LPC55S26JBD64Y - 150MHz Cortex-M33 MCU 256KB | NXP
Teilenummer: LPC55S26JBD64Y ✓ Aktiv| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
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LPC55S26JBD64Y Übersicht
A microcontroller (MCU) is a single-chip embedded computer that integrates a processor core, program memory (flash), data memory (SRAM), and peripherals such as UART, SPI, I2C, USB, and ADC on one die. Within the power-management hierarchy of embedded systems, MCUs sit at the lowest level of programmable control, directly driving sensors, actuators, and communication interfaces. The LPC55S26JBD64Y belongs to the LPC552x/S2x family, part of NXP's EdgeVerse edge computing platform and the world's first general-purpose Cortex-M33-based MCU series.
Key features include a 150 MHz Cortex-M33 core, 256 KB (256K x 8) of flash program memory, and a 40-nm NVM process technology for cost-effective, power-efficient operation. The LPC55S2x variants add NXP security features for protected firmware and data, while remaining pin-, software-, and peripheral-compatible across the family - a major advantage for developers scaling designs between memory or security tiers.
Technically, the Armv8-M mainline architecture supports TrustZone-style security partitioning concepts in the S-series, and the high clock speed combined with single-cycle multiply accelerators delivers DSP-class throughput for signal processing. The exposed-pad HTQFP-64 improves thermal performance and grounding compared with standard gull-wing packages, and the industrial temperature grade supports harsh environments.
Typical applications include industrial automation and motor control, IoT edge nodes and sensor hubs, and consumer appliances or secure connected devices requiring low-power 32-bit processing. The 150 MHz core and rich peripheral set make the device a strong fit for USB-enabled products and analog-sensing systems with on-chip ADC inputs.
When designing with the LPC55S26JBD64Y, allocate decoupling capacitance on all VDD pins, route the exposed pad to a solid ground plane, and plan firmware for the 256 KB flash boundary if code growth is expected - the pin-compatible LPC55S28 doubles flash within the same footprint.
This page synthesizes distributor inventory data, same-family drop-in alternatives, and practical design guidance not consolidated on the manufacturer's own product page.
Drop-in-Alternativen für LPC55S26JBD64Y – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LPC55S26JBD64Y (gleiche Bauform und Footprint) – abweichend in Package, Flash Memory, Core Processor, Interrupt Controller, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LPC55S26JBD64K
✅ Drop-In✓ Auf Lager
$3.89 / Stück
Datenblatt ansehen →LPC55S28JBD64K
✅ Drop-In✓ Auf Lager
$3.6 / Stück
Datenblatt ansehen →LPC5526JBD64K
✅ Drop-In✓ Auf Lager
$3.52 / Stück
Datenblatt ansehen →LPC5528JBD64K
✅ Drop-In✓ Auf Lager
$5.3 / Stück
Datenblatt ansehen →LPC55S16JBD64
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC55S06JBD64
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC55S26JBD64Y Grenzwerte & elektrische Eigenschaften
| Core Processor | ARM Cortex-M33 |
| Core Size | 32-Bit |
| Maximale Taktfrequenz | 150 MHz |
| Program Flash Memory | 256 KB (256K x 8) |
| Versorgungsspannung | 3.3 V |
| Gehäuse | 64-HTQFP (10 x 10 mm), exposed pad |
| Montageart | Surface Mount (Gull Wing terminals) |
| Temperature Grade | Industrial |
| Product Series | LPC552x / LPC55S2x |
| Process Technology | 40-nm NVM |
| Number of Terminals | 64 |
| Package Shape | Square |
| Peripheral Compatibility | Pin-, software- and peripheral-compatible with LPC552x/S2x family |
LPC55S26JBD64Y square Pinbelegungsleitfaden
Pinbelegung für LPC55S26JBD64Y (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LPC55S26JBD64Y.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LPC55S26JBD64Y ist geeignet für 6 Anwendungs: Industrial Automation and Control, IoT Edge Nodes and Sensor Hubs, Secure Connected Devices, USB-Enabled Peripherals, Analog Data Acquisition Systems, Consumer Appliances and Electronics.
Industrial Automation and Control
The LPC55S26JBD64Y fits industrial automation nodes where a 150 MHz Cortex-M33 core processes control loops and communication protocols with deterministic latency, while the industrial temperature grade supports cabinet and floor-level environments. Its 256 KB flash accommodates protocol stacks for industrial fieldbus or IO-Link style links, and the exposed-pad HTQFP package provides solid grounding for electrically noisy factory wiring. Used as the main controller between sensor inputs and actuator drivers, it delivers 32-bit performance at low power; the key trade-off versus a smaller MCU is supply design for the 3.3 V rail and PCB care for the fine-pitch 64-pin footprint.
Empfohlen
IoT Edge Nodes and Sensor Hubs
For IoT edge devices, the LPC55S26JBD64Y combines 150 MHz processing for local filtering and protocol translation with NXP S-series security capabilities that protect device identity and firmware updates - essential for connected deployments. The 40-nm NVM process keeps active power low, extending battery life in duty-cycled sensor nodes, while 256 KB flash stores wireless stacks and OTA update images. As a sensor hub it aggregates ADC and digital sensor streams before forwarding via external radio modules; the design trade-off is that wireless connectivity is external, so board area must be budgeted for the radio companion IC.
Empfohlen
Secure Connected Devices
The S-series LPC55S26 adds NXP security features to the standard LPC5526 platform, making the JBD64Y well suited to secure connected products that need authenticated firmware, protected keys, and tamper-resistant boot flows - all on the same 150 MHz Cortex-M33 core. Because the security functions are integrated on-chip, designers avoid a separate secure element in many designs, reducing BOM cost and attack surface between chips. The 256 KB flash partitions cleanly into immutable boot, application, and update regions; the trade-off is that firmware teams must budget flash carefully, or migrate to the pin-compatible LPC55S28 (512 KB) without PCB changes.
Empfohlen
USB-Enabled Peripherals
With USB peripheral support in the LPC55S2x family and companion USB PHY options, the LPC55S26JBD64Y serves as the controller in USB-connected peripherals, dongles, and test accessories. The 150 MHz core sustains USB data marshalling alongside application logic, and 256 KB flash holds class drivers and vendor firmware. Designers typically pair it with a USB high-speed PHY for bandwidth beyond full-speed, using the PHY companion listed below; the exposed-pad HTQFP grounds the digital return path for signal integrity on the USB lines. The consideration is EMC layout discipline around the USB differential pair when using a fine-pitch 64-pin package.
Empfohlen
Analog Data Acquisition Systems
The LPC55S26JBD64Y is a strong host MCU for precision data acquisition: its Cortex-M33 core applies calibration and DSP filtering at 150 MHz while external precision ADCs digitize sensor channels. Distributor listings confirm on-chip ADC capability for lower-resolution channels, letting the MCU handle auxiliary monitoring while high-precision conversion is delegated to dedicated ADC companions. The 3.3 V supply matches typical analog front-end rails, simplifying power tree design, and the 64-pin package exposes ample parallel/SPI interfaces. The design trade-off is clock noise coupling into analog sections - segregate analog ground beneath the ADC and use the exposed pad for a quiet star ground.
Empfohlen
Consumer Appliances and Electronics
In consumer appliances, the LPC55S26JBD64Y provides cost-effective 32-bit control with headroom: the 150 MHz core runs touch, display, and motor-timing code concurrently, and 256 KB flash accommodates feature-rich user interfaces. Family pin-compatibility is the key commercial advantage - a product line can ship variants with LPC5526 (cost-optimized) or LPC55S28 (more flash) on one PCB, amortizing layout and qualification across SKUs. The industrial-grade HTQFP package also tolerates the thermal environment inside appliances. The trade-off versus 8-bit MCUs is higher unit cost, justified by performance and single-platform scalability across the product family.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LPC55S26JBD64Y – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LPC55S26JBD64K | LPC55S28JBD64K | LPC5526JBD64K | LPC5528JBD64K |
|---|---|---|---|---|---|
| Package | 64-HTQFP (10x10 mm), EP | 64-HTQFP (10x10) - same | 64-HTQFP (10x10) - same | 64-HTQFP (10x10) - same | 64-HTQFP (10x10) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M33, 32-bit | ARM Cortex-M33, 32-bit | ARM Cortex-M33, 32-bit | ARM Cortex-M33, 32-bit | ARM Cortex-M33, 32-bit |
| Max Clock Frequency | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz |
| Flash Memory | 256 KB | 256 KB | 512 KB | 256 KB | 512 KB |
| Security Features (S-series) | Yes | Yes | Yes | No | No |
| Temperature Grade | Industrial | Commercial | Commercial | Commercial | Commercial |
| Lifecycle Status | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade in HTQFP-64 (vs. LPC55S26JBD64K)
- On-chip security features (S-series) (vs. LPC5526JBD64K)
- Cost vs code space trade-off (vs. LPC55S28JBD64K)
Designhinweise
The LPC55S26JBD64Y uses a 64-pin HTQFP with exposed pad (EP). Solder the exposed pad to a grounded copper pour with an array of thermal vias - this is both the primary thermal path and the low-inductance ground reference for the core. Use 0.5 mm pitch footprint per IPC HTQFP-64 land pattern, and keep crystal and USB differential traces short and matched. Verify the exact land pattern against the NXP package outline drawing before layout release.
The device operates from a nominal 3.3 V supply. Decouple every VDD pin pair with 100 nF ceramic capacitors placed within 2 mm of the pins, plus one bulk 10 uF capacitor near the supply entry. If the board also powers analog circuitry, follow the LPC552x/S2x hardware design guideline of separating VDDA/VSSA supply filtering from the digital rail to protect ADC accuracy. Confirm exact decoupling topology in the NXP user manual for the family.
Do not assume pinout equivalence with other vendors' 64-pin Cortex-M MCUs - the LPC55S2x BD64 pin map is NXP-specific, and cross-brand parts are not drop-in. Within the family, migration from LPC55S26 to LPC55S28 (512 KB) is a firmware-level change, but verify link-script memory regions and any flash-configuration constants. When sourcing, note the 'Y' suffix (industrial grade) versus 'K' (commercial) suffix controls the temperature grade, not the pinout.
Compliance-Informationen
Compliance statuses were not present in the verified web data; confirm on the NXP product page (nxp.com/part/LPC55S26JBD64) which lists Environmental Quality details.
