EPF10K130EBC356-3 - 130K Gate FLEX-10KE FPGA, 356-BGA | Altera
Teilenummer: EPF10K130EBC356-3 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $52.78 | $52,78 |
| 10 | $48.5 | $485,00 |
| 100 | $42.9 | $4.290,00 |
| 500 | $38.75 | $19.375,00 |
| 1.000 | $35.2 | $35.200,00 |
EPF10K130EBC356-3 Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, and I/O cells that the designer programs after manufacturing. FPGAs sit in the digital logic hierarchy above general-purpose microcontrollers and below Application-Specific Integrated Circuits (ASICs), offering hardware-level parallelism with on-the-fly reconfigurability. The FLEX-10KE family specifically pioneered the "embedded array" concept by integrating dedicated RAM blocks (EABs) alongside the general logic fabric, enabling System-on-a-Programmable-Chip implementations before the modern SoC FPGA era.
Key features include 130,000 typical gates, 8,192 logic elements, 274 maximum user I/O pins, 12 embedded array blocks (EABs) for memory, and PCI-compliant I/O support. The device offers 0.6 ns pin-to-pin propagation delay in the -3 speed grade, multiVolt I/O supporting 2.5 V/3.3 V/5.0 V mixed-voltage interfaces, and in-system programmability via IEEE 1149.1 (JTAG) boundary-scan. The 356-LBGA package provides high-density interconnect for memory-rich and bus-intensive designs.
The FLEX-10KE architecture combines a fine-grained logic fabric optimized for register-intensive datapaths with coarse-grained EABs (Embedded Array Blocks) that can be configured as 2 Kbit RAM, ROM, or FIFO. The lookup-table (LUT) based logic element, FastTrack interconnect, and continuous routing architecture deliver predictable timing closure. The -3 speed grade is the fastest of the FLEX-10KE family, targeting timing-critical applications such as PCI bus interfaces and high-speed glue logic.
Typical applications include telecommunications line cards, industrial control and automation, PCI bridge logic, video processing and display controllers, and legacy ASIC prototyping. The high I/O count and embedded memory make it especially suitable for data-path bridging and protocol conversion in telecom and industrial systems.
When designing with this FPGA, ensure the 2.5 V core rail is decoupled with 0.1 µF + 10 µF bulk capacitors near each supply pin, and route all configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK) away from switching I/O to avoid in-system programming glitches. Thermal management is straightforward thanks to the LBGA thermal pad; a minimum 4-layer PCB with a thermal via array under the exposed pad is recommended.
This page synthesizes distributor pricing, same-brand speed-grade and density alternatives, lifecycle status, and practical design notes not found in a single manufacturer datasheet — supporting both new designs and long-lifecycle maintenance of legacy FLEX-10KE systems.
Drop-in-Alternativen für EPF10K130EBC356-3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF10K130EBC356-3 (gleiche Bauform und Footprint) – abweichend in Process Technology, Operating Temperature, Package, Speed Grade, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF10K130EBC356-2
✅ Drop-In✓ Auf Lager
$185 / Stück
Datenblatt ansehen →EPF10K130EBC356-1
✅ Drop-In✓ Auf Lager
$95 / Stück
Datenblatt ansehen →EPF10K130EBC356-1N
✅ Drop-In✓ Auf Lager
$18.2 / Stück
Datenblatt ansehen →EPF10K130EBC356-1X
✅ Drop-In✓ Auf Lager
$132 / Stück
Datenblatt ansehen →EPF10K100EBC356-3
✅ Drop-In✓ Auf Lager
$62.5 / Stück
Datenblatt ansehen →EPF10K130EBC356-3 Grenzwerte & elektrische Eigenschaften
| Family | FLEX-10KE |
| Series | FLEX-10KE |
| Typical Gates | 130,000 |
| Logic Elements | 8,192 |
| Logic Array Blocks (LABs) | 832 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 24,576 bits (12 EABs × 2 Kbit) |
| Maximum User I/Os | 274 |
| Core Supply Voltage | 2.375 V to 2.625 V |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5.0 V (multiVolt I/O) |
| Pin-to-Pin Propagation Delay (-3 grade) | 0.6 ns |
| Betriebstemperatur | 0 °C to +70 °C (Commercial) |
| Gehäuse | 356-LBGA (35x35 mm) |
| Montageart | Surface Mount |
| Logic Family | CMOS |
| Process Technology | 0.22 µm SRAM-based CMOS |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) in-system programmable |
| Speed Grade | -3 (fastest) |
| RoHS-Status | Non-compliant (SnPb ball finish on legacy BGA) |
| Lead-Free | No |
| Lifecycle | Obsolete — last-time-buy / Rochester Electronics stock only |
EPF10K130EBC356-3 356-lbga (35x35 mm) Pinbelegungsleitfaden
Pinbelegung für EPF10K130EBC356-3 (356-lbga (35x35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF10K130EBC356-3.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF10K130EBC356-3 ist geeignet für 6 Anwendungs: Telecommunications Line Cards, Industrial Control and Automation, PCI Bridge and Bus Interface Logic, Video Processing and Display Controllers, ASIC Prototyping and Emulation, Legacy System Maintenance and Long-Life Programs.
Telecommunications Line Cards
The EPF10K130EBC356-3's 274 user I/Os and PCI-compliant drivers make it well-suited for telecom line-card glue logic, where the device bridges TDM buses, framer ICs, and network processors. Its 12 Embedded Array Blocks provide 24 Kbits of dual-port RAM for cell buffering and lookup-table storage, while the 0.6 ns Tpd at the -3 speed grade meets timing closure for 33 MHz PCI bus interfaces. The multiVolt I/O at 2.5/3.3/5 V interfaces directly to legacy telecom ASICs without level shifters, simplifying board layout and reducing BOM cost in legacy line-card designs.
Empfohlen
Industrial Control and Automation
The EPF10K130EBC356-3 handles deterministic control loops and high-speed I/O processing in industrial automation systems, where its 130K-gate capacity accommodates custom protocol stacks, motor-control state machines, and encoder interfaces. The 832 LABs provide abundant register-rich datapath resources for parallel I/O scanning, while EAB-based RAM implements message buffers and PID lookup tables. The commercial 0-70 °C temperature range suits factory-floor enclosures with controlled climate; for harsher environments, the EPF10K130EBC356-3N industrial variant extends coverage to -40 to +85 °C.
Empfohlen
PCI Bridge and Bus Interface Logic
The EPF10K130EBC356-3's PCI-compliant I/O drivers and 0.6 ns Tpd at the -3 speed grade support 33 MHz PCI bus bridge implementations with deterministic timing closure. Designers typically instantiate a custom PCI target or master core in the 130K-gate fabric, using the EAB-based RAM for configuration-space registers and FIFOs. The 274 user I/Os accommodate multiple bus interfaces (PCI + local + memory) on a single device, eliminating external bridge chips and reducing board complexity in legacy add-in cards and embedded systems.
Empfohlen
Video Processing and Display Controllers
The EPF10K130EBC356-3 supports video pipeline functions such as frame-rate conversion, overlay generation, and color-space conversion where its 832 LABs implement parallel pixel-processing datapaths and its 12 EABs buffer scan-line data. The 274 user I/Os accommodate wide video buses (24-bit RGB plus control) alongside memory interfaces to external SDRAM or SRAM frame buffers. Designers use the multiVolt I/O to interface directly to 3.3 V video DACs and 5.0 V sync logic, while the 0.6 ns Tpd keeps timing margins comfortable at pixel clocks up to 100 MHz.
Empfohlen
ASIC Prototyping and Emulation
The EPF10K130EBC356-3 serves as an ASIC prototyping vehicle where designers map pre-silicon RTL to the FLEX-10KE fabric to validate functionality, software drivers, and system integration before tape-out. The 130K-gate capacity accommodates medium-complexity ASIC blocks, while the embedded RAM models on-chip SRAMs. Engineers often partition a multi-FPGA ASIC prototype across several EPF10K130EBC356-3 devices, leveraging the 356-LBGA's high I/O count to interconnect emulation partitions with minimal external wiring and the -3 speed grade to maintain real-time emulation throughput.
Empfohlen
Legacy System Maintenance and Long-Life Programs
The EPF10K130EBC356-3 supports long-lifecycle maintenance of fielded systems in military, aerospace, and industrial-automation programs where the original FLEX-10KE-based design must continue operating for 15-25 years. Rochester Electronics is the primary authorized aftermarket source, holding bonded inventory of EPF10K130EBC356-3 units for call-off contracts. The -3 speed grade, 356-LBGA footprint, and standard 2.5 V core supply maintain bitstream compatibility with original designs, so field-replacement units require no firmware changes or timing reclosure.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF10K130EBC356-3 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF10K130EBC356-2 | EPF10K130EBC356-1 | EPF10K130EBC356-1N | EPF10K130EBC356-1X | EPF10K100EBC356-3 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 356-LBGA (35x35 mm) | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same |
| Typical Gates | 130,000 | 130,000 | 130,000 | 130,000 | 130,000 | 100,000 (-23%) |
| Logic Elements | 8,192 | 8,192 | 8,192 | 8,192 | 8,192 | 6,272 (-23%) |
| Speed Grade (Tpd) | -3 (~0.6 ns) | -2 (~0.7 ns, +17%) | -1 (~0.9 ns, +50%) | -1 (~0.9 ns, +50%) | -1 (~0.9 ns, +50%) | -3 (~0.6 ns, identical) |
| Maximum User I/Os | 274 | 274 | 274 | 274 | 274 | 274 |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial, Pb-free) | 0 °C to +70 °C (Commercial) |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS Compliance | Non-compliant | Non-compliant | Non-compliant | Non-compliant | Compliant (Pb-free) | Non-compliant |
Wichtigste Unterscheidungsmerkmale
- Fastest speed grade in the FLEX-10KE 130K-gate family (vs. EPF10K130EBC356-2)
- Higher logic density than the next-lower-density FLEX-10KE variant (vs. EPF10K100EBC356-3)
- Wider availability through Rochester Electronics' bonded inventory program (vs. EPF10K130EBC356-1N)
Designhinweise
The EPF10K130EBC356-3 requires a tightly regulated 2.5 V core supply (2.375-2.625 V) with peak transient current up to ~500 mA during configuration and high-utilization operation. Estimated: at 100% logic utilization with 274 switching I/Os at 33 MHz, ICC_core is approximately 300-450 mA. Place a 10 µF tantalum + 4.7 µF ceramic + 0.1 µF ceramic decoupling network within 5 mm of each VCC pin cluster. The 3.3 V/5.0 V VCCIO banks must be powered before or simultaneously with VCCINT to prevent I/O latchup; a Schottky diode or power-sequencer is recommended for hot-plug safety.
The 356-LBGA package has a theta_JA of approximately 12-15 °C/W with a properly designed thermal via array (estimated, depends on PCB stackup). Estimated: at 1.5 W total dissipation and 25 °C ambient, junction temperature rises 18-22 °C, well within the 125 °C maximum. For high-utilization designs exceeding 2 W, populate a full thermal-via array under the exposed pad and stitch thermal reliefs to internal copper planes on a 4-layer PCB. The commercial temperature grade limits operation to 0-70 °C ambient, derated by junction-to-ambient thermal resistance.
Use a minimum 4-layer PCB with continuous VCC and GND planes for the EPF10K130EBC356-3. The 356-LBGA uses 1.27 mm pitch — escape routing requires 0.2 mm (8 mil) traces with 0.2 mm spaces on the top layer, then via-down to inner BGA breakouts. Maintain 50 Ω controlled impedance on clock and high-speed I/O traces (nCONFIG, DCLK, CONF_DONE). Route all configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK) away from switching I/O to prevent in-system programming glitches. Provide a JTAG header (TCK, TMS, TDI, TDO) per IEEE 1149.1 for boundary-scan and programming access.
Three common pitfalls when migrating the EPF10K130EBC356-3 between speed grades: (1) the -3 (0.6 ns Tpd) and -1 (0.9 ns Tpd) share the same bitstream format, but timing closure fails if a design synthesized for -3 is loaded onto -1 — re-run timing analysis with Quartus II for the target speed grade; (2) mixing commercial (0-70 °C) and industrial (-40-85 °C) variants without checking the part marking causes field failures; (3) confusing the EPF10K100EBC356-3 (100K gates) with EPF10K130EBC356-3 (130K gates) on a BOM swap causes logic overflow — verify gate count via Quartus compilation report before substitution.
For 33 MHz PCI bus interfaces, maintain 65 Ω ±10% trace impedance (PCI specification) and keep PCI bus traces under 50 mm length with matched lengths within ±5 mm. Use series 33 Ω damping resistors on PCI clock nets within 15 mm of the EPF10K130EBC356-3. Enable PCI-compliant I/O drivers in the Quartus II pin planner (PCI-I/O standard). For LVTTL or LVCMOS interfaces above 50 MHz, apply series 22 Ω damping resistors on clock and strobe nets. IBIS models for the FLEX-10KE family are available from Intel's Altera literature archive for board-level signal-integrity simulation.
Compliance-Informationen
EPF10K130EBC356-3 uses SnPb (tin-lead) BGA balls per legacy Altera packaging standards, hence RoHS non-compliant. The -1X variant (EPF10K130EBC356-1X) is the Pb-free RoHS-compliant option. Reach, halogen-free, and conflict-mineral status not explicitly published in the available data. AEC-Q100 is not applicable to commercial-grade FPGAs; for automotive-grade, no FLEX-10KE variant is qualified — automotive designers must migrate to Cyclone IV/V.