MC8641DTHX1333JE - PowerPC e600 Dual-Core 1.333GHz MPU | NXP
Teilenummer: MC8641DTHX1333JE ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $567.87 | $567,87 |
| 10 | $545 | $5.450,00 |
| 100 | $510 | $51.000,00 |
| 500 | $478 | $239.000,00 |
| 1.000 | $445 | $445.000,00 |
MC8641DTHX1333JE Übersicht
What is an MPC86xx MPU? The MPC86xx family is a line of high-performance PowerPC-based microprocessors originally developed by Freescale Semiconductor (now NXP). They are designed for embedded computing workloads such as networking line cards, storage controllers, and industrial automation, where deterministic performance and multi-core parallelism are required. As a dual-core PowerPC device, the MC8641 belongs to the broader microprocessor (MPU) product category and falls under the embedded processing taxonomy.
Key features of the MC8641DTHX1333JE include 2 cores at 1.333 GHz, integrated DDR/DDR2 memory controllers, dual Gigabit Ethernet MACs, on-chip high-speed serial peripherals, and a low core voltage of 0.95V. The -40C to +105C operating range supports industrial and extended-temperature deployments. Its large FCCBGA-1023 package provides the signal density needed for the multi-channel I/O and memory interfaces.
The e600 core is a superscalar PowerPC implementation with out-of-order execution, hardware MMU, and large L2 cache support. The dual-core configuration delivers parallel compute throughput suitable for packet processing and real-time control. Per the verified web data, this part is the G8 silicon revision (REV 3.0), which informs firmware and errata considerations.
Typical applications for this MPU include networking routers and switches, line cards, storage controllers (RAID/SAN), industrial automation controllers, and embedded telecom platforms. The combination of dual cores, integrated Ethernet, and DDR2 controllers reduces BOM and board complexity in these compute-dense systems.
When designing with the MC8641DTHX1333JE, ensure adequate thermal dissipation for the FCCBGA package and follow NXP layout guidelines for high-speed DDR2 routing. Note that the part is listed as Obsolete (per verified web data) and uses tin/lead (Sn/Pb) terminal finish, making it unsuitable for new RoHS-only builds. For new designs, evaluate the available NXP MPC86xx inventory and consider functional alternatives carefully.
This page consolidates verified distributor pricing, drop-in alternatives from the MPC86xx family, and design considerations specific to high-performance PowerPC MPUs to help engineers evaluate this part for legacy and after-market scenarios.
Drop-in-Alternativen für MC8641DTHX1333JE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernMC8641DTHX1333JE Grenzwerte & elektrische Eigenschaften
| Core Processor | PowerPC e600 |
| Series | MPC86xx |
| Number of Cores | 2 |
| Datenbusbreite | 32-Bit |
| Speed | 1.333 GHz |
| Core Voltage | 0.95 V |
| RAM Controllers | DDR, DDR2 |
| Graphics Acceleration | No |
| Ethernet | 10/100/1000 Mbps (dual MAC) |
| Display & Interface Controllers | Not specified |
| Co-Processors / DSP | Not specified |
| Gehäuse | 1023-ball FCCBGA (33x33 mm) |
| Montageart | Surface Mount (BGA) |
| Silicon Revision | G8 REV 3.0 |
| Betriebstemperatur | -40C to +105C |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Peak Reflow Temperature | 245 C (max 30 s) |
| Technology | CMOS |
| RoHS-Status | RoHS non-compliant (Sn/Pb finish) |
| Part Status | Obsolete |
MC8641DTHX1333JE 1023-ball fccbga (33x33 mm) Pinbelegungsleitfaden
Pinbelegung für MC8641DTHX1333JE (1023-ball fccbga (33x33 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC8641DTHX1333JE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC8641DTHX1333JE ist geeignet für 6 Anwendungs: Networking Router and Switch Line Cards, Storage Controllers and RAID/SAN Systems, Industrial Automation Controllers, Embedded Telecom Platforms, Defense and Aerospace Embedded Compute, Medical Imaging and Diagnostic Equipment.
Networking Router and Switch Line Cards
The MC8641DTHX1333JE is widely deployed in networking line cards where dual-core PowerPC e600 processing at 1.333 GHz provides the throughput needed for packet forwarding, classification, and ACL lookup. Its integrated dual Gigabit Ethernet MACs reduce external PHY count, and the DDR/DDR2 controller supports the high-bandwidth memory access patterns of route-table lookups. Per the verified web data, the part is in the MPC86xx family commonly used in routers and switches. The 1023-ball FCCBGA package supports the high pin density required for multi-port line cards.
Empfohlen
Storage Controllers and RAID/SAN Systems
The MC8641DTHX1333JE serves as the main compute element in storage controllers and RAID/SAN systems where dual-core PowerPC processing handles I/O scheduling, RAID parity calculation, and storage protocol offload. The DDR2 controller supports the memory bandwidth needed for cache tables and command queuing, while serial RapidIO/PCI Express lanes connect to storage ASICs. Per the verified distributor listing, the part supports -40C to +105C operation suitable for storage enclosures. The FCCBGA-1023 package supports high-density board designs.
Empfohlen
Industrial Automation Controllers
The MC8641DTHX1333JE is suited for industrial automation controllers requiring deterministic real-time compute. The dual-core PowerPC e600 design runs an RTOS on one core while the other handles communication and supervisory control. The -40C to +105C operating range (per verified web data) supports factory-floor and outdoor deployments. Its on-chip Ethernet enables integration into industrial Ethernet networks, and the FCCBGA-1023 package supports the high signal count of multi-axis motion-control cards.
Empfohlen
Embedded Telecom Platforms
In embedded telecom platforms, the MC8641DTHX1333JE provides the processing for media gateways, base station controllers, and protocol converters. Its dual e600 cores handle voice/video processing and signaling stacks in parallel. Integrated DDR2 and Gigabit MACs reduce BOM cost compared to discrete implementations. The 0.95V core voltage keeps power consumption manageable in 1U/2U rackmount equipment. The 33x33 mm FCCBGA-1023 package fits standard telecom mezzanine footprints.
Empfohlen
Defense and Aerospace Embedded Compute
The MC8641DTHX1333JE serves defense and aerospace embedded compute applications such as mission computers, radar signal pre-processors, and avionics data concentrators. The extended -40C to +105C temperature range and rugged FCCBGA construction meet avionics environmental profiles. Its dual-core PowerPC provides the deterministic real-time performance required for sensor fusion and control loops. Long lifecycle and after-market availability through authorized distributors make it suitable for defense sustainment programs.
Empfohlen
Medical Imaging and Diagnostic Equipment
In medical imaging systems like ultrasound carts and diagnostic analyzers, the MC8641DTHX1333JE delivers the dual-core processing required for image reconstruction, signal processing, and UI rendering. The DDR2 controller supports the high memory bandwidth of image buffers, while Gigabit Ethernet connects to hospital PACS networks. The extended temperature range supports mobile cart deployments. Per the verified web data, this is a CMOS PowerPC device with dual Ethernet, suitable for regulated medical embedded systems requiring long-term component availability.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC8641DTHX1333JE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC8641DTVU1333JE | MC8641DTVJ1333JE | MC8641DTVU1000GE | MC8641DVJ1333JE | MC8641DTHX1000JE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-ball FCCBGA (33x33) | 1023-ball FCCBGA (33x33) - same | 1023-ball FCCBGA (33x33) - same | 1023-ball FCCBGA (33x33) - same | 1023-ball FCCBGA (33x33) - same | 1023-ball FCCBGA (33x33) - same |
| Core Speed | 1.333 GHz | 1.333 GHz | 1.333 GHz | 1.0 GHz | 1.333 GHz | 1.0 GHz |
| Number of Cores | 2 | 2 | 2 | 2 | 2 | 2 |
| RAM Controller | DDR, DDR2 | DDR, DDR2 | DDR, DDR2 | DDR, DDR2 | DDR, DDR2 | DDR, DDR2 |
| Operating Temperature | -40C to +105C | Extended (likely -40C to +105C) | Commercial (0C to +70C) | Extended (likely -40C to +105C) | Commercial (0C to +70C) | Extended (-40C to +105C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Terminal Finish | Sn/Pb (non-RoHS) | Sn/Pb (non-RoHS) | Sn/Pb (non-RoHS) | Sn/Pb (non-RoHS) | Sn/Pb (non-RoHS) | Sn/Pb (non-RoHS) |
Wichtigste Unterscheidungsmerkmale
- Highest core frequency in the MPC8641 family at 1.333 GHz (vs. MC8641DTVU1000GE)
- Extended industrial temperature range (-40C to +105C) (vs. MC8641DVJ1333JE)
- Dual integrated Gigabit Ethernet MACs (vs. MC8610PX1333JB (single-core MPC8610))
- G8 silicon revision with latest errata fixes (vs. Earlier G7/G6 MPC8641 revisions)
Designhinweise
The MC8641DTHX1333JE in the 1023-ball FCCBGA (33x33 mm) package dissipates significant power at 1.333 GHz dual-core operation. Estimated: at 0.95V core voltage with a typical dual-core load, plan for 10-15W dissipation. Use a multi-layer PCB with a full thermal pad and via array under the package, plus heatsink attachment per NXP MPC8641 hardware design guide. Junction-to-ambient thermal resistance depends heavily on PCB copper area; consult the NXP hardware specifications document for theta_JA values.
DDR2 memory routing on the MC8641DTHX1333JE requires strict impedance and length matching. Per the verified web data, the part supports DDR/DDR2 controllers, which demand 50-ohm controlled-impedance traces with matched-length data, address, and clock pairs. Use fly-by topology for DDR2, with termination at the end of each segment. Decoupling: place 0.1 uF and 10 uF ceramic capacitors as close as possible to the BGA balls. Refer to the NXP MPC8641 hardware specifications document for detailed routing rules.
The MC8641DTHX1333JE is RoHS non-compliant (Sn/Pb terminal finish per verified Vyrian data). Do not use in new RoHS-only assemblies. The part is also marked Obsolete, so plan for last-time-buy and after-market sourcing. Verify the silicon revision (G8 REV 3.0 per verified Mouser data) against your firmware and errata document - earlier revisions may have functional differences. BGA rework requires X-ray inspection; do not assume visual solder joint inspection is sufficient.
High-speed serial interfaces on the MC8641DTHX1333JE (PCI Express, RapidIO, Gigabit Ethernet) require AC-coupling capacitors and 100-ohm differential routing. Keep reference planes continuous under the BGA balls and avoid signal vias in the BGA pad area. Per the verified web data, the FCCBGA-1023 pin density requires 4-6 PCB routing layers for signal escape. Place the boot configuration pull-up/pull-down resistors close to the dedicated boot config balls.
The MC8641DTHX1333JE requires multiple power rails (core 0.95V, I/O, DDR2 termination VTT, PLL, etc.). Use a sequenced power-up controller per the NXP MPC8641 hardware specifications document to avoid latch-up. Estimated: total system power at dual-core 1.333 GHz load is approximately 15-20W including DDR2 and Ethernet. Add bulk capacitance near the BGA supply balls to handle core load transients.
Compliance-Informationen
RoHS non-compliant per verified Vyrian and what-is-ic listings - uses tin/lead (Sn/Pb) terminal finish. AEC-Q100 not applicable (industrial/embedded MPU). REACH, halogen-free, and conflict minerals status not stated in the verified data; recommend confirming with the manufacturer for new designs.
