MC34VR500V1ES - 9-Output PMIC for QorIQ LS1/T1 | NXP
Teilenummer: MC34VR500V1ES ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $11.32 | $11,32 |
| 10 | $10.42 | $104,20 |
| 100 | $9.18 | $918,00 |
| 500 | $8.05 | $4.025,00 |
| 1.000 | $6.84 | $6.840,00 |
MC34VR500V1ES Übersicht
A PMIC (Power Management IC) is a system-level integrated circuit that consolidates multiple voltage rails - typically buck switching converters for high-current loads and LDOs for low-noise analog rails - into a single package, replacing dozens of discrete regulators. PMICs reduce BOM count, simplify PCB layout, improve power-up sequencing determinism, and shrink solution footprint for processor-based designs. They are widely used in networking, communications, and embedded computing platforms where multiple coordinated rails are required.
Key features include a quad-buck topology with integrated high-side and low-side MOSFETs, triple user-programmable LDOs with external feedback support, I2C-programmable output voltages and switching frequency, programmable power-up sequencing, and four operating modes (ON, OFF, Sleep, Standby). Built-in protection covers over-voltage, under-voltage, over-current, and thermal shutdown. The 56-QFN-EP package provides a thermal pad for efficient heat spreading under sustained 4.5 A loads.
Typical applications include the NXP QorIQ LS1/T1 communications processors powering routing, switching, and SoC platforms, DDR memory rails, gigabit Ethernet PHYs, and general-purpose networking infrastructure. The PMIC architecture also suits industrial control boards and small-form-factor networking appliances requiring tightly-sequenced multi-rail power.
When designing with the MC34VR500V1ES, follow NXP's reference layout in the manufacturer datasheet for the SW node, input/output capacitors, and exposed pad soldering to maximize thermal performance. Use the I2C registers to set output voltages precisely - do not rely on default settings unless the application rails exactly match them.
Drop-in-Alternativen für MC34VR500V1ES – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC34VR500V1ES (gleiche Bauform und Footprint) – abweichend in Input Voltage Range, Package, Topology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC34VR500V9ES
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC34VR500VAES
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC34PF3001A7EP
✅ Drop-In✓ Auf Lager
$5.2 / Stück
Datenblatt ansehen →MC34VR500V1ES Grenzwerte & elektrische Eigenschaften
| Topologie | Multi-output PMIC: 4 buck converters + 5 LDOs |
| Anzahl der Ausgänge | 9 (4 switching + 5 linear) |
| Maximum Buck Output Current | 4.5 A |
| Number of LDOs | 5 (triple user-programmable) |
| Eingangsspannungsbereich | 3.1 V turn-on threshold (per datasheet) |
| Ausgangsspannungsbereich | -0.3 V to 4.8 V (per datasheet absolute max limits) |
| Programming Interface | I2C (output voltage, frequency, sequencing) |
| Operating Modes | ON, OFF, Sleep, Standby |
| Control Signals | EN pin, PORB (power-on reset) |
| Schaltfrequenz | Programmable via I2C |
| Gehäuse | 56-QFN-EP (HVQFN EP), 8x8 mm |
| Montageart | Surface Mount |
| Compliance | Automotive-qualified process; RoHS per datasheet |
| Process Technology | NXP SMARTMOS |
MC34VR500V1ES 56-qfn-ep (hvqfn ep), 8x8 mm Pinbelegungsleitfaden
Pinbelegung für MC34VR500V1ES (56-qfn-ep (hvqfn ep), 8x8 mm-Gehäuse). Dieses Leistungsbauteil verfügt über Gate-, Drain- und Source-Anschlüsse. Bei nicht gepolten Gehäusen entnehmen Sie die genaue Ausrichtung von Pin 1 und Footprint-Details dem Herstellerdatenblatt. Typische Anwendungen sind Netzteilentwurf, Motoransteuerung und Lastschaltung.
Keine detaillierten Pinbelegungsdaten verfügbar für MC34VR500V1ES.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC34VR500V1ES ist geeignet für 6 Anwendungs: QorIQ LS1/T1 Communications Processors, Networking Infrastructure (Routers / Switches), DDR Memory Power Rails, Industrial Embedded Computing, Telecom Line Cards and Baseband Boards, Automotive Networking Gateways.
QorIQ LS1/T1 Communications Processors
The MC34VR500V1ES is purpose-built for NXP QorIQ LS1/T1 family communications processors used in routers, switches, and SoC platforms. Its four buck rails deliver up to 4.5 A to the SoC core while five LDOs power DDR memory and analog peripherals from the same I2C-programmable IC. Per the NXP manufacturer datasheet, the device's programmable sequencing ensures deterministic power-up order required by the QorIQ boot sequence, eliminating external sequencer logic and reducing board area versus discrete regulator designs.
Empfohlen
Networking Infrastructure (Routers / Switches)
In enterprise and industrial routers and switches, the MC34VR500V1ES provides all rails required by QorIQ-based control planes, including the SoC core, DDR3/DDR4 memory, gigabit Ethernet PHYs, and clock generators. The four switching regulators minimize power dissipation versus LDO-only architectures at the 4.5 A core rail, while the five LDOs supply low-noise analog rails for PHYs and SerDes. According to NXP documentation, I2C programmability lets network OEMs reuse one PMIC across multiple SKUs with different rail voltage requirements.
Empfohlen
DDR Memory Power Rails
The MC34VR500V1ES dedicates switching regulator outputs to power DDR3/DDR4 memory banks alongside the QorIQ processor. The integrated buck converters deliver high current with programmable voltage (typically 1.2 V-1.35 V for DDR3L/DDR4 VTT and VDDQ rails), while adjacent LDOs can be configured for the DDR reference voltage. NXP's reference design places the device adjacent to the DIMM/soldered-DRAM footprint to minimize PCB trace losses and switching-node ringing at high di/dt.
Empfohlen
Industrial Embedded Computing
For industrial control boards and embedded computing platforms based on QorIQ LS1/T1, the MC34VR500V1ES delivers the multi-rail coordination required for deterministic processor boot and reliable operation across industrial temperature ranges. The exposed thermal pad supports continuous 4.5 A loading at elevated ambient temperatures typical of factory-floor enclosures. NXP application notes recommend pairing the PMIC with bulk input capacitors rated for the application's surge and brownout profile.
Empfohlen
Telecom Line Cards and Baseband Boards
In telecom line cards, baseband processing boards, and small-form-factor networking modules, the MC34VR500V1ES supplies nine tightly-sequenced rails from a single I2C-controlled IC, replacing 9+ discrete regulators and shrinking solution footprint. Per the NXP manufacturer datasheet, the device's Sleep and Standby modes enable low quiescent power between traffic bursts, which is critical for energy-efficient telecom designs targeting modern network equipment power-saving standards.
Empfohlen
Automotive Networking Gateways
Although designed primarily for QorIQ LS1/T1 communications platforms, the MC34VR500V1ES's SMARTMOS process and automotive-qualified pedigree make it suitable for in-vehicle networking gateway prototypes and ruggedized telematics units. Its I2C programmability allows in-line reconfiguration of rail voltages for different PHY transceivers on the same gateway board. NXP's SMARTMOS device family is widely deployed in AEC-Q100 contexts, providing a migration path from prototype to automotive-qualified production.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC34VR500V1ES – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC34VR500V9ES | MC34VR500VAES | MC34PF3001A7EP |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 56-QFN-EP (8x8 mm) | 56-QFN-EP (8x8 mm) - same | 56-QFN-EP (8x8 mm) - same | 56-QFN-EP (8x8 mm) - same |
| Number of Rails | 9 (4 buck + 5 LDO) | 9 (4 buck + 5 LDO) | 9 (4 buck + 5 LDO) | 9 (6 buck + 3 LDO for i.MX) |
| Programming Interface | I2C | I2C | I2C | I2C |
| Default Register Map | Original QorIQ LS1/T1 reference | Updated for newer QorIQ silicon | Latest factory default for current QorIQ silicon | i.MX 7/8 register map (not QorIQ) |
| Target Processor Family | QorIQ LS1/T1 | QorIQ LS1/T1 | QorIQ LS1/T1 | NXP i.MX 7/8 |
| Process Technology | SMARTMOS | SMARTMOS | SMARTMOS | SMARTMOS |
Wichtigste Unterscheidungsmerkmale
- Single-IC 9-rail coordination for QorIQ LS1/T1 (vs. Discrete regulator design (4 bucks + 5 LDOs as separate ICs))
- Higher 4.5 A buck current for QorIQ core rails (vs. Typical 4-output PMICs in 56-QFN-EP (3 A max per rail))
- I2C-programmable voltages, frequency, and sequencing (vs. Fixed-output discrete regulators)
Designhinweise
The 56-QFN-EP exposed pad must be soldered to a continuous copper pour covering at least the package footprint and extending with thermal vias to inner PCB ground planes. Under sustained 4.5 A loading on the highest-current buck rail, the exposed pad carries most of the heat out of the package; inadequate soldering will trigger thermal shutdown well before the rated current is reached. Estimated: theta_JA on a 4-layer JEDEC test board with proper EP soldering is approximately 25 C/W, but actual board-level performance depends strongly on copper area and via count.
Place the input bulk capacitors as close as possible to the VIN pins and the exposed pad, and keep the SW (switching node) copper areas small to minimize radiated EMI. Route the feedback and I2C traces away from the SW nodes, and use a solid ground plane on the layer immediately beneath the PMIC. NXP's reference layout in the manufacturer datasheet shows the recommended placement relative to the QorIQ processor and DDR memory footprint; deviating from this layout risks instability on the buck converters and increased output ripple.
Do not assume default factory register values match your QorIQ LS1/T1 derivative - always initialize the I2C registers from the host bootloader to set correct output voltages, switching frequency, and power-up sequencing. Issuing EN before VIN crosses the 3.1 V turn-on threshold or while PORB is asserted will leave the device in OFF state. When migrating from the MC34VR500V1ES to the V9ES or VAES variant, re-validate the I2C initialization script because default register values change between revisions per NXP product change notices.
Select input bulk capacitors rated for the total worst-case buck input current, which can exceed 6 A transient peaks when all four bucks switch simultaneously at full load. Use low-ESR ceramic capacitors (X7R/X5R) on each buck output to minimize ripple, and place a small 100 nF bypass capacitor adjacent to each LDO output pin. According to the NXP datasheet, output capacitor ESR directly affects buck loop stability - exceeding the maximum ESR can cause subharmonic oscillation under load steps.
Compliance-Informationen
RoHS and lead-free status confirmed via NXP product page. The MC34VR500V1ES is built on NXP SMARTMOS technology, which is widely used in AEC-Q100 contexts, but the V1ES variant itself is not explicitly AEC-Q100 qualified per the available datasheet excerpt. The MC34PF3001A7EP alternative is the AEC-Q100-aligned variant for automotive platforms.
