EP4CGX30CF23I7 - Cyclone IV GX FPGA, 29K LE, 484-FBGA | Intel
Teilenummer: EP4CGX30CF23I7 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72 | $720,00 |
| 100 | $65.8 | $6.580,00 |
| 500 | $60.2 | $30.100,00 |
| 1.000 | $55.1 | $55.100,00 |
EP4CGX30CF23I7 Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks such as transceivers, memory controllers, and PLLs. FPGAs belong to the broader category of programmable logic devices (PLDs) and sit within the digital IC family. Unlike fixed-function ASICs, FPGAs are hardware-reconfigurable after manufacture, enabling rapid prototyping and field upgrades.
Key features of the EP4CGX30CF23I7 include 1,840 Configurable Logic Blocks (CLBs), 1,105,920 bits of embedded RAM, four phase-locked loops, and up to 290 user I/O pins. The device contains up to eight 3.125 Gbps transceivers on the GX family, hard memory controllers, and supports Cyclone IV configuration schemes including JTAG, AS, PS, and FPP modes with optional on-chip AES encryption.
Architecture-wise, the Cyclone IV GX family combines a logic fabric of 4-input look-up tables (4-LUTs) with embedded multiplier blocks, memory LABs, and physical coding sublayers (PCS) for the transceiver channels. The 60nm low-power process node allows static power consumption as low as 25 mW per channel, optimized for thermally constrained embedded systems.
Typical applications span industrial video bridging, machine vision, USB 3.0 controllers, low-cost PCIe endpoints, broadcast video conversion, and wireless remote radio heads. The wide operating temperature range (-40C to +100C industrial grade, denoted by the I7 suffix) supports factory-floor and outdoor deployments.
When designing with this part, ensure transceiver reference clocks meet the datasheet jitter specification for reliable link operation. The 484-FBGA requires a 1.0mm ball pitch and at least 6 PCB layers for power/ground integrity; verify signal-integrity simulations for 3.125 Gbps channels before finalizing layout.
This page synthesizes XAIPART distributor pricing, drop-in compatible variants from the same Cyclone IV GX family, and PCB layout guidance beyond the manufacturer datasheet.
Drop-in-Alternativen für EP4CGX30CF23I7 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CGX30CF23I7 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Speed Grade, Transceivers, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CGX30CF23I7N
✅ Drop-In✓ Auf Lager
$41.2 / Stück
Datenblatt ansehen →EP4CGX30CF23C7N
✅ Drop-In✓ Auf Lager
$71.59 / Stück
Datenblatt ansehen →EP4CGX30CF19I7N
✅ Drop-In✓ Auf Lager
$76.4 / Stück
Datenblatt ansehen →EP4CGX30BF14I7N
✅ Drop-In✓ Auf Lager
$65.8 / Stück
Datenblatt ansehen →EP4CGX30CF23C8N
✅ Drop-In✓ Auf Lager
$60.55 / Stück
Datenblatt ansehen →EP4CGX30BF14I7N
✅ Drop-In✓ Auf Lager
$65.8 / Stück
Datenblatt ansehen →EP4CGX30CF23I7 Grenzwerte & elektrische Eigenschaften
| Family | Cyclone IV GX |
| Logic Elements (LE) | 29,440 |
| Configurable Logic Blocks (CLB) | 1,840 |
| Embedded Memory | 1,105,920 bits |
| User I/O Pins | 290 |
| Transceivers | Up to 8 channels, 3.125 Gbps |
| PLLs | 4 |
| Global Clocks | 20 |
| Maximum Operating Frequency | 472.5 MHz |
| Process Technology | 60nm low-power |
| Core Voltage | 1.2 V |
| Gehäuse | 484-ball FBGA (F23) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch |
| Betriebstemperatur | -40C to +100C (Industrial, I7) |
| Configuration Modes | JTAG, AS, PS, FPP |
| AES Encryption Support | Yes |
EP4CGX30CF23I7 23 x 23 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP4CGX30CF23I7 (23 x 23 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CGX30CF23I7.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CGX30CF23I7 ist geeignet für 6 Anwendungs: Industrial Protocol Bridge (EtherCAT / PROFINET), Machine Vision Camera Interface, Low-Cost PCIe Endpoint Card, Broadcast Video Format Conversion, Wireless Remote Radio Head (RRH) Digital Front End, USB 3.0 Peripheral Controller Bridge.
Industrial Protocol Bridge (EtherCAT / PROFINET)
The EP4CGX30CF23I7 is well suited for industrial protocol bridging between EtherCAT, PROFINET, and legacy fieldbus networks. Its 29,440 logic elements provide ample headroom for deterministic real-time processing of network packets, while the integrated 3.125 Gbps transceivers support high-speed industrial Ethernet uplinks with minimal external PHY components. The industrial -40C to +100C temperature range ensures operation in factory-floor enclosures without derating. The device's four PLLs and 20 global clock networks enable jitter-clean recovery of synchronized time bases required by IEEE 1588 and PTP protocols. Companion MPNs include the TI DP83848 Ethernet PHY and Maxim MAX1302 industrial ADC for sensor aggregation backplanes.
Empfohlen
Machine Vision Camera Interface
In machine vision systems, the EP4CGX30CF23I7 serves as the FPGA preprocessor between image sensors (CoaXPress, Camera Link, LVDS) and host PCs. The 29,440 logic elements and M9K memory blocks handle Bayer-to-RGB demosaicing, color correction matrix (CCM), and hardware-accelerated region-of-interest (ROI) cropping. The eight 3.125 Gbps transceivers support multi-lane CoaXPress up to 6.25 Gbps aggregated, ideal for high-frame-rate industrial inspection cameras. The 290 user I/Os allow direct LVDS connection to image sensors without intermediate bridge chips. Pair with the TI LMH1980 sync separator for genlock and ON Semi MT9P031 image sensor for 5MP vision capture.
Empfohlen
Low-Cost PCIe Endpoint Card
The EP4CGX30CF23I7 includes a hard PCIe Gen1 IP block (x1 lane, 2.5 Gbps) that simplifies PCI Express endpoint design without consuming logic fabric for soft PHY implementation. With 29,440 logic elements, designers can implement custom DMA engines, register-based peripherals, or data acquisition pipelines while offloading PCIe transport to hardened logic. The integrated transceivers also support external PCIe Gen2 devices via parallel-up interface. The industrial temperature range suits PCIe cards in embedded servers and industrial PCs. Companion parts include the TI TPS74401 3A LDO for core rail and Micron MT41K256M16 memory for DMA buffering.
Empfohlen
Broadcast Video Format Conversion
The EP4CGX30CF23I7 handles SD-to-HD and HD-to-3G-SDI broadcast video upconversion with integrated audio embedding. Its 1,105,920 bits of embedded RAM buffer line-store interpolation for cross-conversion algorithms, while the transceiver channels support SDI (SMPTE 424M/425M) at 2.97 Gbps. With 290 user I/Os, the device interfaces directly to HDMI receivers, SDI equalizers, and audio ADCs without external glue logic. The industrial temperature grade enables deployment in broadcast equipment racks. Pair with the TI LMH0303 SDI driver and Cirrus Logic CS5343 audio ADC for complete broadcast I/O subsystems.
Empfohlen
Wireless Remote Radio Head (RRH) Digital Front End
For small-cell and pico-cell wireless infrastructure, the EP4CGX30CF23I7 implements CPRI and OBSAI fronthaul interfaces to baseband units. Its 3.125 Gbps transceivers support CPRI line bit rates up to option 3 (2.4576 Gbps) with margin for forward error correction. The device's digital upconversion (DUC) and crest factor reduction (CFR) blocks fit within the 29,440 LE budget alongside the CPRI framer. Industrial temperature rating ensures outdoor cabinet deployment. Pair with TI DAC38J84 16-bit 2.5 GSPS DAC and Analog Devices AD9371 integrated transceiver for complete RRH signal chains.
Empfohlen
USB 3.0 Peripheral Controller Bridge
The EP4CGX30CF23I7 implements USB 3.0 (5 Gbps) device controllers and bridging applications using the ULPI/UTMI+ interface to external USB PHY chips, while internal transceivers support higher-speed sideband channels. With 29,440 logic elements, designers can implement full USB stack, mass storage class, and HID interfaces within fabric. The industrial temperature range suits USB peripherals in harsh environments. Companion parts include the TI TUSB1310 USB 3.0 PHY and Microchip USB5744 USB 3.0 hub controller for downstream ports.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CGX30CF23I7 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CGX30CF23I7N | EP4CGX30CF23C7N | EP4CGX30CF23C8N | EP4CGX30CF19I7N | EP4CGX30BF14I7N |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (F23) | 484-ball FBGA (F23) | 484-ball FBGA (F23) | 484-ball FBGA (F23) | 484-ball FBGA (F19) | 169-ball FBGA (F14) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 |
| Transceivers | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | Up to 4 ch | None (Cyclone IV E) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C | -40C to +100C |
| Speed Grade | 7 (industrial) | 7 | 7 | 8 | 7 | 7 |
| RoHS Compliant (N suffix) | Yes (I7N) | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Higher transceiver channel count in F23 package (vs. EP4CGX30CF19I7N)
- Industrial temperature range vs commercial (vs. EP4CGX30CF23C7N)
- Hard PCIe Gen1 IP vs soft PCIe in Cyclone IV E (vs. EP4CGX30BF14I7N)
Designhinweise
The 484-ball FBGA (F23) package requires a 1.0 mm ball pitch footprint on the PCB. Design at least a 6-layer stack-up with dedicated ground and power planes; use of 4 layers is possible but requires careful power/ground stitching. Decoupling: place 0.1 uF X7R ceramics every 10 balls around the BGA periphery, plus bulk 10 uF and 100 uF tantalums near the FPGA core supply pins. Estimated: 60+ decoupling capacitors total for full F23 package.
The 3.125 Gbps transceiver channels require controlled-impedance differential routing (100 ohm differential, 85 ohm single-ended for SE interfaces). Maintain 8x dielectric thickness (H) spacing from reference plane to trace for microstrip, with trace length matching within 150 mils (3.8 mm). Reference the Cyclone IV GX handbook pin connection guidelines for PCB stackup recommendations. Estimated: total channel insertion loss budget ~6 dB at 3.125 Gbps requiring pre-emphasis or equalization.
The Cyclone IV GX family dissipates between 1.5 W (idle) and 5 W (full transceiver utilization). At full load with industrial temperature operation, the 484-ball FBGA typically requires 100-200 LFM airflow. For sealed enclosures, design a thermal pad connected to the central BGA ground balls and a copper heatsink. Estimated: theta_JA of approximately 18 C/W with proper thermal via array under the BGA.
Do not confuse F23 (484-ball) with F19 or F14 packages - the 'Fxx' suffix denotes the BGA ball count and pinout, not just a thermal variant. Mixing F23 and F19 silicon fails PCB bring-up. Also, ensure MSEL[2:0] pins are correctly configured for the desired configuration scheme (AS, PS, JTAG, FPP) before power-up; incorrect MSEL strapping causes configuration failure. Refer to the Cyclone IV device handbook configuration chapter for MSEL encoding.
Compliance-Informationen
EP4CGX30CF23I7N variant is RoHS compliant per Intel material declaration. EP4CGX30CF23I7 (without N suffix) is the legacy leaded version. Not AEC-Q100 qualified - this is an industrial-grade FPGA, not an automotive-grade part.