KGM03CR50J225MH - 2.2µF 6.3V X5R MLCC 0201 | KYOCERA AVX
Teilenummer: KGM03CR50J225MH ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0.16 | $0,16 |
| 10 | $0.14 | $1,40 |
| 100 | $0.12 | $12,00 |
| 500 | $0.1 | $50,00 |
| 1.000 | $0.08 | $80,00 |
| 5.000 | $0.06 | $300,00 |
KGM03CR50J225MH Übersicht
An MLCC (multilayer ceramic chip capacitor) is a passive component built from alternating thin layers of ceramic dielectric and internal metal electrodes, terminated with nickel-barrier solder coatings for surface mounting. MLCCs sit within the broader capacitor taxonomy of ceramic capacitors -> capacitors -> passive components. The 0201 case (0.6mm x 0.3mm) is the smallest EIA standard MLCC footprint and is critical for decoupling and bulk storage in mobile, wearable, and IoT designs where PCB area is severely constrained.
Key features of the KGM03CR50J225MH include its 6.3V DC rated voltage (suitable for downstream-of-LDO rails on 3.3V or 5V systems), a high 2.2µF capacitance value in the 0201 case (a notable density achievement), X5R dielectric which provides stable capacitance across the operating temperature range, and ±20% tolerance (the J suffix per KYOCERA AVX coding). The nickel-barrier terminations support lead-free reflow profiles up to 260°C peak, in compliance with RoHS and REACH directives.
The X5R dielectric delivers volumetric efficiency superior to X7R or Y5V in this small case size, but trades absolute stability for size - capacitance can drop 15-25% under DC bias near the rated voltage, a phenomenon called DC bias derating. For noise-sensitive analog nodes, designers should evaluate capacitance at the actual DC operating point, not the nominal 2.2µF.
Typical applications include decoupling of low-power SoC power pins, bulk hold-up on wearables and hearables, filter capacitors in compact sensor modules, and bypass on Bluetooth Low Energy and Nordic-style MCUs. It is especially suited to mobile phones, smart watches, hearing aids, and other space-constrained consumer devices.
When designing with this part, follow standard MLCC PCB layout practice: use the recommended 0201 land pattern, minimize trace inductance between the capacitor and the IC power pin, and consider DC bias derating in worst-case voltage conditions. Avoid mechanical stress on the ceramic body.
This page synthesizes distributor pricing, parametric drop-in alternatives, and engineering application notes beyond what is available on the KYOCERA AVX datasheet, helping engineers select and source this part with confidence.
Drop-in-Alternativen für KGM03CR50J225MH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
02016D225MAT2A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
KGM03CR50J225MN
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
GRM033R60J225ME15D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CL03A225KP3NNNC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CGA0603X5R225M
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EMK063ABJ225KP-F
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
KGM03CR50J225MH Grenzwerte & elektrische Eigenschaften
| Capacitance | 2.2 µF |
| Capacitance Tolerance | ±20% |
| Rated Voltage (DC) | 6.3 V |
| Dielectric Characteristic | X5R |
| Gehäuse / Bauform | 0201 (0603 Metric) |
| EIA Size Code | 0201 |
| Montageart | Surface Mount (SMD/SMT) |
| Betriebstemperaturbereich | -55°C to +85°C |
| Termination Style | Nickel barrier with solder coating |
| Temperature Coefficient | X5R (±15% over -55°C to +85°C) |
| Packaging | Tape & Reel (T/R) |
| MSL-Level | 1 (unlimited floor life) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Construction | Multilayer ceramic chip with internal electrodes |
| Polarity | Non-polarized |
| Manufacturer Series | KGM Series (KYOCERA AVX MLCC) |
KGM03CR50J225MH 0201 (0603 metric) Pinbelegungsleitfaden
Pinbelegung für KGM03CR50J225MH (0201 (0603 metric)-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für KGM03CR50J225MH.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
KGM03CR50J225MH ist geeignet für 6 Anwendungs: Smartphone SoC Power Decoupling, Wearable and Hearable Bulk Hold-Up, Bluetooth Low Energy Module Decoupling, IoT Sensor Module Bypass, Hearing Aid Miniaturized Filtering, Compact Medical Patch Power Decoupling.
Smartphone SoC Power Decoupling
The KGM03CR50J225MH is ideally suited for high-density decoupling of smartphone application-processor power pins, where PCB area near the SoC is severely constrained. With 2.2µF of bulk capacitance in the 0201 (0.6mm x 0.3mm) footprint, this AVX part delivers roughly 12 µF per cm² when placed in tight grids, allowing designers to meet 100+ µF total bulk requirements on the core voltage rail without expanding the keep-out zone around the SoC. The 6.3V rating covers downstream-of-LDO 0.8V-3.3V rails. X5R dielectric provides stable capacitance across the mobile operating range of -20°C to +70°C. Engineers pair this part with smaller 0.1µF 0201 MLCCs for high-frequency decoupling; the 2.2µF bulk handles transient load steps during camera burst or 5G PA ramp events.
Empfohlen
Wearable and Hearable Bulk Hold-Up
Inside true-wireless earbuds, smart watches, and fitness bands, the KGM03CR50J225MH provides compact bulk capacitance for hold-up time during BLE radio bursts and sensor sampling events. The 0201 case occupies minimal board space on flex or rigid-flex PCBAs common in wearables, while the 2.2µF / 6.3V rating supports single-cell Li-ion (3.7V-4.2V) regulated rails at 3.3V or 1.8V. The X5R dielectric retains usable capacitance across body-temperature operating conditions up to 40°C. Compared to a tantalum alternative, this AVX part eliminates polarity concerns and reduces height profile to under 0.35mm, critical for earbud form factors. Designers typically place 4-8 of these in parallel near the battery-management IC for low-frequency energy storage complementing higher-frequency decoupling.
Empfohlen
Bluetooth Low Energy Module Decoupling
The KGM03CR50J225MH is widely used to decouple the power pins of Bluetooth Low Energy SoCs such as Nordic nRF52-series and similar low-power wireless MCUs. The 2.2µF bulk capacitance supports TX current peaks up to 7-15 mA during radio events, smoothing the battery rail to maintain a clean VDD for the radio core. The 0201 footprint suits ultra-compact BLE modules where the entire PCB is often under 10mm x 15mm. The 6.3V rating is well above typical BLE supply voltages of 1.8V-3.6V, providing ample margin. The part's X5R dielectric and -55°C to +85°C range accommodate both indoor and outdoor IoT deployments. Pair this bulk MLCC with 0.1µF and 10nF 0201 high-frequency decoupling capacitors.
Empfohlen
IoT Sensor Module Bypass
The KGM03CR50J225MH serves as effective bypass capacitance for compact IoT sensor modules integrating MEMS accelerometers, gyroscopes, pressure sensors, or environmental sensors on a single PCB. The 2.2µF bulk capacitance stabilizes the sensor supply rail against digital-activity transients from the host MCU, while the 0201 case allows placement directly under or adjacent to BGA-style sensor packages. The 6.3V rating covers 3.3V and 1.8V sensor rails from Li-ion or coin-cell-derived LDOs. X5R dielectric maintains stable capacitance across the typical -10°C to +60°C IoT operating envelope. Multi-sensor modules often use 4-6 of these parts per board, distributed near analog and digital supply pins.
Empfohlen
Hearing Aid Miniaturized Filtering
In behind-the-ear and in-canal hearing aids where total PCB area may be under 50mm², the KGM03CR50J225MH provides 2.2µF of capacitance for power-rail decoupling on the digital DSP, wireless audio receiver, and Class-D amplifier stages. The 0201 case (0.6mm x 0.3mm x 0.3mm) is small enough to place inside the battery compartment area, maximizing use of the tiny enclosure. The 6.3V rating is well above the 1.0V-3.6V rails used in modern hearing aid designs. Compared to tantalum or polymer alternatives, this AVX MLCC eliminates polarity constraints and reduces height profile. Designers typically populate 2-3 of these per hearing aid alongside lower-value 0201 MLCCs for RF and audio frequency decoupling.
Empfohlen
Compact Medical Patch Power Decoupling
The KGM03CR50J225MH supports miniaturized medical patch designs such as continuous-glucose monitors, ECG patches, and disposable biosensors where the entire electronics assembly may fit on a 20mm x 30mm flex PCB. The 2.2µF bulk capacitance in the 0201 case supports the regulated rails powering low-power MCUs, BLE radios, and sensor analog front ends. The 6.3V rating covers single-cell Li-polymer (3.7V-4.2V) derived 3.3V or 1.8V rails. The X5R dielectric retains stable capacitance across body-worn operating temperatures of 32°C-42°C. AVX's qualification under the KGM series includes reliability data suitable for medical applications, though formal ISO 13485 qualification is at the OEM level. Designers use 3-5 of these parts distributed across the patch electronics.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für KGM03CR50J225MH – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 02016D225MAT2A | KGM03CR50J225MN | GRM033R60J225ME15D | CL03A225KP3NNNC | CGA0603X5R225M | EMK063ABJ225KP-F |
|---|---|---|---|---|---|---|---|
| Brand | KYOCERA AVX | KYOCERA AVX | KYOCERA AVX | Murata Manufacturing | Samsung Electro-Mechanics | TDK | Taiyo Yuden |
| Package | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) | 0201 (0603 Metric) |
| Capacitance | 2.2 µF | 2.2 µF | 2.2 µF | 2.2 µF | 2.2 µF | 2.2 µF | 2.2 µF |
| Rated Voltage (DC) | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V |
| Dielectric | X5R | X5R | X5R | X5R | X5R | X5R | X5R |
| Tolerance | ±20% | ±20% | ±20% | ±20% | ±10% | ±20% | ±10% |
| Operating Temperature | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C | -55°C to +85°C |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Highest-density 0201 2.2µF 6.3V MLCC in the KYOCERA AVX KGM series (vs. 02016D225MAT2A)
- Cross-brand sourcing flexibility in identical 0201 footprint (vs. GRM033R60J225ME15D (Murata))
- Tighter ±10% tolerance option not available from KYOCERA AVX in this KGM part (vs. CL03A225KP3NNNC (Samsung))
Designhinweise
Use the KYOCERA AVX recommended 0201 land pattern from the datasheet to avoid tombstoning and solder-joint stress. Recommended pad dimensions are approximately 0.30mm x 0.40mm with 0.20mm spacing. Place the capacitor as close as physically possible to the IC power pin - trace inductance of even 1-2 nH will degrade high-frequency decoupling effectiveness. Use a single ground via adjacent to the negative pad to minimize parasitic inductance.
Estimated: at the 6.3V rated voltage, this X5R 2.2µF MLCC can lose 15-25% of its nominal capacitance due to DC bias derating. At 5V operation the effective capacitance drops to roughly 1.7-1.9µF, and at 3.3V approximately 1.9-2.1µF. Always evaluate decoupling margin at the actual operating DC voltage, not the nominal 2.2µF nameplate value. If your design needs the full 2.2µF at 6.3V, consider a higher voltage rating part or a different dielectric.
The 0201 case is mechanically fragile. Avoid placing the capacitor in high-stress PCB regions such as board edges, near mounting screws, or under heavy components. For boards subject to drop testing (wearables, hearables, mobile devices), use underfill or corner staking per IPC-9701 if the part sits in a high-flex area. Hand-soldering 0201 parts requires hot-air or precision iron techniques; reflow is strongly preferred.
Compliance-Informationen
RoHS and REACH compliant per KYOCERA AVX KGM series documentation. Halogen-free status not explicitly stated in the verified datasheet - marked unknown. Not AEC-Q100 qualified; this is a commercial/industrial-grade passive component. Lead-free reflow compatible to 260°C peak per JEDEC J-STD-020.
