EP3SL340F1517C3N - Stratix III L FPGA, 337.5K LE, 1517-FCBGA | Altera
Teilenummer: EP3SL340F1517C3N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4850 | $4.850,00 |
| 10 | $4600 | $46.000,00 |
| 100 | $4250 | $425.000,00 |
| 250 | $3980 | $995.000,00 |
| 500 | $3750 | $1.875.000,00 |
EP3SL340F1517C3N Übersicht
An FPGA (Field Programmable Gate Array) is a programmable logic device containing configurable logic blocks (LABs), embedded memory, DSP blocks, and routing resources that the designer wires up using a hardware description language. FPGAs sit in the wider taxonomy as programmable logic devices → semiconductor ICs → integrated circuits, and offer ASIC-like performance with NRE-free, fast-turn development. The Stratix III family uses Altera's adaptive logic module (ALM) architecture, which folds 8-input fracturable look-up tables into a flexible logic element that improves effective density and reduces dynamic power versus prior Stratix generations.
Key features include 337,500 logic elements organized into 13,500 LABs, 18.8 Mbits of embedded RAM (triple-port M9K and M144K blocks), dedicated DSP blocks for high-throughput multiplication-accumulation, up to 24 transceivers (speed grade and package dependent) for multi-gigabit serial I/O, and hard memory controllers. The 1517-ball FC-BGA package supports the highest I/O count and richest transceiver density in the Stratix III L family, and integrates a serial digital temperature-sensing diode for on-board thermal management.
The -3N speed grade balances timing margin and Fmax (industry-standard notation where lower speed-grade numbers are slower, higher numbers faster); -3 is the fastest commercial grade in Stratix III L, and the N suffix denotes lead-free / RoHS-compliant ball metallurgy. Combined with 1.1 V core, it allows significant static and dynamic power reductions compared with Stratix II, while preserving the transceiver bandwidth and DSP throughput needed for baseband processing, video pipeline, and high-speed bridging.
Typical applications include wireline telecom line cards, software-defined radio (SDR), ASIC prototyping, broadcast video processing, and high-performance DSP coprocessors. The dense embedded memory and wide datapath make the EP3SL340F1517C3N well suited to packet buffering and FEC (forward error correction) in 100G-class networking platforms, as well as medical-imaging reconstruction engines and radar signal pre-processing.
When designing with this part, pay close attention to PCB stack-up and power-tree planning: the 1517-ball FC-BGA requires microvia or via-in-pad technology, the core and I/O banks each need their own decoupling strategy, and Quartus II (or newer Intel Quartus Prime) power analysis should be run early to size the switching regulator for the dynamic load profile. Transceiver channels must be routed with controlled-impedance differential pairs and length-matched within the budget defined by the protocol (PCIe, Serial RapidIO, CEI-6G, etc.).
This page synthesizes Stratix III L distributor pricing, same-package alternatives, and PCB-level design notes that go beyond the device datasheet and Quartus II device handbook content.
Drop-in-Alternativen für EP3SL340F1517C3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SL340F1517C3N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SL340F1517C3
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP3SL340F1517C2N
✅ Drop-In✓ Auf Lager
$13200 / Stück
Datenblatt ansehen →EP3SL340F1517C2
✅ Drop-In✓ Auf Lager
$3050 / Stück
Datenblatt ansehen →EP3SE260F1517C3N
✅ Drop-In✓ Auf Lager
$9850 / Stück
Datenblatt ansehen →EP3SE260F1517C3
✅ Drop-In✓ Auf Lager
$10800 / Stück
Datenblatt ansehen →EP3SL200F1517C3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP3SL340F1517C3N Grenzwerte & elektrische Eigenschaften
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Embedded Memory Bits | 18,822,144 bits (18.8 Mbit) |
| Maximum User I/O Pins | 976 |
| Process Technology | 65 nm CMOS, low-power |
| Core Voltage (VCCINT) | 1.1 V |
| Maximum Core Frequency | 500 MHz |
| Speed Grade | -3 (fastest commercial) |
| Gehäuse | 1517-ball FC-BGA |
| Package Code | F1517 |
| Betriebstemperatur | 0 C to 85 C (commercial) |
| RoHS-Status | Compliant (lead-free ball metallurgy, N suffix) |
| Montageart | Surface Mount (FC-BGA) |
EP3SL340F1517C3N f1517 Pinbelegungsleitfaden
Pinbelegung für EP3SL340F1517C3N (f1517-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SL340F1517C3N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SL340F1517C3N ist geeignet für 6 Anwendungs: Telecom Line Card / 100G Networking, Software Defined Radio (SDR) Baseband, ASIC Prototyping Platform, Broadcast Video Processing, Medical Imaging Reconstruction, Radar Signal Pre-Processing.
Telecom Line Card / 100G Networking
The EP3SL340F1517C3N's 337,500 logic elements and 18.8 Mbit embedded memory suit it for 100G-class packet processing on telecom line cards. Its Tri-speed Ethernet MACs and the ability to instantiate wide packet buffers in M9K/M144K blocks enable cut-through forwarding at line rate. Designers typically place this FPGA between the PHY and the network processor to handle classification, FEC, and traffic management. The -3 speed grade closes timing at 500 MHz for core logic, and the F1517 FC-BGA exposes enough I/O to interface to multiple QSFP28 cages with parallel side-band signaling. Power estimation in Quartus II is critical because total dissipation can exceed 20 W at full utilization, requiring a solid thermal strategy.
Empfohlen
Software Defined Radio (SDR) Baseband
The EP3SL340F1517C3N's DSP blocks and high logic density make it well suited for SDR baseband processing across cellular, military radio, and public-safety waveforms. The Stratix III L family delivers strong DSP block performance per mW, allowing LTE and DVB-S2X channelization, FFT/iFFT computation, and turbo decoding within a single device. Transceivers available on the F1517 package (speed grade dependent) interface directly to ADCs and DACs at multi-GSample rates. The wide embedded memory pool supports long-channel equalizer buffers and HARQ scratchpad storage. Engineers typically pair the FPGA with external RF front-ends and use Quartus II DSP Builder to accelerate model-based design of inner-receiver loops.
Empfohlen
ASIC Prototyping Platform
The EP3SL340F1517C3N is widely used as an ASIC prototype vehicle because its 337,500 logic elements and 18.8 Mbit embedded memory can host multi-million-gate ASIC RTL with high utilization. The Stratix III L architecture supports high gate-to-LE ratios when designs use Altera-friendly memory inference and DSP inference, allowing engineers to validate SoC designs before tape-out. The F1517 FC-BGA exposes enough I/O for prototyping multi-bus ASIC interfaces including DDR3, PCI Express, and Serial RapidIO. Partitioning a large ASIC across multiple FPGAs uses the dedicated ALM architecture to balance logic and routing pressure. Quartus II multi-FPGA partition flows handle top-level chip-to-chip timing closure.
Empfohlen
Broadcast Video Processing
Broadcast video pipelines for 4K/UHD contribution links leverage the EP3SL340F1517C3N's wide datapath and 18.8 Mbit embedded RAM. Designers instantiate multi-stream SDI de-/embedders, color-space converters, and frame-rate conversion engines entirely in the FPGA fabric. The embedded memory supports multiple video line buffers needed for deinterlacing and motion-adaptive noise reduction, while DSP blocks accelerate motion-vector estimation. The F1517 FC-BGA exposes enough I/O for quad-link 3G-SDI or 12G-SDI interfaces, with dedicated transceivers used for HDMI 2.0 and SMPTE ST-2059 PTP timestamping. Total system power is bounded by Stratix III L's low-static-power ALM architecture.
Empfohlen
Medical Imaging Reconstruction
The EP3SL340F1517C3N's combination of high logic density, DSP performance, and wide memory supports CT and MRI back-projection and iterative-reconstruction pipelines. The 18.8 Mbit embedded memory pool is large enough to host projection sinograms and intermediate slice data, while DSP blocks accelerate parallel back-projection kernels at sub-second rates. The FPGA interfaces to high-speed LVDS ADC arrays used in CT detector modules through the F1517 FC-BGA's user I/O. Designers use Quartus II OpenCL to port host-side reconstruction code to FPGA kernels, shortening development cycles. Low-leakage Stratix III L behavior keeps thermal envelope manageable in clinical-grade equipment.
Empfohlen
Radar Signal Pre-Processing
Military and weather-radar front-ends use the EP3SL340F1517C3N for pulse compression, MTI filtering, and CFAR detection in the FPGA fabric. The 18.8 Mbit embedded memory supports long coherent-integration buffers needed for sensitivity gain, and the DSP blocks handle FIR matched filters and FFT/iFFT for Doppler processing. The -3 speed grade closes timing at 500 MHz on critical MTI stages, while the F1517 FC-BGA exposes enough I/O for parallel ADC and DAC links. Designers frequently pair this device with analog front-ends covering S-band through X-band. The Stratix III L low-power architecture reduces cooling requirements in airborne and maritime radar enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SL340F1517C3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SL340F1517C3 | EP3SL340F1517C2N | EP3SL340F1517C2 | EP3SE260F1517C3N | EP3SE260F1517C3 | EP3SL200F1517C3N |
|---|---|---|---|---|---|---|---|
| Package | F1517 (1517-ball FC-BGA) | F1517 (1517-ball FC-BGA) - same | F1517 (1517-ball FC-BGA) - same | F1517 (1517-ball FC-BGA) - same | F1517 (1517-ball FC-BGA) - same | F1517 (1517-ball FC-BGA) - same | F1517 (1517-ball FC-BGA) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E | Stratix III E | Stratix III L |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 254,400 (-24.7%) | 254,400 (-24.7%) | 200,000 (-40.8%) |
| Speed Grade | -3 (fastest) | -3 | -2 (~25% slower) | -2 (~25% slower) | -3 | -3 | -3 |
| Embedded Memory | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 14,135,040 bits | 14,135,040 bits | 11,310,720 bits |
| RoHS Compliance | Yes (N suffix, lead-free) | No (no N suffix) | Yes | No | Yes | No | Yes |
| Approx. Unit Price (USD, qty 1) | 4850.00 | 4750.00 (slight discount, non-RoHS) | 4200.00 (lower speed grade) | 4100.00 | 3650.00 | 3550.00 | 2850.00 |
Wichtigste Unterscheidungsmerkmale
- Highest logic density in Stratix III L family with F1517 FC-BGA (vs. EP3SL200F1517C3N)
- Lowest-power Stratix III variant (vs. EP3SE260F1517C3N)
- Fastest commercial speed grade available (vs. EP3SL340F1517C2N)
Designhinweise
The 1517-ball FC-BGA package requires microvia or via-in-pad PCB technology for breakout; standard through-via stack-ups will not work because the 1.0 mm ball pitch exceeds the manufacturability of laser-drilled microvias on standard 4-layer stacks. Use an 8-layer or higher stack-up with sequential lamination to break out the inner rows of balls. Decoupling must follow Stratix III handbook guidelines: 0.1 uF and 0.01 uF X7R capacitors at every VCCINT/VCCD_PLL ball pair within 100 mil, plus bulk polymer and ceramic capacitors on each supply rail.
Estimated: at 0.85 V VCCINT and 80% logic utilization, total core current for the EP3SL340F1517C3N approaches 15-20 A. Designers should size the switching regulator with a 30% margin and use a Powertrain/VCCP rail for I/O banks that toggles independently. Early Quartus II PowerPlay analysis is essential before committing to the PCB stack-up, because a thermally undersized solution will throttle the design or require a heatsink that exceeds mechanical constraints.
Transceiver channels on the F1517 package must be routed as 100-ohm differential pairs with length matching within the budget defined by the target protocol (PCIe Gen2 = 150 mil, CEI-6G = 50 mil). Use a stripline layer between continuous ground planes for the longest runs to control EMI, and stitch the BGA return-path ground with sufficient vias to keep the via-stub resonance above the data-rate Nyquist frequency. Avoid routing transceiver channels across plane splits.
Do not assume that Stratix III L is forward-compatible with newer Quartus Prime versions beyond the legacy support window: as of 2026, Quartus Prime 21.1 is the last officially supported version for Stratix III L compilation. Engineers porting to newer Intel FPGAs must re-validate IP cores and constraint files. Also avoid mixing speed-grade variants on the same JTAG chain without re-checking BSDL files, because device IDs differ across speed grades.
Compliance-Informationen
RoHS compliance inferred from N suffix per Altera/Intel part numbering convention. Halogen-free status not specified in the provided distributor data. AEC-Q100 not applicable for commercial-grade FPGA.
