MAC7131VVF50R2 - 32-Bit ARM7 MCU, 512KB Flash, 144-MBGA | NXP
Teilenummer: MAC7131VVF50R2 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $73.9466 | $73,95 |
| 10 | $65.5 | $655,00 |
| 100 | $45.2 | $4.520,00 |
| 500 | $32.85 | $16.425,00 |
| 1.000 | $27.26 | $27.260,00 |
MAC7131VVF50R2 Übersicht
The MAC7100 family is a series of ARM7TDMI-S based microcontrollers (MCUs) designed by Freescale (now NXP) for automotive body electronics. As an automotive microcontroller, it sits within the broader hierarchy of embedded processors > microcontroller units (MCUs) > 32-bit MCUs > ARM Cortex/ARM7 family. The part integrates Flash, SRAM, multiple timer modules, CAN and SPI peripherals, and an A/D converter on a single die, reducing system BOM and PCB complexity.
Key features include 512 KB of on-chip program Flash (organized as 512K x 8), a 32-bit ARM7TDMI-S RISC core with Thumb instruction support, automotive-grade temperature operation, and an integrated enhanced CAN (FlexCAN) interface. The MAC7100 series was designed for ISO 9141 and SAE J1850 body-comms protocols and is widely used in BCM (body control module) designs.
Typical applications include automotive body control modules, instrument cluster controllers, HVAC panels, door module controllers, and powertrain peripheral ECUs. The part meets AEC-Q100 stress-test requirements as qualified by Freescale (now NXP) for under-the-hood and body-comfort zones.
Designers should note that the part is mature and in some variants rated Last Time Buy by NXP; verify lifecycle status with the distributor before committing to new designs. The 144-MBGA package requires 4-layer PCB stack-up with controlled-impedance routing for the external memory bus to meet timing closure.
Drop-in-Alternativen für MAC7131VVF50R2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MAC7131VVF50R2 (gleiche Bauform und Footprint) – abweichend in Manufacturer, Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MAC7131MVF50
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAC7141VVF50
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAC7131VVF50
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S12HZ256J3CAL
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MAC7131VVF50R2 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM7TDMI-S 32-bit RISC |
| Core Clock Speed (Max) | 50 MHz |
| Program Memory | 512 KB Flash (512K x 8) |
| Supply Voltage Range | 2.35 V to 2.75 V |
| Gehäuse | 144-MBGA / MAP-BGA (7x7 mm) |
| Montageart | Surface Mount |
| Bit Width | 32-bit |
| Betriebstemperatur | -40C to +125C (automotive grade) |
| AEC-Q100 Qualified | Yes |
| RoHS-Status | RoHS Compliant (lead-free per XSourcePart listing) |
| Inventory at Distributors (Oct 2026) | 42838 units (Full-Electronic); 734 units (XSourcePart) |
| Manufacturer | Freescale Semiconductor (now NXP Semiconductors) |
| Series | MAC7100 |
| Peripherals (typical of family) | FlexCAN, SPI, UART, ADC, Timers |
| Pin/Ball Count | 144 balls |
MAC7131VVF50R2 144-mbga / map-bga (7x7 mm) Pinbelegungsleitfaden
Pinbelegung für MAC7131VVF50R2 (144-mbga / map-bga (7x7 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MAC7131VVF50R2.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MAC7131VVF50R2 ist geeignet für 7 Anwendungs: Automotive Body Control Module (BCM), Instrument Cluster Controller, HVAC Control Panel ECU, Door Module Controller, Automotive Lighting ECU, Powertrain Peripheral ECU (non-safety), Industrial CAN-Based Controller (non-automotive).
Automotive Body Control Module (BCM)
The MAC7131VVF50R2 fits BCM designs because its 50 MHz ARM7TDMI-S core and integrated FlexCAN module handle multiple LIN/CAN body-comfort messages within tight latency budgets. Its 512 KB Flash accommodates a full BCM firmware image including CAN stack, drivers, and application logic, while 2.35V-2.75V operation pairs with a single 5V-to-2.5V LDO from the 12V battery rail. AEC-Q100 Grade-1 qualification and 144-MBGA thermal performance suit under-dash and behind-glovebox installations where ambient temperatures regularly exceed 85C.
Empfohlen
Instrument Cluster Controller
For instrument cluster controllers the MAC7131VVF50R2 drives stepper-motor gauges, indicator LEDs, and CAN-FD messaging at 50 MHz, with 512 KB Flash storing graphical needle-maps and warning-logic tables. Its 144-MBGA 7x7 mm package fits behind-IPC mechanical envelopes, while AEC-Q100 Grade-1 temperature rating ensures reliable operation at sustained 105C ambient under direct sun load. Compared with 8-bit automotive MCUs, the ARM7TDMI-S core delivers deterministic 1-cycle 32-bit math required for odometer/calculation tasks.
Empfohlen
HVAC Control Panel ECU
The MAC7131VVF50R2 supports HVAC ECUs by mixing CAN/LIN communication, PWM blower-fan control, and ADC temperature/blend-door feedback within a single chip. Its -40C to +125C rating handles vent-temperature extremes in cold-start and sun-soaked conditions; 512 KB Flash stores fan-control curves, fault diagnostics, and CAN network-management firmware. Hardware timer modules provide the precise PWM edges required for brushless blower commutation without software jitter.
Empfohlen
Door Module Controller
Within a door module the MAC7131VVF50R2 handles window-lift PWM, mirror-fold motor drive sequencing, and CAN I/O multiplexing with a single 50 MHz ARM7 core. Its 144-MBGA is small enough for slim mirror-footprint PCBs, while the 512 KB Flash supports multi-window anti-pinch algorithms and factory-end-of-line calibration tables. AEC-Q100 Grade-1 temperature tolerance is essential for door-cavity ambient swings from -40C winter soak to 80C sun-soak.
Empfohlen
Automotive Lighting ECU
The MAC7131VVF50R2 drives adaptive headlamp modules, daytime-running-light controllers, and interior-ambient LED managers via PWM timers and CAN-controlled dimming profiles. Its ARM7TDMI-S core executes dimming math and CAN diagnostics within microsecond deadlines, while 512 KB Flash holds per-vehicle light signatures and OTA boot-loader stubs. AEC-Q100 qualification ensures LED-driver outputs remain stable across voltage-dump and load-dump transients.
Empfohlen
Powertrain Peripheral ECU (non-safety)
For non-safety powertrain peripherals such as transmission range sensors, electric water-pump controllers, and oil-condition monitors, the MAC7131VVF50R2 supplies 32-bit math throughput for adaptive control loops while its CAN interface integrates with the vehicle's drivetrain CAN bus. The 144-MBGA 7x7 mm footprint fits IP67-sealed under-hood enclosures, and AEC-Q100 Grade-1 rating survives sustained 125C oil-bath ambients. Choose this part for non-ASIL peripherals; for ASIL-B/C applications migrate to S32K3xx with hardware ASIL decomposition.
Empfohlen
Industrial CAN-Based Controller (non-automotive)
Outside automotive, the MAC7131VVF50R2 suits industrial CANopen or DeviceNet slave controllers driving conveyor segments, hydraulic valves, and machine-tool actuators. Its 50 MHz ARM7 core executes CANopen CiA-401/402/402 profile state machines within 1 ms cycle budgets, while the 512 KB Flash holds multi-protocol firmware variants plus vendor objects. The 144-MBGA enables compact IP67 remote-IO modules where 8-bit MCUs lack the headroom for full CANopen stack.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MAC7131VVF50R2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MAC7131MVF50 | MAC7141VVF50 | MAC7131VVF50 | S9S12HZ256J3CAL |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-MBGA (7x7 mm) | 144-MBGA (7x7 mm) | 144-MBGA (7x7 mm) | 144-MBGA (7x7 mm) | LQFP-112 (different package) |
| Core Architecture | ARM7TDMI-S 32-bit RISC | ARM7TDMI-S 32-bit | ARM7TDMI-S 32-bit | ARM7TDMI-S 32-bit | HCS12 16-bit |
| Maximum Core Clock | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| Supply Voltage | 2.35V to 2.75V | 2.35V to 2.75V | 2.35V to 2.75V | 2.35V to 2.75V | 2.35V to 2.75V |
| Automotive Temperature Grade | Grade-1 (-40C to +125C) | Grade-2 (-40C to +85C) | Grade-1 (-40C to +125C) | Grade-1 (-40C to +125C) | Grade-1 (-40C to +125C) |
| Delivery Form | 13-inch Reel (R2) | 13-inch Reel | 13-inch Reel | Tray (no R2 suffix) | Tray |
Wichtigste Unterscheidungsmerkmale
- Wide-temperature Grade-1 AEC-Q100 qualification (-40C to +125C) (vs. MAC7131MVF50)
- Reel-packaged delivery form for SMT line compatibility (vs. MAC7131VVF50 (non-R2 suffix))
- Established long-term supply in distribution channel (vs. S9S12HZ256J3CAL)
Designhinweise
Estimated: at full 50 MHz core clock with all peripherals enabled and 2.5V supply, the MAC7131VVF50R2 typically draws 60-90 mA (~150-225 mW). The 144-MBGA 7x7 mm package thermal resistance is in the 35-45 C/W range per NXP MAC7100 datasheet, requiring either thermal vias to an inner copper plane or a 4-layer FR4 stack-up with at least 1 oz copper top/bottom pours to keep junction temperature below 125C in under-hood installations.
The 144-MBGA 7x7 mm package requires a 4-layer (or better) PCB stack-up with 0.4 mm-pitch ball pitch and 0.25 mm via-pad diameter. Recommended: microvia-in-pad for all balls, NSMD (non-solder-mask-defined) lands, and 0.1 mm solder-mask expansion. Always follow NXP AN2419 BGA layout guidelines - skipping the microvia stack results in head-in-pillow opens during reflow. Use ENIG finish for better solderability and shelf-life.
Estimated: the MAC7131VVF50R2 2.35V-2.75V supply feeds sensitive analog (ADC) and digital cores; separate them with ferrite beads and 0.1 uF + 10 uF decoupling caps placed within 5 mm of each supply pin. For automotive 12V battery inputs, place a load-dump-protected 5V TO-220 LDO (e.g. NXP MCZ33996) with a 2.5V post-regulator, plus TVS protection for reverse-battery and jump-start transients per ISO 7637-2.
Do not confuse the M temperature grade (MAC7131MVF50) with the V Grade-1 grade (MAC7131VVF50R2) when ordering - the M part is restricted to -40C to +85C, making it unsuitable for true under-hood deployment. Also note that the MAC7100 family uses the legacy Freescale CodeWarrior toolchain; new designs should consider migrating to S32K1xx with active S32 Design Studio support and longer product lifecycle commitments.
The external memory and peripheral buses on the MAC7131 require series-damping resistors (22-33 ohm) on clock and strobe lines to suppress reflections, especially when the bus length exceeds 25 mm. Trace-impedance target of 50 ohms +/- 10% requires the calculated microstrip or stripline geometry; add a guard ground on each critical layer adjacent to the bus. Always validate with TDR measurements on first-article boards.
Compliance-Informationen
RoHS compliant (lead-free) per XSourcePart listing on Oct 21, 2026. AEC-Q100 Grade-1 automotive qualified by Freescale (now NXP). REACH, halogen-free, and conflict-mineral declarations should be obtained directly from NXP compliance portal for end-application documentation.
