,500 LEs and 18.8 Mbit embedded SRAM make it ideal for HD-SDI video broadcast infrastructure. The FPGA can process 4-8 channels of uncompressed 3G-SDI video simultaneously, performing real-time color-space conversion, frame-rate adaptation, and overlay compositing with deterministic latency. The wide 1120-I/O bus exposes enough pins for parallel SDI deserializer/serializer interfaces without external muxing, while dedicated DSP blocks accelerate chroma-key blending and motion-adaptive deinterlacing. Stratix III L's 65 nm low-power silicon keeps chassis thermal envelopes manageable in master-control switchers and broadcast encoder racks.
Empfohlen
Medical Imaging Systems
In diagnostic imaging modalities such as CT, MRI, and ultrasound front-ends, the EP3SL340F1760C3N serves as a real-time beamformer and image-processing engine. The 337K LEs execute FIR filter banks, Hilbert transforms, and envelope-detection pipelines at sample frequencies above 200 MHz, while 18.8 Mbit embedded memory holds line buffers and lookup tables for windowing and log-compression. Industrial temperature grading (0C to +85C) supports cart-based ultrasound enclosures. The wide user-I/O count accommodates 16-32 channel ADC interfaces at LVDS rates, reducing or eliminating external buffer logic.
Empfohlen
Military Signal Intelligence (SIGINT)
The EP3SL340F1760C3N is well matched to wideband SIGINT receivers requiring real-time FFT processing across hundreds of MHz of instantaneous bandwidth. Its DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput, ideal for channelization, pulse compression, and direction-finding algorithms. 18.8 Mbit of embedded memory supports sliding-window FFTs and overlap-save convolution without spilling to external DDR. The 1760-BGA package accommodates 1120 user I/Os for parallel ADC/DAC links and high-speed serial transceivers up to 6.375 Gbps for sensor aggregation. Designers typically combine the FPGA with external ADC/DAC companion chips for the RF front-end.
Empfohlen
High-Frequency Trading Accelerator
Latency-sensitive HFT gateways leverage the EP3SL340F1760C3N's 500 MHz fabric to accelerate market-data parsing, order-book maintenance, and FIX/protocol serialization in hardware. The deterministic 65 nm logic fabric delivers sub-microsecond tick-to-trade latency at lower power than software stacks. Embedded M9K/M144K blocks store per-symbol order books in on-die memory, while 1120 user I/Os fan out to multiple 10 G Ethernet MACs and PCIe Gen2 endpoints. The low-power Stratix III L bin keeps per-card power below typical switch-fabric ASIC envelopes, enabling dense co-location deployments.
Empfohlen
Multi-Port Network Switching / NPUs
Network processing units built around the EP3SL340F1760C3N handle L2-L4 classification, deep-packet inspection, and QoS scheduling for 10G/40G aggregation switches. The 337K LEs map to multiple parallel pipeline stages that sustain 40 Gbps line rate even with complex ACL lookups. 18.8 Mbit on-die SRAM holds TCAM-equivalent hash tables and flow counters, reducing external memory accesses. The 1760-BGA exposes enough I/Os for multi-lane SFP+/QSFP cages alongside Interlaken or SPI4.2 fabric interfaces, replacing legacy ASIC NPUs with programmable logic.
Empfohlen
Industrial Test & Measurement
Automated Test Equipment (ATE) and high-channel-count oscilloscopes rely on the EP3SL340F1760C3N for timing-critical waveform generation and correlation. The FPGA drives hundreds of LVDS pattern-generator pins while the DSP fabric executes real-time FFT, eye-diagram analysis, and protocol-decode algorithms. 18.8 Mbit embedded SRAM caches deep acquisition memory windows, and 1120 user I/Os support mixed-signal test pin electronics. The 0C to +85C operating range and robust Stratix III L silicon ensure 24/7 production-floor reliability across temperature-cycled environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SL340F1760C3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SL340F1760C3 | EP3SL340F1760C2 | EP3SL340F1760C4N | EP3SL340F1760I3N | EP3SL340F1517C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-BBGA, FCBGA | 1760-BBGA, FCBGA (same) | 1760-BBGA, FCBGA (same) | 1760-BBGA, FCBGA (same) | 1760-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (different footprint) |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits |
| Speed Grade | C3 | C3 | C2 (slower) | C4 (faster) | I3 (industrial temp) | C3 |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| Lead-Free / RoHS | Yes (N suffix) | Finish variant | Yes | Yes | Yes | Yes |
| Quartus II Support | Yes (v13.1 and earlier) | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Highest-density Stratix III L member with 337.5K LEs (vs. EP3SL200F1760C3N)
- Low-power Stratix III silicon at 1.1 V core (vs. EP3SE260F1760C3N)
- C3 speed grade balances timing margin and cost (vs. EP3SL340F1760C2)
Designhinweise
Estimated: Stratix III L FPGAs draw significant transient current during configuration and at clock edges. Place at least 8 to 12 low-ESR 0.1 uF and 10 uF decoupling capacitors within 5 mm of the FBGA-1760 balls, distributed across VCCINT (1.1 V), VCCAUX, and VCCIO banks. Use a 4-layer PCB with dedicated power planes; voltage-regulator ripple must stay below 30 mV peak-to-peak on VCCINT to meet jitter specifications. Power sequencing per the Stratix III L Hardware Reference Manual (VCCINT before VCCAUX before VCCIO) is mandatory.
Estimated: With 337,500 LEs running at 500 MHz, junction temperature can approach 95C under worst-case vectors. The 1760-BGA exposes the die through the package substrate, so attach a heatsink via thermal interface material (TIM) and ensure at least 400 LFM airflow in chassis designs. Designers targeting 0C to +85C ambient should budget junction-to-ambient theta-JA of approximately 8-12 C/W with the recommended heatsink; verify in-situ with on-die temperature diode.
The 1760-ball FBGA package has a 1.0 mm or 0.8 mm pitch - confirm the exact pitch from the Altera package symbol before PCB layout. Use microvia-in-pad or stacked-via technology to fan out inner balls, with via-in-pad plating filled and capped to prevent solder wicking. Match differential-pair lengths within 5 mils for high-speed transceiver lanes and reference-clock traces; impedance-controlled stack-up (typically 50 ohm SE / 100 ohm diff) is mandatory for rates above 1 Gbps.
Do not assume the EP3SL340F1760C3N bitstream is interchangeable with the EP3SL340F1760C4N bitstream - speed-grade differences alter timing-closure behavior. Verify JTAG chain integrity before configuring in production; the 1760-BGA exposes TCK/TMS/TDO/TDI on dedicated configuration pins that share a bank with user I/O and must be left floating or pulled per the handbook. Finally, install Quartus II 13.0sp1 or 13.1 final patch before generating bitstreams; later Quartus versions dropped Stratix III support.
Compliance-Informationen
N-suffix indicates lead-free (Pb-free) finish and RoHS compliance per Altera product page. Halogen-free status not confirmed in provided data.
