NXP Semiconductors

MC9S08AC16MFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP

Teilenummer: MC9S08AC16MFGE ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.7 V to 5.5 V Vdss 44-pin LQFP (10x10 mm), 0.8 mm pitch Package 40 MHz Speed 16 KB Flash Memory
Ab $2.95 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $5.12 $5,12
10 $4.65 $46,50
100 $3.92 $392,00
500 $3.4 $1.700,00
1.000 $2.95 $2.950,00
ℹ️ Alle Preise sind in USD

MC9S08AC16MFGE Übersicht

The NXP MC9S08AC16MFGE is an 8-bit HCS08 microcontroller featuring 16 KB of Flash, 1 KB of RAM, a 40 MHz CPU core, and a 44-pin LQFP (10x10 mm) package. It operates from a 2.7 V to 5.5 V supply and integrates a 10-bit ADC, multiple timers (TPM), and serial peripherals (SCI, SPI, I2C) for embedded designs.

An 8-bit microcontroller (MCU) is a small, low-power processor that integrates CPU, memory, and peripherals on a single silicon die. Within the semiconductor hierarchy, an MCU belongs to the broader family of microcontrollers, which sit under microprocessors, ICs, and finally semiconductors. The HCS08 family uses an enhanced S08 CPU core, which improves code density and peripheral integration compared to legacy HC08 cores.

Key features of the MC9S08AC16MFGE include 16 KB on-chip Flash for program storage, 1 KB RAM for data, 38 general-purpose I/O lines, a 10-bit successive-approximation ADC with up to 8 input channels, two Timer/PWM modules, and an internal clock source that supports crystal-less USB-less operation. The device also includes an integrated voltage regulator, low-voltage detection, and a hardware cryptographic accelerator (where marked) for secure communications.

The S08 architecture uses a von Neumann bus structure with 16-bit internal addressing, allowing linear access to the full memory map. The 40 MHz bus speed (20 MHz core with 2:1 pipeline) gives roughly 1.25 MIPS/MHz efficiency, suiting cost-sensitive control loops. The LQFP-44 package provides an industry-standard 0.8 mm pitch footprint compatible with hand-solderable and reflow-compatible PCB layouts.

Typical applications include automotive body controllers, industrial sensor interfaces, white-goods motor control, low-cost consumer appliances, and HVAC thermostats. Designers select this MCU when integration, low BOM cost, and 5 V tolerance outweigh the need for higher MIPS or larger memory.

When designing with this device, allocate adequate decoupling (0.1 uF on each VDD pair), keep analog/digital grounds separated, and route the RESET pin with a 10 kohm pull-up to VDD. For power-critical designs, leverage the STOP3 and Wait modes to reduce quiescent current below 1 uA.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a stock NXP or DigiKey product summary alone.

Drop-in-Alternativen für MC9S08AC16MFGE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08AC16MFGE (gleiche Bauform und Footprint) – abweichend in Package, RAM, Mounting Type, RoHS Status, Core Processor.

NXP Semiconductors
Package: 44-LQFP (10x10 mm)
Vergleichen mit MC9S08AC16MFGE →
NXP Semiconductors
Package: 44-LQFP (10x10 mm)
RoHS Status: RoHS Compliant
Core Processor: S08 (HCS08)
Vergleichen mit MC9S08AC16MFGE →
NXP Semiconductors
Package: 44-LQFP (10x10 mm)
RoHS Status: RoHS Compliant
Core Processor: S08 (HCS08)
Vergleichen mit MC9S08AC16MFGE →
NXP Semiconductors
Package: 44-LQFP (10 x 10 mm)
RAM: 2 KB
RoHS Status: RoHS compliant
Vergleichen mit MC9S08AC16MFGE →
NXP Semiconductors
Package: 44-LQFP (10x10 mm)
RAM: 512 B
Mounting Type: Surface Mount (Gull Wing)
Vergleichen mit MC9S08AC16MFGE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S08AC16CFGE

✅ Drop-In
NXP Semiconductors
📦 44-pin LQFP (10x10)
HCS08 (8-bit) · 40 MHz · 20 MHz · 16 KB (16K x 8) · 2.7 V to 5.5 V · 38 · 44-LQFP (10x10 mm)

✓ Auf Lager

$2.6 / Stück

Datenblatt ansehen →

MC9S08AC32MFGE

✅ Drop-In
NXP Semiconductors
📦 44-pin LQFP (10x10)
S08 (HCS08) · 8-Bit · 40 MHz · 20 MHz · 32KB (32K x 8) · FLASH · 2.7 V to 5.5 V · 38

✓ Auf Lager

$5.98 / Stück

Datenblatt ansehen →

MC9S08AC60CFGE

✅ Drop-In
NXP Semiconductors
📦 44-pin LQFP (10x10)
S08 (HCS08), 8-bit CISC · 8-bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 2 KB · 2.7 V to 5.5 V · 3.3 V / 5 V

✓ Auf Lager

$3.42 / Stück

Datenblatt ansehen →

MC9S08AC8MFGE

✅ Drop-In
NXP Semiconductors
📦 44-pin LQFP (10x10)
HCS08 (S08) 8-bit CPU · 40 MHz · 20 MHz · 8 KB (8K x 8) · 512 B · 2.7 V to 5.5 V · 38 · 44-LQFP (10x10 mm)

✓ Auf Lager

$4.95 / Stück

Datenblatt ansehen →

MC9S08AC32CFGE

✅ Drop-In
NXP Semiconductors
📦 44-pin LQFP (10x10)
S08 (HCS08) · 8-Bit · 40 MHz · 20 MHz · 32 KB (32K x 8) · 2.7 V to 5.5 V · 38 · 44-LQFP (10x10 mm)

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S08AC16MFGE Grenzwerte & elektrische Eigenschaften

Core S08 (HCS08) 8-bit
Program Memory 16 KB Flash
RAM 1 KB
Maximum CPU Frequency 40 MHz
Supply Voltage Range 2.7 V to 5.5 V
I/O Pins 38
ADC 10-bit, up to 8 channels
Timers/PWM 2 TPM modules
Serial Interfaces SCI (UART), SPI, I2C
Betriebstemperaturbereich -40 C to +125 C (industrial)
Gehäuse 44-pin LQFP (10x10 mm), 0.8 mm pitch
Montageart Surface Mount
MSL-Level 3 (168 hours)
RoHS-Status Compliant
Lead-Free Yes
Internal Voltage Regulator Yes (low-voltage detect)

MC9S08AC16MFGE Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 PTD1/TxD — Port D GPIO / SCI transmit
Pin 2 PTD0/RxD — Port D GPIO / SCI receive
Pin 3 PTC0 — Port C GPIO
Pin 4 PTC1 — Port C GPIO
Pin 5 PTC2 — Port C GPIO
Pin 6 PTC3 — Port C GPIO
Pin 7 VSS — Ground
Pin 8 VDD — Supply voltage (2.7-5.5 V)
Pin 9 PTC4 — Port C GPIO
Pin 10 PTC5 — Port C GPIO
Pin 11 PTC6 — Port C GPIO
Pin 12 PTB7 — Port B GPIO
Pin 13 PTB6 — Port B GPIO
Pin 14 PTB5 — Port B GPIO
Pin 15 PTB4 — Port B GPIO
Pin 16 VSS — Ground
Pin 17 VDD — Supply voltage
Pin 18 PTB3 — Port B GPIO
Pin 19 PTB2 — Port B GPIO
Pin 20 PTB1 — Port B GPIO
Pin 21 PTB0 — Port B GPIO
Pin 22 PTA7 — Port A GPIO / ADC
Pin 23 PTA6 — Port A GPIO / ADC
Pin 24 PTA5 — Port A GPIO / ADC
Pin 25 PTA4 — Port A GPIO / ADC
Pin 26 PTA3 — Port A GPIO / ADC
Pin 27 PTA2 — Port A GPIO / ADC
Pin 28 PTA1 — Port A GPIO / ADC
Pin 29 PTA0 — Port A GPIO / ADC
Pin 30 VREFH — ADC reference high
Pin 31 VREFL — ADC reference low
Pin 32 BKGD — Background debug mode pin
Pin 33 RESET — Reset input, active low
Pin 34 IRQ — External interrupt request
Pin 35 PTE7 — Port E GPIO
Pin 36 PTE6 — Port E GPIO
Pin 37 PTE5 — Port E GPIO
Pin 38 PTE4 — Port E GPIO
Pin 39 PTE3 — Port E GPIO
Pin 40 PTE2 — Port E GPIO
Pin 41 PTE1 — Port E GPIO
Pin 42 PTE0 — Port E GPIO
Pin 43 VSS — Ground
Pin 44 VDD — Supply voltage

Typische Anwendungen

MC9S08AC16MFGE ist geeignet für 6 Anwendungs: Automotive Body Controllers, Industrial Sensor Interface Boards, White Goods Motor Control, Low-Cost Consumer Appliances, HVAC Thermostats, IoT Edge Sensor Nodes.

🚗

Automotive Body Controllers

The MC9S08AC16MFGE fits automotive body modules because of its 2.7-5.5 V supply range, -40 to +125 C industrial temperature grade, and on-chip 10-bit ADC for analog sensor reads. The HCS08 core at 40 MHz can scan multiple switch inputs and drive PWM-controlled loads like door locks, mirror adjust, and lighting FETs in real time. Compared to a discrete logic board, this MCU consolidates timing, ADC, SCI, and PWM into one LQFP-44 footprint, simplifying PCB layout and lowering BOM cost. The integrated low-voltage detect (LVD) supports cranking profiles on 12 V automotive rails when paired with an external regulator. SPI/I2C peripherals connect directly to LED drivers or sensor front-ends.

🏭

Industrial Sensor Interface Boards

The 10-bit ADC and dual TPM timers in the MC9S08AC16MFGE allow industrial sensor interface boards to sample analog signals at up to roughly 100 ksps while driving PWM outputs to valve or motor stages. Its 38 GPIO pins accommodate parallel keypads, indicator LEDs, and discrete logic signals on the same PCB. The 5 V tolerance of the GPIO is useful when interfacing to legacy 5 V industrial sensors, and the SCI peripheral bridges to RS-485 transceivers with no extra glue. The LQFP-44 package supports reflow-compatible assembly, important for medium-volume industrial production runs.

⚡

White Goods Motor Control

White-goods designs such as washing machines, dishwashers, and induction cooktops use the MC9S08AC16MFGE for cost-sensitive motor control loops. Two TPM modules deliver complementary PWM outputs to gate drivers or low-side FET switches, while the 10-bit ADC samples current and back-EMF for closed-loop regulation. The 16 KB Flash stores small RTOS-style control firmware plus diagnostics, and the 1 KB RAM holds transient calculation state. Industrial temperature grade plus integrated LVD suit the noisy electrical environment of mains-powered appliances.

📱

Low-Cost Consumer Appliances

For entry-level consumer appliances such as coffee makers, fans, and small kitchen tools, the MC9S08AC16MFGE provides sufficient MIPS at the lowest BOM cost in the S08AC family. The integrated 16 KB Flash fits typical UI state machines and PWM profiles, while the SCI/SPI/I2C peripherals drive displays, keypads, and indicator LEDs without external logic. STOP3 and Wait modes drop quiescent current to single-digit microamps, satisfying energy-star standby budgets.

💡

HVAC Thermostats

HVAC thermostat designs rely on the MC9S08AC16MFGE for analog temperature sensing, keypad/encoder UI input, and triac-style PWM heating/cooling actuation. The 10-bit ADC digitizes thermistor bridges directly, while the TPM timers generate zero-crossing or phase-angle control signals. Industrial temperature operation (-40 to +125 C) supports the enclosed equipment bay environment and adjacent heat sources. SCI enables connection to building automation networks, and the 16 KB Flash accommodates calibration tables and menu logic.

🧩

IoT Edge Sensor Nodes

Edge IoT nodes benefit from the MC9S08AC16MFGE's low power modes and integrated peripherals: SCI/SPI/I2C can host radios, sensors, and EEPROM, while the 10-bit ADC reads environmental data on demand. The MCU wakes from STOP3 in microseconds, allowing duty-cycled operation that extends battery life. Industrial temperature operation makes the part suitable for outdoor enclosures, and the LQFP-44 footprint supports both hand-soldered prototypes and high-volume reflow production.

What is the operating voltage of the MC9S08AC16MFGE?
The MC9S08AC16MFGE operates from a 2.7 V to 5.5 V DC supply. According to the NXP S08AC reference manual, the on-chip voltage regulator derives the internal 1.8 V core rail directly from the external supply, so only a single 5 V or 3.3 V rail is required for typical embedded designs. Designers must keep the supply within range to avoid POR reset events.
How much Flash and RAM does the MC9S08AC16MFGE have?
The MC9S08AC16MFGE integrates 16 KB of Flash for program storage and 1 KB of RAM for data, as listed on the NXP product page and DigiKey listing. This memory ratio suits small control loops with up to roughly 4,000 lines of C code, leaving adequate headroom for stack and scratchpad operations in typical firmware builds.
What is the maximum CPU clock of the MC9S08AC16MFGE?
The MC9S08AC16MFGE runs at up to 40 MHz internal bus frequency, providing 20 MIPS of CPU throughput. The HCS08 core is rated at roughly 1.25 MIPS per MHz, giving designers adequate headroom for digital filtering and serial protocol handling on a single chip.
What package does the MC9S08AC16MFGE use?
The MC9S08AC16MFGE comes in a 44-pin LQFP package measuring 10x10 mm with a 0.8 mm lead pitch. This JEDEC-standard LQFP-44 footprint is widely supported by breakout boards, hand-solderable prototyping, and reflow-compatible PCB assembly processes. Surface-mount footprint libraries include the LFQP44 / LQFP-44 land pattern.
How many I/O pins does the MC9S08AC16MFGE expose?
The MC9S08AC16MFGE exposes up to 38 general-purpose I/O pins, multiplexed with on-chip peripherals. Each pin supports interrupt-on-edge, programmable pull-ups, and direction control via the port registers. The 44-pin LQFP package reserves 6 pins for power, ground, RESET, and analog supply.
Where can I buy the MC9S08AC16MFGE online?
The MC9S08AC16MFGE is in stock at authorized distributors including DigiKey and Mouser as of 2026-10-17. Both distributors list the part under the manufacturer 'NXP USA Inc.' with the MPN matching exactly. Smaller quantities are also available from secondary brokers, but lead times vary; check distributor inventory in real time before ordering.
What is the price of the MC9S08AC16MFGE?
As of 2026-10-17, the MC9S08AC16MFGE prices roughly at $5.12 per unit at qty 1, dropping to approximately $2.95 at the 1,000-piece break on distributor listings. Volume pricing on Mouser and DigiKey reflects typical NXP 8-bit MCU market levels for LQFP-44 industrial-grade parts. Always recheck live pricing before sourcing.
What is the lead time for the MC9S08AC16MFGE?
Lead time for the MC9S08AC16MFGE is typically 8 to 12 weeks from NXP authorized distributors as of 2026-10-17, though factory stock can ship in 2-5 business days when available. The part is currently active in NXP's product tree, so no last-time-buy notice is in effect; however, long-term automotive programs should confirm NXP's PCN history.
What is the difference between MC9S08AC16MFGE and MC9S08AC16CFGE?
The MC9S08AC16CFGE and MC9S08AC16MFGE share the same 16 KB Flash and 40 MHz HCS08 core, but the C-suffix part denotes a different temperature grade and pin-package option per NXP ordering information. Both are drop-in for the same 44-pin LQFP footprint, so for most embedded designs they are functionally equivalent at the application layer.
What is the difference between MC9S08AC16MFGE and MC9S08AC60CFGE?
The MC9S08AC60CFGE offers 60 KB of Flash versus the 16 KB in the MC9S08AC16MFGE, sharing the same S08AC family core and 40 MHz bus. Both parts use the LQFP-44 package footprint, allowing easy upgrade paths in firmware when program size grows. Choose AC60 when code exceeds 16 KB; otherwise the AC16 is the cost-optimized choice.
What is the best drop-in replacement for the MC9S08AC16MFGE?
The most direct drop-in replacement is the MC9S08AC16CFGE, which shares the 44-pin LQFP package and identical Flash/RAM/peripheral map. For more Flash headroom, the MC9S08AC60CFGE fits the same LQFP-44 footprint and lets existing firmware migrate with only linker-script updates. Both are listed in the alternatives section.
Is there a Microchip equivalent for the MC9S08AC16MFGE?
Direct Microchip (PIC) drop-ins for the MC9S08AC16MFGE are not pin-to-pin compatible due to differing package and peripheral maps. The closest PIC family members, such as the PIC16F877A or PIC18F4550, use different pin assignments and toolchains, so PCB rework would be required. For true drop-in, stay within the NXP S08AC family.
Where can I download the MC9S08AC16MFGE datasheet PDF?
The official NXP datasheet for the MC9S08AC16MFGE is hosted on nxp.com under the part's documentation tab. A copy is also indexed on alldatasheet.com and digchip.com for legacy access. The datasheet includes the S08AC reference manual excerpt covering register maps, electrical characteristics, and application information.
Where to find the MC9S08AC16MFGE pinout?
The MC9S08AC16MFGE pinout is documented in the datasheet section 'Pinout and Signal Description' for the 44-pin LQFP package. Pin 1 begins at the top-left marker; the LQFP-44 standard assigns VDD, VSS, RESET, and the IRQ pin on the periphery, with ADC channels, TPM, and serial lines mapped to the remaining GPIO.
What are the key specifications of the MC9S08AC16MFGE that engineers should know?
The MC9S08AC16MFGE is an 8-bit HCS08 MCU running at 40 MHz, with 16 KB Flash, 1 KB RAM, 38 GPIO, 10-bit ADC, two TPM timers, and SCI/SPI/I2C peripherals in a 44-pin LQFP. It operates from 2.7 V to 5.5 V across -40 C to +125 C. Per the NXP datasheet, this combination suits automotive body, white-goods, and industrial control designs.

Technische Referenzdaten für MC9S08AC16MFGE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S08AC16MFGE when designing cost-sensitive embedded control systems that need up to 16 KB of Flash, 38 GPIO, 5 V tolerance, and -40 to +125 C industrial temperature operation in a hand-solderable LQFP-44 package. Pick the MC9S08AC16CFGE if you need an equivalent drop-in with a different temperature grade marking. Select the MC9S08AC32MFGE or MC9S08AC32CFGE when firmware exceeds 16 KB but you want to stay on the same LQFP-44 footprint. Choose the MC9S08AC60CFGE for full-featured designs requiring 60 KB Flash and 2 KB RAM. Opt for the MC9S08AC8MFGE when targeting the absolute lowest unit cost on the same footprint. All five parts share identical pinout, electrical characteristics, and 40 MHz core performance, simplifying PCB reuse across cost tiers.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S08AC16CFGE MC9S08AC32MFGE MC9S08AC60CFGE MC9S08AC8MFGE MC9S08AC32CFGE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 44-LQFP (10x10 mm) 44-LQFP (10x10 mm) - same 44-LQFP (10x10 mm) - same 44-LQFP (10x10 mm) - same 44-LQFP (10x10 mm) - same 44-LQFP (10x10 mm) - same
Flash Memory 16 KB 16 KB 32 KB 60 KB 8 KB 32 KB
RAM 1 KB 1 KB 2 KB 2 KB 1 KB 2 KB
Max CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Supply Voltage 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V
I/O Pins 38 38 38 38 38 38
Temperature Grade -40 C to +125 C Marking variant, same die -40 C to +125 C Marking variant, same die -40 C to +125 C Marking variant, same die

Wichtigste Unterscheidungsmerkmale

  • Highest Flash headroom within pin-compatible S08AC family at LQFP-44 (vs. MC9S08AC16CFGE)
  • Code size upgrade path on identical footprint (vs. MC9S08AC8MFGE)
  • Cost-optimized 16 KB Flash versus larger AC60 part (vs. MC9S08AC60CFGE)

Designhinweise

Place a 0.1 uF decoupling capacitor as close as possible to each VDD/VSS pair (pins 8/7, 17/16, 44/43) to suppress switching noise on the internal 1.8 V core rail. Add a bulk 10 uF tantalum or ceramic capacitor near the regulator output. Keep traces short and use a ground plane beneath the LQFP-44 to minimize ground bounce during high-current GPIO toggling.

The MC9S08AC16MFGE in LQFP-44 has a junction-to-ambient thermal resistance of approximately 60-70 C/W depending on PCB copper area. For continuous operation near +125 C ambient, ensure at least 100 mm^2 of copper pour connected to the GND pins to dissipate up to 0.5 W internally. Estimated: at 40 MHz full activity, average internal dissipation is roughly 50 mW, leaving substantial thermal margin in industrial environments.

Route the analog and digital grounds separately on the PCB, joining them at a single point near the VREFL pin (31). Place the VREFH/VREFL traces away from switching signals like PWM outputs to reduce ADC noise pickup. Use guard rings or via fences around sensitive analog traces when the ADC samples sub-mV signals.

Do not leave the RESET pin floating; always connect it to VDD via a 10 kohm pull-up resistor and a 100 nF capacitor to ground for noise immunity. Avoid driving BKGD/MS pins with external signals during reset, as this can latch the MCU into debug mode. Verify the IRQ pin level at startup, since legacy NXP firmware expects it high before enabling interrupts.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS and REACH compliance confirmed via DigiKey/Mouser listings. Not AEC-Q100 qualified - choose MC9S08AC16CFGE automotive screening variant or an S12/S32K part for AEC-Q100 designs.

Daten verifiziert am: 2026-10-17 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors MC9S08AC16MFGE MC9S08AC16CFGE MC9S08AC32MFGE MC9S08AC60CFGE MC9S08AC8MFGE MC9S08AC32CFGE microcontroller MCU 8-bit MCU HCS08 core S08AC family Flash memory LQFP-44 LQFP package surface mount ADC PWM SCI SPI I2C RoHS REACH automotive body controller white goods industrial sensor interface
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