LPC1857FET256 - 180MHz Cortex-M3 MCU, 1MB Flash | NXP | LBGA-256
Teilenummer: LPC1857FET256 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.92 | $18,92 |
| 10 | $17.05 | $170,50 |
| 100 | $15.14 | $1.514,00 |
| 500 | $13.62 | $6.810,00 |
| 1.000 | $12.3 | $12.300,00 |
LPC1857FET256 Übersicht
An ARM Cortex-M3 microcontroller is a 32-bit RISC processor core designed for deterministic real-time embedded applications; the Cortex-M3 sits within the ARM Cortex-M family (Cortex-M0/M0+/M3/M4/M7/M33) and is widely used where deterministic interrupt latency, hardware division, and Thumb-2 instruction efficiency are required. The LPC18xx family specifically targets high-throughput connected applications by pairing the Cortex-M3 core with high-speed peripherals including two HS USB ports, an on-chip LCD controller, an Ethernet MAC, and external memory controllers. Positioned within the broader taxonomy: microcontroller -> MCU -> 32-bit MCU -> ARM Cortex-M MCU -> LPC18xx -> LPC1857.
Key features of the LPC1857FET256 include 1 MB flash with a flash accelerator, 136 kB total SRAM, two High-Speed USB 2.0 controllers (one with on-chip HS PHY), 10/100 Ethernet MAC, an LCD controller supporting STN and TFT panels up to WXGA, a Quad-SPI Flash Interface (SPIFI), two CAN 2.0B interfaces, three SSP/SPI controllers, one Fast-mode Plus I2C, a 10-bit ADC, a 10-bit DAC, four general-purpose timers, two SCTimer/PWM subsystems, an RTC, and a windowed watchdog timer. The device supports up to 142 GPIO pins with 5 V-tolerant I/O on most pins, an external memory controller (EMC) for SRAM/PSRAM/NOR/NAND, and an SD/MMC interface.
The LPC1857FET256 uses a 3.3 V single-supply core with internal LDO regulation, a configurable clock generation unit (PLL) sourced from an external crystal or internal RC, and a power management block that supports Sleep, Deep-Sleep, Power-down, and Deep Power-down modes with multiple wake-up sources including RTC alarm, USB activity, Ethernet Wake-on-LAN, and external interrupts. The dual-bank flash with flash accelerator delivers zero-wait-state execution from flash at full 180 MHz, enabling deterministic code execution for industrial control loops.
Typical applications include industrial HMI panels with TFT LCD, factory automation controllers, point-of-sale terminals, USB-enabled embedded peripherals, gateway nodes for industrial Ethernet, motor-control front-ends, secure connected sensors, and rugged portable medical devices where the Cortex-M3 deterministic interrupt latency simplifies safety-critical code paths.
When designing with the LPC1857FET256, pay attention to decoupling the LBGA256 power rails: a four-layer PCB with continuous power planes under the BGA is required to achieve the thermal performance and signal integrity the part expects; the SPIFI interface allows low-cost quad-SPI NOR flash expansion without increasing pin count.
Drop-in-Alternativen für LPC1857FET256 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LPC1857FET256 (gleiche Bauform und Footprint) – abweichend in External Memory Controller (EMC), LCD Controller, Package, Core Architecture, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LPC4357FET256
✅ Drop-In✓ Auf Lager
$9.5 / Stück
Datenblatt ansehen →LPC1850FET256
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LPC4350FET256
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LPC1833JET256
✅ Drop-In✓ Auf Lager
$9.72 / Stück
Datenblatt ansehen →LPC1830FET256
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LPC1857FET256 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M3 (32-bit) |
| Maximum CPU Frequency | 180 MHz |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 136 kB |
| Package Type | 256-LBGA (17 x 17 mm) |
| Supply Voltage (VDD) | 2.2 V to 3.6 V |
| GPIO Count | 142 |
| High-Speed USB Controllers | 2 (one with on-chip HS PHY) |
| Ethernet MAC | 10/100 Mbit/s (RMII/MII) |
| LCD Controller | Yes (STN/TFT, up to WXGA) |
| CAN 2.0B Interfaces | 2 |
| SSP/SPI Controllers | 3 |
| I2C Interfaces | 1 (Fast-mode Plus) |
| External Memory Controller (EMC) | Yes (SRAM/PSRAM/NOR/NAND) |
| SPIFI (Quad-SPI Flash Interface) | Yes |
| ADC | 10-bit |
| DAC | 10-bit |
| Betriebstemperatur | -40 C to +85 C |
| Montageart | Surface Mount (LBGA) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Product Family | LPC18xx |
LPC1857FET256 256-lbga (17 x 17 mm) Pinbelegungsleitfaden
Pinbelegung für LPC1857FET256 (256-lbga (17 x 17 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LPC1857FET256.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LPC1857FET256 ist geeignet für 7 Anwendungs: Industrial HMI with TFT LCD, USB Peripheral and Industrial Gateway, Point-of-Sale (POS) Terminal, Motor Control and Industrial Drive Front-End, Connected Sensor Hub with Ethernet, Rugged Portable Medical Device, Automotive Infotainment / Telematics Module.
Industrial HMI with TFT LCD
The LPC1857FET256's integrated LCD controller supporting STN and TFT panels up to 1024 x 768 with 24-bit RGB makes it ideal for industrial human-machine interface (HMI) panels. The 136 kB SRAM is sufficient to host a small GUI framebuffer, and the 1 MB flash holds the LVGL or emWin graphical stack plus the application. The Cortex-M3 deterministic interrupt latency keeps touch response and process-control loops predictable. The on-chip HS USB with PHY simplifies connecting to barcode scanners and printers. Compared to an MCU + external LCD controller design, the LPC1857FET256 reduces BOM cost by one chip and removes an external bus. Designers typically run the LCD controller in TFT mode at 60 Hz and route the 24-bit RGB plus the touch-SPI through the MCU's flexible pin-mux.
Empfohlen
USB Peripheral and Industrial Gateway
Two High-Speed USB 2.0 controllers, one with an on-chip HS PHY, make the LPC1857FET256 ideal for USB peripherals and industrial gateway nodes. The MCU can run as a USB device at 480 Mbit/s or as an embedded host for USB mass-storage and HID devices without additional components. Combined with the 10/100 Ethernet MAC, an LPC1857FET256-based gateway can aggregate USB sensor traffic onto Modbus TCP or EtherNet/IP without an external PHY. The deterministic Cortex-M3 core handles TCP/IP offload via the lightweight IP stack while keeping USB interrupt latency bounded. Power consumption in idle is reduced by the Deep-Sleep mode, and the RTC alarm can wake the system for periodic polling.
Empfohlen
Point-of-Sale (POS) Terminal
The LPC1857FET256 suits compact point-of-sale terminals: it drives a customer-facing TFT display via the integrated LCD controller, accepts card-reader USB peripherals via the HS USB with PHY, prints receipts through a UART or SPI link, and connects to store LAN via Ethernet. The 136 kB SRAM hosts USB stacks, TCP/IP for transaction upload, and the GUI simultaneously. AES hardware via the on-chip crypto engine (LPC185x variant) accelerates payment encryption for occasional drops.
Empfohlen
Motor Control and Industrial Drive Front-End
Two SCTimer/PWM subsystems on the LPC1857FET256 generate complementary PWM with dead-time insertion for three-phase motor control, while the Cortex-M3 deterministic core runs the FOC algorithm at 180 MHz. The two CAN 2.0B ports provide CANopen or DeviceNet connectivity for industrial drives, and the EMC bus connects to external SRAM for data logging. With 10-bit ADC and 10-bit DAC on-chip, a basic servo or BLDC drive fits in a single MCU. Compared to a Cortex-M0 motor-control part, the LPC1857FET256 adds headroom for a graphical HMI on the same chip.
Empfohlen
Connected Sensor Hub with Ethernet
Sensor hub applications that aggregate analog and digital sensor data and push it to the cloud via Ethernet fit the LPC1857FET256: 10-bit ADC plus I2C/SPI/CAN interfaces cover most sensor families, the Ethernet MAC with external PHY delivers TCP/IP connectivity, and the SPIFI interface allows low-cost quad-SPI NOR flash expansion if 1 MB is insufficient. Power-down modes with RTC, USB, and Ethernet wake sources keep idle current low for solar- or battery-powered edge nodes. With the Cortex-M3 zero-wait-state flash accelerator, deterministic sampling intervals are easy to maintain.
Empfohlen
Rugged Portable Medical Device
The LPC1857FET256's industrial operating temperature range (-40 C to +85 C) and deterministic Cortex-M3 interrupt latency make it suitable for rugged portable medical peripherals such as patient monitors, infusion-pump controllers, and diagnostic readers. The HS USB with PHY simplifies connecting to a host tablet for data upload, and the integrated LCD controller drives a small bedside TFT display. AES hardware (on LPC185x variant) supports encrypted patient-data at rest. Compared to a Cortex-M0 medical MCU, the LPC1857FET256 adds Ethernet for bedside network connectivity and significant RAM for waveform buffering.
Empfohlen
Automotive Infotainment / Telematics Module
Although not AEC-Q100 qualified, the LPC1857FET256 is sometimes designed into non-safety automotive modules such as head-unit peripherals, telematics control units, and aftermarket infotainment add-ons where its Ethernet MAC, dual CAN 2.0B, and HS USB with PHY replace several discrete peripherals. The 1 MB flash stores audio decoding firmware and the 136 kB SRAM buffers compressed audio streams. Designers must validate the industrial temperature grade against their specific in-cabin thermal profile.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LPC1857FET256 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LPC4357FET256 | LPC1850FET256 | LPC4350FET256 | LPC1833JET256 | LPC1830FET256 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-LBGA (17 x 17 mm) | 256-LBGA (17 x 17 mm) - same | 256-LBGA (17 x 17 mm) - same | 256-LBGA (17 x 17 mm) - same | 256-LBGA (17 x 17 mm) - same | 256-LBGA (17 x 17 mm) - same |
| Core Architecture | ARM Cortex-M3 | Cortex-M4 + Cortex-M0 | ARM Cortex-M3 | Cortex-M4 + Cortex-M0 | ARM Cortex-M3 | ARM Cortex-M3 |
| Maximum CPU Frequency | 180 MHz | 204 MHz | 180 MHz | 204 MHz | 150 MHz | 150 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB |
| SRAM | 136 kB | 136 kB | 136 kB | 136 kB | 104 kB | 104 kB |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | No | Yes (10/100) | Yes (10/100) |
| HS USB with On-Chip PHY | Yes | Yes | Yes | Yes | Yes | No |
| LCD Controller | Yes (STN/TFT up to WXGA) | Yes (STN/TFT up to WXGA) | Yes | Yes | No | No |
Wichtigste Unterscheidungsmerkmale
- Highest-density NXP Cortex-M3 with 1 MB flash + Ethernet + LCD + HS USB PHY (vs. LPC1833JET256)
- Upgrades to dual-core Cortex-M4 + Cortex-M0 on same footprint (vs. LPC4357FET256)
- Lower-cost pin-compatible variant for less demanding designs (vs. LPC1830FET256)
Designhinweise
The 256-LBGA package requires a four-layer PCB with continuous ground and power planes under the BGA for signal integrity and thermal dissipation. Microvia-in-pad or via-in-pad technology is recommended for the inner balls to fan out the high-density escape routing; NXP's reference design files include the BGA land pattern and via-stack-up that meet IPC-7351 and IPC-2222 guidelines. Without continuous power planes, the LBGA's exposed die paddle cannot dissipate heat effectively, and signal integrity on the parallel LCD and EMC buses degrades visibly on an oscilloscope.
Use a 3.3 V main LDO with at least 500 mA headroom for the LPC1857FET256, plus a separate low-noise 1.2 V LDO for the core rail if the internal LDO is bypassed. Place 100 nF decoupling on every VDD/VSS pair as close to the balls as possible, and add bulk 4.7 uF and 10 uF ceramic capacitors near the package. Inrush current at cold-start can reach 200 mA; ensure the LDO can supply that without sagging below 2.2 V. For low-noise analog subsystems, isolate the ADC/DAC AVDD pin with a ferrite bead from the digital 3.3 V rail.
A common mistake is to forget the boot pin configuration: the LPC1857FET256 samples several pins at reset to determine the boot source (internal flash, SPIFI, EMC, UART). Pull-ups or pull-downs on the boot pins must match the chosen boot source or the part will appear dead on the bench. Also note that the on-chip HS USB PHY requires the VBUS pin to be tied through a 5 V-tolerant path; do not connect VBUS directly to a 3.3 V regulator. Finally, when migrating from LPC1768 firmware, note the changed interrupt vector table layout and the new EMC pin-mux - existing 1768 code requires porting, not recompiling.
Estimated: at 180 MHz active CPU and 3.3 V supply drawing 150 mA, power dissipation is approximately 0.5 W. With the LBGA256 thermal pad soldered to a 4-layer PCB's ground plane with at least 4 thermal vias, theta_JA is roughly 25 C/W per NXP's thermal data, giving a junction rise of 12 C above ambient at room temperature. Designers do not need a heatsink for typical industrial use; for enclosed high-temperature enclosures, validate with a thermocouple on the thermal pad.
The high-speed USB differential pair (D+/D-) requires 90 ohm differential impedance on the PCB and must be routed over a continuous ground plane with no splits. Length matching within 150 mil (3.8 mm) is required, and the on-chip HS PHY calibration should be performed via NXP's USB certification tool. For the Ethernet MAC MII/RMII bus, route the clock line away from the data lines and place a 50 ohm series-termination resistor at the MCU end if the trace exceeds 50 mm. The LCD RGB bus can be length-matched in groups of 8 bits within 1 inch for resolutions up to WXGA at 60 Hz.
Compliance-Informationen
RoHS and lead-free per NXP product page and DigiKey listing. Industrial temperature grade (-40 C to +85 C) only; not AEC-Q100 qualified. REACH and conflict-minerals status confirmed by NXP corporate compliance statements.
