MC9S08AC60MFGE - 40MHz 8-Bit 60KB Flash MCU | NXP
Teilenummer: MC9S08AC60MFGE ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.7005 | $7,70 |
| 10 | $7.7005 | $77,01 |
| 100 | $7.7005 | $770,05 |
| 500 | $7.7005 | $3.850,25 |
| 1.000 | $7.7005 | $7.700,50 |
MC9S08AC60MFGE Übersicht
A microcontroller is a semiconductor that integrates a processor core, program memory, data memory, I/O, and peripherals into one embedded-control component. The HCS08 family belongs to the broader 8-bit microcontroller hierarchy, where the CPU executes firmware, samples inputs, controls outputs, and manages communications. This device is intended for applications that need deterministic embedded behavior, moderate processing throughput, and flexible serial connectivity without adopting a higher-cost application processor.
The MC9S08AC60MFGE provides 60 KB of flash program storage and 8 KB of RAM according to the verified product data. Its listed 40 MHz clock supports efficient execution of embedded control tasks, while the 2.7 V to 5.5 V supply range accommodates common 3.3 V and 5 V system rails. The 38 I/O ports provide connections for sensors, switches, indicators, actuators, and interface transceivers.
Its documented peripheral set includes up to a 16-channel, 10-bit ADC with automatic compare, two SCI modules supporting LIN 2.0 and SAE J2602-related functions, an SPI module, and an IIC module. These interfaces allow the MCU to connect analog sensors, serial transceivers, displays, memory devices, and other embedded peripherals without requiring a separate protocol controller for each function.
Typical applications include industrial sensor nodes, building controls, automotive accessory controllers, communications modules, motor or relay control boards, and low-cost consumer products. The 44-LQFP package is useful when a board requires a conventional leaded surface-mount footprint rather than a very small fine-pitch package. Designers should verify the exact pin multiplexing, electrical limits, and peripheral availability in the manufacturer datasheet before finalizing a PCB.
For new designs, preserve the recommended decoupling and provide a stable clock and programming interface. Confirm that the selected external components, voltage levels, and firmware dependencies match the MC9S08AC60MFGE datasheet. This page consolidates verified product information, sourcing details, and design-oriented context for engineers evaluating the device.
This data page also distinguishes verified specifications from unavailable parameters, avoiding unsupported assumptions. It is intended as a practical starting point for schematic capture, firmware planning, PCB layout, lifecycle review, and distributor sourcing of the NXP MC9S08AC60MFGE.
Drop-in-Alternativen für MC9S08AC60MFGE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08AC60MFGE (gleiche Bauform und Footprint) – abweichend in Package, RAM, CPU Frequency, Core, Debug Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08AC60CFUE
✅ Drop-In✓ Auf Lager
$4.05 / Stück
Datenblatt ansehen →MC9S08AC60CFGER
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08AC48MFGE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08AC32CFGE
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S08AW60MFGE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08AW60CFUE
✅ Drop-In✓ Auf Lager
$8.1029 / Stück
Datenblatt ansehen →MC9S08AC60MFGE Grenzwerte & elektrische Eigenschaften
| CPU Architecture | 8-bit HCS08 |
| Maximum Clock Speed | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Program Memory | 60 KB flash |
| RAM | 8 KB |
| Supply Voltage Range | 2.7 V to 5.5 V |
| I/O Port Count | 38 ports |
| ADC Resolution | 10-bit |
| ADC Channel Count | Up to 16 channels |
| Serial Communications Interface | 2 SCI modules |
| SPI Interface | 1 SPI module |
| IIC Interface | IIC module |
| Gehäuse | 44-LQFP, 10 x 10 mm |
| Montageart | Surface mount |
| Operating Lifecycle Status | NRND |
| RoHS-Status | RoHS compliant |
| Manufacturer | NXP Semiconductors |
| Series | S08AC |
| Product Type | 8-bit embedded microcontroller |
MC9S08AC60MFGE 44-lqfp, 10 x 10 mm Pinbelegungsleitfaden
Pinbelegung für MC9S08AC60MFGE (44-lqfp, 10 x 10 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08AC60MFGE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S08AC60MFGE ist geeignet für 6 Anwendungs: Industrial Sensor Nodes, Building and HVAC Control, Automotive Accessory Control, Serial Communication Hubs, Motor and Relay Control, Consumer and Battery-Powered Devices.
Industrial Sensor Nodes
The MC9S08AC60MFGE fits industrial sensor-node designs that combine local signal acquisition, control, and serial reporting. Its verified 10-bit ADC supports up to 16 channels, while 38 I/O ports can connect digital sensors, status indicators, and actuators. The 40 MHz HCS08 core provides timing headroom for sampling, filtering, threshold decisions, and communication tasks, and the 60 KB flash plus 8 KB RAM provides room for application firmware and working data. Use SCI, SPI, or IIC for suitable field-bus or peripheral connectivity, but verify exact multiplexing and electrical levels in the datasheet.
Empfohlen
Building and HVAC Control
MC9S08AC60MFGE is appropriate for building-control modules that coordinate sensors, relays, indicators, and serial controllers. The ADC can monitor temperature, light, or other analog conditions, while the I/O ports support switches, alarms, and discrete actuators. The 40 MHz clock allows responsive control logic, and SCI or IIC can connect to transceivers or building peripherals. Designers should define fail-safe states and debounce strategy for relay outputs, then confirm pin alternate functions and operating limits from the manufacturer datasheet before layout.
Empfohlen
Automotive Accessory Control
The MC9S08AC60MFGE can be evaluated for low-complexity automotive accessory-control boards where local logic, serial communication, and analog sensing are required. The 2.7–5.5 V supply range, 38 I/O ports, ADC, and SCI resources are useful for distributed body, comfort, or interface functions. However, the verified data does not confirm AEC-Q100 qualification or automotive temperature limits, so this use requires an explicit qualification and reliability review rather than assuming suitability from the 8-bit architecture alone.
Empfohlen
Serial Communication Hubs
MC9S08AC60MFGE can serve as a compact protocol-conversion or communications-hub controller when the design needs several serial interfaces and local buffering. Its two SCI modules, SPI module, and IIC module provide useful connectivity options, while 60 KB flash can hold protocol tables and application logic. Choose SCI for asynchronous serial links, SPI for faster peripheral-oriented transfers, and IIC for low- and medium-speed devices. The exact baud rates, timing modes, pin multiplexing, and electrical levels require verification in the datasheet.
Empfohlen
Motor and Relay Control
MC9S08AC60MFGE can be used in small motor, solenoid, or relay-control boards where deterministic digital sequencing and analog sensing are useful. The 38 I/O ports provide connection points for control inputs, gate or driver signals, feedback, and status LEDs, while the ADC can monitor current or position-related signals. Use the MCU for command sequencing rather than driving high-power loads directly. External drivers, protection components, current sensing, and appropriate fault handling remain necessary, and the package pin assignments must be verified before schematic capture.
Empfohlen
Consumer and Battery-Powered Devices
MC9S08AC60MFGE is useful for compact consumer devices that need local control, sensor input, and serial accessory connectivity. The 8 KB RAM is appropriate for modest embedded workloads, while 60 KB flash supports application code and fixed data. Its low pin-count surface-mount package can simplify assembly compared with very fine-pitch devices. Battery-powered designs still require careful review of sleep modes, active current, peripheral shutdown behavior, and regulator efficiency, none of which are specified in the supplied data. Confirm those parameters from the manufacturer datasheet before claiming low-power operation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08AC60MFGE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08AC60CFUE | MC9S08AC60CFGER | MC9S08AC48MFGE | MC9S08AC32CFGE | MC9S08AW60MFGE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 60 KB | 60 KB family naming | 60 KB family naming | 48 KB family naming | 32 KB family naming | 16 KB |
Wichtigste Unterscheidungsmerkmale
- Higher flash capacity than lower-density MC9S08AC family candidates (vs. MC9S08AC32CFGE)
- Larger memory footprint than the related MC9S08AW60 variants (vs. MC9S08AW60MFGE)
- Integrated serial connectivity for embedded control (vs. MC9S08AC48MFGE)
Designhinweise
Start the layout from the exact MC9S08AC60MFGE package drawing in the manufacturer datasheet rather than from distributor search snippets. The supplied results conflict between 44-LQFP, QFP 44, and QFN-48 descriptions. Confirm the ordering code, body size, lead pitch, pin-one marker, programming pins, and exposed-pad requirements before placing the symbol or routing escape traces.
The verified supply range is 2.7 V to 5.5 V. Place the regulator and MCU decoupling path for low impedance, keep analog and digital return currents separated where practical, and verify the datasheet's recommended capacitor values. Do not assume the listed I/O count is usable at the same voltage or that every peripheral can operate simultaneously without checking the electrical characteristics.
Because MC9S08AC60MFGE is NRND, avoid silently treating it as a current production choice. For a new design, compare an active replacement and verify package, pin mapping, memory, clock, ADC, SCI, SPI, IIC, voltage, temperature, and firmware compatibility. For an existing design, obtain a written lifecycle and supply statement from NXP or an authorized distributor before committing to production quantities.
For SPI, IIC, and SCI connections, keep traces short and route them away from switching nodes and high-current actuator paths. Confirm input thresholds, pull-up requirements, maximum bus rates, and alternate-function pin assignments in the datasheet. If a board combines communication and motor-control functions, use controlled return paths and consider isolation when the external interface leaves the protected enclosure.
The supplied data does not state the operating temperature range, power dissipation, or thermal resistance for this device. Treat those values as [DATA_NEEDED: operating temperature range], [DATA_NEEDED: power dissipation], and [DATA_NEEDED: thermal resistance] in the specification table. Do not approve a thermal design until the exact package and datasheet limits are confirmed.
Compliance-Informationen
RoHS compliance is identified in the verified distributor data. REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals information was not supplied and must not be inferred.
