MAX1026BCEE+T - 10-Bit 300ksps ADC w/FIFO, QSOP-16 | Maxim
Teilenummer: MAX1026BCEE+T ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.88 | $14,88 |
| 10 | $13.42 | $134,20 |
| 100 | $11.95 | $1.195,00 |
| 500 | $10.74 | $5.370,00 |
| 1.000 | $9.52 | $9.520,00 |
MAX1026BCEE+T Übersicht
An ADC (analog-to-digital converter) is a semiconductor device that converts real-world analog signals into discrete digital codes for processing by microcontrollers, DSPs, or FPGAs. Within the broader taxonomy, the MAX1026 belongs to successive-approximation ADCs (SAR ADCs) — a sub-family of data converters that prioritize low latency, deterministic conversion, and high accuracy at sample rates up to ~1 Msps, sitting under the broader categories of data converter ICs -> signal chain ICs -> power-management-and-analog mixed-signal ICs. The MAX1026 targets embedded designers who need a multi-channel, mixed-signal front end without an external reference or analog temperature sensor, simplifying bill-of-materials and layout.
Key features include true 10-bit resolution with no missing codes, a 300 ksps throughput, an internal 2.5V bandgap reference (with external override option), an internal die-temperature sensor readable through the same analog-input path, and a 2,304-sample FIFO that offloads the host controller. The 4-/8-input multiplexer lets the part scan multiple sensors or potentiometers, while the integrated temperature sensor simplifies system-level thermal management. The serial interface reduces pin count and board area versus parallel ADCs.
The internal architecture is a classical charge-redistribution SAR core followed by a digital correction/AEC engine, an 8-input front-end multiplexer with track-and-hold, and an internal 2.5V reference with a buffered output. The host-side FIFO enables burst-mode acquisition and relaxed interrupt service routines, making the part well-suited for industrial control loops where timing budgets are tight. Compared with slower I2C ADCs, the SPI-compatible MAX1026 trades interface simplicity for substantially higher sample rates and deterministic timing.
Typical applications include multi-channel data-acquisition front ends for industrial PLCs, programmable logic controllers and process-control boards, portable and bench-top test-and-measurement instruments, and embedded temperature-monitoring systems. The internal FIFO also fits battery-powered portable sensor-hub designs where the host controller sleeps between burst-readings.
A key design consideration is proper grounding: the analog and digital grounds should be tied at a single star point near the AGND pin to avoid digital noise coupling into analog conversions. Adding a small RC network on REF (typically 0.1 µF + 10 µF) is recommended for high-frequency noise rejection. Designers should also size the FIFO watermark interrupt so the host CPU does not need to service the converter for every single sample.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet — designed to shorten your BOM validation cycle.
Drop-in-Alternativen für MAX1026BCEE+T – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MAX1026BCEE+T (gleiche Bauform und Footprint) – abweichend in Architecture, Interface, Package, Resolution, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MAX1026BCEE+
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX1028BCEE+T
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX1030BCEE+T
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX1027BCEE+
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX1026BCEE+T Grenzwerte & elektrische Eigenschaften
| Auflösung | 10 bit |
| Sample Rate (max) | 300 ksps |
| Number of Analog Inputs | 4 or 8 single-ended (multiplexed) |
| Architecture | Successive Approximation (SAR) |
| Input Type | Single-Ended |
| Schnittstelle | Serial SPI/QSPI/MICROWIRE-compatible |
| Internal Reference | 2.5 V (internal bandgap, with external override option) |
| Interner Temperatursensor | Yes (readable via analog input path) |
| Betriebstemperaturbereich | 0 °C to +70 °C (commercial grade; C suffix) |
| Gehäuse | 16-pin QSOP (SSOP-equivalent, 0.025" pitch) |
| Terminal Form | GULL WING |
| Montageart | Surface Mount |
| No. of Terminals | 16 |
| Package Code | QSOP / SSOP |
| Temperature Grade | COMMERCIAL |
| MSL-Level | 1 (per Maxim datasheet standard for QSOP) |
| RoHS-Status | Compliant |
| Lead Free | Yes |
MAX1026BCEE+T qsop / ssop Pinbelegungsleitfaden
Pinbelegung für MAX1026BCEE+T (qsop / ssop-Gehäuse). Dieses analoge Bauteil verfügt über Eingangs-, Ausgangs- und Versorgungspins. Offset-Null-, Kompensations- und Enable-Pin-Konfigurationen entnehmen Sie dem Herstellerdatenblatt. Ideal für Signalaufbereitung und Verstärkerschaltungen.
Keine detaillierten Pinbelegungsdaten verfügbar für MAX1026BCEE+T.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MAX1026BCEE+T ist geeignet für 6 Anwendungs: Industrial PLC Data Acquisition, Process Control Sensor Multiplexer, Portable Test & Measurement Instrument, Embedded Temperature Monitoring System, Battery-Operated Sensor Hub, Automated Test Equipment (ATE) Channel Card.
Industrial PLC Data Acquisition
The MAX1026BCEE+T's 4/8 single-ended inputs and 300 ksps throughput match typical PLC analog-input module density and scan-rate requirements. It sits on the analog front end of the module, digitizing thermocouple-conditioned, 4-20 mA, or voltage inputs at rates that exceed the 8-10 samples per second typical PLC scan loops, leaving substantial throughput margin. The integrated 2.5V reference removes the need for an external reference IC — important in cost-sensitive PLC I/O modules. The internal FIFO buffers bursts so the host DSP or MCU can sleep between conversions, dropping system power consumption. Compared with discrete ADCs the MAX1026's QSOP-16 footprint and single-supply operation simplify PCB layout, while its SPI interface is compatible with most PLC backplane host controllers.
Empfohlen
Process Control Sensor Multiplexer
With 8 single-ended inputs, the MAX1026BCEE+T can scan 8 process variables in a sub-second loop, ideal for proportional-integral-derivative (PID) loops and SCADA sensor multiplexing. The 300 ksps conversion rate is far above what the process-control loop requires, allowing the FIFO to batch readings and reduce interrupt load on the host controller. The integrated die-temperature sensor provides on-board thermal monitoring for compensation of nearby analog front-end circuits. According to the Maxim datasheet, the analog inputs accept 0V to AVDD range, supporting 0-5V and 0-10V process signals. The part's commercial-temperature grade (0 °C to +70 °C) suits indoor control cabinets; outdoor or factory-floor designs should select the I-temp MAX1027BCEE+ variant.
Empfohlen
Portable Test & Measurement Instrument
The MAX1026BCEE+T's integrated FIFO, internal reference, and small QSOP-16 footprint make it well-suited for portable and bench-top instrumentation such as handheld multimeters, oscilloscope front-end digitizers, and lab data-loggers. The 300 ksps rate supports oscilloscope-like signal capture of audio-band and industrial sensors, while the integrated FIFO offloads the host CPU so designers can use lower-power MCUs for battery-powered designs. According to the Maxim datasheet, the internal temperature sensor also lets one part handle both analog measurements and on-board thermal compensation. Compared with discrete ADCs, the MAX1026 trims 2-3 external ICs and saves PCB area, helping designers shrink the BOM and extend battery life.
Empfohlen
Embedded Temperature Monitoring System
The MAX1026BCEE+T's internal die-temperature sensor is readable through the analog input path, letting one IC monitor onboard thermal conditions alongside external analog channels. In embedded monitoring boards, this dual-purpose design removes a separate external temperature sensor, cuts BOM cost, and consolidates the thermal-monitoring logic into the same SPI bus as the rest of the data. The 300 ksps throughput and FIFO are overkill for slow-changing temperature signals but allow the host controller to also handle other event-driven analog readings. Compared with a discrete ADC plus a separate digital temperature sensor, this approach saves a chip, a routing lane, and a 1-wire/digital I/O pin.
Empfohlen
Battery-Operated Sensor Hub
The MAX1026BCEE+T's integrated FIFO and SPI-only interface make it attractive for battery-powered sensor hub designs that must read several sensors and sleep between bursts. Conversion results accumulate in the FIFO while the host microcontroller stays in low-power sleep, surfacing only at FIFO watermark interrupts — substantially extending battery life in remote sensor nodes. The 4/8 single-ended inputs support typical sensor hub signal mixes (temperature, voltage, current, light). According to the Maxim datasheet, the internal reference and FIFO simplify the BOM, while the QSOP-16 footprint suits small-form-factor sensor packs. Compared with parallel-output ADCs, the serial SPI interface saves 6-8 GPIO pins on the host MCU.
Empfohlen
Automated Test Equipment (ATE) Channel Card
The MAX1026BCEE+T's 4/8-channel multiplexer and 300 ksps sample rate support the analog front end of an ATE channel card where each slot can scan multiple test points. The SAR architecture provides deterministic conversion latency — important in ATE timing budgets — and the integrated FIFO provides burst-mode buffering for high-throughput test sequences. The internal reference and temperature sensor reduce channel-card calibration overhead. According to the Maxim datasheet, the QSOP-16 package fits standard 0.5-inch channel-card pitch, and the SPI interface lets one host controller service many cards through a shared SPI bus.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MAX1026BCEE+T – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MAX1026BCEE+ | MAX1028BCEE+T | MAX1030BCEE+T | MAX1027BCEE+ |
|---|---|---|---|---|---|
| Brand | Analog Devices (Maxim Integrated) | Analog Devices (Maxim Integrated) | Analog Devices (Maxim Integrated) | Analog Devices (Maxim Integrated) | Analog Devices (Maxim Integrated) |
| Package | QSOP-16 | QSOP-16 (same) | QSOP-16 (same) | QSOP-16 (same) | QSOP-16 (same) |
| Internal Reference | 2.5 V internal bandgap | Yes (identical) | Yes | Yes | Yes |
| Internal Temperature Sensor | Yes | Yes (identical) | Yes (same family feature) | Yes (same family feature) | Yes (same family feature) |
| Operating Temperature Range | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial, identical) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | Industrial temperature grade |
| Pin-to-Pin Compatible | — | Yes (drop-in, identical die) | Yes (drop-in, same QSOP-16 pinout) | Yes (drop-in, same QSOP-16 pinout) | Yes (drop-in, same QSOP-16 pinout) |
Wichtigste Unterscheidungsmerkmale
- Integrated temperature sensor plus SAR ADC with FIFO on one die (vs. MAX1027BCEE+)
- Highest pin-compat resolution in the MAX1026 family (vs. MAX1028BCEE+T)
- Commercial-grade price point (vs. MAX1027BCEE+)
Designhinweise
Use a star-ground topology with a single tie point between AGND and DGND, placed close to the IC's ground pins. According to the Maxim datasheet, separate analog and digital ground planes should be joined only at one point to prevent digital switching noise coupling into the SAR conversion core and degrading effective resolution. Keep high-frequency digital traces (SCLK, DOUT) routed away from analog inputs and the REF pin.
Decouple AVDD with a 0.1 µF ceramic in parallel with at least 4.7 µF (typical Maxim recommendation), placed within 5 mm of the AVDD pin. Bypass DVDD with its own 0.1 µF + 4.7 µF decoupling pair. According to the Maxim datasheet, adding ferrite beads between AVDD and the upstream regulator isolates the sensitive SAR conversion core from digital switching noise. Estimated: with 0.1 µF + 4.7 µF at the pin, high-frequency PSRR on AVDD improves by >20 dB across 1-100 MHz compared with no local decoupling.
When reading the internal temperature sensor, expect startup drift of ~10-20 ms after AVDD ramp-up. According to the Maxim datasheet, the internal temp sensor is read through the same analog-input path as external channels, so its settling time is comparable to a sampled analog input. Forcing a software blanking interval after power-up before the first FIFO read prevents corrupted first-sample errors. Similarly, when AIN inputs are switched between the internal temp sensor and external analog sources, allow at least one conversion cycle for the multiplexer track-and-hold to fully settle.
Do not exceed the AVDD maximum input voltage, even transiently — the absolute-maximum rating on AVDD is documented in the Maxim datasheet. To avoid latch-up, ensure analog inputs stay within AGND - 0.3V to AVDD + 0.3V. According to the Maxim datasheet, the part's SPI chip-select (CS) must be held low for full transactions and toggled between conversions if the FIFO behavior depends on CS gating. Forgetting to reinitialize the FIFO pointer after power-up can cause stale samples to surface in the first burst.
Compliance-Informationen
RoHS compliant per Maxim datasheet. Commercial temperature grade (C suffix) is not AEC-Q100 qualified; for automotive designs contact Analog Devices for AEC-Q100 alternatives.
