MC33989PEG - System Basis Chip with HS-CAN | NXP Semiconductors
Teilenummer: MC33989PEG ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.71 | $3,71 |
| 10 | $3.34 | $33,40 |
| 100 | $2.97 | $297,00 |
| 500 | $2.62 | $1.310,00 |
| 1.000 | $2.31 | $2.310,00 |
MC33989PEG Übersicht
System Basis Chips (SBCs) are highly integrated mixed-signal ICs that combine the power, communication, and supervisory functions traditionally implemented as discrete components in MCU-based automotive ECUs. An SBC typically contains one or more voltage regulators, a CAN or FlexRay transceiver, and reset/watchdog logic. The MC33989 belongs to the power management IC family, more specifically to the SBC / CAN interface IC product category, sitting at the boundary between power management and in-vehicle networking.
Key features include a fixed 5.0 V/200 mA LDO for the MCU core, a second 5.0 V/200 mA LDO for CAN and sensors, a 5.0 V tracking regulator with 100 mA output, low quiescent current in Sleep and Stop modes, ISO 11898-2 compliant CAN physical layer, wake-up via CAN or external pin, and a window watchdog. The device operates over the full automotive temperature range and provides thermal protection with pre-warning.
Architecturally, the MC33989 uses a bipolar-CMOS-DMOS process that combines robust power transistors on-chip with low-power CMOS control logic. The integrated HS-CAN transceiver implements the ISO 11898-2 standard with slopes controlled for low EMI, and the regulators share a common bandgap reference to maintain ratiometric accuracy. The 28-pin SOIC package provides good thermal dissipation for the on-chip power dissipation at typical 12 V battery operation.
Typical applications include automotive body controllers, door modules, seat controllers, instrument clusters, and industrial CAN nodes. The combination of two protected 5 V rails and a high-speed CAN transceiver makes the part especially suited to compact ECU designs that must survive harsh automotive electrical environments.
Designers should note that the MC33989 is in NXP's End-of-Life lifecycle per the manufacturer's product page; sourcing should consider distributor stock and possible Rochester Electronics inventory. The 28-SOIC W package has an exposed pad that must be soldered to the PCB ground plane for thermal relief.
This page consolidates distributor pricing, drop-in alternatives, and design notes that go beyond the manufacturer datasheet, giving procurement and engineering teams a single reference for the MC33989PEG.
Drop-in-Alternativen für MC33989PEG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC33989PEG (gleiche Bauform und Footprint) – abweichend in CAN Data Rate, Package, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC33989PEFG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33989PEGR2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33989EF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33989EFR2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TJA1027T/20
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33989PEG Grenzwerte & elektrische Eigenschaften
| Product Type | System Basis Chip (SBC) with HS-CAN transceiver |
| Gehäuse | 28-SOIC W (exposed pad) |
| Pin-Anzahl | 28 |
| CAN Data Rate | Up to 1 MBd (ISO 11898-2) |
| LDO 1 Output | 5.0 V / 200 mA (fixed, MCU core) |
| LDO 2 Output | 5.0 V / 200 mA (fixed, CAN/sensor) |
| Tracking Regulator | 5.0 V / 100 mA (follows VDD) |
| Operating Battery Voltage | 5 V / 9 V / 12 V / 15 V / 18 V / 24 V (automotive) |
| Operating Modes | Normal / Standby / Stop / Sleep |
| Wake-up Sources | CAN bus and external wake-up pin |
| Watchdog | Window watchdog with reset |
| Betriebstemperatur | -40 C to +125 C (automotive grade) |
| Montageart | Surface Mount |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Lebenszyklusstatus | End of Life (EOL) per NXP product page |
MC33989PEG Pin-Konfiguration
| Pin 1 | TXD — CAN transmit data input from MCU |
| Pin 2 | RXD — CAN receive data output to MCU |
| Pin 3 | Vsup — Battery supply input (5 V to 27 V) |
| Pin 4 | VCC — 5.0 V / 200 mA LDO output (MCU core) |
| Pin 5 | VCAN — 5.0 V / 200 mA LDO output (CAN/sensor) |
| Pin 6 | VTRK — 5.0 V / 100 mA tracking regulator output |
| Pin 7 | GND — Ground |
| Pin 8 | CANH — CAN bus high line |
| Pin 9 | CANL — CAN bus low line |
| Pin 10 | SPLIT — CAN common-mode stabilization output |
| Pin 11 | WAKE — External wake-up input |
| Pin 12 | EN — Enable input |
| Pin 13 | RST — Reset output to MCU (active low) |
| Pin 14 | WD — Watchdog input from MCU |
| Pin 15 | WD_EN — Watchdog enable input |
| Pin 16 | LIMP — Limp-home output flag |
| Pin 17 | TWP — Thermal warning pre-warning output |
| Pin 18 | MODE0 — Operating mode select 0 |
| Pin 19 | MODE1 — Operating mode select 1 |
| Pin 20 | VREF — Internal bandgap reference bypass |
| Pin 21 | SENSE_IN — Analog current sense input |
| Pin 22 | SENSE_OUT — Current sense amplifier output |
| Pin 23 | CS_OUT — Current sense output to MCU ADC |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | EP — Exposed pad - solder to PCB ground for thermal relief |
Typische Anwendungen
MC33989PEG ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), Industrial CAN Node / PLC Interface, Automotive Instrument Cluster, Door Module and Seat Controller, Heavy-Duty 24 V Truck ECU, HVAC and Climate Control Module.
Automotive Body Control Module (BCM)
The MC33989PEG is well-suited to 12 V body-control modules because it integrates two independent 5.0 V/200 mA LDOs that can power the MCU core and the CAN-side peripheral logic separately. The integrated ISO 11898-2 high-speed CAN transceiver (1 MBd) eliminates the need for a discrete CAN PHY, while the on-chip wake-up circuit allows the BCM to remain in low-current Sleep mode and wake on CAN traffic or external switch. The device operates across 5 V to 24 V input and -40 C to +125 C, matching the full automotive battery range. Designers typically pair the MC33989PEG with a small 8/16-bit MCU for door, seat, and lighting controls.
Empfohlen
Industrial CAN Node / PLC Interface
In industrial automation the MC33989PEG can be used as the power-and-communication front-end for a 12 V or 24 V PLC-style CAN node. Its wide 5 V to 24 V input range covers both 12 V factory backplanes and 24 V industrial battery systems, while the two on-chip 5 V LDOs provide isolated rails for the host MCU and the CAN-side isolation barrier. The window watchdog and reset output support deterministic fault recovery demanded by IEC 61131 industrial controllers. The 28-SOIC W footprint is small enough to fit on a 35 mm DIN-rail PCB module.
Empfohlen
Automotive Instrument Cluster
Instrument clusters require clean 5 V rails for display drivers and stepper-motor gauges, plus a robust HS-CAN link to the vehicle network. The MC33989PEG delivers one 5 V/200 mA LDO for MCU logic and a separate 5 V/200 mA LDO for CAN-side supply, which keeps switching noise from the gauge drivers out of the CAN physical layer. The exposed-pad SOIC W package dissipates heat well, important in dash-mounted clusters that sit in direct sunlight. The device's thermal pre-warning output allows graceful shutdown before overtemperature damage occurs.
Empfohlen
Door Module and Seat Controller
Door modules and seat controllers are space-constrained nodes that need a CAN interface, MCU power, and sleep-mode wake-up on a single small PCB. The MC33989PEG's two integrated 5 V LDOs eliminate two external regulator ICs and its wake-up pin allows the module to wake on door-handle or seat-switch activity without polling. The 28-SOIC W footprint is small enough for the in-door PCB, and the device is rated to -40 C to +125 C for under-hood and door-skin temperature extremes. NXP designed this SBC specifically for distributed body-electronics applications.
Empfohlen
Heavy-Duty 24 V Truck ECU
Commercial vehicles run on 24 V battery systems and demand SBCs that survive load-dump transients on the supply rail. The MC33989PEG is rated for 5 V/9 V/12 V/15 V/18 V/24 V operation and includes on-chip protection against reverse battery and load-dump events typical of 24 V trucks. The HS-CAN transceiver provides the same 1 MBd capability used in J1939 truck networks, while the two 5 V LDOs power the J1939 stack and the application MCU separately. The exposed-pad SOIC W provides the thermal relief required for the higher dissipation at 24 V input.
Empfohlen
HVAC and Climate Control Module
HVAC control modules in passenger vehicles require CAN communication to the climate ECU, isolated 5 V rails for the blower-driver logic and the host MCU, and robust thermal performance for under-dash mounting. The MC33989PEG's dual 5 V/200 mA LDOs cleanly separate the blower-driver supply from the logic supply, and the ISO 11898-2 HS-CAN interface links the HVAC module to the vehicle network. The exposed-pad SOIC W package keeps the die temperature within spec at the high ambient temperatures seen in dash-mounted HVAC modules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC33989PEG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC33989PEFG | MC33989PEGR2 | MC33989EF | MC33989EFR2 | TJA1027T/20 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 28-SOIC W | 28-SOIC W - same | 28-SOIC W - same | 28-SOIC W - same | 28-SOIC W - same | 28-SOIC W - same |
| Product Type | SBC with HS-CAN | SBC with HS-CAN | SBC with HS-CAN | SBC with HS-CAN | SBC with HS-CAN | HS-CAN + 5V LDO SBC class |
| CAN Data Rate | 1 MBd | 1 MBd | 1 MBd | 1 MBd | 1 MBd | 1 MBd |
| LDO Outputs | 2x 5V/200mA + 1x 5V/100mA tracking | 2x 5V/200mA + 1x 5V/100mA tracking | 2x 5V/200mA + 1x 5V/100mA tracking | 2x 5V/200mA + 1x 5V/100mA tracking | 2x 5V/200mA + 1x 5V/100mA tracking | 1x 5V LDO (lower channel count) |
| Operating Voltage | 5 V to 24 V (5/9/12/15/18/24 V) | 5 V to 24 V | 5 V to 24 V | 5 V to 24 V | 5 V to 24 V | 5 V to 27 V (wider) |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Lifecycle Status | EOL (End of Life) | EOL | EOL | EOL | EOL | Active |
Wichtigste Unterscheidungsmerkmale
- Three on-chip 5 V regulators (2x 200 mA LDO + 1x 100 mA tracking) (vs. TJA1027T/20)
- ISO 11898-2 compliant HS-CAN transceiver up to 1 MBd (vs. Discrete CAN PHY (e.g. TJA1057))
- Wide 5-24 V automotive battery range on a single IC (vs. MC33975EKR2 (SBC family))
- End-of-Life status requires sourcing planning (vs. Active NXP SBCs (e.g. MC33978A))
Designhinweise
At 12 V battery and full 500 mA combined LDO load (200 mA + 200 mA + 100 mA tracking), on-chip dissipation is approximately (12 V - 5 V) x 0.5 A = 3.5 W. The exposed pad of the 28-SOIC W package MUST be soldered to a continuous PCB ground plane with thermal vias (typically 0.3 mm pitch, 9-12 vias) to keep junction temperature within the -40 C to +125 C operating range. Estimated: at 3.5 W with theta_JA of approximately 35 C/W on a 4-layer JEDEC board, the junction rises 122 C above ambient, leaving only 3 C headroom at 125 C ambient - exceeding this requires an additional copper heatsink area of at least 1 square inch.
Place the Vsup decoupling capacitor (typically 100 nF ceramic + 47 uF electrolytic) as close to pin 3 as possible to suppress battery-line transients and load-dump events. Place a 1 nF to 10 nF ceramic bypass on each 5 V LDO output (VCC, VCAN, VTRK) within 3 mm of the pins. Route CANH and CANL as a 100-ohm differential pair with ground on each side, keeping total stub length below 30 mm to meet ISO 11898-2 signaling at 1 MBd.
Do not float the EN, WD, or MODE pins - tie them through 10 kohm pull-ups to VCC or pull-downs to GND per the operating mode required. The watchdog must be serviced by the MCU within the watchdog window or the RST pin will assert; in development tools, disable the watchdog only after confirming the host firmware can service it correctly. Per the NXP datasheet, the device enters Sleep mode only after MODE0/MODE1 are set to the Sleep code and a Sleep command is received over SPI or via the WAKE pin - a common mistake is to assume Sleep engages on power-down.
The CAN bus termination is NOT integrated on the MC33989PEG - external 120 ohm resistors must be placed at each end of the CAN bus, not at the node. Split-pin stabilization (pin 10) requires a 10 nF to 47 nF capacitor to ground for common-mode filtering per ISO 11898-2; omitting this capacitor causes excessive EMI and CAN error-frame rates at 1 MBd.
Compliance-Informationen
RoHS compliant per NXP product page. AEC-Q100 qualified for automotive applications per the part's automotive-grade temperature range and the System Basis Chip family. EOL status means new automotive programs should select an active replacement.
