MC13892JVLR2 - i.MX PMUIC 4-Buck/12-LDO PMIC | NXP | 186-PBGA
Teilenummer: MC13892JVLR2 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $5.05 | $50,50 |
| 100 | $4.52 | $452,00 |
| 500 | $3.98 | $1.990,00 |
| 1.000 | $3.87 | $3.870,00 |
| 3.000 | $3.65 | $10.950,00 |
MC13892JVLR2 Übersicht
A Power Management IC (PMIC) for application processors is a mixed-signal system IC that generates, sequences, monitors, and protects every DC voltage rail required by a SoC and its companion peripherals. PMICs sit at the top of the portable power hierarchy (battery charger -> PMIC -> DC-DC converters -> LDOs -> load) and replace what would otherwise be a dozen+ regulators and sequencers with one programmable device. For i.MX-class multimedia processors the PMIC must supply core, memory, I/O, PLL, and analog rails at precise voltages with controlled rise times, so dedicated i.MX PMICs (the MC13892 family) exist as opposed to generic multi-rail controllers.
Key features include 4 synchronous buck converters for high-current SoC rails, 12 LDOs (some low-noise) for peripherals, a programmable battery charger with JEITA support, a backlight/WLED driver, USB-OTG boost, an ATE SPI/IC control interface for dynamic voltage scaling, and integrated power-on reset plus thermal shutdown. Output voltages are factory-trimmed but can be re-programmed in-system through the SPI bus for hardware bring-up and DVFS. Active supply current draw is held low in deep-sleep modes to extend battery life in always-on mobile devices.
Typical applications span portable media players, in-vehicle infotainment and telematics, navigation (GPS/PND) devices, e-readers and tablet-style handhelds, industrial handhelds, and any battery-powered i.MX-based embedded platform. In each case the MC13892JVLR2 reduces part count, eases power sequencing, and provides a single point of configuration through the standard SPI/I2C interface used by the Linux BSP and Android HAL.
When designing with this part, follow the NXP reference layout closely: 186-pin PBGA demands microvia HDI stack-ups with controlled-impedance inner layers, and decoupling capacitors must be placed directly under the BGA break-out vias to support the buck converters' switching transients.
This page synthesizes distributor pricing, drop-in alternatives in the same package, and practical design notes such as PCB layout for the 186-PBGA, drawing on data sources beyond the basic manufacturer datasheet.
Drop-in-Alternativen für MC13892JVLR2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC13892JVLR2 (gleiche Bauform und Footprint) – abweichend in Function, Package, Topology, Host Interface, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC13892DJVLR2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC13892JVL
✅ Drop-In✓ Auf Lager
$7.65 / Stück
Datenblatt ansehen →MC13892CJVR2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC13892AJVL
✅ Drop-In✓ Auf Lager
$6.1 / Stück
Datenblatt ansehen →MC13892JVLR2 Grenzwerte & elektrische Eigenschaften
| Product Type | PMIC (Power Management IC) |
| Funktion | PMUIC with 4 buck converters and 12 LDO regulators |
| Application Processor Support | i.MX51, i.MX37, i.MX35, i.MX27 |
| Buck Converters | 4 (synchronous) |
| LDO Regulators | 12 (including low-noise) |
| Schnittstelle | SPI / I2C (programmable) |
| Battery Charger | Integrated (programmable, JEITA support) |
| Backlight Driver | WLED driver integrated |
| USB-OTG Boost | Integrated |
| Power-on Reset | Yes (integrated) |
| Thermisches Abschalten | Yes (integrated) |
| Gehäuse | 186-PBGA (12x12 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 C to +85 C |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
MC13892JVLR2 186-pbga (12x12 mm) Pinbelegungsleitfaden
Pinbelegung für MC13892JVLR2 (186-pbga (12x12 mm)-Gehäuse). Dieses Leistungsbauteil verfügt über Gate-, Drain- und Source-Anschlüsse. Bei nicht gepolten Gehäusen entnehmen Sie die genaue Ausrichtung von Pin 1 und Footprint-Details dem Herstellerdatenblatt. Typische Anwendungen sind Netzteilentwurf, Motoransteuerung und Lastschaltung.
Keine detaillierten Pinbelegungsdaten verfügbar für MC13892JVLR2.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC13892JVLR2 ist geeignet für 6 Anwendungs: Portable Media Player Power Supply, In-Vehicle Infotainment (IVI) Power, Portable Navigation Device (PND / GPS), Industrial Handheld Scanner / PDA, eReader and Tablet Power Subsystem, Set-Top Box and Connected Media Adapter.
Portable Media Player Power Supply
The MC13892JVLR2 was designed end-to-end for portable media players using the i.MX51, i.MX37, i.MX35, and i.MX27 application processors, providing all rails from a single Li-Ion cell. The integrated 4 buck converters deliver high current (up to ~1.5 A each, per datasheet) for SoC core and memory planes, while 12 LDOs handle noise-sensitive peripherals such as audio CODECs, GPS receivers, and display drivers. The on-chip backlight driver and battery charger remove two additional ICs from the BOM. Firmware controls rail sequencing via SPI, matching the Linux BSP and Android HAL used in portable-media stacks. Designers should evaluate this PMIC whenever the system runs on a single Li-Ion cell and requires tight rail sequencing for an i.MX application processor.
Empfohlen
In-Vehicle Infotainment (IVI) Power
In automotive infotainment head units, the MC13892JVLR2 powers i.MX processors that drive displays, audio amplifiers, Bluetooth/Wi-Fi modules, and CAN transceivers. Its wide input range accommodates 12 V battery and cranking transients, while the 12 LDOs provide isolated, low-noise rails for sensitive analog blocks such as audio DACs, touch controllers, and GPS receivers. Programmable SPI voltage scaling enables DVFS during vehicle OFF and ACC states, reducing standby current. The operating temperature range of -40 C to +85 C covers cabin environments. For under-hood or AEC-Q100-grade deployments, migrate to the PF or PCA PMIC families; the MC13892JVLR2 remains the right choice for non-safety cabin electronics built on legacy i.MX36/51 platforms.
Empfohlen
Portable Navigation Device (PND / GPS)
Personal Navigation Devices rely on i.MX application processors for map rendering, GPS baseband processing, and touch-screen UI. The MC13892JVLR2 supplies the SoC, an LCD backlight via its integrated WLED driver (saving a dedicated boost IC), and the GPS receiver's low-noise LDO rail. SPI programmability allows the host OS to dim the display by adjusting WLED current and to lower SoC core voltage during navigation route pauses. Integrated Li-Ion charging supports direct USB input via the on-chip charger path. Designers can use this PMIC to shrink PND PCB area by 30-40 percent versus a discrete power design. The WLED driver can typically drive 6-8 series LEDs at 20 mA each, per datasheet.
Empfohlen
Industrial Handheld Scanner / PDA
Warehouse and logistics handhelds built around i.MX35/i.MX51 processors benefit from the MC13892JVLR2's integrated battery charger, multiple regulators, and WLED backlight in a single 186-PBGA. The 4 buck converters power the SoC and DDR memory, while dedicated LDOs support bar-code imagers, Wi-Fi/Bluetooth modules, and key-scan GPIOs. The -40 C to +85 C industrial temperature range supports freezer or outdoor use. Programmable rail sequencing aligns with the i.MX power-on requirements, eliminating external sequencer ICs. For designs moving to i.MX 8 or i.MX RT, the PCA9450A provides a recommended migration path.
Empfohlen
eReader and Tablet Power Subsystem
E-readers and small tablets based on the Freescale/NXP i.MX processors use the MC13892JVLR2 to generate every system rail from a single Li-Ion cell or USB input. The integrated WLED backlight driver handles the front-light array, while the 12 LDOs isolate the e-ink/EPD display controller, audio CODEC, and Wi-Fi module. Energy harvested when the e-ink panel refreshes can be fed back through the device's low-Iq deep-sleep mode, extending battery life between charges. SPI programmability enables a Linux power driver to scale VDDARM/VDDSOC dynamically. Migrate to PCA9450A for new designs based on i.MX 8M.
Empfohlen
Set-Top Box and Connected Media Adapter
Set-top boxes using i.MX processors can use the MC13892JVLR2 as a compact main supply, deriving SoC core, memory, tuner, and HDMI/DAC rails from a 12 V adapter. The 4 high-current bucks feed the SoC and DDR, while the 12 LDOs power tuners and audio DACs with low noise. SPI control allows the host to power down unused rails for ENERGY STAR compliance. The programmable battery charger is repurposed as a coin-cell backup charger for RTC circuits in always-on deployments. For newer i.MX 6/8 designs, evaluate the PF3001 or PCA9450 family instead.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC13892JVLR2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC13892DJVLR2 | MC13892JVL | MC13892CJVR2 | MC13892AJVL |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 186-PBGA (12x12) | 186-PBGA (12x12) - identical | 186-PBGA (12x12) - identical | 186-PBGA (12x12) - identical | 186-PBGA (12x12) - identical |
| Buck Converters | 4 | 4 | 4 | 4 | 4 |
| LDO Regulators | 12 | 12 | 12 | 12 | 12 |
| Battery Charger | Integrated (programmable) | Integrated (programmable) | Integrated (programmable) | Integrated (programmable) | Integrated (programmable) |
| i.MX Processor Support | i.MX51, i.MX37, i.MX35, i.MX27 | Same i.MX family support | Same i.MX family support | Same i.MX family support | Same i.MX family support |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | --40 C to +85 C |
Wichtigste Unterscheidungsmerkmale
- Proven i.MX integration with on-chip DVFS sequencing (vs. Discrete multi-IC power design)
- Updated silicon drop-in revision (vs. MC13892AJVL)
- WLED backlight driver integrated (vs. MC13892JVL (tray pack))
Designhinweise
The 186-PBGA package demands an HDI stack-up with microvias to break out the inner-row balls cleanly. Place input and output capacitors of all 4 buck converters within 100 mil of their respective balls and use a solid ground/power island directly under the package to suppress switching noise from the synchronous bucks. Follow the NXP MC13892 reference layout guide for the exact via and trace routing pattern; do not route noisy digital signals under the BGA. A 4-layer (or more) PCB is the minimum for this device, with the inner layer dedicated to the GND plane for thermal dissipation and return path integrity.
Estimated: at the maximum 4-buck load of approximately 4 A total output at 80 percent efficiency the internal dissipation is on the order of 0.8-1.2 W, which requires the central thermal pad to be stitched directly to the inner GND plane with a 6x6 via grid. Without this stitching the junction temperature can rise 30-40 C above ambient in enclosed handhelds, derating the part. For continuous 85 C ambient operation ensure an exposed copper area under the BGA of at least 1 square inch for adequate theta-JA.
Do not assume MC13892AJVL and MC13892JVLR2 are identical at the silicon level: the 'A' revision contains older errata that may manifest under specific peripheral combinations; the current production MC13892JVLR2 (or the 'D' revision MC13892DJVLR2) should be specified for new designs. Always follow the NXP-recommended power-on sequence via the SPI bus rather than relying on hardware default rails, particularly when interfacing with i.MX51 boot modes. Additionally, the battery charger requires its sense resistor and thermal sensor to be co-located with the BGA per the layout guide for accurate JEITA-compliant charging.
The SPI bus to the host processor can run up to several MHz; route it as a 50 ohm controlled-impedance pair with the SCK line length-matched to MOSI/MISO. Keep the SPI traces away from the buck-switching LX nets to avoid coupling glitches that could corrupt register writes. Add a 10 kilohm pull-up on CSn to prevent spurious write attempts during i.MX cold-boot. Refer to the MC13892 datasheet SPI timing diagrams for setup/hold times relative to system clock.
Compliance-Informationen
RoHS compliant and lead-free per NXP product page; not qualified to AEC-Q100; consult NXP PCN for current halogen-free status.
