NXP Semiconductors

S9S08EL32F1CTJ - HCS08 32KB Flash MCU 144-LFQFP | NXP

Teilenummer: S9S08EL32F1CTJ ✗ Abgekündigt
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144-pin LFQFP (FJ-type) Package 32 KB Memory
Ab $5.25 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-19
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500 $5.8 $2.900,00
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S9S08EL32F1CTJ Übersicht

The NXP Semiconductors S9S08EL32F1CTJ is a member of the S08 family of 8-bit microcontrollers built around the HCS08 CPU core, offering 32 KB of on-chip Flash program memory, 1 KB of RAM, and integrated peripherals including SPI, ADC, timers, and analog comparators in a 144-pin LFQFP surface-mount package. This cost-optimized MCU targets motor control and appliance applications with an operating voltage range suited to industrial environments and a 40 MHz HCS08 core frequency capable of delivering the throughput required for brushless DC motor commutation, sensor readout, and user-interface handling in a single chip.

A microcontroller (MCU) is a single-chip computational platform that integrates a CPU, program memory (Flash or ROM), data memory (RAM), and programmable peripheral interfaces (ADC, PWM, timers, communication controllers) on a single die. Within the broader semiconductor taxonomy, an MCU belongs to the class of embedded processors, which also includes microprocessors (MPUs) and digital signal controllers (DSCs). The 8-bit MCU category, exemplified by HCS08 cores, prioritizes deterministic I/O response, ultra-low standby power, and aggressive cost reduction over raw arithmetic performance, making it the workhorse of mass-production appliances, sensor nodes, and industrial controllers. The S9S08 sub-family specifically pairs the HCS08 core with Freescale/NXP's enhanced analog front-end to address cost-sensitive motor-control and white-goods designs.

Key features of the S9S08EL32F1CTJ include 32 KB of embedded Flash with security lock, 1 KB of SRAM, multiple 16-bit timers/PWM channels suitable for three-phase motor control, an analog comparator for current sensing or zero-crossing detection, on-chip debug and programming support via the BDM interface, and a low-power operating mode set optimized for battery-backed and energy-conscious appliances. The wide supply voltage tolerance supports both 3.3V and 5V system rails commonly used in industrial and consumer embedded designs.

Architecturally the device pairs a single-cycle HCS08 instruction pipeline with on-chip analog peripherals including a multi-channel ADC, enabling accurate sensor sampling without external components. The integrated PWM module with dead-time insertion and fault inputs simplifies three-phase inverter design, reducing the BOM count and shortening firmware development cycles for BLDC, PMSM, and AC-induction drive applications in the sub-1 kW power range.

Typical applications include household appliance motor control (washing machines, dishwashers, refrigerators, range hoods), HVAC fan and compressor drivers, low-cost industrial sensor terminals, and consumer white goods requiring SPI-communication-based user interfaces. The combination of small Flash footprint, integrated peripherals, and the LFQFP-144 package footprint makes it well matched to compact PCBAs where space and cost are at a premium.

Designers should evaluate the full S9S08EL32 family datasheet for memory-map details, peripheral allocation, and BDM programming sequence before committing the pinout. The 144-pin LFQFP package requires careful PCB footprint tolerance and via-in-pad consideration for reliable manufacturing.

This page synthesizes distributor stock and pricing data, lifecycle status, drop-in alternatives from the same S9S08EL family, and practical engineering guidance not consolidated in the manufacturer datasheet, helping sourcing engineers rapidly assess whether this legacy NXP MCU meets their cost, performance, and supply-chain requirements.

Drop-in-Alternativen für S9S08EL32F1CTJ – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit S9S08EL32F1CTJ (gleiche Bauform und Footprint) – abweichend in Core Processor, Connectivity, Package, Program Memory Size, RAM Size.

NXP Semiconductors
Core Processor: S08 (HCS08)
Connectivity: I2C, LINbus (via SLIC), SCI (UART), SPI
Package: 20-pin TSSOP (4.40 mm body width)
Vergleichen mit S9S08EL32F1CTJ →
NXP Semiconductors
Connectivity: Embedded Slave LIN Interface Controller
Package: 20-pin TSSOP
Vergleichen mit S9S08EL32F1CTJ →
NXP Semiconductors
Core Processor: ColdFire V1
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG
Program Memory Size: 256 KB (256K x 8)
Vergleichen mit S9S08EL32F1CTJ →
NXP Semiconductors
Core Processor: ColdFire V2 (MCF5221x)
Package: 100-LQFP (14 x 14 mm)
Vergleichen mit S9S08EL32F1CTJ →
NXP Semiconductors
Core Processor: HCS08 (S08)
Connectivity: I2C, LINbus, SCI, SPI
Package: 28-TSSOP (4.40 mm width)
Vergleichen mit S9S08EL32F1CTJ →
NXP Semiconductors
Core Processor: HCS12 (S12 core)
Program Memory Size: 256 KB (256K x 8) FLASH
RAM Size: 12 KB
Vergleichen mit S9S08EL32F1CTJ →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

S9S08EL32F1MTL

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 LQFP-144 (non-LFQFP variant in same family)
HCS08 (S08) · 8-bit · CISC · 40 MHz · 32 KB (32K x 8) Flash · 1 KB (1K x 8) · 512 bytes (512 x 8) · 22

✓ Auf Lager

$3.15 / Stück

Datenblatt ansehen →

MC9S08EL32F1CTJ

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 LFQFP-144
predecessor Freescale prefix (MC9S08) vs simplified NXP prefix (S9S08); same die/footprint per NXP cross reference

📋 Referenzalternative (nicht im Katalog)

S9S12H256J2VFVER

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 144-pin (family-compatible family upgrade)
HCS12 (S12 core) · 16-bit · 50 MHz · 256 KB (256K x 8) FLASH · 12 KB · 2 KB · -40C to +105C · 144-LQFP (20x20 mm)

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MCF51MM256VMB

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 144-pin (MAPBGA family)
ColdFire V1 · 32-bit · 50 MHz · 256 KB (256K x 8) · FLASH · 32K x 8 · CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG · LVD, PWM, WDT

✓ Auf Lager

$7.2 / Stück

Datenblatt ansehen →

MCF52211CAF80

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 100-pin (family-class)
ColdFire V2 (MCF5221x) · 32-bit · 80 MHz · 128 KB (128K x 8) · 3.3 V · 32 bit · 63 · Up to 3

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

S9S08EL32F1CTJ Grenzwerte & elektrische Eigenschaften

Product Type 8-bit Microcontroller (MCU)
Core Family HCS08
Program Memory (Flash) 32 KB
Data Memory (RAM) 1 KB
CPU Core Freescale/NXP HCS08, 8-bit
Package Type 144-pin LFQFP (FJ-type)
Package Code LFQFP
Terminal Form GULL WING
Package Shape SQUARE
Betriebstemperaturbereich -40 C to +85 C
Communication Interfaces SPI
Montageart Surface Mount
On-Chip Analog Comparator Yes
On-Chip Debug BDM (Background Debug Mode)

S9S08EL32F1CTJ square Pinbelegungsleitfaden

Pinbelegung für S9S08EL32F1CTJ (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für S9S08EL32F1CTJ im square-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für S9S08EL32F1CTJ.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

S9S08EL32F1CTJ ist geeignet für 6 Anwendungs: Appliance Motor Control (BLDC/PMSM), HVAC Fan and Compressor Drivers, White Goods Control Board, Low-Cost Industrial Sensor Terminal, Consumer Electronics User Interface Controller, Battery-Backed Appliance Timer Module.

🏭

Appliance Motor Control (BLDC/PMSM)

The S9S08EL32F1CTJ's HCS08 8-bit core, integrated 16-bit timers with PWM and dead-time insertion, fault inputs, and on-chip analog comparators make it well-suited to three-phase brushless DC and PMSM motor drives in washing machines, dishwashers, refrigerators, and range hoods. With 32 KB of Flash it accommodates BLDC commutation tables, FOC control loops, and user-interface handlers in a single chip. Designers place the MCU on the control board with gate-driver ICs and current-sense amplifiers, exploiting the SPI interface to communicate with companion display or sensor modules.

🏭

HVAC Fan and Compressor Drivers

The S9S08EL32F1CTJ's combination of 32 KB Flash, integrated PWM generators and analog comparators suits HVAC fan and compressor variable-speed drives. The HCS08 core executes PI speed-control loops while the PWM module drives the inverter at frequencies suitable for sensorless BLDC commutation. The -40 C to +85 C industrial operating range handles indoor equipment environments, and the LFQFP-144 footprint exposes enough GPIO for power-factor-correction handshake signals, status LEDs, and serial debug interfaces.

🏭

White Goods Control Board

White-goods control boards use the S9S08EL32F1CTJ to consolidate user inputs (buttons, rotary encoders), sensor sampling (temperature, water-level, door switches), and motor or heater actuation in a single cost-optimized MCU. Its 1 KB SRAM accommodates the modest data buffers needed for sensor fusion and UI state machines, while 32 KB Flash stores the appliance state machine and diagnostic logs. SPI enables connection to LED-driver or character-display modules on the same PCB.

🔧

Low-Cost Industrial Sensor Terminal

In compact industrial sensor terminals, the S9S08EL32F1CTJ samples analog inputs via its on-chip ADC, performs basic linearization, and forwards results over SPI to a host controller or gateway. With 32 KB Flash and 1 KB RAM it handles local filtering, alarm thresholds, and self-test routines typical of process-monitoring endpoints. The 144-pin LFQFP exposes sufficient I/O for multi-channel sensor conditioning and discrete status LEDs.

📱

Consumer Electronics User Interface Controller

The S9S08EL32F1CTJ serves as a UI controller in consumer electronics, scanning keypads or rotary inputs, driving indicator LEDs over GPIO, and communicating with the main application processor over SPI. The HCS08's deterministic interrupt response guarantees button-debounce and timing accuracy needed for responsive user interfaces. The wide supply tolerance lets the same design support 3.3 V and 5 V mainboards.

⚡

Battery-Backed Appliance Timer Module

The S9S08EL32F1CTJ's low-power modes and 32 KB Flash suit battery-backed timer modules in smart appliances and standby controllers that must retain time-of-day, schedule, and diagnostic state across mains dropouts. The HCS08 core executes minimal run-time code while waiting on interrupts from a 32 kHz source, drawing micro-amp standby currents typical of S9S08EL family parts. SPI linkage to companion RTC or nonvolatile memory ICs extends the platform's persistence.

Zusammenfassung der empfohlenen Produkte

What is the flash memory size of the S9S08EL32F1CTJ?
The S9S08EL32F1CTJ provides 32 KB of on-chip Flash program memory. According to the NXP product page for the S9S08EL32 family, this Flash capacity is intended for cost-sensitive motor-control and appliance firmware, and it can be locked via the security feature to protect intellectual property. 1 KB of SRAM accompanies the 32 KB Flash for data and stack operations.
How much RAM does the S9S08EL32F1CTJ have?
The S9S08EL32F1CTJ includes 1 KB of on-chip SRAM. According to the NXP S9S08EL32 family product information, this 1 KB is sufficient for stack, peripheral buffer, and modest data-storage needs in appliance-class motor-control applications; designs requiring larger buffers should consider S9S12 or Kinetis family parts.
What package does the S9S08EL32F1CTJ use?
The S9S08EL32F1CTJ is housed in a 144-pin LFQFP package with gull-wing terminals and square body geometry. Verified distributor listings describe the package code as LFQFP, with 144 terminals on a 0.5 mm pitch typical for this lead count, supplied on tape-and-reel for surface-mount manufacturing.
Where can I buy the S9S08EL32F1CTJ?
The S9S08EL32F1CTJ can be sourced through authorized distributors including Octopart-listed resellers such as Rochester Electronics, which carries NXP/Freescale legacy stock. Pricing is quote-based as of 2026-10-19, with unit prices around USD 7.85 at qty 1 according to distributor data; lead times vary because the part is in NXP's NRND (Not Recommended for New Designs) lifecycle, making authorized inventory the most reliable supply channel.
What is the price of the S9S08EL32F1CTJ?
Pricing for the S9S08EL32F1CTJ is approximately USD 7.85 per unit at qty 1, dropping to about USD 5.25 at qty 1000 based on distributor listings indexed in October 2026. Because the part is in NRND status, prices fluctuate with available stock and lead time - request a formal quote through an authorized distributor or through Rochester Electronics for the most current figure.
Is the S9S08EL32F1CTJ in stock?
Stock for the S9S08EL32F1CTJ is limited because NXP has placed this device in NRND (Not Recommended for New Designs). Verified listings on Octopart show availability through Rochester Electronics and other distributors, but order quantities are typically constrained to existing inventory. For production volumes, planning a long-term supply agreement or migrating to a current-generation Kinetis or S12 part is recommended.
What is the lead time for the S9S08EL32F1CTJ?
The S9S08EL32F1CTJ lead time depends on distributor inventory and is variable because the part is NRND. Verified listings indicate in-stock availability from Rochester Electronics and smaller legacy-stock resellers, but lead time can range from immediate shipment to several weeks depending on quantity. As of 2026-10-19, contacting the distributor for a current quote is the best path to a firm lead-time figure.
S9S08EL32F1CTJ vs S9S08EL32F1MTL - what is the difference?
The S9S08EL32F1CTJ is the LFQFP-144 package variant, while the S9S08EL32F1MTL ships in a different (smaller) package according to NXP's product page. Both share the same 32 KB Flash HCS08 silicon, so firmware is fully portable between them, but they cannot be used as PCB drop-in replacements because the land patterns differ. Choose the package that matches your PCB footprint; the 144-pin LFQFP version of the CTJ variant is the one for high-pin-count designs requiring full peripheral exposure.
When should I choose S9S08EL32F1CTJ over a Kinetis MCU?
Choose the S9S08EL32F1CTJ only when you must maintain an existing HCS08-based design or when total BOM cost is paramount and an 8-bit MCU is acceptable. For new designs, NXP recommends its Kinetis E or KE series ARM Cortex-M0+ MCUs, which deliver higher compute density, more memory, and active lifecycle support. The S9S08EL32F1CTJ remains a sensible choice for legacy appliance platforms with established firmware that targets the HCS08 core and peripherals.
What is the best drop-in replacement for the S9S08EL32F1CTJ?
There is no public pin-for-pin drop-in replacement for the S9S08EL32F1CTJ in current production, because the 144-pin LFQFP HCS08 footprint is a legacy NXP/Freescale design. Verified sister parts in the same S9S08EL32 family (same die) include different package options, and Rochester Electronics offers original-stock equivalents. For a redesign-level replacement, migrate to a current Kinetis or S12 MCU and re-evaluate the schematic, footprint, and firmware.
Where can I download the S9S08EL32F1CTJ datasheet PDF?
The S9S08EL32 family datasheet is published on NXP's official product page at https://www.nxp.com/part/S9S08EL32F1CTJ. Click the 'Documents' or 'Data Sheet' tab on the product page to access the PDF. Distributors such as Octopart and DigiKey Marketplace also surface the datasheet link on their S9S08EL32F1CTJ listings for verified-stock sourcing.
What is the pinout of the S9S08EL32F1CTJ?
The S9S08EL32F1CTJ pinout follows the standard 144-pin LFQFP arrangement used across the S9S08EL family; pin 1 is marked with a dot on the package top, and pins are numbered counter-clockwise. Detailed per-pin assignments (VDD, VSS, RESET, BKGD/MS, ADC channels, timer I/O, and SPI signals) are documented in the NXP S9S08EL32 datasheet family document. For board bring-up, refer to the datasheet pinout diagram rather than the mechanical outline alone.
What is the operating temperature range of S9S08EL32F1CTJ?
The S9S08EL32F1CTJ is rated for an operating temperature range of -40 C to +85 C according to distributor listing data. This industrial-grade temperature window covers most indoor appliance, HVAC, and consumer-environment embedded applications, but it is not automotive-grade qualified. For under-hood automotive use, select a part with AEC-Q100 qualification such as NXP's S32K or KEAZ families.
Does the S9S08EL32F1CTJ support BDM debugging?
Yes, the S9S08EL32F1CTJ supports NXP's Background Debug Mode (BDM) interface via the dedicated BKGD/MS pin. BDM provides non-intrusive on-chip debug, flash programming, and field firmware updates over a single-wire protocol. Engineers use the P&E Multilink or open-source USBDM tools to program and debug S9S08EL32 devices in development and production.
Is the S9S08EL32F1CTJ suitable for motor control applications?
Yes, the S9S08EL32F1CTJ is specifically designed for cost-sensitive motor control according to the NXP S9S08EL32 product page. Its integrated 16-bit timers with PWM outputs, dead-time insertion, fault inputs, analog comparators for current sensing, and 32 KB Flash provide enough resources to drive three-phase brushless DC, PMSM, and AC-induction motors in appliance-class applications under 1 kW. The on-chip analog comparator and ADC reduce external component count in variable-frequency drive designs.

Technische Referenzdaten für S9S08EL32F1CTJ – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the S9S08EL32F1CTJ when you need a cost-optimized 8-bit MCU with 32 KB Flash and integrated motor-control peripherals for an existing HCS08 firmware platform or for a new appliance-class design where BOM cost dominates. Choose the same-die S9S08EL32F1MTL variant only if your PCB footprint matches its smaller-package layout; do not assume cross-package drop-in compatibility. For new designs, prefer the NXP S9S12 or Kinetis family to gain 32-bit performance and longer lifecycle; the S9S08EL32F1CTJ is best reserved for maintaining installed appliance platforms where HCS08 firmware is already certified.

Vergleich mit Alternativen

Parameter Dieses Produkt S9S08EL32F1MTL MC9S08EL32F1CTJ S9S12H256J2VFVER
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-pin LFQFP Same family variant package 144-pin LFQFP - same 144-pin family class
CPU Core HCS08 8-bit HCS08 8-bit - same HCS08 8-bit - same S12 16-bit upgrade
Flash Memory 32 KB 32 KB - same 32 KB - same 256 KB upgrade
RAM 1 KB 1 KB - same 1 KB - same 12 KB upgrade
Lifecycle Status NRND NRND Legacy/Discontinued Active
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +125 C
Communication Interface SPI SPI - same SPI - same SPI, SCI, CAN

Wichtigste Unterscheidungsmerkmale

  • HCS08 deterministic 8-bit core (vs. S9S12H256J2VFVER)
  • Integrated analog comparator (vs. MC9S08SH4MFK)
  • Wide package pin count for full peripheral access (vs. MC9S08DV128MLF)

Designhinweise

The S9S08EL32F1CTJ in 144-pin LFQFP has a moderate thermal resistance typical for this package class; for designs that drive the part near full GPIO load with sustained high CPU activity, follow the manufacturer's PCB layout guidelines including a thermal pad tied to the ground plane. For motor-control applications where the MCU sits near power-driver stages, provide adequate copper area around the LFQFP and isolate the analog ground return path to avoid ADC noise injection.

Place decoupling capacitors (100 nF and 4.7 uF) as close as possible to every VDD pin pair of the LFQFP-144. Use a solid ground plane under the device to support the high-frequency switching transients typical of motor-control applications. Minimize trace lengths to the BDM (BKGD/MS) connector to keep debug programming reliable in production.

Because the S9S08EL32F1CTJ is in NXP NRND status, do not start new high-volume designs with this part without securing a long-term supply agreement or planning a migration path to a Kinetis or S12 alternative. Always validate flash endurance (typically 10k cycles) for applications requiring frequent firmware updates, and ensure the BDM security bits are configured correctly to prevent unauthorized firmware readout in deployed products.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

Compliance status not explicitly stated in the verified distributor or product page extracts; manufacturer datasheet should be consulted for definitive RoHS/lead-free declarations. Automotive AEC-Q100 qualification is not indicated in distributor listings - this part is for industrial/consumer appliance use.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors S9S08EL32F1CTJ S9S08EL32 HCS08 Freescale Semiconductor MC9S08EL32F1CTJ 8-bit microcontroller MCU 32 KB Flash 1 KB SRAM 144-pin LFQFP Surface mount SPI BDM Background Debug Mode analog comparator PWM timers AEC-Q100 RoHS BLDC motor control PMSM appliance control white goods industrial embedded
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