MC68EN360AI33L-FR - 33MHz CPU32+ QUICC MPU 240-FQFP | Freescale
Teilenummer: MC68EN360AI33L-FR ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $76.5 | $765,00 |
| 100 | $62 | $6.200,00 |
| 500 | $48.5 | $24.250,00 |
| 1.000 | $40.25 | $40.250,00 |
MC68EN360AI33L-FR Übersicht
What is a QUICC microprocessor? The QUICC is an integrated communications controller family that fuses a general-purpose CPU32+ microprocessor with a dedicated RISC-based Communications Processor Module offloading serial and networking tasks. In the system hierarchy it sits between microcontroller units (MCUs) and dedicated ASIC/SoC solutions, targeted at routers, bridges, telecom equipment, and industrial control nodes that need deterministic Ethernet and serial performance without an external MAC.
Key features include 1 core 32-bit data path, 33 MHz CPU32+ instruction throughput, a CPM offload engine with 10 Mbps Ethernet, and four SCC channels supporting HDLC/SDLC/PPP/UART framing. The 240-FQFP package is a surface-mount fine-pitch QFP measuring 32x32 mm, suitable for multilayer industrial backplanes. The 5 V core supply and 5 V tolerant I/O simplify integration into legacy telecom backplanes that standardize on 5 V rails rather than 3.3 V.
Architecturally, the CPU32+ core is a 32-bit M68k-family CPU with a unified instruction and data programming model, while the CPM is a separate RISC engine (CP) that handles all serial DMA, SCC/SMC framing, and Ethernet packet buffering without interrupting the main CPU. This dual-engine approach yields deterministic serial latency under heavy network load, an important property for HDLC/PPP links and protocol bridges. The integrated 10 Mbps Ethernet MAC and serial glue allow glue-free connection to PHYs and transceivers.
Typical applications include 10/100 Mbps Ethernet bridges/routers, telecom line cards (ISDN, T1/E1), HDLC/PPP frame relay equipment, industrial serial servers, and legacy 5 V M68k embedded control. The package size and pin count limit it to high-density industrial designs where the CPM's offload is more valuable than a more compact footprint.
When designing with this part, note its End-of-Life status: NXP's product page marks MC68EN360AI33L as "Not For New Designs" and the -FR variant is supplied exclusively by authorized aftermarket distributors for long-life programs. Always validate thermal and signal-integrity margins against the manufacturer's datasheet before finalizing a new design on this part, and consider the MC68EN360AI33L or MC68360 family derivatives if a current-production alternative is required.
This page synthesizes distributor pricing, package and pinout data, drop-in alternatives, and practical design notes that are not collected together in the manufacturer datasheet.
Drop-in-Alternativen für MC68EN360AI33L-FR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernMC68EN360AI33L-FR Grenzwerte & elektrische Eigenschaften
| Core Processor | CPU32+ |
| Number of Cores | 1 Core, 32-Bit |
| Speed / Clock Frequency | 33 MHz |
| Operating Voltage | 5 V |
| Co-Processors / DSP | Communications Processor Module (CPM); SCC x4, SMC x2, SPI x1 |
| Ethernet | 10 Mbps (MII) |
| RAM Controllers | DRAM |
| Gehäuse / Bauform | 240-FQFP (32 x 32 mm) |
| Packaging | Tray |
| Montageart | Surface Mount |
| Process Technology | 0.57 um CMOS |
| Pin-Anzahl | 240 |
| Lead Free Status | Lead Free |
| RoHS-Status | Compliant |
| Product Status | Not For New Designs (EOL) |
MC68EN360AI33L-FR 240-fqfp (32 x 32 mm) Pinbelegungsleitfaden
Pinbelegung für MC68EN360AI33L-FR (240-fqfp (32 x 32 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC68EN360AI33L-FR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC68EN360AI33L-FR ist geeignet für 6 Anwendungs: 10 Mbps Ethernet Bridges and Routers, Telecom Line Cards (ISDN / T1 / E1 Framers), HDLC / PPP Frame-Relay Equipment, Industrial Serial Servers (Multi-Port RS-232/485), Legacy 5V M68k Embedded Control, Industrial Control / Factory Automation Nodes.
10 Mbps Ethernet Bridges and Routers
The MC68EN360AI33L-FR's integrated 10 Mbps Ethernet MAC with MII interface makes it a fit for legacy bridge and router designs, eliminating the need for an external MAC chip. The CPU32+ core at 33 MHz handles forwarding table management while the CPM's RISC engine runs the Ethernet DMA channel, delivering wire-rate 10 Mbps throughput without CPU loading. Combined with the four SCCs supporting HDLC/SDLC, designers get a complete WAN/LAN routing node - a typical configuration pairs the part with an external 10BASE-T PHY for a 4-port switch.
Empfohlen
Telecom Line Cards (ISDN / T1 / E1 Framers)
The four SCCs on the MC68EN360AI33L-FR support HDLC, SDLC, and transparent T1/E1 framing natively in hardware, offloading the main CPU32+ from bit-banging serial streams. In a T1 line card the device handles 24 DS0 channels across 2 SCCs while two more SCCs manage signaling, and the SMCs run auxiliary UART channels for system maintenance. Operates from 5 V supply, matching legacy telecom backplane standards. The QUICC architecture was designed for this workload and remains preferred on long-life telecom gear.
Empfohlen
HDLC / PPP Frame-Relay Equipment
The CPM's Serial Communication Controllers handle HDLC and PPP frame assembly in hardware with CRC-16 generation, transparently to the application code running on the CPU32+. At 33 MHz system clock the part sustains 4 simultaneous full-duplex HDLC channels at speeds up to 2.048 Mbps each. Frame-relay switch designs use the 240-FQFP package's generous I/O budget to expose all four SCCs plus SMC and SPI to multi-link rear-panel PHYs, while the 5 V core simplifies integration with legacy ST-BUS or H.110 backplanes common in 1990s carrier equipment.
Empfohlen
Industrial Serial Servers (Multi-Port RS-232/485)
Using the dual Serial Management Controllers (SMCs) and SPI master, the MC68EN360AI33L-FR can run up to six UART- or character-mode serial ports when including the SMC pair plus the four SCCs in UART mode. Industrial serial server boxes pair the device with external RS-485 transceivers and an Ethernet PHY, forming a 4-to-32 port serial concentrator rated for substation and SCADA environments. 5 V tolerance and 240-FQFP thermal performance (-40 C to +85 C industrial grade typically) suit unmanned outdoor cabinets.
Empfohlen
Legacy 5V M68k Embedded Control
The MC68EN360AI33L-FR is a member of the Freescale M68k family and is binary-compatible with the CPU32 instruction set, allowing reuse of legacy firmware, bootloaders, and toolchains (Diab, Green Hills, Microtec). 5 V core supply matches older industrial control hardware that never migrated to 3.3 V, sparing redesign of analog front-ends and 5 V sensors. The CPM block is unused or disabled in such uses, but the SCCs and Ethernet MAC remain available for control-network add-ons such as Modbus RTU over RS-485 or LonWorks bridging.
Empfohlen
Industrial Control / Factory Automation Nodes
In a PLC backplane or distributed IO node the MC68EN360AI33L-FR combines deterministic serial performance with the CPU32+ running a real-time OS (RTOS) such as VxWorks or PSOS. The DRAM controller supports up to 4 GB of byte-addressable memory banks, accommodating large protocol stacks and data-logging buffers on factory-floor nodes. The 33 MHz CPU budget is sufficient for ladder-logic interpretation at sub-millisecond cycle times on typical machines. Long-term field service programs in steel mills, substations, and rail signaling systems continue to deploy these controllers precisely because they are a known, well-characterized commodity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC68EN360AI33L-FR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC68EN360AI33L | MC68EN360AI25L | MC68360AI25L | MC68EN360AI50L |
|---|---|---|---|---|---|
| Package | 240-FQFP (32x32) | 240-FQFP (32x32) - same | 240-FQFP (32x32) - same | 240-FQFP (32x32) - same | 240-FQFP (32x32) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | CPU32+ 1-core 32-bit | CPU32+ 1-core 32-bit - same | CPU32+ 1-core 32-bit - same | CPU32 1-core 32-bit - older ISA, no "EN" Ethernet enhancements | CPU32+ 1-core 32-bit - same |
| Clock Frequency | 33 MHz | 33 MHz | 25 MHz | 25 MHz | 50 MHz |
| Operating Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Ethernet | 10 Mbps integrated MAC | 10 Mbps integrated MAC | 10 Mbps integrated MAC | 10 Mbps integrated MAC | 10 Mbps integrated MAC |
| Serial Controllers | 4 SCC, 2 SMC, 1 SPI | 4 SCC, 2 SMC, 1 SPI | 4 SCC, 2 SMC, 1 SPI | 4 SCC, 2 SMC, 1 SPI | 4 SCC, 2 SMC, 1 SPI |
| Lifecycle Status | Obsolete / Not For New Designs | Obsolete / Not For New Designs | Obsolete / Not For New Designs | Obsolete / Not For New Designs | Obsolete / Not For New Designs |
| Parametric Match | 100% (reference) | 100% | 90% | 80% | 95% |
Wichtigste Unterscheidungsmerkmale
- Identical silicon to MC68EN360AI33L (non-FR variant) - true drop-in (vs. MC68EN360AI33L)
- 33 MHz system clock meets mid-band M683xx needs (vs. MC68EN360AI25L)
- EN-enhanced Ethernet MAC and CPM offload present (vs. MC68360AI25L)
- 5 V-tolerant for legacy telecom backplanes (vs. MPC8309CMAJDA)
Designhinweise
Estimated: The 240-FQFP package has a typical theta_JA of approximately 18-22 C/W on a 4-layer JEDEC test board with air flow at 1 m/s. At 33 MHz and 5 V the part dissipates approximately 1.2-1.6 W typical during full CPM operation including Ethernet MAC active. A 30 K margin to a 100 C ambient (industrial class) requires either forced-air cooling or thermal vias tying the die flag to an inner copper plane. Always measure the actual junction temperature with the on-chip thermal diode for safety margins in sealed-enclosure installations.
The 240-FQFP on 0.5 mm pitch demands 4-layer (at minimum) PCB stack-up with controlled impedance for the address/data bus traces. Place at least 8 decoupling capacitors (4x 100 nF X7R, 4x 10 uF tantalum or polymer) within 5 mm of the power and ground pins around the package perimeter. Bulk 47-100 uF polymer caps should sit on the 5 V plane adjacent to the part. Ethernet MII bus lines to the external PHY must be length-matched to within 50 mils and shielded with ground pours to meet 10BASE-T emission limits.
NXP flags MC68EN360AI33L as "End of Life / Not For New Designs" on the official product page. For long-life fielded programs verify stock availability with authorized aftermarket distributors such as Rochester Electronics LLC, who franchise the original Freescale die bank. For NEW designs consider migration to PowerQUICC derivatives (MPC8309, MPC8360) or ARM-based MCF5441x, noting these require PCB redesign, BSP bring-up, and firmware port beyond the CPU32+ instruction set.
The 33 MHz CPU32+ bus and CPM DMA traffic generate simultaneous switching noise (SSN) on the address/data bus. Add series damping resistors (22-33 ohm) on outputs driving long backplane traces, and keep bus lengths under 75 mm to avoid reflections. The DRAM clock output should be routed with matched trace impedance and bypassed at every DRAM chip select pin. The CPM SCC outputs to external transceivers should be AC-coupled if the transceiver uses a different ground reference (typical for telecom isolators).
Compliance-Informationen
RoHS compliant and lead-free per Freescale/NXP distributor data. AEC-Q100 not applicable: this is a communications microprocessor, not an automotive analog/power IC. REACH, halogen-free, and conflict-mineral status not stated in the verified web data.
