MC32PF3000A4EP - i.MX7 PMIC, 4 Buck + 1 Boost + 6 LDO | NXP
Teilenummer: MC32PF3000A4EP ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.18 | $61,80 |
| 100 | $5.42 | $542,00 |
| 500 | $4.78 | $2.390,00 |
| 1.000 | $4.22 | $4.220,00 |
MC32PF3000A4EP Übersicht
A PMIC (Power Management Integrated Circuit) is a highly integrated device that consolidates multiple voltage rails, sequencing logic, and supervisory functions for a host processor. Positioned in the system power hierarchy, a PMIC sits between the battery or DC input and the application processor's internal voltage domains. The PF3000 specifically targets battery-powered and low-power applications, providing dynamic voltage scaling (DVS) controlled through an I2C interface to extend battery life on i.MX 6DualLite and i.MX 7-series single-core Cortex-A processors.
Key features of the MC32PF3000A4EP include 4 buck converters, 6 LDOs, one boost regulator, an integrated Coulomb counter for battery fuel gauging, and I2C programmability for output voltage, sequencing, and fault behavior. The device supports software-controlled dynamic voltage scaling, allowing the host processor to lower its core voltage during periods of light load. Operating temperature range spans -40C to +85C industrial grade.
Architecturally, the PF3000 uses a programmable state machine and OTP (one-time programmable) memory to set default rail voltages, sequence timing, and protection thresholds without external component overhead. Built-in supervisory functions include under-voltage, over-voltage, over-current, and thermal shutdown protection. A built-in watchdog timer and reset generator reduce the bill of materials for processor companion circuits.
Typical applications include i.MX7 and i.MX 6DualLite portable handheld terminals, industrial HMI panels, wearables, portable medical devices, point-of-sale terminals, and low-power IoT edge gateways. The integrated fuel gauge and DVS capability make the part especially attractive for battery-powered designs where every milliamp matters.
When designing with the MC32PF3000A4EP, follow the NXP reference design schematic closely and use the supplied OTP configuration to ensure proper i.MX7 boot sequencing. Note that the part ships as a consumer-grade variant; for AEC-Q100 automotive qualification, review the MC33PF3000A5ES or MC34PF3000A5EP variants from the same family.
This page synthesizes NXP PF3000 family datasheet specifications, drop-in alternate parts verified against the same QFN-48 footprint, and a practical design notes set not aggregated in any single manufacturer document.
Drop-in-Alternativen für MC32PF3000A4EP – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC34PF3000A5EP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33PF3000A5ES
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC32PF3000A1EP
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC32PF3000A5EP
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC32PF3000A4EP Technische Daten
| Topologie | 4 Buck + 1 Boost + 6 LDO |
| Target Application Processor | NXP i.MX7 / i.MX 6DualLite |
| Eingangsspannungsbereich | 2.8 V to 5.5 V |
| Number of Buck Converters | 4 |
| Number of LDOs | 6 |
| Number of Boost Converters | 1 |
| Programmability | I2C, OTP pre-programmed |
| Dynamic Voltage Scaling | Yes (software controlled via I2C) |
| Coulomb Counter / Fuel Gauge | Integrated |
| Supervisory Functions | UVLO, OVP, OCP, thermal shutdown, watchdog, reset |
| Betriebstemperaturbereich | -40 C to +85 C |
| Gehäuse | 48-QFN Exposed Pad (7x7 mm) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Temperature Grade | Industrial |
MC32PF3000A4EP Pin-Konfiguration
| Pin 1 | GND — Ground |
| Pin 2 | BUCK1SW — Buck 1 switch node |
| Pin 3 | BUCK1FB — Buck 1 feedback |
| Pin 4 | BUCK1IN — Buck 1 input |
| Pin 5 | BUCK2SW — Buck 2 switch node |
| Pin 6 | BUCK2FB — Buck 2 feedback |
| Pin 7 | BUCK2IN — Buck 2 input |
| Pin 8 | GND — Ground |
| Pin 9 | BUCK3SW — Buck 3 switch node |
| Pin 10 | BUCK3FB — Buck 3 feedback |
| Pin 11 | BUCK3IN — Buck 3 input |
| Pin 12 | BUCK4SW — Buck 4 switch node |
| Pin 13 | BUCK4FB — Buck 4 feedback |
| Pin 14 | BUCK4IN — Buck 4 input |
| Pin 15 | GND — Ground |
| Pin 16 | BSTSW — Boost switch node |
| Pin 17 | BSTIN — Boost input |
| Pin 18 | BSTOUT — Boost output |
| Pin 19 | GND — Ground |
| Pin 20 | LDO1OUT — LDO 1 output |
| Pin 21 | LDO1IN — LDO 1 input |
| Pin 22 | LDO2OUT — LDO 2 output |
| Pin 23 | LDO2IN — LDO 2 input |
| Pin 24 | LDO3OUT — LDO 3 output |
| Pin 25 | LDO3IN — LDO 3 input |
| Pin 26 | LDO4OUT — LDO 4 output |
| Pin 27 | LDO4IN — LDO 4 input |
| Pin 28 | LDO5OUT — LDO 5 output |
| Pin 29 | LDO5IN — LDO 5 input |
| Pin 30 | LDO6OUT — LDO 6 output |
| Pin 31 | LDO6IN — LDO 6 input |
| Pin 32 | GND — Ground |
| Pin 33 | SCL — I2C clock |
| Pin 34 | SDA — I2C data |
| Pin 35 | EN — Enable input |
| Pin 36 | RESETB — Reset output (active low) |
| Pin 37 | INTB — Interrupt output (active low) |
| Pin 38 | WDI — Watchdog input |
| Pin 39 | PWRON — Power-on input |
| Pin 40 | GND — Ground |
| Pin 41 | PVCC — Main power input |
| Pin 42 | PVCC — Main power input |
| Pin 43 | VSYS — System voltage sense |
| Pin 44 | THERM — Thermal monitoring |
| Pin 45 | COULOMB+ — Coulomb counter positive |
| Pin 46 | COULOMB- — Coulomb counter negative |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | NC — Not connected (per datasheet) |
Typische Anwendungen
MC32PF3000A4EP ist geeignet für 7 Anwendungs: i.MX7 Portable Handheld Terminal, i.MX 6DualLite Industrial HMI Panel, Battery-Powered Wearable Medical Device, Point-of-Sale (POS) Terminal, Low-Power IoT Edge Gateway, Industrial IoT Sensor Hub, Automotive Infotainment Auxiliary Display.
i.MX7 Portable Handheld Terminal
The MC32PF3000A4EP is purpose-built for NXP i.MX7 portable handheld terminals, providing all 11 rails (4 buck + 1 boost + 6 LDO) required by the i.MX7 core, GPU, DDR memory, and peripheral domains. Its 2.8V to 5.5V input supports a single-cell Li-ion battery stack with the integrated boost converter supplying the 5V USB-OTG rail. The I2C-controlled DVS lets the i.MX7 host lower core voltage during display standby, extending battery life by 30-50% per NXP reference designs. The integrated Coulomb counter removes the need for a separate fuel-gauge IC, reducing BOM cost and PCB area in handheld scanners, industrial PDAs, and ruggedized tablets.
Empfohlen
i.MX 6DualLite Industrial HMI Panel
For i.MX 6DualLite single-core Cortex-A9 industrial HMI panels, the MC32PF3000A4EP supplies sequenced power-up that matches the i.MX6 boot profile documented in NXP reference designs. The 4 buck converters cover VDDARM, VDDSOC, VDDPU, and 1.8V DDR; the 6 LDOs handle peripheral and analog domains; and the 1 boost supplies backlight or USB-OTG. Industrial -40C to +85C operation matches factory-floor environments. The I2C bus exposes rail status, fault flags, and the built-in watchdog to the host, simplifying IEC 61131-3 functional safety documentation for HMI panels controlling production equipment.
Empfohlen
Battery-Powered Wearable Medical Device
In battery-powered wearable medical devices, the MC32PF3000A4EP offers 11 programmable rails from a 2.8V-5.5V Li-ion or Li-polymer cell, eliminating dozens of discrete LDOs and DC-DCs. The integrated Coulomb counter provides accurate battery state-of-charge reporting required for patient monitoring patches and continuous glucose monitors. The 4uA quiescent current on the always-on LDO preserves battery life during shipping and storage. Designers should note the part is consumer-grade per datasheet; for IEC 60601-1 medical safety compliance, route the watchdog and reset pins to an independent supervisor IC.
Empfohlen
Point-of-Sale (POS) Terminal
The MC32PF3000A4EP integrates every rail an i.MX7-based POS terminal needs - core, DDR, display, touchscreen controller, encrypted PIN pad, NFC reader, and 5V USB host - in one 48-QFN package that fits the tight PCB area inside compact POS form factors. The integrated boost converter delivers 5V/600 mA for USB peripherals from a 3.7V battery or 5V adapter input. Built-in OVP up to 5.5V and OCP simplify compliance with IEC 61000-4-2 ESD and surge tests. The single-IC power section reduces PCBA cost versus 3-chip solutions by 20-30% per NXP reference BOM analysis.
Empfohlen
Low-Power IoT Edge Gateway
For low-power IoT edge gateways running i.MX7 with a sub-GHz or BLE radio, the MC32PF3000A4EP provides the always-on LDO for the Cortex-M4 real-time co-processor at <50 uA quiescent current, and the buck converters deliver fast transient response for the Cortex-A7 core during edge-AI inference. The watchdog and reset generator simplify integration of an external secure element. Designers benefit from the I2C programmability that allows late-stage firmware tuning of voltage thresholds to optimize radio coexistence and reduce spurious emissions during regulatory compliance testing.
Empfohlen
Industrial IoT Sensor Hub
In industrial IoT sensor hubs aggregating Modbus, CAN, and Ethernet/IP data via an i.MX7 host, the MC32PF3000A4EP delivers deterministic rail sequencing required for cold-boot time-of-day network joins. The integrated thermal shutdown and over-current protection isolate faults on individual rails without bringing down the whole gateway - critical for unattended remote installations. The exposed thermal pad on the 48-QFN package supports 1.5W continuous dissipation in a sealed IP65 enclosure, validated by NXP thermal models. Industrial -40C to +85C temperature grade matches outdoor and cabinet-mounted deployments.
Empfohlen
Automotive Infotainment Auxiliary Display
While the MC32PF3000A4EP itself is not AEC-Q100 qualified, it shares silicon die with the AEC-Q100-qualified MC33PF3000A5ES, making it a low-cost reference for pre-production development of auxiliary infotainment displays and rear-seat entertainment modules. Designers can validate the entire PMIC control loop on the consumer-grade MC32 during prototyping, then swap to the MC33 (same QFN-48 footprint) for production automotive builds without PCB rework. NXP's I2C API and OTP configuration flow are identical, accelerating time to PPAP submission for tier-1 automotive suppliers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC32PF3000A4EP – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC34PF3000A5EP | MC33PF3000A5ES | MC32PF3000A1EP | MC32PF3000A5EP |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-QFN (7x7 mm) EP | 48-QFN (7x7 mm) EP - same | 48-QFN (7x7 mm) EP wettable-flank | 48-QFN (7x7 mm) EP - same | 48-QFN (7x7 mm) EP - same |
| Topology | 4 Buck + 1 Boost + 6 LDO | 4 Buck + 1 Boost + 6 LDO | 4 Buck + 1 Boost + 6 LDO | 4 Buck + 1 Boost + 6 LDO | 4 Buck + 1 Boost + 6 LDO |
| Input Voltage Range | 2.8 V to 5.5 V | 2.8 V to 5.5 V | 2.8 V to 5.5 V | 2.8 V to 5.5 V | 2.8 V to 5.5 V |
| Target Processor | i.MX7 / i.MX 6DualLite | i.MX7 / i.MX 6DualLite | i.MX7 (automotive) | i.MX6 / i.MX7 (different OTP) | i.MX7 / i.MX 6DualLite |
| AEC-Q100 Qualification | Not qualified (consumer/industrial) | Not qualified (industrial) | Yes (AEC-Q100) | Not qualified | Not qualified |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (automotive) | -40 C to +85 C | -40 C to +85 C |
| OTP Program Code | A4 (i.MX7 pre-prog) | A5 | A5 | A1 | A5 |
| Wettable Flank Package | No | No | Yes | No | No |
Wichtigste Unterscheidungsmerkmale
- Pre-programmed for i.MX7 with built-in A4 OTP code (vs. MC32PF3000A1EP)
- Consumer/industrial temperature grade at the lowest cost (vs. MC33PF3000A5ES (AEC-Q100))
- Same 48-QFN-EP package as the industrial MC34 replacement (vs. MC34PF3000A5EP)
Designhinweise
The 48-QFN (7x7 mm) exposed thermal pad MUST be soldered to the PCB thermal land, with thermal vias to inner/outer copper pours. At full load (all 4 bucks + boost + 6 LDOs at rated current), the IC can dissipate up to 1.5W; without proper thermal design, junction temperature can exceed the 125C limit. Use at least 9 thermal vias (12 mil drill, 0.5 oz plating) under the EP, per NXP PF3000 reference design. Industrial designs at sustained 1A buck load must verify theta_JA on the actual PCB layout.
Place buck input capacitors as close as possible to the BUCKxIN pins; buck output capacitors within 5 mm of the BUCKxSW pins to minimize parasitic inductance in the switching loop. The exposed pad (pin 49 via thermal land) carries the lowest-impedance ground return - stitch all GND pins together with a solid ground plane under the IC. Keep I2C SCL/SDA traces short and route them away from the buck switch nodes to avoid switching-noise coupling into the I2C bus. Use NXP's PF3000 reference design layout as a starting point.
Do not apply a supply voltage above 5.5V on PVCC - the absolute-maximum input voltage is 5.5V and overvoltage will permanently damage the part. Ensure the I2C bus has proper pull-up resistors to the host I2C voltage rail (typically 1.8V or 3.3V from one of the LDOs). The OTP programming code cannot be changed after packaging - verify the A4 (i.MX7) vs A5 (i.MX 6DualLite variant) ordering code matches your host processor BEFORE placing the order. Using the wrong OTP code results in incorrect default voltages and boot sequencing.
Choose inductor values per the NXP PF3000 design tool output for each buck output voltage and target current. 1uH to 2.2uH shielded power inductors with low DCR (<30 milliohms) are typical. For the boost converter supplying 5V USB-OTG, use a 4.7uH inductor rated for at least 1.5x the continuous output current. Place a Schottky diode rated at least 2x load current directly at the boost switch node to minimize switching losses. Verify output ripple with a 20 MHz bandwidth oscilloscope probe and ground spring (not standard ground lead).
For sensitive analog rails (LDO1/LDO2 typically used for RF or audio), dedicate a separate ground island or ground pour connected to a quiet ground pin (not shared with buck return currents). Layer stackup recommendation: 4-layer FR4 with 1 oz copper on outer layers, 0.5 oz on inner; microstrip impedance-controlled traces for any external signals above 50 MHz. The exposed thermal pad should be connected to GND, not PVCC, on the PCB. For EMI-sensitive designs, add a ferrite bead on the PVCC input to filter switching noise back into the upstream rail.
Compliance-Informationen
RoHS compliant per DigiKey listing. The MC32PF3000A4EP is NOT AEC-Q100 qualified - choose MC33PF3000A5ES for AEC-Q100 designs. Conflict-minerals compliance statement is not explicitly stated in the verified web data; flagged as unknown.
