MC34910BAC - LIN SBC, 5V/60mA LDO, High-Side Drivers | NXP | LQFP-32
Teilenummer: MC34910BAC ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.85 | $4,85 |
| 10 | $4.36 | $43,60 |
| 100 | $3.88 | $388,00 |
| 500 | $3.49 | $1.745,00 |
| 1.000 | $3.1 | $3.100,00 |
MC34910BAC Übersicht
A System Basis Chip (SBC) is a category of mixed-signal power management and communication IC that consolidates what would otherwise be three or four discrete chips - a voltage regulator, a bus transceiver, and high-side driver stages - into a single package. SBCs sit in the vehicle network hierarchy at the edge node, between the LIN/CAN bus and the local microcontroller, and they fall under the broader category of automotive power management ICs (PMICs). By colocating the regulator and the LIN physical layer, an SBC eliminates board space, reduces quiescent current, and simplifies EMC design because the regulated 5V rail used by the MCU stays physically close to its supply pins.
Key features of the MC34910BAC include a wide VBAT operating range suitable for direct connection to the automotive 12V bus, a low standby current that supports battery-friendly sleep modes, programmable watchdog and reset generation for the host MCU, ESD robustness on the LIN pin enhanced to meet IEC 61000-4-2 gun-test contact discharge, and configurable high-side outputs that can be PWM-driven for dimming or load management. The SPI interface allows the host microcontroller to read diagnostic status, control the high-side switches, configure wake-up sources, and manage the device's sleep transitions. The integrated 5V LDO delivers up to 60 mA to power the host MCU and small peripheral circuitry.
Architecturally, the MC34910BAC uses a high-side DMOS topology for the power outputs, a bandgap-referenced regulator for the 5V rail, and a LIN physical layer that meets the LIN 2.1 standard. An internal state machine handles bus wake-up detection and cyclic sense capability so the device can wake the system when the main regulator is otherwise disabled, dramatically reducing quiescent current in always-connected body modules.
Typical applications include automotive body control modules, HVAC panel controllers, door/window lift modules, seat controllers, mirror adjusters, and LIN slave nodes for interior lighting. Industrial LIN-based sensor nodes and small appliance controls also benefit from the integrated LIN + LDO + driver combination. The 32-pin LQFP package gives adequate thermal headroom for the high-side drivers and supports both hand and automated assembly.
When designing with the MC34910BAC, allocate sufficient copper pour under the exposed thermal pad and on the high-side output traces to dissipate load current, place the VBAT bypass capacitor as close as possible to the supply pin to handle LIN bus ESD transients, and configure the SPI watchdog and reset timing to match the host MCU's startup latency. Selecting the correct LQFP-32 variant within the MC34910 family tree (BAC vs G5) determines which high-side driver topology and current ratings you get; the MC34910BAC specifically provides the configuration shown in this datasheet.
Drop-in-Alternativen für MC34910BAC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC34910BAC (gleiche Bauform und Footprint) – abweichend in Package, Product Type, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC33910BAC
✅ Drop-In✓ Auf Lager
$1.82 / Stück
Datenblatt ansehen →MC34910G5
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC33911BAC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC33910G5
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
NCV7428D10R20
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC34910BAC Grenzwerte & elektrische Eigenschaften
| Product Type | LIN System Basis Chip (SBC) |
| Communication Interface | LIN 2.1 (physical layer) + SPI (digital control) |
| Integrated Voltage Regulator | 1x 5.0 V LDO |
| LDO Output Current | 60 mA |
| High-Side Drivers | 2x integrated high-side switches |
| Supply Voltage (VBAT) | 6.0 V to 27 V (automotive 12 V bus, with load-dump tolerance) |
| Betriebstemperatur | -40 C to +125 C (automotive grade 1) |
| Gehäuse | 32-pin LQFP, 7 x 7 mm |
| Montageart | Surface Mount |
| ESD (LIN pin, gun contact) | >= +/-6.0 kV per IEC 61000-4-2 |
| Wake-Up Sources | LIN bus, cyclic sense, SPI command |
| Watchdog / Reset | Programmable window watchdog and MCU reset generator via SPI |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| Automotive Qualification | AEC-Q100 grade 1 capable |
| RoHS-Status | Compliant |
MC34910BAC Pin-Konfiguration
| Pin 1 | VBAT — Battery supply input (12V automotive) |
| Pin 2 | GND — Ground |
| Pin 3 | LIN — LIN bus physical interface |
| Pin 4 | LINTX — LIN transmit input from MCU |
| Pin 5 | LINRX — LIN receive output to MCU |
| Pin 6 | VCC5V — 5V LDO output (60 mA) |
| Pin 7 | CS — SPI chip select (active low) |
| Pin 8 | SCLK — SPI clock |
| Pin 9 | MOSI — SPI master-out slave-in |
| Pin 10 | MISO — SPI master-in slave-out |
| Pin 11 | RST — Reset output to host MCU |
| Pin 12 | INT — Interrupt output to host MCU |
| Pin 13 | HSD1 — High-side driver output 1 |
| Pin 14 | HSD2 — High-side driver output 2 |
| Pin 15 | WAKE — Wake-up input |
| Pin 16 | TXD — LIN transmit data from MCU |
| Pin 17 | RXD — LIN receive data to MCU |
| Pin 18 | VSUP — Voltage supply (filtered) |
| Pin 19 | VREG — Voltage regulator bypass |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | NC — Not connected (per datasheet) |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | EP — Exposed thermal pad (connect to GND) |
| Pin 32 | NC — Not connected (per datasheet) |
Typische Anwendungen
MC34910BAC ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), HVAC Panel Controller, Door Module / Mirror Adjuster, Interior Lighting / LED Dimmer Module, Seat Controller Slave Node, Industrial LIN Sensor Module.
Automotive Body Control Module (BCM)
The MC34910BAC fits BCM slave-node designs because its integrated LIN 2.1 transceiver, 5V/60mA LDO, and two high-side drivers collapse what would be 3-4 discrete chips into one 32-LQFP. With VBAT accepting the 12V automotive bus directly and AEC-Q100 grade 1 qualification (-40C to +125C), the device connects to the body network via LIN while powering a low-power MCU and switching small lamps or relays through the high-side outputs. Placed near the LIN bus connector with a 100nF VBAT bypass and adequate copper pour for thermal dissipation, the MC34910 enables compact BCM slaves with reduced BOM count and EMC-friendly layout. Compared to discrete LIN + LDO designs, the integrated SBC saves approximately 40% board area.
Empfohlen
HVAC Panel Controller
HVAC panel controllers benefit from the MC34910BAC because the 5V LDO can power the panel MCU and small display logic while the two high-side drivers switch panel backlight LEDs and small resistive loads. LIN 2.1 compliance means the panel can communicate bidirectionally with the HVAC master over a single wire, and SPI gives the host MCU diagnostic access to LIN bus faults, over-temperature, and under-voltage events. With IEC 61000-4-2 ESD hardening >= +/-6.0 kV on the LIN pin, the panel tolerates direct human-contact ESD during installation and use. The 32-LQFP (7x7) package supports automated assembly in volume production.
Empfohlen
Door Module / Mirror Adjuster
Door modules and mirror adjusters are classic LIN slave applications for the MC34910BAC. The two integrated high-side drivers can directly drive mirror heating elements or small DC motor bridges through external H-bridge MOSFETs, while the 5V LDO powers the local MCU and position-sensing circuitry. LIN 2.1 physical-layer conformance means the door module communicates with the body controller without a dedicated CAN transceiver. The SPI-controlled watchdog and reset protect the local MCU from code-lockup events common in harsh automotive electrical environments. AEC-Q100 grade 1 plus load-dump tolerance on VBAT ensures reliable operation across the automotive battery envelope.
Empfohlen
Interior Lighting / LED Dimmer Module
Interior lighting modules use the MC34910BC's PWM-controllable high-side outputs to drive LED strings with dimming while the LIN bus carries brightness commands from the body controller. The 5V LDO supplies the LED controller IC and small logic, and SPI lets the MCU read back fault flags for open-load and short-to-ground detection on each high-side output. The wide VBAT range tolerates cranking and load-dump transients on the 12V bus without reset. Compared to discrete designs, the integrated SBC eliminates a separate LIN transceiver footprint and reduces quiescent current via the SBC's sleep mode with LIN wake-up.
Empfohlen
Seat Controller Slave Node
Seat controllers with multiple adjusters use the MC34910BAC as a LIN slave node that powers a local microcontroller and switches seat-heating elements or position motors through its high-side outputs. LIN 2.1 bidirectional communication lets the seat module report position feedback and diagnostics to the master BCM over a single wire, reducing wiring harness weight. The 5V LDO's 60mA capability supports the local MCU plus small sensor signal-conditioning circuitry. AEC-Q100 grade 1 qualification and IEC 61000-4-2 ESD performance on LIN meet automotive EMI/EMC requirements without external protection components.
Empfohlen
Industrial LIN Sensor Module
Industrial LIN-based sensor modules benefit from the MC34910BAC's integrated LIN + 5V LDO combination, which allows a single 32-LQFP chip to power the sensor MCU and interface with a factory LIN backbone. The two high-side drivers can switch sensor power or small actuator loads directly, and the SPI bus provides diagnostic feedback for predictive maintenance. Wide operating temperature range (-40C to +125C) supports deployment in unconditioned industrial environments. The SBC's low standby current and wake-on-LIN capability suit battery-backed or energy-harvesting sensor nodes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC34910BAC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC33910BAC | MC34910G5 | MC33911BAC | MC33910G5 | NCV7428D10R20 |
|---|---|---|---|---|---|---|
| Package | 32-LQFP (7x7) | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | onsemi |
| LIN Standard | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.x |
| High-Side Drivers | 2x integrated | 2x integrated | 2x integrated (different rating) | 2x integrated | 2x integrated | 2x integrated |
| SPI Control | Yes | Yes | Yes | Yes | Yes | Yes |
| AEC-Q100 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Wichtigste Unterscheidungsmerkmale
- AEC-Q100 grade 1 with enhanced IEC 61000-4-2 ESD on LIN pin (vs. Discrete LIN + LDO designs)
- Single-chip integration reduces BOM and PCB area (vs. Discrete LIN transceiver + LDO + high-side drivers)
- SPI diagnostics with window watchdog (vs. NCV7428 (onsemi equivalent family))
Designhinweise
The MC34910BAC's high-side drivers dissipate significant heat at full load. With theta_JA approximately 50-60 C/W on a 32-LQFP (7x7) on a standard JEDEC 4-layer test board, derate high-side output power above 1W continuous. Provide at least 1 square inch of copper pour on the top layer connected to the exposed thermal pad (EP) and stitched to the internal ground plane with multiple thermal vias. For HSD outputs switching 0.5A continuous, this keeps junction temperature rise below 30 C.
Place the VBAT bypass capacitor (100nF X7R minimum, plus a bulk electrolytic) within 5 mm of the VBAT pin to suppress load-dump and LIN bus ESD transients. Keep the LIN trace short and route it away from switching nodes. Place the VCC5V output capacitor directly at the LDO output pin to minimize ripple on the host MCU supply. The exposed thermal pad must be soldered to a continuous ground plane for both electrical and thermal performance.
Do not exceed the VBAT maximum voltage including load-dump transients; add a TVS diode such as SMBJ24A if the application has poor transient suppression. The integrated 5V LDO is rated for 60mA; do not use it to drive power-hungry peripherals. Always configure the SPI watchdog timing window to match the MCU's worst-case startup latency, or the SBC will issue spurious resets. The NC pins in the LQFP-32 package must be left floating per datasheet - do not connect them to ground or supply.
Compliance-Informationen
AEC-Q100 grade 1 qualified per NXP product family datasheet. RoHS compliant per DigiKey listing. IEC 61000-4-2 ESD >= +/-6.0 kV on LIN pin per NXP datasheet.
