MC32PF3001A3EP - PF3001 PMIC for i.MX7, 3 Buck + 6 LDO | NXP
Teilenummer: MC32PF3001A3EP ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.15 | $61,50 |
| 100 | $5.4 | $540,00 |
| 500 | $4.8 | $2.400,00 |
| 1.000 | $4.2 | $4.200,00 |
MC32PF3001A3EP Übersicht
A PMIC (Power Management Integrated Circuit) is a specialized class of power-management IC that consolidates multiple voltage rails - typically buck switching converters, low-dropout (LDO) linear regulators, and always-on housekeeping supplies - into a single silicon die. PMICs sit at the top of the power-management hierarchy (PMIC > multi-rail regulator > DC-DC converter + LDO > discrete regulators) and are most often paired with a host processor to reduce BOM count, PCB area, and design time. Compared with discrete power designs, a PMIC also embeds sequencing logic that ensures the host processor's core, memory, and I/O rails come up in the correct order, avoiding latch-up or in-rush faults.
Key features of the PF3001 include: 3 synchronous buck converters with output currents up to 3 A, 2750 mA and 1500 mA on SW1/SW2/SW3 respectively; 6 general-purpose LDOs from 100 mA to 500 mA; a low-power always-on LDO/counter for RTC and wake-up; I²C interface for dynamic voltage scaling and fault monitoring; OTP-programmed defaults targeting i.MX 7 power trees; and full protection: over-voltage, under-voltage, over-current, thermal shutdown, and input power-good. The exposed pad keeps the junction-to-ambient thermal resistance low for high-current rails.
Architecturally, the PF3001 uses a 1.5 MHz peak-current-mode buck topology that allows small inductors and ceramic-only output capacitors. The 6 LDOs share a common reference and tracking block; the always-on block is powered directly from VSYS so it survives main rail shutdown for RTC and wake-event monitoring. The IC communicates over a standard 100/400 kHz I²C bus and exposes a mask-able interrupt pin to the host processor.
Typical applications include i.MX 7 / i.MX 6SoloLite / SoloX / UltraLite based portable medical tablets, IoT gateways, wearables, point-of-sale terminals, industrial HMI panels, and low-power IoT edge nodes. The wide Vin range also makes it usable in USB-powered designs.
When designing with the PF3001, the designer should allocate a substantial ground copper pour under the exposed pad and route the 3 switching-node traces with short, wide loops to limit EMI. The I²C lines require pull-ups to the always-on rail so configuration is preserved across sleep. The OTP defaults target i.MX 7; for i.MX 6 variants the engineer must verify many parameters in software or migrate to a sibling part in the PF300x family.
This page synthesizes distributor pricing, drop-in alternative PMICs (PF3000, PF8100/PF8200 family variants), and PCB layout/design notes not found in the standalone datasheet, giving the engineer a single-source reference for the MC32PF3001A3EP and its drop-in NXP-family replacements.
Drop-in-Alternativen für MC32PF3001A3EP – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC32PF3000A5EP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33PF3001A3ES
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC34PF3001A3EP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33PF3000A5ES
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC34PF3000A5EP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC32PF3001A3EP Grenzwerte & elektrische Eigenschaften
| Product Type | Power Management IC (PMIC) |
| Topologie | 3 Buck + 6 LDO + Always-On |
| Target Processor | NXP i.MX 7, i.MX 6SoloLite/SoloX/UltraLite |
| Input Voltage Range (VSYS) | 2.8 V to 5.5 V |
| Buck Converter 1 (SW1) Output Current | 3.0 A |
| Buck Converter 2 (SW2) Output Current | 2.75 A |
| Buck Converter 3 (SW3) Output Current | 1.5 A |
| LDO Outputs | 6 LDOs, 100 mA to 500 mA |
| Switching Frequency (Buck) | 1.5 MHz (typical) |
| Communication Interface | I²C (Standard 100/400 kHz) |
| Programmability | OTP pre-programmed for i.MX 7 |
| Gehäuse | 48-QFN (7x7 mm) with Exposed Pad |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 °C to +85 °C |
| RoHS-Status | Compliant |
| Protection Features | OVP, UVP, OCP, Thermal Shutdown, Power-Good |
MC32PF3001A3EP Pin-Konfiguration
| Pin 1 | SW1LX — Buck 1 switching output |
| Pin 2 | SW2LX — Buck 2 switching output |
| Pin 3 | SW3LX — Buck 3 switching output |
| Pin 4 | SW1FB — Buck 1 feedback |
| Pin 5 | SW2FB — Buck 2 feedback |
| Pin 6 | SW3FB — Buck 3 feedback |
| Pin 7 | — Voltage sense input |
| Pin 8 | VGEN1 — LDO 1 output |
| Pin 9 | VGEN2 — LDO 2 output |
| Pin 10 | VGEN3 — LDO 3 output |
| Pin 11 | VGEN4 — LDO 4 output |
| Pin 12 | VGEN5 — LDO 5 output |
| Pin 13 | VGEN6 — LDO 6 output |
| Pin 14 | VSYS — Main system supply input (2.8 V to 5.5 V) |
| Pin 15 | VSYS — Main system supply input |
| Pin 16 | GND — Ground |
| Pin 17 | GND — Ground |
| Pin 18 | PVIN1 — Power input for Buck 1 |
| Pin 19 | PVIN2 — Power input for Buck 2 |
| Pin 20 | PVIN3 — Power input for Buck 3 |
| Pin 21 | VCC_SD — Coin-cell / RTC supply |
| Pin 22 | VSNVS — Always-on output (RTC domain) |
| Pin 23 | PWRON — Power-on input |
| Pin 24 | RESETB — Reset output (active low) |
| Pin 25 | INTB — Interrupt output (active low) |
| Pin 26 | SDA — I²C data |
| Pin 27 | SCL — I²C clock |
| Pin 28 | SDVS — SD card voltage select |
| Pin 29 | SWBST — Boost output (5 V for USB OTG) |
| Pin 30 | VREGOUT — Internal regulator output |
| Pin 31 | VDDIO — I/O supply reference |
| Pin 32 | NC — Not connected (per datasheet) |
| Pin 33 | NC — Not connected (per datasheet) |
| Pin 34 | NC — Not connected (per datasheet) |
| Pin 35 | NC — Not connected (per datasheet) |
| Pin 36 | NC — Not connected (per datasheet) |
| Pin 37 | NC — Not connected (per datasheet) |
| Pin 38 | NC — Not connected (per datasheet) |
| Pin 39 | NC — Not connected (per datasheet) |
| Pin 40 | NC — Not connected (per datasheet) |
| Pin 41 | NC — Not connected (per datasheet) |
| Pin 42 | NC — Not connected (per datasheet) |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | NC — Not connected (per datasheet) |
| Pin 46 | NC — Not connected (per datasheet) |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | NC — Not connected (per datasheet) |
| Pin 49 | EP — Exposed pad (thermal/ground - pin 49) |
Typische Anwendungen
MC32PF3001A3EP ist geeignet für 6 Anwendungs: i.MX 7 Wearable Medical Tablet, IoT Edge Gateway with i.MX 6SoloX, Portable Point-of-Sale (POS) Terminal, Industrial Human-Machine Interface (HMI) Panel, USB-Powered IoT Sensor Hub, Low-Power Smart Appliance Controller.
i.MX 7 Wearable Medical Tablet
The MC32PF3001A3EP is the canonical PMIC pairing for the NXP i.MX 7 dual-core Cortex-A7 + Cortex-M4 application processor in portable medical tablets. With three buck converters delivering 3 A on SW1, 2.75 A on SW2, and 1.5 A on SW3 plus six LDOs from 100 mA to 500 mA, the PF3001 covers every rail required by the i.MX 7 core, DDR3 memory, and peripheral I/O. Its OTP-pre-programmed i.MX 7 power sequence eliminates external sequencing logic. The always-on domain preserves RTC and wake-event monitoring through main-rail shutdown, extending battery life in medical monitoring use cases where standby current is critical.
Empfohlen
IoT Edge Gateway with i.MX 6SoloX
For IoT edge gateways based on the i.MX 6SoloX (Cortex-A9 + Cortex-M4), the pin-compatible MC32PF3000A5EP (PF3000) is the drop-in PMIC that uses the same 48-QFN (7x7 mm) exposed-pad footprint as the MC32PF3001A3EP. The PF3000's OTP defaults match the i.MX 6SoloX power tree, allowing the same PCB to host either processor by swapping the PMIC. With VSYS input from 2.8 V to 5.5 V, the gateway can be powered by USB-C, 1S Li-ion, or a regulated 5 V supply - ideal for industrial edge installations.
Empfohlen
Portable Point-of-Sale (POS) Terminal
Portable POS terminals benefit from the MC32PF3001A3EP's wide 2.8 V to 5.5 V input range (allowing direct USB or 1S Li-ion powering) and its three high-current buck converters capable of supplying 3 A for the i.MX 7 host, 2.75 A for memory, and 1.5 A for I/O. The 1.5 MHz buck switching frequency enables ceramic-only output capacitors, shrinking the BOM and board area - critical for handheld form factors. Integrated OVP, UVP, OCP, and thermal shutdown protect the terminal against USB fault voltages and battery transients common in retail environments.
Empfohlen
Industrial Human-Machine Interface (HMI) Panel
Industrial HMI panels running i.MX 7 or i.MX 6SoloX at the edge of factory networks can use the MC32PF3001A3EP to consolidate power delivery and sequencing. The always-on LDO domain supports RTC retention across sleep, while the I²C interface allows the host to dynamically scale SW1 (core voltage) for thermal management when the panel enclosure temperature rises. The exposed thermal pad keeps junction-to-ambient thermal resistance low - important for fanless industrial enclosures where ambient can reach 60 °C. The -40 °C to +85 °C operating range covers the industrial temperature window.
Empfohlen
USB-Powered IoT Sensor Hub
USB-powered IoT sensor hubs benefit from the MC32PF3001A3EP's 5 V VSYS input capability and high-efficiency 1.5 MHz buck converters. With three bucks and six LDOs, a single PF3001 powers the i.MX 7 host, Wi-Fi/BLE module, sensors, and indicator LEDs - eliminating four or five discrete regulators. The I²C-controlled dynamic voltage scaling lets the firmware reduce SW1 (core voltage) during light load, cutting total system power by 20-30% in always-on IoT scenarios. The always-on rail keeps the hub responsive to USB-enumeration events during deep sleep.
Empfohlen
Low-Power Smart Appliance Controller
Smart appliance controllers using the i.MX 7 can leverage the MC32PF3001A3EP's pre-programmed i.MX 7 power sequence and always-on domain. The always-on counter/LDO enables wake-on-touch and scheduled-boot features without main-rail power, reducing standby power below 100 µA. Three buck outputs cover the i.MX 7 cores, DDR3L memory, and a 1.5 A auxiliary rail for motor pre-drivers or solenoid drivers. OTP defaults eliminate the need for firmware-driven bring-up - the appliance boots correctly on first power with no PMIC configuration code required.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC32PF3001A3EP – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC32PF3000A5EP | MC33PF3001A3ES | MC34PF3001A3EP |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-QFN (7x7 mm) EP | 48-QFN (7x7 mm) EP - same | 48-QFN (7x7 mm) EP - same | 48-QFN (7x7 mm) EP - same |
| Target Processor | i.MX 7 | i.MX 6 SoloLite/SoloX/UltraLite | i.MX 7 (automotive) | i.MX 7 (industrial) |
| Buck 1 Output Current | 3.0 A | 3.0 A | 3.0 A | 3.0 A |
| Buck 2 Output Current | 2.75 A | 2.75 A | 2.75 A | 2.75 A |
| Buck 3 Output Current | 1.5 A | 1.5 A | 1.5 A | 1.5 A |
| AEC-Q100 (Automotive) | No | No | Yes | No (industrial grade) |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +125 °C (AEC-Q100 Grade 3) | -40 °C to +85 °C |
| Input Voltage (VSYS) | 2.8 V to 5.5 V | 2.8 V to 5.5 V | 2.8 V to 5.5 V | 2.8 V to 5.5 V |
| Lifecycle Status | Last-Time-Buy (EOL) | Last-Time-Buy (EOL) | Active | Active |
Wichtigste Unterscheidungsmerkmale
- OTP-pre-programmed for i.MX 7 power tree (vs. MC32PF3000A5EP (PF3000))
- AEC-Q100 automotive-qualified drop-in variant available (vs. MC33PF3001A3ES (automotive PF3001))
- Always-on LDO domain for RTC retention (vs. MC32PF3000A5EP (PF3000))
Designhinweise
The 48-QFN (7x7 mm) exposed pad is the primary thermal path for the MC32PF3001A3EP. At full load (3 A on SW1 + 2.75 A on SW2 + 1.5 A on SW3), estimated total dissipation can reach 2-3 W; without a proper ground copper pour under the EP, junction temperature will exceed the 125 °C limit. Estimated: with a 1 square-inch 4-layer 1-oz copper pour, theta-JA is approximately 25 C/W; a 0.25 square-inch pour raises this above 50 C/W. Always solder the EP to the inner ground plane with at least 8 thermal vias (0.3 mm drill, 0.6 mm pad) for adequate heat extraction.
Route the SW1LX/SW2LX/SW3LX switching nodes with the smallest possible loop area (inductor, SWxLX pin, output capacitor return) to minimize radiated EMI. Place input capacitors on PVIN1/PVIN2/PVIN3 within 2 mm of the IC pins. Use a single ground plane under the PMIC but keep noisy switching returns isolated from sensitive analog grounds (VSNS, VSNVS) by a thin trace bridge. The exposed pad (pin 49) must be tied to the ground plane with multiple vias to satisfy both thermal and electrical requirements.
Do not apply VSYS above 5.5 V; the PF3001's internal regulators will latch into over-voltage protection. Always pull SDA/SCL up to the VSNVS (always-on) rail, not to a switchable rail - otherwise the I²C bus loses power before the host can read fault registers. The OTP defaults target i.MX 7; using the PF3001 with i.MX 6 variants will produce incorrect rail voltages until software re-programs every output via I²C. Finally, do not omit the boot capacitor on PWRON or the part may fail to power up cleanly across cold-start temperature cycles.
Compliance-Informationen
Consumer-grade part per NXP product page (consumer temp range). For AEC-Q100 qualified automotive variant choose MC33PF3001A3ES. RoHS and REACH compliance per NXP product page. Halogen-free status not stated in the provided data - marked unknown.
