LPC1112LVFHI33/103 - 50MHz Cortex-M0 MCU 16KB | NXP
Teilenummer: LPC1112LVFHI33/103 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1.42 | $1,42 |
| 10 | $1.28 | $12,80 |
| 100 | $1.09 | $109,00 |
| 500 | $0.95 | $475,00 |
| 1.000 | $0.82 | $820,00 |
LPC1112LVFHI33/103 Übersicht
A microcontroller unit (MCU) integrates a processor core, memory, and peripherals on a single chip, sitting at the top of the embedded-hierarchy ladder above plain logic ICs and below application processors. The ARM Cortex-M0 is a 32-bit core designed as an evolutionary and performance upgrade path from 8/16-bit MCUs, offering a simple instruction set and reduced code size while retaining low power and low cost.
Key features of the LPC1112LVFHI33/103 include the low-voltage (LV) supply design of the LPC11xxLV family, CPU frequencies up to 50 MHz, fast general-purpose I/O, and standard serial peripherals such as UART, SPI, and I2C typical of the LPC1100LV series. The 32-HVQFN 5x5 mm footprint suits compact, cost-sensitive boards.
Technically, the Cortex-M0 core executes a 56-instruction Thumb instruction set with a 32-bit architecture, delivering significantly higher efficiency than 8-bit MCUs while maintaining deterministic interrupt behavior through its nested vectored interrupt controller (NVIC).
Typical applications include 8/16-bit MCU replacement in consumer appliances, motor control and sensing nodes, and battery-powered industrial accessories where low cost, low power, and 32-bit headroom are needed.
Design consideration: as an LV (low-voltage) family member, verify supply-rail compatibility - the LV series operates at lower core/IO voltage domains than the standard LPC11xx, so confirm the exact operating range in the NXP datasheet before substituting standard-voltage parts.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet. Per the NXP product page, LPC1112LVFHI33 is announced End of Life (EOL), so alternatives and last-time-buy planning are covered below.
Drop-in-Alternativen für LPC1112LVFHI33/103 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LPC1114LVFHI33/103
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC1113LVFHI33/103
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC1111LVFHI33/103
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC1112LVFHI33/102
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC1112FHI33/103
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC1112LVFHI33/103 Grenzwerte & elektrische Eigenschaften
| Core Processor | ARM Cortex-M0 |
| Core Size | 32-Bit |
| Max CPU Frequency | 50 MHz |
| Flash Memory | 16 KB (16K x 8) |
| SRAM | 8 KB |
| Gehäuse | 32-HVQFN (5x5 mm) |
| Montageart | Surface Mount |
| Series | LPC1100LV |
| Program Memory Type | Flash |
| Lebenszyklusstatus | End of Life (per NXP product page) |
LPC1112LVFHI33/103 32-hvqfn (5x5 mm) Pinbelegungsleitfaden
Pinbelegung für LPC1112LVFHI33/103 (32-hvqfn (5x5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LPC1112LVFHI33/103.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LPC1112LVFHI33/103 ist geeignet für 6 Anwendungs: 8/16-bit MCU Replacement in Consumer Appliances, Battery-Powered Sensing Nodes, Industrial Auxiliary Control and Monitoring, Motor Control Auxiliary Functions, Handheld and Portable Accessories, EOL Sustain / Legacy Board Service.
8/16-bit MCU Replacement in Consumer Appliances
The LPC1112LVFHI33/103 fits appliance control boards (small appliances, chargers, thermostats) that historically used 8-bit MCUs. Its 50 MHz Cortex-M0 core delivers substantially more computation per cycle than typical 8-bit cores, while 16 KB flash and 8 KB SRAM cover control-loop and UI-scan firmware. NXP explicitly designed the LPC11xxLV family for 8/16-bit migration with a simple instruction set and reduced code size. In circuit, the MCU runs from a single low-voltage rail with internal oscillators, minimizing external BOM cost; the 32-HVQFN 5x5 mm footprint keeps PCB area small for cost-sensitive consumer designs. Quantified benefit: 32-bit headroom and pin-compatible upward migration to 24/32 KB flash variants without PCB respin.
Empfohlen
Battery-Powered Sensing Nodes
The LPC1100LV low-voltage family was developed for battery-operated equipment, and the LPC1112LVFHI33/103's 16 KB flash / 8 KB SRAM is sufficient for sensor acquisition, filtering, and duty-cycled reporting tasks. The Cortex-M0's low gate count yields low active current, and family sleep/deep-sleep modes support microamp-level standby budgets described in the NXP datasheet. The on-chip ADC (8-channel per family documentation) samples analog sensor outputs directly, eliminating an external ADC in simple nodes. The MCU reads the sensor via GPIO/ADC, averages readings in SRAM, and communicates over UART or I2C when wake events occur. Trade-off: with 16 KB flash, firmware using heavy protocol stacks should move to the 32 KB LPC1114LVFHI33/103.
Empfohlen
Industrial Auxiliary Control and Monitoring
In industrial equipment, the LPC1112LVFHI33/103 serves as an auxiliary controller for panel monitoring, relay sequencing, and simple communication gateways. Its 50 MHz Cortex-M0 handles CRC-checked UART framing and I2C peripheral polling comfortably, while deterministic NVIC interrupt latency supports reliable timeout supervision. The 32-HVQFN package tolerates standard industrial ambient ranges when designed per the datasheet thermal guidance. Typical topology: the MCU monitors digital inputs, drives status LEDs and small relays via GPIO, and reports over UART to a main PLC or controller. Quantified benefit: flash variants up to 32 KB share the identical footprint, allowing a single PCB platform to scale firmware across product tiers without layout changes.
Empfohlen
Motor Control Auxiliary Functions
Entry-level motorized products (fans, small pumps, ducted actuators) can use the LPC1112LVFHI33/103 for start/stop sequencing, tachometer pulse counting, and protection supervision, complementing dedicated driver ICs. The 50 MHz Cortex-M0 counts input capture events with deterministic timing, and 8 KB SRAM holds speed-table and fault-history buffers. NXP markets the LPC11xx family for motor-control-adjacent roles in its entry-level portfolio. The MCU interfaces to a gate-driver or driver IC over GPIO/PWM outputs while monitoring current-sense amplifier outputs through the on-chip ADC. Design consideration: confirm PWM peripheral count and timer resources in the datasheet against your modulation scheme before committing firmware architecture.
Empfohlen
Handheld and Portable Accessories
Portable accessories - measuring tools, key fobs, small instruments - benefit from the LPC1112LVFHI33/103's combination of 32-bit processing, low-voltage operation, and a compact 32-HVQFN 5x5 mm footprint. The LPC1100LV family was explicitly positioned for low-power designs, and the Cortex-M0 instruction set keeps code density high so 16 KB flash suffices for button handling, display driving, and simple measurement routines. Typical use: MCU scans keys via GPIO interrupts, computes readings, and updates a segment LCD or UART-connected display module. Quantified benefit: a 5x5 mm QFN saves roughly 40% board area versus comparable LQFP-packaged MCUs, enabling slimmer enclosures in handheld form factors.
Empfohlen
EOL Sustain / Legacy Board Service
Because NXP has announced LPC1112LVFHI33 End of Life, this MPN is now primarily sourced for sustaining existing PCB assemblies rather than new designs. Service organizations use remaining distributor stock (e.g., 52,575 pcs reported by Micro-Semiconductor) and last-time-buy windows to keep production lines running. For repair depots, the pin-compatible family members LPC1113LVFHI33/103 and LPC1114LVFHI33/103 serve as drop-in substitutes on the same 32-HVQFN footprint, provided firmware fits the variant's flash. Practical guidance: when re-popping the footprint, reflash the replacement with the original production firmware image and verify the /103 variant code matches the bootloader expectations of field-programming tools.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LPC1112LVFHI33/103 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LPC1114LVFHI33/103 | LPC1113LVFHI33/103 | LPC1111LVFHI33/103 | LPC1112FHI33/103 |
|---|---|---|---|---|---|
| Package | 32-HVQFN (5x5 mm) | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | HVQFN-32 (5x5 mm) - same footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 |
| Max CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 16 KB | 32 KB | 24 KB | 8 KB | 16 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Voltage Family | LV (low-voltage LPC1100LV) | LV | LV | LV | Standard LPC11xx |
Wichtigste Unterscheidungsmerkmale
- Balanced memory configuration at lowest family cost (vs. LPC1111LVFHI33/103)
- Low-voltage LPC1100LV design (vs. LPC1112FHI33/103)
- Footprint-scalable memory options (vs. LPC1114LVFHI33/103)
Designhinweise
The LPC1112LVFHI33/103 belongs to the low-voltage LPC1100LV family, which differs from the standard LPC11xx supply domain. Before board bring-up, confirm the exact VDD operating range and maximum rating from the NXP LPC11xxLV datasheet - powering the LV variant from a standard LPC11xx rail (up to 3.6 V) could exceed ratings. Use a dedicated low-noise LDO with 100 nF decoupling at each VDD pin plus 4.7-10 uF bulk capacitance, and verify power-ramp behavior against the datasheet power-up requirements.
The 32-HVQFN (5x5 mm) package has a central exposed die pad that must be soldered to a grounded copper pour for reliable operation - this pad is often the device's thermal and ground return path. Design the land pattern per the NXP datasheet footprint with via array under the pad for solder paste volume control. Place the crystal (if used) within 5 mm of the OSC pins with short guard traces, and keep SWD debug header traces routed with a nearby ground reference for in-circuit flashing.
Two common pitfalls with this MPN: (1) variant-code confusion - the /102 and /103 suffixes denote different pre-programmed serial bootloader configurations; field-programming tools expecting the /103 boot code will fail on a /102 part even though the silicon is identical. (2) EOL sourcing risk - since NXP announced End of Life, grey-market stock is circulating; purchase only from franchised distributors (Mouser, DigiKey) with certificate of conformance, and qualify the pin-compatible LPC1114LVFHI33/103 as the long-term migration path.
Compliance-Informationen
Compliance status not explicitly stated in the provided web data. Verify via the NXP LPC1112LVFHI33 product page (Environmental Quality section) or distributor certificate of conformance.
