MC33991DWR2-FR - Dual Stepper Gauge Driver SPI 24-SOIC | Freescale
Teilenummer: MC33991DWR2-FR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.58 | $55,80 |
| 100 | $4.95 | $495,00 |
| 500 | $4.46 | $2.230,00 |
| 1.000 | $3.97 | $3.970,00 |
MC33991DWR2-FR Übersicht
A gauge driver IC is a specialized power-management and motion-control device that sits between a microcontroller and the electromechanical stepper or air-core gauges in an instrument cluster. The MC33991DWR2-FR belongs to the gauge driver sub-category of motor drivers, within the broader hierarchy of power management ICs, semiconductor drivers, and analog/mixed-signal ICs. The four on-chip H-bridges each consist of a high-side and low-side output pair, allowing bidirectional current flow through a gauge coil; the SPI register set commands pointer position, applies micro-stepping or full-step updates, and reports diagnostics back to the cluster MCU.
Key features of the MC33991DWR2-FR include SPI communication for host-commanded pointer positioning, four integrated dual-output H-bridge drivers, on-chip fault detection (open coil, shorted coil, over-temperature, under-voltage), and a wide operating temperature range suitable for automotive clusters. The wide-body 24-SOIC package with bottom thermal pad allows efficient heat spreading on FR4 with copper pours, while the bipolar CMOS architecture balances drive strength, fault robustness, and quiescent draw.
Architecture-wise, the device pairs a serial peripheral interface (SPI) front-end with a per-bridge PWM current regulator and diagnostic state machine. Each of the four H-bridge outputs can be commanded independently, and the chip supports simultaneous dual-stepper operation by interleaving SPI commands across the two motor channels. The internal charge pump and gate drivers permit full N-channel H-bridge outputs, which lowers RDSon and improves efficiency compared to half-N/half-P designs.
Typical applications for the MC33991DWR2-FR include automotive instrument cluster gauges (speedometer, tachometer, fuel, temperature), dual air-core stepper pointer drives, body controller gauge emulation, and aftermarket gauge replacement modules. Its integrated diagnostics also make it a strong fit for OEM clusters that require ASIL-grade fault reporting through the SPI status registers.
When designing with the MC33991DWR2-FR, follow automotive PCB layout best practices: keep battery input traces short and wide, place reverse-battery and load-dump protection close to the connector, and tie all four H-bridge returns to a single ground star. Use a 100 nF decoupling capacitor within 5 mm of the VDD pin and a bulk aluminum or tantalum capacitor (>= 47 uF) on the motor supply to absorb back-EMF energy.
This page combines distributor availability, drop-in replacement candidates, and applied design considerations that go beyond the manufacturer datasheet, helping engineers select, source, and integrate the MC33991DWR2-FR faster.
Drop-in-Alternativen für MC33991DWR2-FR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC33991DWR2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33991DW
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC33991DWEFR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC33992DW
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TLE4729G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AMIS-30621
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33991DWR2-FR Grenzwerte & elektrische Eigenschaften
| Part Number | MC33991DWR2-FR |
| Manufacturer | Freescale Semiconductor (NXP Semiconductors) |
| Funktion | Dual stepper motor gauge driver IC |
| Number of H-Bridge Outputs | 4 dual-output H-bridges (drives 2 stepper motors) |
| Schnittstelle | SPI (Serial Peripheral Interface) |
| Load Dump Tolerance | Compatible with 12 V automotive load-dump transients |
| Betriebstemperaturbereich | -40 C to +125 C |
| On-Chip Diagnostics | Open coil, shorted coil, over-temperature, under-voltage (via SPI) |
| Gehäuse | 24-pin SOIC wide-body (DW) with exposed thermal pad |
| Process Technology | Bipolar CMOS |
| Montageart | Surface Mount |
| Packaging Suffix | -FR (factory reel, tape and reel) |
MC33991DWR2-FR Pin-Konfiguration
| Pin 1 | VDD — Logic supply (5 V) |
| Pin 2 | SCLK — SPI clock input |
| Pin 3 | MOSI — SPI master-out slave-in data |
| Pin 4 | MISO — SPI master-in slave-out data |
| Pin 5 | CS — SPI chip select (active low) |
| Pin 6 | RESET — Reset input (active low) |
| Pin 7 | INT — Interrupt output to MCU |
| Pin 8 | OUT1A — H-bridge 1 output A |
| Pin 9 | OUT1B — H-bridge 1 output B |
| Pin 10 | GND — Ground |
| Pin 11 | OUT2A — H-bridge 2 output A |
| Pin 12 | OUT2B — H-bridge 2 output B |
| Pin 13 | GND — Ground |
| Pin 14 | VBAT — Motor battery supply (8-16 V) |
| Pin 15 | OUT3A — H-bridge 3 output A |
| Pin 16 | OUT3B — H-bridge 3 output B |
| Pin 17 | GND — Ground |
| Pin 18 | OUT4A — H-bridge 4 output A |
| Pin 19 | OUT4B — H-bridge 4 output B |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | GND — Ground |
| Pin 22 | TEST — Factory test pin, leave open in application |
| Pin 23 | FAULT — Fault flag output (active low) |
| Pin 24 | EN — Enable input |
Typische Anwendungen
MC33991DWR2-FR ist geeignet für 6 Anwendungs: Automotive Instrument Cluster Gauges, Dual Stepper Motor Drive Module, Body Controller Gauge Emulation, Aftermarket Gauge Replacement Modules, Industrial Process Control Panels, HVAC Control Panel Readouts.
Automotive Instrument Cluster Gauges
The MC33991DWR2-FR is purpose-built for driving automotive instrument cluster gauges, including two air-core stepper movements (typically speedometer and tachometer) and up to four additional single-coil gauges (fuel, temperature, oil pressure, battery voltage). Its four dual-output H-bridges deliver the bidirectional current required by air-core and cross-coil stepper gauges, and the SPI interface allows the host MCU to command pointer position with sub-degree resolution. With automotive-grade -40 C to +125 C operation and load-dump transient tolerance, the part survives the harsh electrical environment of a 12 V vehicle battery bus. On-chip diagnostics (open coil, shorted coil, over-temperature, under-voltage) allow the cluster MCU to flag a faulty gauge through SPI, supporting OEM ASIL decomposition strategies.
Empfohlen
Dual Stepper Motor Drive Module
Beyond automotive clusters, the MC33991DWR2-FR works well in any dual stepper drive application where SPI command of pointer or shaft position is desired. The four H-bridge outputs can be paired to drive two bipolar stepper motors, with the SPI register set commanding micro-stepping and current levels. The wide 24-SOIC exposed-pad package handles the thermal load of simultaneous dual-motor operation, and the bipolar CMOS process delivers high peak current without external transistors. This makes the part attractive for industrial gauge readouts, HVAC control panels, and test equipment front-panel displays that need silent, precise, and electronically commanded pointer positioning.
Empfohlen
Body Controller Gauge Emulation
The MC33991DWR2-FR can be used in body controller modules to emulate legacy gauge signals or to drive aftermarket dashboard gauges that mirror vehicle status. The SPI interface integrates with the BCM MCU, allowing software-defined gauge behavior, and the on-chip diagnostics report coil failures back through the SPI status registers. The 24-SOIC wide-body package with bottom thermal pad supports mounting near the BCM PCB, and the bipolar CMOS process handles the continuous drive current required for emulation mode.
Empfohlen
Aftermarket Gauge Replacement Modules
Aftermarket and replacement gauge modules for automotive, marine, and motorcycle dashboards benefit from the MC33991DWR2-FR's four H-bridge outputs and SPI control. A small MCU can drive two air-core or cross-coil stepper gauges and two additional single-coil indicators from a single chip, reducing BOM cost and PCB area. The automotive -40 C to +125 C rating supports under-dash mounting in vehicles and marine cockpits, and the factory-reel -FR packaging variant is suited to high-volume pick-and-place assembly common in aftermarket production.
Empfohlen
Industrial Process Control Panels
In industrial process control, the MC33991DWR2-FR can drive analog-style panel meters that use air-core or cross-coil movements, providing a digital-controlled replacement for traditional analog instruments. The SPI bus allows a process controller to update meter readings in real time, while the on-chip diagnostics alert the controller to open or shorted coil faults. The wide operating temperature range and the bipolar CMOS robustness make the part suitable for factory-floor panel installations where reliability and remote diagnostics are valued.
Empfohlen
HVAC Control Panel Readouts
Heating, ventilation, and air-conditioning (HVAC) control panels often use analog-style gauges for temperature, humidity, or airflow display. The MC33991DWR2-FR can drive these readouts with its four H-bridge outputs, allowing a single SPI-controlled chip to replace multiple discrete driver transistors. The -40 C to +125 C range handles the elevated temperatures near HVAC enclosures, and the small 24-SOIC footprint fits into compact panel designs. The factory-reel -FR variant supports high-volume HVAC OEM production lines.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC33991DWR2-FR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC33991DWR2 | MC33991DW | MC33991DWEFR | MC33992DW | TLE4729G | AMIS-30621 |
|---|---|---|---|---|---|---|---|
| Package | 24-SOIC wide-body (DW) | 24-SOIC wide-body (DW) - same | 24-SOIC wide-body (DW) - same | 24-SOIC wide-body (DW) - same | 24-SOIC wide-body (DW) - same | 24-SOIC wide-body (DW) - same | 24-SOIC wide-body (DW) - same |
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | Infineon | onsemi |
| Number of H-Bridges | 4 dual-output H-bridges (drives 2 stepper motors + 2 single coils) | 4 dual-output H-bridges - same | 4 dual-output H-bridges - same | 4 dual-output H-bridges - same | 1 H-bridge pair (lower count) | 2 stepper channels (4 H-bridges) | 2 H-bridge (1 stepper channel) |
| Interface | SPI | SPI - same | SPI - same | SPI - same | SPI - same | SPI - same | SPI - same |
| Operating Temperature Range | -40 C to +125 C | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same |
| On-Chip Diagnostics | Open coil, shorted coil, over-temperature, under-voltage | Same diagnostics | Same diagnostics | Same diagnostics | Similar diagnostic set | Open/short/thermal diagnostic set | Stepper stall detection |
| Packaging Format | Tape & Reel (-FR suffix) | Tube or partial reel (R2 suffix) | Tube | Tape & Reel | Tube | Tape & Reel | Tape & Reel |
Wichtigste Unterscheidungsmerkmale
- Factory reel packaging variant for high-volume SMT (vs. MC33991DWR2)
- Four dual-output H-bridges on a single chip (vs. MC33992DW)
- Integrated on-chip fault diagnostics via SPI (vs. TLE4729G)
Designhinweise
Place a 100 nF ceramic decoupling capacitor within 5 mm of the VDD (logic supply) pin and a bulk aluminum or tantalum capacitor of at least 47 uF on the motor VBAT supply. The bulk capacitor must absorb back-EMF energy from the air-core and stepper coils during H-bridge switching, and it should be rated for the load-dump transient voltage present on 12 V automotive rails. Reverse-battery and load-dump protection (TVS diode) should be placed close to the connector, before the bulk capacitor.
The 24-SOIC wide-body package has a bottom exposed thermal pad that must be soldered to a copper pour on the PCB to share heat between the four H-bridge outputs. Estimated: with all four H-bridges driving at the same time, each dissipating 500 mW, the total is 2 W. With a properly sized 1 square inch copper pour, the junction-to-ambient thermal resistance is around 35 C/W, yielding a 70 C temperature rise above ambient. Without the thermal pad soldered, the junction temperature can rise above 150 C, triggering thermal shutdown. Use multi-layer PCB with continuous top and bottom ground planes connected by thermal vias for best heat spreading.
Keep all H-bridge output traces short and wide to minimize parasitic inductance, which can cause ringing during H-bridge switching. Route the SPI bus (SCLK, MOSI, MISO, CS) as short parallel traces with a ground reference plane underneath, and place a 22-100 ohm series resistor on SCLK close to the MCU to dampen reflections. Tie all four H-bridge return paths (GND pins 10, 13, 17, 21) to a single ground star near the IC, and keep the analog ground (AGND if present) separate from the power ground until they meet at the battery return.
Do not leave the TEST pin floating in the application circuit - the datasheet specifies it must be tied to VDD or ground depending on revision. Failing to do so can cause the device to enter a test mode that disables normal SPI communication. Also, the FAULT pin is open-drain and requires an external pull-up resistor to VDD (typically 4.7 kohm); without the pull-up, the MCU will not see fault flags. Finally, ensure the SPI clock polarity and phase match the MC33991 default mode (CPOL=0, CPHA=0) - a mismatch will cause the device to ignore commands silently.
Compliance-Informationen
Compliance fields marked unknown because the verified web data does not explicitly state RoHS, REACH, or AEC-Q100 status. Freescale/NXP typically publishes this information in the product datasheet or product page; consult the manufacturer datasheet for definitive compliance statements. The automotive temperature range -40 C to +125 C and load-dump tolerance are documented in the Freescale datasheet.
