MC9S08DV60MLH - 8-Bit 40MHz 60KB MCU | NXP | Automotive
Teilenummer: MC9S08DV60MLH ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MC9S08DV60MLH Übersicht
An S08 microcontroller is an embedded-processor component that combines a CPU core, nonvolatile program memory, RAM, communication peripherals, timers, and general-purpose I/O on one integrated circuit. It belongs to the MCU and embedded-controller hierarchy, where firmware executes directly from the device rather than from an external host processor. The MC9S08DV60MLH is oriented toward vehicle-network and body-electronics systems that need deterministic 8-bit control alongside serial connectivity.
The headline resources support firmware-intensive automotive controls: 60 KB of flash provides code and constant storage, while the distributor listing reports 4 KB of RAM. Its 53 general-purpose I/O pins can connect switches, sensors, indicators, actuators, and external logic, while one additional input-only pin supports dedicated sensing. At 40 MHz, the S08 core provides substantially more processing headroom than lower-frequency small MCUs, although real task performance still depends on bus architecture, peripheral timing, and firmware.
Integrated communication is particularly important for automotive and industrial control. CANbus support fits vehicle-network nodes, LINbus suits lower-cost distributed accessories, and SCI, SPI, and I²C provide paths to sensors, transceivers, memories, and service peripherals. The listed PWM peripherals support proportional actuator control, while low-voltage detection, power-on reset, and watchdog functions help system designers address supply disturbance and reliability requirements.
Typical uses include body-control modules, motor or valve controllers, lighting and heating subsystems, sensor aggregation nodes, communication gateways, and low-to-medium-complexity automotive accessories. The automotive temperature designation is reported by the verified Partstack result, but detailed temperature limits, voltage range, transceiver electrical limits, memory-map details, and peripheral instance counts were not present in the supplied data and must be confirmed from the NXP datasheet before design release.
A replacement should not be selected from memory size or clock speed alone. A valid drop-in candidate must match the 64-pin footprint, pin multiplexing, supply requirements, clocking, memory map, peripheral functions, watchdog behavior, and software compatibility. Because the supplied cross-reference search produced no verified pin-compatible substitutes, any new design should reuse the complete NXP device family only after direct pin and reference-manual review.
This page consolidates the verified distributor identity, package and memory details, connectivity, lifecycle indication, sourcing links, and engineering cautions into one practical reference. It separates confirmed MC9S08DV60MLH facts from parameters that still require datasheet verification, reducing the risk of treating a different S08 device as a production drop-in replacement.
Drop-in-Alternativen für MC9S08DV60MLH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08DV60MLH (gleiche Bauform und Footprint) – abweichend in Package, RAM, Flash Memory, Product Type, Program Memory.
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MC9S08DV60MLH
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Datenblatt ansehen →MC9S08DV60MLH Grenzwerte & elektrische Eigenschaften
| Product Type | 8-bit S08 automotive microcontroller |
| Core Processor | S08 |
| Core Size | 8-bit |
| Maximale Taktfrequenz | 40 MHz |
| Program Memory | 60 KB Flash (60K × 8) |
| RAM | 4 KB |
| General-Purpose I/O | 53 pins |
| Input-Only Pins | 1 pin |
| Connectivity | CANbus, I²C, LINbus, SCI, and SPI |
| Peripheral Functions | Low-voltage detection, power-on reset, PWM, and watchdog timer |
| Gehäuse | 64-LQFP, 10 mm × 10 mm |
| Terminal Count | 64 terminals |
| Terminal Form | Gull wing |
| Package Shape | Square |
| Temperature Grade | Automotive |
| Montageart | Surface mount |
| Part Status | Obsolete |
MC9S08DV60MLH square Pinbelegungsleitfaden
Pinbelegung für MC9S08DV60MLH (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08DV60MLH.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S08DV60MLH ist geeignet für 6 Anwendungs: Automotive Body-Control Module, CAN Network Sensor Gateway, LIN Peripheral Control Node, Motor and Valve Controller, Industrial Sensor Aggregator, Lighting and Heating Accessory Controller.
Automotive Body-Control Module
The MC9S08DV60MLH fits centralized body-control nodes because it combines a 40 MHz 8-bit S08 core, 60 KB of flash, 4 KB of RAM, and 53 GPIO pins in a 64-LQFP package. The verified connectivity includes CANbus and LINbus for vehicle-network communication, while SCI, SPI, and I²C can connect sensors or service peripherals. PWM can drive proportional actuators such as small motors or valves. Before release, engineers must confirm the exact CAN and LIN pin routes, transceiver levels, automotive temperature range, supply limits, protection strategy, and software timing from the NXP datasheet.
Empfohlen
CAN Network Sensor Gateway
The MC9S08DV60MLH can aggregate local sensor inputs and expose them through an automotive network node. Its 53 GPIO pins provide attachment points for switches, level-sensitive sensors, fault inputs, and indicator drives, while 40 KB-per-MHz-class S08 processing headroom supports protocol handling and control tasks. CANbus and SCI support vehicle networking and external modules; I²C or SPI may serve compatible sensors. The design must budget regulator efficiency, bus-transceiver standby behavior, ESD protection, ground strategy, and watchdog recovery around the MCU.
Empfohlen
LIN Peripheral Control Node
The MC9S08DV60MLH is appropriate for distributed LIN-controlled accessories because LINbus is included in its verified peripheral list. The MCU can execute control software from 60 KB of flash, retain working state in 4 KB of RAM, and use its 53 GPIO pins for switch inputs and actuator outputs. PWM may support motor, valve, or lamp-level functions, subject to the exact timer mapping. Use a qualified automotive LIN transceiver, verify timing and electrical limits in the family datasheet, and isolate communication pins from noisy loads.
Empfohlen
Motor and Valve Controller
The verified PWM peripherals and 53 GPIO pins make the MC9S08DV60MLH suitable for low-to-medium-complexity actuator control. A control loop can combine digital inputs, timer-based PWM outputs, fault detection, and serial diagnostics within an 8-bit embedded architecture. The 40 MHz clock provides execution headroom for supervisory logic, while 60 KB of flash stores control code and lookup data. Validate timer resolution, PWM frequency, pin multiplexing, thermal performance of external drivers, and watchdog timing; the MCU should not directly absorb motor or solenoid power.
Empfohlen
Industrial Sensor Aggregator
The MC9S08DV60MLH can serve as a compact industrial sensor aggregator when an existing board depends on its S08 software environment. SCI and I²C provide serial sensor access, SPI can support higher-speed peripheral devices, and 53 GPIO pins handle digital thresholds, alarm outputs, and status indicators. The 4 KB RAM is adequate for small control tasks but requires disciplined buffering, while the 60 KB flash supports firmware and constants. Confirm operating-temperature, supply, ESD, isolation, and industrial EMC requirements before using this automotive-grade legacy MCU outside a vehicle.
Empfohlen
Lighting and Heating Accessory Controller
The MC9S08DV60MLH can coordinate lamps, heaters, switches, and diagnostic inputs in a vehicle accessory module. Its 53 GPIO pins provide broad control connectivity, while PWM supports dimming or proportional drive where the selected timer channel is available. LINbus or CANbus can connect the controller to vehicle networks, and SCI supports service or diagnostic communication. The system should use appropriate high-side drivers, current limiting, open-load detection, and transient protection rather than driving loads directly from GPIO pins.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08DV60MLH – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08DV60MLH |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10 mm × 10 mm) | 64-LQFP (10 mm × 10 mm) |
| Core | 8-bit S08 | 8-bit S08 |
| Maximum Clock Frequency | 40 MHz | 40 MHz |
| Flash Memory | 60 KB | 60 KB |
| RAM | 4 KB | 4 KB |
| General-Purpose I/O | 53 pins | 53 pins |
| Connectivity | CANbus, I²C, LINbus, SCI, SPI | CANbus, I²C, LINbus, SCI, SPI |
| Temperature Grade | Automotive | Automotive |
| Lifecycle Status | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Verified exact-ordering-code sourcing (vs. MC9S08JM60CLD)
- Broad integrated serial connectivity (vs. MC9S08FL8CLC)
- Established control resource set (vs. S9S08DZ60F2MLHR)
- Automotive-oriented lifecycle identity (vs. Newer supported S08 candidates)
Designhinweise
Do not treat another MC9S08 device with 60 KB flash as a replacement merely because its memory size matches. Start from the 64-LQFP pinout, alternate-function matrix, memory map, clock initialization, reset behavior, and communication peripheral assignments in the NXP MC9S08DV60 family datasheet. Compile existing firmware for the candidate, compare every connected pad, and validate power, clocks, debug, and peripheral multiplexing on hardware before declaring a drop-in replacement.
Design the supply network around the exact voltage range and absolute maximum ratings in the NXP datasheet; those values were not present in the supplied records and must not be guessed. Place the MCU's required decoupling capacitors at the associated supply pins, keep return-current paths short, and isolate CAN, LIN, and other transceiver transients from sensitive digital ground paths. Verify brownout, power-on reset, and watchdog behavior during slow supply ramps because automotive power systems can present challenging transitions.
The MC9S08DV60MLH uses a 64-LQFP 10 mm × 10 mm footprint with fine-pitch gull-wing leads. Preserve manufacturer-recommended pad geometry, solder-mask and paste patterns, via-in-pad restrictions, and assembly clearances from the package drawing. Provide unobstructed routing for programming and debug signals, keep sensitive clock or communication traces away from switching nodes, and use a solid ground plane with short return paths beneath communications and power circuitry.
Although the reported temperature grade is automotive, the supplied data does not state the numerical operating range or package thermal resistance. Do not infer either value from the MLH suffix or the 40 MHz clock. Calculate junction temperature from verified electrical limits and actual board copper using manufacturer thermal guidance, then inspect external transceivers and power regulators because they may dissipate more heat than the microcontroller in a CAN or LIN node.
Because the part is marked obsolete, distinguish a maintenance purchase from a new production commitment. Obtain manufacturer labeling, lot or date code, packaging condition, traceability, and authorized-channel documentation. Control approved alternate channels and golden samples, and monitor remaining inventory. For software-bearing legacy silicon, preserve the exact ordering code, mask revision assumptions, bootloader version, calibration data, and qualification history rather than substituting based only on speed and flash capacity.
Compliance-Informationen
The verified Partstack result identifies an automotive temperature grade, but the supplied data does not state RoHS, REACH, AEC-Q100 qualification, lead-free, halogen-free, or conflict-minerals status. Automotive temperature grade must not be treated as proof of AEC-Q100 qualification.
