IW611UK - Dual-band Wi-Fi 6 + BT 5.4 SoC | NXP
Teilenummer: IW611UK ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.79 | $6,79 |
| 10 | $6.32 | $63,20 |
| 100 | $5.86 | $586,00 |
| 500 | $5.45 | $2.725,00 |
| 1.000 | $5.1 | $5.100,00 |
IW611UK Übersicht
A Wi-Fi SoC (System-on-Chip) is an integrated circuit that combines a wireless network radio, baseband modem, MAC, and often a host interface into a single package. Within the RF and wireless hierarchy, it sits alongside other connectivity devices such as standalone Bluetooth controllers and combo modules, and forms the physical-layer foundation of IoT gateways, smart home nodes, and industrial edge devices.
Key features include concurrent dual-band 2.4/5 GHz operation at 1x1 Wi-Fi 6, Bluetooth 5.4 dual-mode (BR/EDR classic plus Low Energy), and a high level of on-chip integration that reduces the external BOM. Wi-Fi 6 technology brings OFDMA, higher modulation efficiency, and improved coexistence behavior in dense RF environments compared with Wi-Fi 4/5 devices.
The IW611 architecture integrates the complete RF front end for both bands, digital baseband processing, and memory in the 140-XFBGA WLCSP package, minimizing board area for space-constrained designs. The single-chip approach removes the need for a separate Bluetooth controller, cutting system cost and simplifying certification.
Typical applications include smart home devices and accessories, smart appliances, smart energy meters, industrial automation nodes, and IoT gateways. The dual-band radio supports robust 5 GHz operation in congested 2.4 GHz environments typical of apartments and factories.
Designers should plan antenna matching and RF layout per the NXP reference design, and confirm the correct orderable suffix (A1IZ, A1CZ, A1ITZ, A1IAZ) for firmware and temperature grade requirements.
This page synthesizes distributor pricing, drop-in same-family alternatives, pinout availability, and practical design notes not found in the manufacturer datasheet, providing a complete sourcing and engineering reference for the IW611UK.
Drop-in-Alternativen für IW611UK – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
IW611UK/A1IZ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
IW611UK/A1CZ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
IW611UK/A1ITZ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
IW611UK/A1IAZ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
IW611UK Technische Daten
| Product Type | 2.4/5 GHz dual-band 1x1 Wi-Fi 6 + Bluetooth 5.4 single-chip solution |
| Wi-Fi Standard | 802.11ax (Wi-Fi 6), 1x1 SISO |
| Operating Bands | 2.4 GHz and 5 GHz |
| Bluetooth Version | Bluetooth 5.4 / Bluetooth Low Energy 5.4 |
| Bluetooth Topology | Dual-mode (BR/EDR + LE) |
| Gehäuse | 140-XFBGA, WLCSP |
| Montageart | Surface Mount |
| Kategorie | RF Transceiver IC |
| Target Applications | Smart home, smart appliances, smart energy, industrial automation, gateways, IoT |
| Integration Level | Highly integrated single-chip (RF transceiver + baseband) |
| System Benefit | Very low system cost and low system power via high integration |
IW611UK 140-xfbga, wlcsp Pinbelegungsleitfaden
Pinbelegung für IW611UK (140-xfbga, wlcsp-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für IW611UK.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
IW611UK ist geeignet für 6 Anwendungs: Smart Home Devices and Accessories, Smart Appliances, Smart Energy Metering, Industrial Automation Nodes, IoT Gateways, Smart Device Accessories and Wearables-Adjacent Hubs.
Smart Home Devices and Accessories
The IW611UK fits smart home products because its 1x1 Wi-Fi 6 radio delivers adequate throughput for connected bulbs, plugs, sensors, and accessories while keeping BOM cost and power low. Dual-band 2.4/5 GHz operation lets devices avoid the crowded 2.4 GHz spectrum typical of homes with dozens of Wi-Fi clients, and OFDMA in Wi-Fi 6 improves latency when many small devices talk concurrently. Bluetooth Low Energy 5.4 provides out-of-band commissioning: a phone provisions the device over BLE first, then Wi-Fi credentials transfer to the IW611. Placed on a compact two-layer-to-four-layer board with the 140-XFBGA WLCSP footprint, the single-chip solution replaces separate Wi-Fi and BLE controllers, cutting cost and board area in space-limited accessory housings.
Empfohlen
Smart Appliances
Washers, refrigerators, ovens, and HVAC controllers need dependable cloud connectivity plus a simple local service interface, and the IW611UK addresses both in one chip. The 5 GHz band support matters in kitchens and laundry rooms where 2.4 GHz interference from microwaves and neighbor networks is severe; 802.11ax efficiency keeps telemetry reliable in dense multi-apartment buildings. BLE 5.4 enables technician setup apps and end-user pairing without a display. The highly integrated single-chip design of the IW611 reduces component count on long-lifecycle appliance boards where reliability and vendor continuity matter, and NXP's industrial market focus supports multi-year supply planning. Firmware selection across the A1IZ/A1CZ/A1ITZ suffixes lets appliance makers match security and feature requirements per product tier.
Empfohlen
Smart Energy Metering
Smart energy meters and gateway nodes benefit directly from the IW611's dual-mode Bluetooth 5.4 and dual-band Wi-Fi 6 combination. BLE periodic advertising enhancements in 5.4 support utility-grade commissioning and data broadcast to phones or drive-by readers, while Wi-Fi 6 backhaul pushes metering data to head-end systems over either 2.4 GHz (range) or 5 GHz (interference immunity). The single-chip integration keeps meter BOM cost low - a critical constraint at utility volumes of hundreds of thousands of units - and the WLCSP 140-ball package fits compact meter form factors. NXP explicitly lists smart energy as a target market for the IW611, and distributor stock (3500+ units reported) supports volume procurement through standard channels.
Empfohlen
Industrial Automation Nodes
On factory floors, RF congestion is the dominant wireless challenge, and the IW611UK mitigates it by operating 1x1 Wi-Fi 6 in the 5 GHz band where industrial 2.4 GHz noise from legacy equipment is absent. OFDMA scheduling reduces latency jitter for sensor nodes reporting to edge gateways, and BLE 5.4 handles maintenance-tool connectivity and beacon-based asset identification. The chip's high integration lowers the cost of deploying hundreds of nodes per line, and low system power suits battery or energy-harvesting sensors. Designers should follow the NXP reference RF layout for the 140-XFBGA WLCSP and plan conformal coating compatible with chip-scale packaging. Industrial-grade suffix selection should be verified against the datasheet ordering table.
Empfohlen
IoT Gateways
Compact IoT gateways use the IW611UK as the Wi-Fi 6 client or soft-AP radio plus a BLE provisioning/management channel. As a Wi-Fi uplink, the 1x1 dual-band radio delivers sufficient throughput for sensor aggregation, while Wi-Fi 6 airtime efficiency keeps the gateway responsive when many leaf nodes contend. As BLE 5.4 controller, it accepts commissioning from mobile apps and supports local beaconing for asset tracking. The single-chip design replaces a two-chip Wi-Fi + BLE architecture, reducing gateway PCB area and cost - important in wall-plug and DIN-rail form factors. Design trade-off: 1x1 SISO limits peak throughput, so for camera-heavy or high-bandwidth gateways, evaluate NXP 2x2-class combo devices instead and accept the higher cost and power.
Empfohlen
Smart Device Accessories and Wearables-Adjacent Hubs
Accessories that bridge personal devices to the home network - streaming dongles, fitness-hub bases, camera bridges - match the IW611UK's profile: 1x1 Wi-Fi 6 provides modern-standard connectivity at accessory price points, dual-band operation avoids Wi-Fi congestion near entertainment centers, and Bluetooth 5.4 classic plus LE handles pairing with phones and speakers. The WLCSP 140-ball package minimizes height and footprint for slim accessory enclosures, and NXP's emphasis on very low system cost enables aggressive retail price targets. Because BLE handles the first-time setup UX, the accessory needs no physical network jack or provisioning button matrix. Engineers should budget RF matching components per the NXP datasheet reference design and confirm antenna placement for metal-adjacent housings.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für IW611UK – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | IW611UK/A1IZ | IW611UK/A1CZ | IW611UK/A1ITZ | IW611UK/A1IAZ |
|---|---|---|---|---|---|
| Package | 140-XFBGA, WLCSP | 140-XFBGA, WLCSP - same | 140-XFBGA, WLCSP - same | 140-XFBGA, WLCSP - same | 140-XFBGA, WLCSP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Wi-Fi Standard | Wi-Fi 6 (802.11ax), 1x1 | Wi-Fi 6 (802.11ax), 1x1 | Wi-Fi 6 (802.11ax), 1x1 | Wi-Fi 6 (802.11ax), 1x1 | Wi-Fi 6 (802.11ax), 1x1 |
| Bluetooth Version | Bluetooth 5.4 / BLE 5.4 | Bluetooth 5.4 / BLE 5.4 | Bluetooth 5.4 / BLE 5.4 | Bluetooth 5.4 / BLE 5.4 | Bluetooth 5.4 / BLE 5.4 |
| Operating Bands | 2.4 GHz / 5 GHz dual-band | 2.4 GHz / 5 GHz dual-band | 2.4 GHz / 5 GHz dual-band | 2.4 GHz / 5 GHz dual-band | 2.4 GHz / 5 GHz dual-band |
| Firmware/Grade Suffix | Per orderable suffix ordered | A1IZ firmware/grade | A1CZ firmware/grade | A1ITZ firmware/grade | A1IAZ firmware/grade |
| Drop-in Compatible | Yes (within IW611 family) | Yes - pin-to-pin identical | Yes - pin-to-pin identical | Yes - pin-to-pin identical | Yes - pin-to-pin identical |
Wichtigste Unterscheidungsmerkmale
- Wi-Fi 6 (802.11ax) at combo-SoC cost (vs. IW611UK/A1IZ)
- Bluetooth 5.4 dual-mode in one die (vs. IW611UK/A1CZ)
- Suffix flexibility without respin (vs. IW611UK/A1ITZ)
Designhinweise
The IW611UK uses a 140-ball XFBGA wafer-level chip-scale package (WLCSP), where the die expansion during solder reflow must be accommodated by the land pattern. Follow the NXP reference land pattern from the IW611 datasheet and the associated NXP hardware design application note exactly - do not scale pad geometry. Keep RF traces to the antenna (2.4/5 GHz) at 50 ohm impedance with a solid ground reference, and place the pi-matching network close to the antenna feed so the exact matching can be tuned per antenna choice.
Wi-Fi TX bursts create fast load-current transients on the supply rails. Decouple each supply pin of the IW611 per the datasheet reference design - typically bulk capacitance plus 100 nF ceramics placed within 2 mm of the balls - and use a DC-DC or LDO with adequate transient response rated for the Wi-Fi PA burst current specified in the NXP datasheet. Poor decoupling manifests as degraded EVM and reduced sensitivity, especially on the 5 GHz band, and can fail regulatory spurious-emission masks.
Ordering the wrong suffix is the most common IW611 pitfall: A1IZ, A1CZ, A1ITZ, and A1IAZ share the same silicon and package but differ in firmware image and grade options, so a mismatch can mean the device boots without the expected feature set or temperature rating. Verify the suffix against the NXP ordering-information table before releasing the BOM. Additionally, confirm BT/Wi-Fi coexistence firmware configuration early - concurrent BT and Wi-Fi traffic requires the NXP coexistence scheme enabled in the driver stack.
Compliance-Informationen
Compliance data not present in the verified web data retrieved on 2026-10-10. Confirm RoHS/REACH status on the official NXP IW611UK product page (https://www.nxp.com/part/IW611UK) or NXP's product compliance portal.
