LPC54113J256UK49Z - ARM Cortex-M4 256KB Flash MCU | NXP
Teilenummer: LPC54113J256UK49Z ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $7.05 | $70,50 |
| 100 | $6.28 | $628,00 |
| 500 | $5.65 | $2.825,00 |
| 1.000 | $5.1 | $5.100,00 |
LPC54113J256UK49Z Übersicht
What is an ARM Cortex-M4 microcontroller? A Cortex-M4 MCU is a 32-bit RISC processor designed by Arm and licensed to silicon vendors; it is part of the Cortex-M family which sits under the broader Arm architecture umbrella. MCUs integrate CPU core, memory (Flash/SRAM), peripherals (ADC, timers, communication blocks), and power management on a single die, serving the role of the central controller in an embedded system. The Cortex-M4 specifically introduces single-precision FPU and DSP extensions versus the Cortex-M3, while remaining pin- and tool-compatible for code that does not use the FPU.
Key features of the LPC54113J256UK49Z include a 12-bit resolution ADC, 37 configurable I/O pins, an operating voltage range of 1.62 V to 3.6 V, and an extended industrial temperature range from -40 C to +105 C. The WLCSP-49 package occupies only ~11.8 mm squared of PCB area, making it suitable for compact wearables and sensor nodes where board real estate is constrained.
The LPC541xx architecture uses a low-leakage process with multiple low-power modes (Sleep, Deep-Sleep, Power-down, Deep Power-down) and a flexible ROM-based boot loader. Peripherals include multiple USART, SPI, I2C interfaces, timers, and a 12-bit ADC with sample rates suitable for sensor acquisition.
Typical applications include IoT sensor nodes, wearable health monitors, BLE-enabled HID devices, low-power wireless sensor hubs, and battery-powered industrial sensor endpoints where the M4's signal-processing capability is combined with aggressive sleep-current management.
Design consideration: The WLCSP package requires careful PCB pad design and under-bump metallization; reflow profile must follow JEDEC J-STD-020 MSL handling rules to avoid package cracking. Confirm that your in-house manufacturing supports WLCSP assembly before committing to this variant.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, and reflects verified web data as of 2026-10-08.
Drop-in-Alternativen für LPC54113J256UK49Z – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LPC54113J128UK49
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LPC54113J256BD64
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LPC54103J256UK49
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC54113J256UK49Z Grenzwerte & elektrische Eigenschaften
| Core | ARM Cortex-M4 (single core, no M0+ coprocessor) |
| Datenbusbreite | 32 bit |
| Maximale Taktfrequenz | 100 MHz |
| Program Memory Size (Flash) | 256 KB (256K x 8) |
| Data RAM Size | 192 KB |
| ADC Resolution | 12 bit |
| Number of I/Os | 37 |
| Betriebsversorgungsspannung | 1.62 V to 3.6 V |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +105 C |
| Gehäuse / Bauform | WLCSP-49 (3.44 x 3.44 mm) |
| Montagestil | SMD/SMT |
| Family | LPC541xx low-power MCU series |
| On-chip ROM Boot Loader | Yes (ISP via USART) |
| FPU | Single-precision hardware FPU |
| DSP Extensions | Yes (MAC, SIMD instructions) |
| RoHS-Status | Compliant |
LPC54113J256UK49Z wlcsp-49 (3.44 x 3.44 mm) Pinbelegungsleitfaden
Pinbelegung für LPC54113J256UK49Z (wlcsp-49 (3.44 x 3.44 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LPC54113J256UK49Z.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LPC54113J256UK49Z ist geeignet für 6 Anwendungs: IoT Sensor Node / Wireless Sensor Hub, Wearable Health Monitor, Battery-Powered Industrial Sensor Endpoint, Low-Power BLE HID / Smart Remote, Audio DSP Front-End / Microphone Array, Always-On Smart Home Sensor Hub.
IoT Sensor Node / Wireless Sensor Hub
The LPC54113J256UK49Z's 100 MHz Cortex-M4 with FPU, 192 KB SRAM, and deep-sleep currents below 10 uA make it ideal for battery-powered IoT sensor nodes aggregating multiple I²C interface sensors (temperature, accelerometer, gas). Why it works - the M4 core executes on-device inference and DSP filters while the WLCSP-49 (3.44x3.44 mm) keeps the PCB within coin-cell form factors. How it is used - the MCU wakes periodically to sample sensors, runs an FFT or moving-average filter in hardware, transmits over BLE/UART, and returns to deep-sleep; the 256 KB Flash is enough for a full RTOS plus BLE host stack. Compared with an M0+ class MCU, the M4 doubles the throughput per active milliamp, extending battery life.
Empfohlen
Wearable Health Monitor
Wearable health monitors (heart-rate, SpO2, step counters) require a tiny footprint, low active power, and DSP-grade processing for biosignal filtering. The LPC54113J256UK49Z fits because its WLCSP-49 occupies only 11.8 mm² of PCB, leaving room for a small Li-Po cell and optical sensor. How it is used - the M4's DSP extensions run real-time PPG/heart-rate algorithms at 100 MHz while the 12-bit ADC samples the photodiode signal; the 256 KB Flash hosts a small RTOS plus the algorithm binary. Quantified benefit - versus a Cortex-M0+ at the same workload, the M4 finishes in roughly half the cycles, halving the active energy per measurement and extending wearable battery life by 30-50 percent.
Empfohlen
Battery-Powered Industrial Sensor Endpoint
Industrial 4-20 mA loop-powered or battery-backup sensor endpoints in factories need industrial temperature range (-40 C to +105 C), robust I/O count, and predictable behavior. The LPC54113J256UK49Z qualifies because it covers the full -40 C to +105 C industrial range and runs from 1.62 V to 3.6 V, allowing direct connection to a 3.3 V industrial rail or two AA cells. How it is used - 37 GPIO drive encoder feedback, switch signals, and 4-20 mA loop readback through the 12-bit ADC; UART and CAN-ready peripherals interface to the plant network. The 192 KB SRAM is sufficient for protocol stacks like Modbus RTU or IO-Link device firmware.
Empfohlen
Low-Power BLE HID / Smart Remote
Bluetooth Low Energy HID devices (keyboards, smart remote controls, presentation clickers) demand a small MCU footprint, ultra-low standby power, and enough Flash for a HID descriptor table plus bond storage. The LPC54113J256UK49Z satisfies this with 256 KB Flash (ample for HID stack + application code), sub-10 uA deep-sleep, and the WLCSP-49 footprint fitting inside a CR2032 keyfob enclosure. How it is used - the MCU stays in deep-sleep until a key interrupt wakes it, performs key-scan debouncing on the GPIO matrix, then drives a companion nRF52832 BLE radio over UART for the wireless HID link. Quantified trade-off - the M4's fast wake time (~2 us) and FPU-accelerated HID processing keep the active window short, preserving coin-cell life.
Empfohlen
Audio DSP Front-End / Microphone Array
Microphone array beamforming and audio pre-processing require DSP extensions and deterministic interrupt latency. The LPC54113J256UK49Z works here because the M4 with hardware FPU executes CMSIS-DSP biquad and FFT kernels efficiently, and the 12-bit ADC captures PDM or analog mic data at sufficient sample rates. How it is used - multi-channel digital microphones stream PDM into a timer capture, the M4 decimates and runs a beamformer, then outputs I²S to a codec or USB audio device. The 192 KB SRAM holds audio buffers plus the DSP kernel workspace; the 256 KB Flash holds firmware plus a small voice-trigger keyword model.
Empfohlen
Always-On Smart Home Sensor Hub
Smart-home sensor hubs aggregate multiple wireless sensors (door, motion, leak, temperature) and require low standby power with sufficient Flash for application logic and OTA updates. The LPC54113J256UK49Z handles this role with its deep-sleep modes, 192 KB SRAM for sensor history buffers, and 256 KB Flash that accommodates a small RTOS, Zigbee/Thread host or Matter bridge stub, and OTA bootloader. How it is used - the MCU stays in deep-sleep until a sensor interrupt or timer wake event; it then services the radio, updates local state, and returns to sleep. The WLCSP-49 footprint allows the entire hub to fit behind a wall switch.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LPC54113J256UK49Z – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LPC54113J128UK49 | LPC54113J256BD64 | LPC54103J256UK49 |
|---|---|---|---|---|
| Package | WLCSP-49 (3.44x3.44 mm) | WLCSP-49 (3.44x3.44 mm) - same | LQFP-64 - different (drop-in only if PCB reworked) | WLCSP-49 (3.44x3.44 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M4 (single core) | ARM Cortex-M4 (single core) | ARM Cortex-M4 (single core) | ARM Cortex-M4 (single core) |
| Max Clock Frequency | 100 MHz | 100 MHz | 100 MHz | 75 MHz |
| Flash Size | 256 KB | 128 KB (-50%) | 256 KB | 256 KB |
| SRAM Size | 192 KB | 192 KB | 192 KB | 96 KB (-50%) |
| Operating Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| GPIO Count | 37 | 37 | 51 (LQFP-64 exposes more) | 37 |
| ADC Resolution | 12 bit | 12 bit | 12 bit | 12 bit |
Wichtigste Unterscheidungsmerkmale
- Smallest available footprint in the LPC5411x family (vs. LPC54113J256BD64)
- Highest Flash density at 100 MHz in WLCSP-49 (vs. LPC54113J128UK49)
- Full 100 MHz performance in compact package (vs. LPC54103J256UK49)
Designhinweise
WLCSP-49 assembly per JEDEC J-STD-020 requires non-solder-mask-defined (NSMD) landing pads with a 0.4 mm pitch ball grid. Confirm that the assembly line supports wafer-level chip-scale packages, including under-bump metallization compatibility and a flat, void-free reflow profile. Estimated: typical PCB land pattern for 0.4 mm pitch WLCSP is 0.20 mm pad diameter with 0.40 mm pitch (per NXP AN11843). Use a 1.6 mm or thinner PCB stack-up to reduce package-to-PCB stress.
Decouple VDD with a 100 nF X7R ceramic placed within 2 mm of each supply pin and a bulk 4.7 uF ceramic on the main rail. The LPC54113J256UK49Z has multiple VDD pins (VDD, VDDA, VDDIO); each must be decoupled separately to avoid supply noise coupling into the ADC. Estimated: a 100 nF + 4.7 uF combo per rail typically yields >40 dB PSRR at 1 MHz, suitable for 12-bit ADC SNR targets.
Do not assume the WLCSP-49 footprint tolerates hand-soldering rework; the 0.4 mm pitch is below the practical limit for manual rework stations. Plan for stencil-printed reflow and have a known-good BGA/WLCSP rework station available. Also: enable the on-chip ROM boot loader ISP via USART0 at reset if you plan to field-flash blank parts; this avoids needing a separate programmer.
At 100 MHz active with all peripherals running, the LPC54113J256UK49Z typically draws 15-20 mA at 3.3 V (estimated based on NXP family datasheet typical curves). In deep-power-down, current drops to under 2 uA. Design the power budget assuming worst-case 25 mA active, and ensure the power source (LDO or buck) can sustain this transient without sagging below 1.62 V.
Compliance-Informationen
RoHS compliant per JLCPCB and DigiKey Marketplace listings. Not AEC-Q100 qualified - this is an industrial-grade MCU. Halogen-free status not explicitly stated in the verified web data and is recorded as unknown.
