KMPC8321CVRADDC - PowerPC e300c2 MPU 266MHz 516-PBGA | NXP
Teilenummer: KMPC8321CVRADDC ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $88.4 | $88,40 |
| 10 | $79.5 | $795,00 |
| 100 | $71.2 | $7.120,00 |
| 500 | $65.8 | $32.900,00 |
| 1.000 | $62.4 | $62.400,00 |
KMPC8321CVRADDC Übersicht
What is a PowerQUICC MPU? A PowerQUICC (pronounced 'powerquick') microprocessor is a class of Power-Architecture communications processors derived from NXP/Freescale's MPC8xx family, designed around integrated communications peripherals such as Ethernet MACs, PCI, and HDLC channels. In the system hierarchy, the KMPC8321 sits under 'microprocessor -> communications processor -> embedded MPU -> semiconductor IC' and is intended to consolidate a CPU plus communications I/O onto a single die for networking appliances.
Key features of the KMPC8321CVRADDC include the PowerPC e300c2 core with MMU and dual-issue capability, a 32-bit PCI 2.3 controller, dual 10/100 Ethernet MACs (one of which is MII/RMII-capable), USB 2.0 (Full-Speed) interface, DDR1/DDR2 SDRAM controller, local bus interface (8/16/32-bit with NAND flash support), four DMA channels, two I2C controllers, two UARTs, and serial peripheral interfaces. The integrated security engine accelerates DES, 3DES, AES, and SHA/MD5 hashing.
Architecturally the device uses a 266 MHz core feeding a 32-bit peripheral bus and the integrated peripherals are clocked from independent peripheral clocks synchronized via internal PLLs. The on-chip caches (16 KB instruction / 16 KB data) and the integrated DDR memory controller allow zero-wait-state external memory access in typical embedded configurations, while the BGA package exposes both high-speed peripheral balls and memory/PCI bus balls.
Typical applications include small-form-factor routers and gateways, networked attached storage (NAS) controllers, industrial Ethernet bridges, multi-channel VoIP/IP-PBX cards, line cards for access equipment, and printer/scanner MFP controllers where PCI plus Ethernet plus DDR are needed on one chip.
When designing with the KMPC8321CVRADDC, follow NXP's hardware design guide for the 516-PBGA - the package requires a multi-layer (typically 6+ layer) PCB with controlled-impedance routing for DDR/PCI, matched-length Ethernet pairs, and extensive thermal vias under the die. Plan power sequencing carefully because the DDR interface requires VTT termination that is referenced to VDDQ.
This page synthesizes distributor inventory, drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für KMPC8321CVRADDC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit KMPC8321CVRADDC (gleiche Bauform und Footprint) – abweichend in Mounting Type, Core, Core Architecture, Ethernet, Memory Controller.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8321CVRADDC
✅ Drop-In✓ Auf Lager
$20.75 / Stück
Datenblatt ansehen →MPC8321CVRADDCA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8323CVRADDC
✅ Drop-In✓ Auf Lager
$26.4 / Stück
Datenblatt ansehen →MPC8321EZQAFF
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8321ECVRAFD
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
KMPC8321CVRADDC Grenzwerte & elektrische Eigenschaften
| Family | PowerQUICC (MPC83xx) |
| Core | PowerPC e300c2 (32-bit, single-core) |
| Core Frequency | 266 MHz |
| Gehäuse | 516-PBGA (27 mm x 27 mm) |
| Memory Controller | DDR1/DDR2 SDRAM controller with ECC |
| L1 Cache | 16 KB instruction / 16 KB data |
| PCI Interface | PCI 2.3, 32-bit, up to 66 MHz |
| Ethernet | 2x 10/100 Mbps MAC (MII/RMII) |
| USB | USB 2.0 Full-Speed (12 Mbps) device/host |
| Local Bus | 8/16/32-bit, NAND Flash support |
| DMA Channels | 4 |
| I2C / UART / SPI | 2x I2C, 2x UART, 1x SPI |
| Security Engine | DES / 3DES / AES / SHA / MD5 accelerator |
| Montageart | Surface Mount (BGA) |
KMPC8321CVRADDC 516-pbga (27 mm x 27 mm) Pinbelegungsleitfaden
Pinbelegung für KMPC8321CVRADDC (516-pbga (27 mm x 27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für KMPC8321CVRADDC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
KMPC8321CVRADDC ist geeignet für 6 Anwendungs: Small-Office / Home-Office Router and Gateway, Industrial Ethernet Bridge / Protocol Converter, Network-Attached Storage (NAS) Controller, Multi-Channel VoIP / IP-PBX Media Card, Multi-Function Printer (MFP) / Scanner Controller, Aerospace / Avionics Databus Bridge.
Small-Office / Home-Office Router and Gateway
The NXP KMPC8321CVRADDC is purpose-built for SOHO routers and integrated gateway designs. It combines a 266 MHz PowerPC e300c2 core with dual 10/100 Ethernet MACs (MII/RMII), a 32-bit PCI 2.3 port, DDR1/DDR2 controller with ECC, and full-speed USB, providing the entire routing/datapath subsystem on a single IC. The DDR SDRAM controller connects to a 16-bit-wide DDR DIMM or discrete DDR for embedded routing tables, the Ethernet MACs each drive an external PHY to expose two LAN/WAN ports, and USB Full-Speed supports legacy DSL modem dongles. Using the MPC8321's integrated peripherals eliminates an external Ethernet switch IC, reducing BOM cost and PCB area in fanless SOHO enclosures; the trade-off is single-core throughput so this part suits up to ~100 Mbps NAT routing rather than multi-Gigabit firewalls.
Empfohlen
Industrial Ethernet Bridge / Protocol Converter
Industrial networks requiring fieldbus-to-Ethernet bridges benefit from the KMPC8321CVRADDC's ARM-style deterministic interrupt response and integrated peripherals. The two 10/100 Ethernet MACs convert between Profinet-Modbus-TCP layers, while the four DMA channels offload bulk protocol translation without CPU intervention. The e300c2 core's MMU plus the integrated security engine (DES/3DES/AES) enable on-bridge encryption/decryption for IT-OT segmentation; the wide local bus (8/16/32-bit, NAND-flash-capable) allows direct interface to legacy fieldbus ASICs without a bridge PLD. The commercial temperature grade (0 to +70°C) suits a sealed control cabinet, and the 1 mm pitch BGA tolerates vibration-tolerant underfills in factory-floor MTBF environments - a fanless heatsink is generally sufficient given the 266 MHz core running at modest voltage.
Empfohlen
Network-Attached Storage (NAS) Controller
Entry-level NAS appliances use the KMPC8321CVRADDC as the system-on-chip: the 266 MHz e300c2 core runs Linux/embedded-NAS OS, the DDR1/DDR2 controller (with ECC) holds the in-memory FS cache, and the 32-bit PCI 2.3 port attaches a SATA or hardware-RAID card for spinning disks. The integrated USB 2.0 Full-Speed host supports front-panel copy buttons, the local bus interfaces to NOR/NAND boot flash, and the two Ethernet MACs offer a dedicated management port and a data port without an external switch. Hardware RAID-5/6 acceleration is NOT on-chip (use an external IOP or RAID controller over PCI), so this suits 2-4 bay consumer/SMB NAS rather than enterprise arrays. Power dissipation is dominated by the external PHYs and disk controller; the MPC8321 itself typically burns 2.5-3 W at full tilt.
Empfohlen
Multi-Channel VoIP / IP-PBX Media Card
Carrier-grade VoIP line cards built around the KMPC8321CVRADDC leverage its HDLC and time-division-multiplexing FCC channels to bridge T1/E1 framers with Ethernet. The e300c2 core plus its MMU runs a Linux media gateway stack (Asterisk, FreeSWITCH); the PCI 2.3 port connects to a DSP daughter card for codec acceleration, the two Ethernet MACs backhaul SIP/RTP, and the local bus reaches registers on the TDM framers. Hardware-based encryption from the integrated security engine protects signaling traffic, and ECC on DDR keeps soft-state reliable. The commercial temp range matches climate-controlled telecom closets; for outdoor cabinets verify against NXP's industrial-grade sibling speed grades before deployment.
Empfohlen
Multi-Function Printer (MFP) / Scanner Controller
Office MFP controllers use the KMPC8321CVRADDC as the high-performance scanner-and-print engine controller, off-loading it from the main ARM SoC in higher-end devices. The e300c2 core runs PostScript/PDF rasterization, the dual Ethernet MACs deliver gigabit-class scan-to-email/FTP, USB Full-Speed supports legacy peripherals, the local bus drives a hardware image-pipeline FPGA, and the PCI port attaches an external ASIC for fax/Modem. ECC-backed DDR is essential for fault-tolerant scan buffers. The 27 x 27 mm BGA demands a 4-layer board minimum with thermal vias; commercial-grade 0 to +70°C is acceptable given MFP operating environments.
Empfohlen
Aerospace / Avionics Databus Bridge
Lower-tier avionics databus bridges (ARINC 429, MIL-STD-1553) use the KMPC8321CVRADDC alongside a dedicated transceiver ASIC. The wide local bus interfaces directly to an FPGA-based ARINC bridge, the Ethernet MACs deliver cockpit-to-cabin networking, and the PCI port brings in another avionics subsystem. The hardware AES/DES engine accelerates secure-comm telemetry; ECC-protected DDR retains integrity against single-event upsets when combined with radiation-mitigation by software scrubbing. Note: the commercial temperature variant is acceptable for pressurized cabin electronics; for harsh environments use an industrial-grade variant - this part is commercial-temp only, so filter BOM accordingly.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für KMPC8321CVRADDC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8321CVRADDC | MPC8321CVRADDCA | MPC8323CVRADDC | MPC8321EZQAFF | MPC8321ECVRAFD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27) | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same |
| Core | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 |
| Core Frequency | 266 MHz | 266 MHz | 266 MHz | 266 MHz | 266 MHz | 186 MHz (lower) |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC + DDR2-266 | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Ethernet MACs | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps | 2x 10/100 Mbps |
| PCI | PCI 2.3, 32-bit | PCI 2.3, 32-bit | PCI 2.3, 32-bit | PCI 2.3, 32-bit | PCI 2.3, 32-bit | PCI 2.3, 32-bit |
| Operating Temperature | 0 to +70°C (commercial) | 0 to +70°C | 0 to +70°C | 0 to +70°C | 0 to +70°C | 0 to +70°C |
Wichtigste Unterscheidungsmerkmale
- Direct catalog-aware prefix over generic catalog code (KMP vs MPC) (vs. MPC8321CVRADDC)
- Drop-in compatibility with the entire MPC8321/MPC8323 family in the same 516-PBGA 27x27 ballout (vs. MPC8323CVRADDC)
- Lower speed-grade MPC8321ECVRAFD is a drop-in alternative within the same package for power-sensitive designs (vs. MPC8321ECVRAFD)
Designhinweise
The NXP KMPC8321CVRADDC 516-PBGA dissipates roughly 2.5-3 W at 266 MHz with all peripherals active. A 4- or 6-layer PCB with thermal vias arranged in a 0.5 mm grid directly under the die is the standard NXP recommendation; running the part fanless at full throttle is feasible if the PCB has at least 50 cm² of 1 oz copper flood under and around the BGA. Estimate: at 3 W with theta_JA = ~18 C/W (datasheet typical) the junction rises ~54°C above 25°C ambient - within commercial-temp headroom.
Route DDR signals as 50 ohm single-ended microstrip with matched-length within ±25 mil and use VTT termination (typically 56 ohm to VDDQ/2). PCI signals require 90 ohm differential or 50 ohm single-ended, also length-matched. BGA fanout uses 4-mil trace/space microvia stackups on the inner layers, with via-in-pad recommended for the inner ring of balls. Decouple each VDD ball pair with 100 nF + 10 µF ceramic capacitors placed on the opposite side of the BGA.
Do not boot from DDR without first configuring the DDR controller registers via U-Boot or equivalent - the silicon default state of the DDR controller is undefined. Ensure that the JTAG TAP is accessible without removing nearby decoupling, and that the HRESET line holds during PLL configuration (~100 µs) before code execution. The KMP-vs-non-KMP catalog prefixes indicate minor silicon revs - re-validate bootloaders against the latest BSP from NXP.
Compliance-Informationen
RoHS / REACH / lead-free / halogen-free status was not provided in the verified web data; NXP PowerQUICC II parts are typically RoHS compliant for newer date codes (PCN 2006+). AEC-Q100 not applicable - this is a communications processor, not an analog IC.
