MC68360ZQ33L - 33MHz QUICC 32-Bit Comm Controller | NXP
Teilenummer: MC68360ZQ33L ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $48.75 | $48,75 |
| 10 | $42.5 | $425,00 |
| 100 | $38.2 | $3.820,00 |
| 500 | $35.8 | $17.900,00 |
| 1.000 | $33.5 | $33.500,00 |
MC68360ZQ33L Übersicht
A microprocessor (MPU) is an integrated circuit that contains the full CPU, ALU, register file, and control logic of a processor, executing program instructions fetched from external memory. Within the broader taxonomy, the MC68360ZQ33L is a microcontroller-class IC (CPU32+ core), part of the Freescale/NXP 68K/ColdFire legacy, and is commonly categorized under Microcontrollers or Microprocessors depending on partitioning of memory on-chip versus off-chip. Its strength is integrated serial communications, reducing the need for an external UART or serial controller.
Key features of the MC68360ZQ33L include a CPU32+ 32-bit core with 4 SCCs supporting HDLC/SDLC, UART, and transparent modes, an SPI, an I2C controller, a 10/100-capable Ethernet system, and a 33 MHz maximum CPU clock at 5 V. The integrated communications processor module (CPM) offloads serial frame handling from the CPU. The 357-BGA package provides high-density interconnect for the wide parallel bus and many serial channels, while the tray packaging is consistent with low-volume industrial-grade sockets.
Architecturally, the MC68360ZQ33L is built on a 0.57 micron HCMOS process with separate instruction/data paths and an internal RISC communications engine that executes serial channel microcode independently of the CPU. The CPM uses dual-port RAM and RISC timers to maintain bit-rate timing for all four SCCs simultaneously, leaving the CPU32+ free for application logic, protocol stacks, and supervisory code.
Typical applications include industrial serial routers, telecom multiplexer equipment, factory automation controllers, ISDN terminal adapters, and any embedded system requiring many synchronous/asynchronous serial links. The combination of 32-bit processing throughput and four hardware SCCs is uncommon at this price/board-area.
When designing with the MC68360ZQ33L, ensure the 357-BGA PCB footprint has matched-impedance traces for the external memory bus and that ground reference is continuous under the BGA field, since the wide parallel memory bus carries multi-hundred-MHz edges even at 33 MHz core speed.
This page synthesizes distributor pricing and stock, drop-in same-package alternatives, and engineering selection notes specific to legacy embedded MPU designs not found in any single manufacturer document.
Drop-in-Alternativen für MC68360ZQ33L – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC68360ZQ33L (gleiche Bauform und Footprint) – abweichend in Package / Case, Processor Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC68EN360ZQ33L
✅ Drop-In✓ Auf Lager
$52.75 / Stück
Datenblatt ansehen →MC68360ZQ25L
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68360ZQ33VL
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68360ZQ33L Grenzwerte & elektrische Eigenschaften
| Processor Type | M683xx 32-Bit |
| Core | CPU32+ (32-bit) |
| Number of Cores | 1 |
| Maximum Clock Speed | 33 MHz |
| Operating Voltage | 5 V |
| Serial Communication Controllers (SCC) | 4 |
| Gehäuse / Bauform | 357-BBGA / 357-PBGA (25x25 mm) |
| Montageart | Surface Mount (BGA) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS-Status | RoHS Non-Compliant |
| Temperature Grade | COMMERCIAL |
| Terminal Form | BALL |
| Number of Terminals | 357 |
| Process Technology | 0.57 um HCMOS |
| Lebenszyklusstatus | End of Life (Last-Time-Buy) |
MC68360ZQ33L 357-bbga / 357-pbga (25x25 mm) Pinbelegungsleitfaden
Pinbelegung für MC68360ZQ33L (357-bbga / 357-pbga (25x25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC68360ZQ33L.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC68360ZQ33L ist geeignet für 6 Anwendungs: Industrial Serial Routers and Protocol Bridges, Telecom Multiplexer Equipment (T1/E1 Aggregators), Factory Automation Controllers, ISDN Terminal Adapters and BRI/PRI Interfaces, Embedded Network Appliances (Legacy Maintenance), Point-of-Sale and Banking Terminals.
Industrial Serial Routers and Protocol Bridges
The MC68360ZQ33L's four hardware SCCs and 33 MHz CPU32+ core make it a strong fit for industrial serial routers and protocol bridges needing many async/sync serial channels without an external UART. Each SCC can be independently configured for HDLC, UART, transparent, or BISYNC at up to E1/T1 rates. The CPU32+ handles routing tables and supervisory logic while the CPM offloads bit-level framing. A typical design uses 3 of 4 SCCs for framed serial links to remote PLCs and the 4th as a debug console.
Empfohlen
Telecom Multiplexer Equipment (T1/E1 Aggregators)
The four SCCs supporting HDLC and transparent modes at E1/T1 rates make the MC68360ZQ33L well-suited to telecom multiplexer aggregation. The CPM handles bit-level framing and clock recovery in hardware, allowing the CPU32+ to handle higher-layer management, alarm processing, and console telemetry. A 5 V 33 MHz implementation aligns with legacy synchronous modem and CSU/DSU designs. Engineers moving to packet-based aggregation typically pair this design with an Ethernet-equipped MC68EN360ZQ33L.
Empfohlen
Factory Automation Controllers
Programmable logic controller (PLC) mainboards benefit from the MC68360ZQ33L's 32-bit processing headroom, four high-speed serial channels, and SPI/I2C masters for sensor and actuator buses. The 33 MHz CPU32+ executes ladder-logic or motion-code, while the SCCs link to remote I/O blocks over RS-485/HDLC. The 357-BGA package supports a compact controller form factor, and its commercial temperature grade suits factory-floor enclosures. Pair the CPU with external DRAM/Flash to handle ladder programs at >1 KB scan times.
Empfohlen
ISDN Terminal Adapters and BRI/PRI Interfaces
ISDN terminal adapters historically leveraged the MC68360ZQ33L's HDLC-mode SCCs for the BRI (2B+D) Layer 1 framing and the CPU32+ for higher-layer signalling stack. The four SCCs allow simultaneous management of two B-channels, one D-channel, and a debug RS-232 port. The 5 V 33 MHz core is sufficient to execute the Q.931 state machine without hardware assistance. Industrial-temperature variants (VL suffix) target outdoor or non-climate-controlled cabinets.
Empfohlen
Embedded Network Appliances (Legacy Maintenance)
Long-lifecycle network appliances - especially those deployed in 1990s/2000s utility, railroad, and military telecom systems - continue to use the MC68360ZQ33L as a field-replacement service part. The 32-bit core, four SCCs, and 5 V operation match the surrounding analog front-end, while the 357-BGA matches existing inventory of qualified PCB assemblies. Because the part is Last-Time-Buy, repair depots hold field stock; design teams instead are requalifying ColdFire MCF5329/MCF5373 boards for forward production.
Empfohlen
Point-of-Sale and Banking Terminals
Point-of-sale terminals and banking controllers benefit from the MC68360ZQ33L's combination of 32-bit processing, multi-channel serial connectivity (for magnetic-stripe readers, smart-card couplers, PIN pads), and SPI/I2C for peripheral chips. The CPM offloads card-protocol timing so the CPU32+ can handle encryption and audit logging in real time. The 357-BGA footprint supports the small motherboards required by retail counter equipment, though the lead-containing BGA restricts deployment to RoHS-exempt regions.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC68360ZQ33L – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC68EN360ZQ33L | MC68360ZQ25L | MC68360ZQ33VL |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Maximum Clock Speed | 33 MHz | 33 MHz - same | 25 MHz (-24%) | 33 MHz - same |
| Core | CPU32+ (32-bit) | CPU32+ (32-bit) - same | CPU32+ (32-bit) - same | CPU32+ (32-bit) - same |
| Operating Voltage | 5 V | 5 V - same | 5 V - same | 5 V - same |
| SCC Count | 4 | 4 - same | 4 - same | 4 - same |
| On-chip Ethernet | No | Yes (10/100 MAC) | No | No |
| Temperature Grade | COMMERCIAL (0 C to +70 C) | COMMERCIAL - same | COMMERCIAL - same | INDUSTRIAL (-40 C to +85 C) |
| RoHS Compliance | RoHS Non-Compliant (contains lead) | RoHS Non-Compliant (contains lead) | RoHS Non-Compliant (contains lead) | RoHS Non-Compliant (contains lead) |
| Lifecycle Status | Last-Time-Buy (EOL) | Last-Time-Buy (EOL) | Obsolete | Last-Time-Buy (EOL) |
Wichtigste Unterscheidungsmerkmale
- Includes on-chip Ethernet MAC in identical package (vs. MC68EN360ZQ33L)
- Higher CPU clock speed than the ZQ25L variant (vs. MC68360ZQ25L)
- Commercial temperature grade vs industrial VL variant (vs. MC68360ZQ33VL)
Designhinweise
Estimated: at 33 MHz full-load operation the MC68360ZQ33L dissipates roughly 0.8 W to 1.2 W of power from its 5 V supply (using a typical Icc of 200 mA per NXP datasheet). The 357-BGA package provides adequate thermal mass via internal bond wires and PCB copper; designers should provide at least 1 square inch of unbroken ground plane beneath the BGA footprint for heat spreading. Active cooling is generally not required for the commercial-grade variant.
Estimated: BGA-357 PCBs require 0.8 mm or 1.0 mm ball pitch escaping. Design microvia stacks directly under each BGA ball, with all signals routed on inner layers to maintain a continuous reference plane. Use 50 ohm controlled impedance for the external memory bus and place 4 to 6 decoupling capacitors (0.1 uF plus 10 uF bulk) within 5 mm of the BGA footprint. NXP reference designs call out an 8-layer stack-up with continuous ground reference under the BGA field.
Do not confuse part-number suffixes: 'L' indicates the 5 V low-power variant, 'VL' indicates industrial temperature grade (-40 C to +85 C), and 'ZQ' indicates the 357-BGA package. Verify the full part number on the shipping label before soldering - the 25 MHz and 33 MHz speed grades are NOT software-identical and timing-sensitive code may malfunction on the slower part. Because the device is Last-Time-Buy, capture sufficient buffer stock before design freeze.
Compliance-Informationen
RoHS Non-Compliant per DigiKey catalog; part contains lead. Part is End-of-Life per NXP product page (as of 2026-10-17).
