MAX1009C/D-C10301 - 12-Bit 32-Channel ADC ASIC Die | Maxim Integrated
Teilenummer: MAX1009C/D-C10301 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.2 | $282,00 |
| 100 | $22.1 | $2.210,00 |
| 500 | $17.8 | $8.900,00 |
| 1.000 | $14.95 | $14.950,00 |
MAX1009C/D-C10301 Übersicht
An ADC (analog-to-digital converter) is a data-converter integrated circuit that samples continuous analog input signals and quantizes them into discrete digital codes for downstream processing by microcontrollers, FPGAs, or DSPs. Multi-channel ADCs such as the MAX1009 integrate an input multiplexer, a sample-and-hold front-end, a quantizer, and a digital interface on a single die; supplying the device as a bare die lets the OEM place the converter directly next to the analog sensor cluster, minimizing trace length, parasitic capacitance, and analog crosstalk. The "LN" suffix in the part description indicates a low-noise analog front-end, which is important when digitizing low-amplitude sensor signals such as those from thermocouples, strain gauges, photodiodes, and biomedical electrodes.
Key features include 12-bit resolution across 32 analog input channels, low-noise analog front-end, ASIC-grade integration (system-on-die multi-channel design), bare-die (C/D) package for custom packaging, and a Bulk shipping form factor that protects the un-packaged die. The 12-bit resolution provides 4096 discrete output codes (LSB = VREF/4096), adequate for general-purpose instrumentation, industrial process monitoring, and medical patient-monitoring equipment where 14-16 bit performance is not required.
The MAX1009C/D-C10301 is best understood as part of Maxim's broader MAX1009 family of multi-channel data-acquisition ASICs. Because it is supplied as a bare die, all I/O pads, ESD protection, bonding-diagram, and pad-pitch details are application-specific and must be reviewed against the full manufacturer datasheet before PCB or substrate layout is finalized. Distributors list the part under the category "Data Acquisition - Analog to Digital Converters (ADC)", confirming its positioning within the mixed-signal data-converter portfolio.
Typical applications include multi-channel sensor interfaces, industrial process control, portable instrumentation, medical patient monitoring, and automated test equipment (ATE) where the bare-die form factor enables compact, custom-packaged multi-channel signal chains. When designing with this die, coordinate package, bonding, and ESD layout with the manufacturer reference documentation and the chosen substrate house to ensure signal integrity across all 32 channels.
Drop-in-Alternativen für MAX1009C/D-C10301 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MAX1009C/D-C10301 (gleiche Bauform und Footprint) – abweichend in Converter Type, Input Type, Manufacturer, Mounting Type, Resolution.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MAX1009C/D
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MAX1009C/D-C10302
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MAX1009CEE
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MAX1009C/D-C10301 Grenzwerte & elektrische Eigenschaften
| Auflösung | 12 bits |
| Number of Input Channels | 32 |
| Converter Type | ADC (multi-channel, low-noise analog front-end) |
| Input Type | Single-ended analog inputs (channel count per datasheet) |
| Architecture | ASIC multi-channel data-acquisition front-end |
| Package Type | Bare Die (C/D form) |
| Montageart | Die mount / chip-on-board |
| Packaging Form (Shipping) | Bulk |
| RoHS-Status | ROHS3 Compliant (per distributor listing) |
| Base Part Number | MAX1009 |
| Manufacturer | Analog Devices Inc. / Maxim Integrated |
MAX1009C/D-C10301 bare die (c/d form) Pinbelegungsleitfaden
Pinbelegung für MAX1009C/D-C10301 (bare die (c/d form)-Gehäuse). Dieses analoge Bauteil verfügt über Eingangs-, Ausgangs- und Versorgungspins. Offset-Null-, Kompensations- und Enable-Pin-Konfigurationen entnehmen Sie dem Herstellerdatenblatt. Ideal für Signalaufbereitung und Verstärkerschaltungen.
Keine detaillierten Pinbelegungsdaten verfügbar für MAX1009C/D-C10301.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MAX1009C/D-C10301 ist geeignet für 6 Anwendungs: Multi-Channel Industrial Sensor Interface, Medical Patient Monitoring Equipment, Portable Battery-Powered Instrumentation, Automated Test Equipment (ATE) for Mixed-Signal ICs, Building Automation and HVAC Sensor Networks, Aerospace Flight-Control Sensor Aggregation.
Multi-Channel Industrial Sensor Interface
The MAX1009C/D-C10301's 32 single-ended input channels and 12-bit resolution make it well-suited to industrial sensor-interface modules that aggregate thermocouple, RTD, pressure, and flow signals in a single hybrid assembly. Placing the ADC as a bare die directly adjacent to the sensor cluster minimizes trace-induced noise and channel-to-channel skew, which is critical when digitizing sub-millivolt signals at 12-bit LSB resolution. The low-noise analog front-end (LN in the description) preserves SNR across all 32 channels without requiring per-channel instrumentation amplifiers, simplifying the analog signal chain.
Empfohlen
Medical Patient Monitoring Equipment
Medical multi-parameter patient monitors (ECG, SpO2, temperature, respiration) often require 12-bit resolution across 8-32 analog channels per module, and the MAX1009C/D-C10301 is well-matched to that channel density. Its bare-die format allows the ADC to be co-located with the analog front-end in a compact, EMI-shielded hybrid, which is important for IEC 60601-1 patient-safety compliance. The 12-bit LSB granularity (VREF/4096) is adequate for ECG (typically 10-12 bits effective) and SpO2 plethysmography when paired with a low-noise reference.
Empfohlen
Portable Battery-Powered Instrumentation
Portable handheld instruments (data loggers, environmental analyzers, field-calibration tools) benefit from the MAX1009C/D-C10301's high channel count in a tiny bare-die footprint, freeing PCB area for batteries and display. With 12-bit resolution across 32 channels the ADC can scan a multi-sensor array (gas, humidity, temperature, flow) at low aggregate data rates suitable for low-power duty-cycled sampling. Pairing the bare die with a low-power MCU/FPGA lets the entire data-acquisition subsystem fit in a palm-sized enclosure.
Empfohlen
Automated Test Equipment (ATE) for Mixed-Signal ICs
Multi-site ATE for mixed-signal ICs typically requires digitizing many DUT pins in parallel during characterization, and the MAX1009C/D-C10301's 32-channel density on a single die is an efficient match. The bare-die format also supports integration into a probe-card or DUT-board hybrid where PCB-based ADCs would occupy too much real estate around the test socket. The 12-bit resolution is appropriate for functional parametric tests (DC levels, supply currents via sense resistors) where 0.025% precision is sufficient.
Empfohlen
Building Automation and HVAC Sensor Networks
Building automation controllers aggregate dozens of analog sensors (temperature, humidity, CO2, occupancy) per floor or zone, and the MAX1009C/D-C10301's 32 channels on a single die minimize the per-channel cost and PCB area. The low-noise analog front-end digitizes small thermistor and photo-sensor signals with 12-bit accuracy, which is adequate for HVAC setpoint control and trend logging. Hybrid integration lets the sensor node fit in a small ceiling-mounted enclosure alongside the wireless module.
Empfohlen
Aerospace Flight-Control Sensor Aggregation
Avionics and UAV flight-control systems use multi-channel ADC ASICs to digitize position, rate, and actuator-feedback sensors, and the MAX1009C/D-C10301 is a candidate for high-density hybrid sensor interfaces. The bare-die format allows the ADC to be packaged with radiation-tolerant shielding or alongside a custom analog front-end in a single hermetic module. The 12-bit resolution supports typical flight-control feedback accuracies (1 LSB ~0.025% FS), and the 32-channel count lets one ADC serve an entire sensor cluster per flight-control channel.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MAX1009C/D-C10301 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MAX1009C/D | MAX1009C/D-C10302 | MAX1009CEE | MAX1302EEG+ |
|---|---|---|---|---|---|
| Package | Bare Die (C/D, Bulk) | Bare Die (C/D, Bulk) - same | Bare Die (C/D, Bulk) - same | Bare Die (C/D, ESS) - same die, screened variant | QSOP-24 (packaged, not bare die) |
| Brand | Maxim Integrated (now Analog Devices) | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Resolution | 12 bits | 12 bits - same | 12 bits - same | 12 bits - same | 14 bits (higher) |
| Number of Input Channels | 32 | 32 - same | 32 - same | 32 - same | 16 (half - need 2 ICs for 32) |
| Converter Type | ADC ASIC, Low-Noise | ADC ASIC, Low-Noise - same | ADC ASIC, Low-Noise - same | ADC ASIC, Low-Noise (ESS) - same | SAR ADC, Packaged |
| Mounting Type | Die mount / chip-on-board | Die mount - same | Die mount - same | Die mount - same | Surface Mount (QSOP-24) |
| RoHS Compliance | ROHS3 Compliant | ROHS3 Compliant - same | ROHS3 Compliant - same | ROHS3 Compliant - same | ROHS3 Compliant |
| Primary Use Case | Hybrid 32-channel sensor aggregation | Same use case, no customer suffix | Same use case, customer-programmed | Same use case, higher-reliability screening | SMT 16-channel data-acquisition board |
Wichtigste Unterscheidungsmerkmale
- 32 single-ended analog input channels on a single bare die (vs. MAX1302EEG+ (16-channel packaged))
- Bare-die (C/D) supply for hybrid/Chip-on-Board integration (vs. MAX1302EEG+ (QSOP-24 packaged))
- Low-noise (LN) analog front-end per Maxim product line (vs. TI ADS1258 (24-bit 24-channel))
Designhinweise
The MAX1009C/D-C10301 is supplied as a bare die; PCB design must follow the manufacturer's bonding diagram for pad pitch, pad metal (typically Au over Ni), and ESD protection. Do not attempt to solder a bare die to a standard PCB land pattern - the part requires die-attach and wire-bond or flip-chip processes handled by a qualified hybrid-assembly house. Confirm pad pitch and passivation opening dimensions from the manufacturer datasheet before substrate layout is committed.
When laying out the substrate for the bare die, place the analog input traces (32 channels) symmetrically and shield them with a guard ring tied to the analog ground plane to minimize channel-to-channel crosstalk. Keep digital interface traces (clock, data, /CS) on the opposite side of the die with a separate digital ground that joins the analog ground only at the ADC ground pad. Estimated: at 12-bit LSB = VREF/4096, 1 LSB of cross-channel coupling can be caused by as little as ~250 uV of common-mode noise on a 1 V reference.
Bare-die ADCs require known-good-die (KGD) testing and ESD-safe handling (HBM class 1A or better). Store the die in nitrogen-purged dry-pack packaging until assembly, and observe ESD-safe workstation protocols (grounded wrist strap, ionizer, dissipative mat) per JEDEC JESD625-A. Operating-temperature range, supply voltage, and ESD HBM/CDM ratings are not fully disclosed in the distributor listings and must be confirmed against the manufacturer datasheet before production release.
Decoupling: place a 100 nF X7R ceramic bypass capacitor on each analog VDD pad and a 10 uF bulk capacitor at the package entry; place a 100 nF cap on each digital VDD pad. Reference: use a low-noise, low-drift external reference (e.g. MAX6126 or ADR01) with the reference input bypassed by 10 uF + 100 nF. Estimated: at 12 bits, reference noise must be kept below ~250 uVrms to avoid degrading SNR by 0.5 LSB.
Compliance-Informationen
ROHS3 Compliant per distributor listing (ic-acquisition.com). AEC-Q100 not applicable (industrial / instrumentation positioning). REACH, halogen-free, and conflict-mineral status not disclosed in distributor data; consult Analog Devices' product compliance letter for confirmation.
