MC7447AHX600NB - PowerPC G4 MPU 600MHz 360-FCCBGA | NXP
Teilenummer: MC7447AHX600NB ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $125 | $1.250,00 |
| 100 | $98.5 | $9.850,00 |
| 500 | $76.2 | $38.100,00 |
| 1.000 | $62.4 | $62.400,00 |
MC7447AHX600NB Übersicht
A PowerPC G4 microprocessor is a reduced instruction set computer (RISC) CPU that combines a classic Power architecture with vector processing extensions (AltiVec) for high-throughput data and signal processing. It belongs to the broader category of embedded microprocessors -> RISC processors -> Power architecture CPUs -> high-performance 32-bit cores, sitting between ARM Cortex-A application processors and pure DSP engines. The MPC7447A family is widely deployed in networking, telecom control planes, and defense applications where deterministic performance and long-life supply are critical.
Key features include 512 KB of unified L2 cache, dual-precision AltiVec execution units, a 64-bit MPX/MPBus system interface supporting multiprocessor coherency, hardware MMU and TLBs for full virtualization support, thermal management sensors, and dynamic frequency scaling. Power consumption is held below 5 W typical at 600 MHz, balancing performance with embedded thermal envelopes.
The MC7447AHX600NB utilizes the 0.13 micron CMOS process on a copper interconnect stack, yielding the high clock frequency and low leakage required for thermally constrained compute blades. Its superscalar out-of-order execution engine can dispatch up to three instructions per cycle, and AltiVec adds SIMD throughput across 16-way single-precision floating-point streams.
Typical applications include embedded networking line cards, defense and aerospace signal processors, industrial single-board computers, and legacy PowerPC G4 upgrade upgrades in storage controllers. Per the NXP product page, the part is suitable for leading-edge computing, embedded network control, and signal processing workloads.
When designing around the MC7447AHX600NB, observe the 1.1 V core voltage rail sequencing relative to the 2.5 V MPX I/O supply, and provide adequate thermal relief for the 25x25 mm FCCBGA substrate. The AltiVec unit must be initialized by system firmware before SIMD instructions are issued.
This page consolidates FCCBGA package references, same-family MPC7447 variants, and OEM design notes not always surfaced in the manufacturer hardware specification addendum.
Drop-in-Alternativen für MC7447AHX600NB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC7447AHX1000NB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC7447AHX867NB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC7448HX1000NB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC7447AHX1100NB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC7447AHX600NB Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Series | MPC7447A (APOLLO7PM, RV1.1) |
| Core Architecture | PowerPC G4 - 32-bit RISC |
| Core Count | 1 |
| Maximum CPU Frequency | 600 MHz |
| L2 Cache | 512 KB on-chip |
| SIMD Engine | AltiVec 128-bit |
| System Bus Width | 64-bit MPX/MPBus |
| Core Supply Voltage | 1.1 V |
| Betriebstemperatur | 0 C to 105 C |
| Gehäuse | 360-FCCBGA, 25 mm x 25 mm |
| Terminal Form | Ball |
| Package Style | Grid Array |
| RoHS Status (NB suffix) | Compliant, lead-free |
| Status per NXP | End of Life - Discontinuance announced |
MC7447AHX600NB grid array Pinbelegungsleitfaden
Pinbelegung für MC7447AHX600NB (grid array-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC7447AHX600NB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC7447AHX600NB ist geeignet für 6 Anwendungs: Embedded Networking Line Cards, Defense and Aerospace Signal Processing, Industrial Single-Board Computers, Print and Imaging Controllers, Storage and RAID Controllers, Legacy PowerPC G4 System Refresh.
Embedded Networking Line Cards
The MC7447AHX600NB delivers 600 MHz of dual-issue PowerPC G4 throughput paired with 128-bit AltiVec SIMD, making the part well-suited to embedded networking line cards running deep-packet classification and QoS shaping. The 64-bit MPX system bus delivers sufficient I/O bandwidth for FPGA co-processing peripherals, while 512 KB of on-chip L2 keeps re-classification tables on-die. Designers typically pair the MPU with an MPC107 northbridge for SDRAM and PCI-X expansion, scaling across multi-MHz control plane workloads.
Empfohlen
Defense and Aerospace Signal Processing
Within aerospace and defense platforms the MPC7447AHX600NB serves as an upgrade-replacement for earlier Motorola/Freescale PowerPC processors in line with MIL-SPEC thermal and IPC-A-610 manufacturing concerns. AltiVec SIMD enables real-time filtering and FFT kernels for radar and SIGINT payloads, while the 105 C junction rating covers conformal-coated chassis. The 360-FCCBGA package also proves robust under vibration once soldered to a properly engineered PCB stack-up with underfilled BGA attach.
Empfohlen
Industrial Single-Board Computers
Industrial SBCs benefit from the MC7447AHX600NB through a combination of legacy VxWorks and Wind River Linux support, deterministic interrupt response, and long-life EOL stock availability through Rochester Electronics. The 1.1 V core simplifies VRM design on 3.3 V-only backplanes, while the 64-bit MPX bus drives PCI-X peripherals and dual Gigabit Ethernet. Board designers should refer to NXP reference platforms (Lite5200B variants) for validated schematics and BSD-licensed firmware adapters.
Empfohlen
Print and Imaging Controllers
High-end commercial printers and imaging controllers leverage the MC7447AHX600NB for RIP engine performance, particularly when AltiVec-accelerated PostScript and PDF parsing libraries are available. The 600 MHz clock combined with 128-bit SIMD saturates duplex print pipelines at engine speeds above 100 pages per minute. The 360-FCCBGA keeps the footprint compatible with earlier MPC7410/MPC7441 designs, simplifying refresh of long-life product lines.
Empfohlen
Storage and RAID Controllers
RAID controllers and storage appliances pair the MC7447AHX600NB's compute capability with hardware XOR engines for parity computation and TCP offload stacks for iSCSI. The 64-bit MPX bus negotiates coherency transactions cleanly between CPU and DMA agents on shared PCI-X channels. The AltiVec SIMD additionally accelerates Reed-Solomon and LDPC codecs in software-defined storage implementations.
Empfohlen
Legacy PowerPC G4 System Refresh
Designers of late-1990s and early-2000s PowerPC G4 systems (such as embedded VME controllers and older Apple-compatible industrial hardware) use the MC7447AHX600NB as a low-cost 1.1 V upgrade over earlier 1.8 V cards in the same 360-FCCBGA socket. Because the package is pin-compatible across MPC7447A speed grades, refresh boards can be assembled with the same JTAG probe footprints and BSD-licensed firmware bring-up paths. This minimizes NRE for long-life industrial retrofits while keeping inventory cost reasonable.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC7447AHX600NB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC7447AHX1000NB | MPC7447AHX867NB | MPC7448HX1000NB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same |
| CPU Frequency | 600 MHz | 1.0 GHz | 867 MHz | 1.0 GHz |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.3 V |
| Architecture | PowerPC G4 (MPC7447A) | PowerPC G4 (MPC7447A) | PowerPC G4 (MPC7447A) | PowerPC G4 (MPC7448) |
| L2 Cache | 512 KB | 512 KB | 512 KB | 1 MB |
| System Bus | 64-bit MPX | 64-bit MPX | 64-bit MPX | 64-bit MPX |
| AltiVec SIMD | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C |
| Lifecycle | EOL (discontinued) | EOL (discontinued) | EOL (discontinued) | EOL (discontinued) |
Wichtigste Unterscheidungsmerkmale
- 1.1 V low-power core reduces total system power (vs. MPC7448HX1000NB)
- Same-package upgrade path to 1.0 GHz within 1.1 V envelope (vs. MPC7447AHX1000NB)
- AltiVec 128-bit SIMD at low frequency for thermal envelopes (vs. MPC7447AHX1100NB)
Designhinweise
Estimated: at 600 MHz and a 1.1 V core the MPC7447A power envelope is approximately 4-6 W; this concentrates in a 25x25 mm FCCBGA substrate. Provide at least one interior thermal pad stitching pattern on the PCB plus a heat-spreader or heat-sink to keep the junction below 105 C in a sealed enclosure, since the 360-ball BGA restricts top-side airflow.
Use a high-Tg FR-4 (Tg >= 170 C) or polyimide stack-up with matched-CTE core layers to survive BGA solder fatigue. The 360-FCCBGA needs an 0.8 mm (or finer) pitch escape rule with microvias and dog-bone fan-out. Per the NXP hardware specification, the package-land-pattern is symmetric: confirm with the datasheet land-pattern dimensions before finalizing artwork.
Power sequencing: hold the 2.5 V MPX I/O rail until the 1.1 V core rail is stable, then assert HRESET for at least 100 us before the PLL lock. Use a low-noise LDO (for example the TI TPS74401) on the 1.1 V rail rather than a switching converter; the PowerPC G4 PLL is sensitive to input ripple and will lose lock if the rail dips below 1.05 V during startup.
Do not substitute 1.3 V MPC7448 parts into 1.1 V MPC7447A sockets without first revving the VRM - the higher core voltage will permanently damage the MPC7447A silicon. Equally, ensure the BGA balls are not contaminated with flux residue before X-ray inspection because the FCCBGA pitch is too fine for optical inspection at SMT shop-level.
Compliance-Informationen
RoHS and lead-free status determined from the 'NB' suffix in the part number (NXP/Freescale naming convention). Halogen-free status not explicitly stated in provided data; AEC-Q100 not applicable to MPUs. EOL discontinuance announced by NXP - designers should plan last-time-buy.
