IRS2334MTRPBF - 600V 3-Phase Gate Driver HVIC, 28-MLPQ | Infineon
Teilenummer: IRS2334MTRPBF ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.32 | $4,32 |
| 10 | $3.89 | $38,90 |
| 100 | $3.21 | $321,00 |
| 500 | $2.74 | $1.370,00 |
| 1.000 | $2.39 | $2.390,00 |
IRS2334MTRPBF Übersicht
A three-phase gate driver HVIC (high-voltage integrated circuit) is a semiconductor device that sits between low-voltage control logic (microcontroller, DSP, or FPGA) and the high-voltage power stage. It belongs to the family of gate driver ICs, which are categorized within power management and motor/power-conversion semiconductors. The HVIC integrates level shifting, bootstrap circuitry, and dead-time management so that three half-bridges can be driven from a single low-voltage supply.
The IRS2334MTRPBF features built-in shoot-through protection (preventing simultaneous turn-on of high-side and low-side switches in the same leg), undervoltage lockout (UVLO) for both VCC and VBS supplies, a typical 0.2 A source and 0.35 A sink gate-drive capability, and a 600 V absolute maximum offset voltage rating on the high-side channels. Its MLPQ-28 5x5 mm package exposes a thermal pad that lowers junction-to-ambient thermal resistance for high-frequency switching applications.
The IC is fabricated using Infineon's Gen5 HVIC process, which combines CMOS input logic with high-voltage level-shifting DMOS transistors. This monolithic approach eliminates the need for optocouplers or pulse transformers, providing 600 V transient isolation through the silicon itself and supporting switching frequencies up to the UVLO/impedance-limited boundary.
Typical applications include three-phase motor drives for HVAC compressors, fans, and pumps; industrial inverters; variable-frequency drives (VFDs); and switched-mode power-supply (SMPS) front-end stages. The device is also used in servo drives and small electric-vehicle traction inverters where space-constrained 28-MLPQ packaging is preferred.
When designing with the IRS2334MTRPBF, carefully select bootstrap diode and capacitor values based on switching frequency and high-side quiescent current. A common design pitfall is undersizing the bootstrap capacitor, which causes high-side UVLO tripping under continuous high-side-on conditions.
This page synthesizes distributor pricing, package-level pinout, drop-in compatible alternatives, and practical design notes not found in the standalone datasheet, helping engineers evaluate and source the IRS2334MTRPBF more efficiently.
Drop-in-Alternativen für IRS2334MTRPBF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit IRS2334MTRPBF (gleiche Bauform und Footprint) – abweichend in Package, Configuration, Number of Channels, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
IRS2334MPBF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
IRS2334MTRPBF
✅ Drop-In✓ Auf Lager
$2.39 / Stück
Datenblatt ansehen →IRS2334STRPBF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
IRS2334MTRPBF Grenzwerte & elektrische Eigenschaften
| Driver Type | Three-phase gate driver HVIC, non-inverting |
| Number of Channels | 6 (3 high-side + 3 low-side) |
| Configuration | Half-bridge (three-phase) |
| Offset Voltage (High-Side) | 600 V (max) |
| Gate Drive Source Current | 0.2 A (typical) |
| Gate Drive Sink Current | 0.35 A (typical) |
| Supply Voltage VCC | 10 V to 20 V |
| Bootstrap Supply VBS | Up to VCC + 600 V |
| Input Logic | Non-inverting, 3.3 V/5 V compatible |
| Shoot-Through Protection | Yes (built-in) |
| Undervoltage Lockout (UVLO) | Yes (VCC and VBS) |
| Betriebstemperaturbereich | -40C to +125C |
| Gehäuse | 28-MLPQ (5x5 mm) with thermal pad |
| Montageart | Surface Mount |
| Pin-Anzahl | 28 |
| RoHS-Status | Compliant |
IRS2334MTRPBF Pin-Konfiguration
| Pin 1 | HIN1 — Logic input for high-side gate driver 1 |
| Pin 2 | HIN2 — Logic input for high-side gate driver 2 |
| Pin 3 | HIN3 — Logic input for high-side gate driver 3 |
| Pin 4 | LIN1 — Logic input for low-side gate driver 1 |
| Pin 5 | LIN2 — Logic input for low-side gate driver 2 |
| Pin 6 | LIN3 — Logic input for low-side gate driver 3 |
| Pin 7 | FAULT — Fault indicator output (open-drain) |
| Pin 8 | RCIN — RC network input for deadtime adjustment |
| Pin 9 | VSS — Logic ground reference |
| Pin 10 | VCC — Low-side logic supply voltage (10-20 V) |
| Pin 11 | COM — Low-side gate driver return |
| Pin 12 | LO3 — Low-side gate drive output 3 |
| Pin 13 | LO2 — Low-side gate drive output 2 |
| Pin 14 | LO1 — Low-side gate drive output 1 |
| Pin 15 | VS3 — High-side source connection 3 (phase node C) |
| Pin 16 | VB3 — Bootstrap supply for high-side driver 3 |
| Pin 17 | HO3 — High-side gate drive output 3 |
| Pin 18 | VS2 — High-side source connection 2 (phase node B) |
| Pin 19 | VB2 — Bootstrap supply for high-side driver 2 |
| Pin 20 | HO2 — High-side gate drive output 2 |
| Pin 21 | VS1 — High-side source connection 1 (phase node A) |
| Pin 22 | VB1 — Bootstrap supply for high-side driver 1 |
| Pin 23 | HO1 — High-side gate drive output 1 |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
Typische Anwendungen
IRS2334MTRPBF ist geeignet für 6 Anwendungs: Three-Phase BLDC / PMSM Motor Drive, Industrial Variable-Frequency Drive (VFD), HVAC Compressor and Fan Inverter, Switched-Mode Power Supply (SMPS) Front-End PFC Stage, Servo Drive Power Stage, Solar Micro-Inverter and String Inverter.
Three-Phase BLDC / PMSM Motor Drive
The IRS2334MTRPBF directly drives six IGBT or MOSFET switches forming the three-phase bridge of a BLDC or PMSM motor inverter. Its six independent gate channels (3 high-side + 3 low-side), 0.35 A sink current, and integrated deadtime / shoot-through protection eliminate the need for discrete half-bridge drivers. The 600 V offset rating covers 400 V AC class motor systems. Placed between a 3.3 V/5 V MCU and the power bridge, with bootstrap capacitors on VB1/VB2/VB3, the IC provides compact motor control up to several kW.
Empfohlen
Industrial Variable-Frequency Drive (VFD)
The IRS2334MTRPBF is widely used as the central gate driver in industrial variable-frequency drives controlling three-phase AC induction motors. Its 600 V transient rating withstands 480 V rectified bus rails with switching transients, while the 0.35 A sink current ensures fast turn-off to minimize switching losses. The MLPQ-28 5x5 mm footprint with thermal pad supports high-frequency PWM operation without external heatsinking. Deadtime insertion and shoot-through logic protect the IGBT bridge from cross-conduction faults common in industrial environments.
Empfohlen
HVAC Compressor and Fan Inverter
Compact HVAC compressor and fan inverters benefit from the IRS2334MTRPBF's small 5x5 mm MLPQ footprint and integrated three-phase logic. The 0.2 A source and 0.35 A sink currents are sufficient for driving mid-power IGBTs in 1-5 kW compressor drives, while the device's -40C to +125C operating range supports outdoor HVAC equipment. Bootstrap architecture reduces external component count, and the built-in UVLO on VBS prevents high-side switching faults during low-line brownout conditions.
Empfohlen
Switched-Mode Power Supply (SMPS) Front-End PFC Stage
The IRS2334MTRPBF can drive the three-phase PFC or three-phase interleaved PFC front-end of a high-power SMPS or UPS. While optimized for motor drives, its six independent channels and 600 V rating adapt well to three-channel interleaved boost PFC converters above 5 kW. The integrated level shifting removes optocouplers from the high-voltage feedback path, improving loop bandwidth and long-term reliability versus discrete high-side driver designs.
Empfohlen
Servo Drive Power Stage
Industrial servo drives use the IRS2334MTRPBF to drive precision three-phase IGBT bridges controlling servo motors in CNC machines, robotics, and automation. Its fast propagation delay and tight channel-to-channel matching enable high-bandwidth current control loops essential for servo performance. The 0.35 A sink current handles high di/dt turn-off events, and the MLPQ-28 footprint allows compact PCB layout near the power stage for minimal parasitic inductance.
Empfohlen
Solar Micro-Inverter and String Inverter
The IRS2334MTRPBF is used in residential solar micro-inverters and small commercial string inverters converting DC panel output to grid-quality AC. The 600 V rating covers 400 V DC bus rails from 24-cell strings, and the three-phase output can be reconfigured as interleaved single-phase stages. Built-in deadtime and shoot-through protection minimize cross-conduction losses critical for high-frequency PWM solar conversion efficiency.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für IRS2334MTRPBF – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | IRS2334MPBF | IRS2334MTRPBF | IRS2334STRPBF |
|---|---|---|---|---|
| Package | 28-MLPQ (5x5 mm) | 28-MLPQ (5x5 mm) - same | 28-MLPQ (5x5 mm) - same | 28-MLPQ (5x5 mm) - same |
| Brand | Infineon | Infineon | Infineon | Infineon |
| Maximum Offset Voltage | 600 V | 600 V | 600 V | 600 V |
| Source Current | 0.2 A (typ) | 0.2 A (typ) | 0.2 A (typ) | 0.2 A (typ) |
| Sink Current | 0.35 A (typ) | 0.35 A (typ) | 0.35 A (typ) | 0.35 A (typ) |
| Number of Channels | 6 (3 high + 3 low) | 6 (3 high + 3 low) | 6 (3 high + 3 low) | 6 (3 high + 3 low) |
| Shoot-Through Protection | Yes | Yes | Yes | Yes |
| Packaging Format | Tape & Reel | Tube / Tray | Tape & Reel (alternate orientation) | Tape & Reel |
Wichtigste Unterscheidungsmerkmale
- Compact 5x5 mm MLPQ-28 with integrated thermal pad (vs. IR2130STRPBF (28-SOIC))
- Gen5 HVIC silicon with integrated shoot-through protection (vs. IR2130SPBF (older IR-gen silicon))
- 0.35 A sink current enables fast turn-off (vs. IRS2332SPBF)
Designhinweise
Estimated: VCC supply current consumption is approximately 5-10 mA for quiescent operation plus gate charge current per channel. At 20 kHz switching frequency driving 50 nC Qg IGBTs, total VCC supply current reaches approximately 60-80 mA (3 high-side + 3 low-side active). Use a low-ESR bypass capacitor of at least 1 uF ceramic plus 10 uF bulk on VCC, placed within 5 mm of the VCC pin. VBS bootstrap capacitors (typically 1-10 uF ceramic) must be sized per switching frequency to prevent high-side UVLO dropout during long high-side on-times.
The 28-MLPQ package has an exposed thermal pad (pin 29) that MUST be soldered to a copper pour on the PCB for rated thermal performance. Without the thermal pad soldered, theta_JA increases dramatically and the device may thermally limit at high switching frequencies. Recommended layout: minimum 1 square inch (645 mm^2) of 2 oz copper on top and bottom layers connected via 4-9 thermal vias (0.3 mm diameter) directly under the exposed pad. At full 0.35 A sink current and 20 kHz switching, junction temperature rise is approximately 30-40 C above ambient with proper copper.
Keep the high-side VS (phase) traces short and wide to minimize parasitic inductance that causes voltage overshoot above the 600 V absolute maximum rating. Add 100 nF to 1 uF ceramic bypass capacitors directly at each VB-VS bootstrap pair, within 2-3 mm of the package pins. Route input logic signals (HIN1/2/3, LIN1/2/3) away from high-side switching traces; cross only at 90 degrees if necessary. Connect VSS and COM to a single ground star point to avoid ground-loop noise that could falsely trigger UVLO.
Common design pitfalls include: (1) undersizing bootstrap capacitors causing high-side UVLO trips under sustained high-side-on duty cycle, (2) omitting the bootstrap diode, which must be a fast-recovery or Schottky type rated above the bus voltage, (3) exceeding the 600 V transient rating due to insufficient snubber or clamp on the phase node, and (4) driving HIN/LIN with logic signals above VCC + 0.3 V or below VSS - 0.3 V which can latch up the input ESD structure. Always reference the manufacturer datasheet's bootstrap design guidelines and timing diagrams before PCB layout.
Compliance-Informationen
RoHS compliant per Infineon product page. Not AEC-Q100 qualified - for automotive applications, contact Infineon for qualified HVIC alternatives in the same package family.
