KMPC8323EVRAFDC - 333MHz PowerPC e300c2 MPU w/ Encryption | NXP
Teilenummer: KMPC8323EVRAFDC ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $77.5 | $775,00 |
| 100 | $70 | $7.000,00 |
| 500 | $64.5 | $32.250,00 |
| 1.000 | $59 | $59.000,00 |
KMPC8323EVRAFDC Übersicht
A communications processor is a system-on-chip designed for protocol-aware networking equipment, combining a CPU core, dedicated peripheral engines (such as encryption accelerators, DMA controllers, and serial interfaces), and on-chip memory to offload packet processing from a host processor. The MPC83xx family sits at the interface between networking ASICs and general-purpose CPUs in routers, switches, and secure gateways, delivering deterministic throughput for line-rate packet handling without the overhead of a desktop-class operating system.
Key features include the e300c2 core with MMU and floating-point support, QUICC Engine multi-channel communications controller for HDLC/PPP/T1/E1 framing, integrated security engine (SEC 2.0) for hardware-accelerated encryption, dual 10/100/1000 Ethernet MACs with SGMII support, DDR and DDR2 memory controller up to 333 MHz, four-channel DMA, PCI Express endpoint, and a wide range of connectivity peripherals (USB, UART, I2C, SPI, local bus). The 516-ball TEBGA (top-exposed-pad BGA) provides the pin density required for this highly integrated SoC.
Architecturally, the device combines a classic PowerPC superscalar core with NXP's QUICC Engine technology, which offloads serial communications, TDM, and ATM processing from the CPU. The SEC 2.0 crypto accelerator executes AES, 3DES, SHA-1/-256, and RSA workloads without CPU intervention, enabling multi-gigabit secure throughput for VPN gateways. The part is manufactured in a low-power CMOS process rated for industrial temperature operation.
Typical applications include industrial wired and wireless routers, secure VPN gateways, xDSL/cable modems, industrial control and SCADA networks with embedded security, and line-card controllers for multi-service access switches. The combination of CPU plus on-chip crypto engine plus two Gigabit Ethernet MACs makes it well suited to branch-office routers that must forward encrypted traffic at line rate.
When designing with this device, allocate PCB area for the 27x27 mm BGA with microvia or laser-drilled stacked via technology on inner layers; conventional 6-mil/8-mil via-in-pad is not always feasible below the BGA on standard 4-layer FR-4 stack-ups. Plan DDR2 termination, a flash footprint for U-Boot, and a JTAG header at board level, and verify that the firmware image (Freescale/NXP BSP) supports the EVRA security-engine driver interface.
This page synthesizes distributor pricing, same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für KMPC8323EVRAFDC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit KMPC8323EVRAFDC (gleiche Bauform und Footprint) – abweichend in RoHS Status, Memory Controller, Operating Temperature, Package, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8323EVRAFDC
✅ Drop-In✓ Auf Lager
$33.1 / Stück
Datenblatt ansehen →KMPC8323CVRAGDC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8323EVRAFC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
KMPC8323EVRAFDC Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Series | MPC83xx |
| Core | PowerPC e300c2 |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 333 MHz |
| Betriebstemperatur | 0C to +85C (commercial) / -40C to +125C (extended, package-dependent) |
| Gehäuse | 516-PBGA (27x27 mm, TEBGA, with encryption) |
| Montageart | Surface Mount |
| Memory Controller | DDR/DDR2 up to 333 MHz |
| Ethernet | Dual 10/100/1000 MAC (GMII/RGMII/TBI/SGMII) |
| Communications Controller | QUICC Engine with multi-channel HDLC/PPP/TDM |
| Security Engine | SEC 2.0 (DES, 3DES, AES, SHA, PKA) |
| PCI Express | PCIe endpoint (per datasheet variant) |
| DMA Channels | 4 channels |
| RoHS-Status | Compliant (NOPB suffix) |
| Pbfree / Lead-Free | Yes (PB-free per part suffix) |
| MSL-Level | 3 (per BGA handling) |
KMPC8323EVRAFDC 516-pbga (27x27 mm, tebga, with encryption) Pinbelegungsleitfaden
Pinbelegung für KMPC8323EVRAFDC (516-pbga (27x27 mm, tebga, with encryption)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für KMPC8323EVRAFDC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
KMPC8323EVRAFDC ist geeignet für 7 Anwendungs: Industrial Secure VPN Gateway, xDSL and Cable Modem Residential Gateways, Industrial Control and SCADA Networking, Line-Card Controller for Access Switches, Network Security Appliance, Wireless Backhaul Aggregation, Print Server and Industrial Imaging.
Industrial Secure VPN Gateway
The KMPC8323EVRAFDC's combination of a PowerPC e300c2 core running at 333 MHz and an integrated SEC 2.0 crypto engine makes it an excellent fit for industrial secure VPN gateways processing IPsec/SSL/TLS traffic at branch-office speeds. The SEC engine offloads DES, 3DES, AES, SHA-1/-256, and RSA operations from the core, leaving the e300c2 free for routing and firewall duties. The dual Gigabit Ethernet MACs (RGMII/SGMII) provide WAN aggregation plus LAN-facing interfaces, and the DDR2 controller streams packet data without bottlenecks at line rate. Typical deployment is a 100 to 500 Mbps site-to-site IPsec tunnel with simultaneous LAN connectivity, with the QUICC Engine handling TDM/serial side-channels for SCADA telemetry.
Empfohlen
xDSL and Cable Modem Residential Gateways
The MPC8323E's QUICC Engine multi-channel communications controller, dual Gigabit Ethernet, and security engine (KMPC8323EVRAFDC variant) are tailored to xDSL, cable, and fiber residential gateway designs where packet throughput must remain deterministic under continuous load. The e300c2 core runs a Linux BSP with optimized network stack offload, while the QUICC Engine handles DSL or DOCSIS framing. The integrated encryption engine secures remote management, parental controls, and operator-provisioned VPN tunnels without CPU saturation. Power consumption is bounded by the low-power CMOS process at 333 MHz, well within typical residential gateway thermal envelopes.
Empfohlen
Industrial Control and SCADA Networking
The KMPC8323EVRAFDC is well matched to industrial control and SCADA networking hubs that aggregate Modbus/Profibus/DNP-3 traffic from field devices and forward it to enterprise networks. The QUICC Engine's multichannel TDM controller handles T1/E1 and HDLC/PPP framing common in legacy SCADA backbones, while the dual Gigabit Ethernet MACs provide redundant LAN uplinks with hardware failover. The temperature-grade package (industrial VRA suffix) operates from -40C to +85C for outdoor or factory-floor cabinets. Determinism is delivered by the deterministic QUICC Engine - unlike a general-purpose SoC, protocol processing does not depend on OS scheduling jitter.
Empfohlen
Line-Card Controller for Access Switches
In multi-service access switches and DSLAM equipment, the KMPC8323EVRAFDC serves as a line-card controller aggregating subscriber lines into an upstream switch fabric over PCI Express. The single e300c2 core runs management-plane software (CLI, SNMP, RADIUS), the SEC 2.0 engine handles per-subscriber authentication and IPsec tunneling, the QUICC Engine times the TDM-side subscriber interfaces, and the dual Ethernet MACs handle upstream redundancy. Operating system support is mature - VxWorks, Linux, and Green Hills INTEGRITY BSPs all run on the MPC8323E family, ideal for carrier-grade life cycles of 10+ years.
Empfohlen
Network Security Appliance
For network security appliances such as UTM, NGFW, and secure proxy platforms, the KMPC8323EVRAFDC combines SEC 2.0 hardware crypto with the e300c2 333 MHz core to execute deep-packet inspection and IPsec encryption at small-to-medium enterprise throughputs. The security engine handles AES-256 IPsec at multiple Gbps of bulk crypto offload, leaving the CPU for full packet classification, policy lookups, and threat analytics over the Linux kernel's netfilter and IPS stack. The dual Gbit Ethernet MACs serve as WAN and LAN trust zones, while the QUICC Engine provides auxiliary serial consoles, modem ports, or TDM links.
Empfohlen
Wireless Backhaul Aggregation
For wireless backhaul aggregation in LTE/5G small-cell and microwave backhaul nodes, the KMPC8323EVRAFDC terminates multiple Ethernet links and aggregates them into a single high-speed uplink, while the QUICC Engine handles legacy T1/E1 traffic common in 2G/3G macrocell backhaul. The SEC 2.0 engine provides per-bearer IPsec encryption for backhaul hardening, and the operating-temperature range of the VRA suffix supports outdoor enclosures. Operating system support, long product life, and mature U-Boot/Linux firmware make the part a low-risk BOM choice for network operators running multi-decade telecom infrastructure.
Empfohlen
Print Server and Industrial Imaging
The KMPC8323EVRAFDC's QUICC Engine and dual Gigabit Ethernet MACs make it suitable as a print-server or industrial-imaging controller, where high-bandwidth image and protocol streams must be queued, prioritized, and forwarded to a host PC or remote printer. The 333 MHz e300c2 core runs image-processing glue logic and PostScript/PDF rasterization workloads, while the SEC engine secures document transfer over IPsec. Industrial-grade environmental tolerance and long-life availability make the part a stable choice for medical imaging and factory-floor machine-vision hubs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für KMPC8323EVRAFDC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8323EVRAFDC | MPC8323EVRAFC | KMPC8323CVRAGDC |
|---|---|---|---|---|
| Package | 516-PBGA (27x27 mm, TEBGA) | 516-PBGA (27x27 mm, TEBGA) - same | 516-PBGA (27x27 mm, TEBGA) - same | 516-PBGA (27x27 mm, TEBGA) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC e300c2 (33x series) | PowerPC e300c2 (33x series) - same | PowerPC e300c2 (33x series) - same | PowerPC e300c2 (33x series) - same |
| Core Frequency | 333 MHz | 333 MHz | 333 MHz | 266 MHz |
| Encryption Engine | SEC 2.0 (included) | SEC 2.0 (included) | SEC 2.0 (included) | SEC not present (non-E variant placeholder) |
| QUICC Engine | Yes (multi-channel, HDLC/PPP/TDM) | Yes | Yes | Yes |
| Ethernet MACs | 2x 10/100/1000 (RGMII/SGMII) | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 |
| Memory Controller | DDR/DDR2 up to 333 MHz | DDR/DDR2 up to 333 MHz | DDR/DDR2 up to 333 MHz | DDR/DDR2 up to 333 MHz |
Wichtigste Unterscheidungsmerkmale
- Integrated encryption engine on a 32-bit PowerPC platform (vs. MPC8323 (non-E))
- QUICC Engine multi-channel serial controller (vs. MPC8360E PowerQUICC II Pro)
- K ordering code vs. base MPC ordering code (vs. MPC8323EVRAFDC (non-K))
Designhinweise
The 516-ball TEBGA requires a 6-layer (minimum) or 8-layer PCB stack-up with laser-drilled microvias for ball breakout; conventional 0.25 mm via-in-pad is not always sufficient on sub-1.0 mm pitch. Allocate the top exposed pad (TEP) to a continuous copper pour stitched with thermal vias (0.3 mm drill, 1.0 mm pitch) to keep case temperature below 70C at the 333 MHz operating point. Use a matched-length impedance-controlled stack for DDR2 data lanes (typically 50 to 60 ohm single-ended, 100 ohm differential for SGMII). Reference the NXP AN-3642 (MPC83xx Hardware Design Checklist) for layer-stack recommendations and decoupling capacitor placement topology.
The MPC8323E requires separate core, GTL, and I/O supply rails - typically 1.2 V core, 1.5 V DDR2 VTT, and 3.3 V I/O; populate local decoupling with 0.1 uF X7R bypass caps within 5 mm of every supply pin, plus 10 uF tantalum bulk on each rail. Bring-up sequence per MPC8323E datasheet: assert 3.3 V first, then 1.5 V GTL supply, then 1.2 V core; a POR supervisor must hold the e300c2 reset until all rails are within tolerance. Estimated standby power at 333 MHz idle: ~1.2 W with QUICC Engine disabled; full-throughput typical power: ~3.5 W. Ensure your DC-DC converters (such as MAX15300 ETI + T) deliver at least 30% headroom over the worst-case in-rush during firmware decryption.
Three pitfalls commonly cause field failures on MPC8323E designs: (1) omitting the JTAG header entirely, leaving no recovery vector when firmware deadlocks - always populate a 14-pin JTAG plus POR to U-Boot rescue boot path; (2) selecting wrong DDR2 CAS latency for the 333 MHz controller - the part supports CL5/CL6, but PCB signal integrity may require CL6 at lower DIMM loading; (3) the SEC 2.0 engine requires matched DMA descriptor alignment to 64 bytes - misaligned structures cause silent throughput loss without bringing down the link. Reference the MPC8323E Reference Manual section on 'Security Engine' and 'DDR2 Controller Programming Model' before finalizing the BOM.
Estimated: at 333 MHz with the SEC engine active full-duplex and both Ethernet MACs operating at line rate, the TEBGA junction temperature rises approximately 25C above ambient with the recommended PCB footprint and 5x5 cm of inner copper; an exposed-pad thermal via array carrying 0.7 W/K helps maintain TJ below 105C. The top-exposed-pad (TEP) must be soldered to the top-side copper pour - skipping this step raises theta_JA by ~35% and may cause thermal shutdown during sustained encryption workloads. Industrial VRA temperature grade is suitable for -40C to +85C ambient deployments in outdoor cabinets.
Differential SGMII lanes between the MPC8323E and the SERDES PHY require 100 ohm controlled-impedance routing without vias where practical; route length matching to within 0.4 mm. The 10/100/1000 RGMII interface uses source-synchronous clocking with a 2 ns setup/hold window - keep MAC-to-PHY traces under 75 mm and isolate from switching supplies on adjacent layers. DDR2 data lanes must be matched within 25 ps of the byte clock and the address/control group matched within 50 ps; NXP's MQX / BSP Design Guide includes an IBIS model ("MPC8323E_IBIS") that should be run through your 3D-EM simulator before tape-out.
Compliance-Informationen
RoHS compliance and lead-free (NOPB suffix) status extracted from the part suffix per NXP naming convention. AEC-Q100 not applicable - this is a network processor, not an automotive qualified part. REACH status per NXP general product statement.
