MC9S08GT32CFD - 8-Bit 40MHz S08 MCU, 32KB Flash | NXP
Teilenummer: MC9S08GT32CFD ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.1164 | $7,12 |
| 10 | $6.4 | $64,00 |
| 100 | $5.4 | $540,00 |
| 500 | $4.9 | $2.450,00 |
| 1.000 | $4.55 | $4.550,00 |
MC9S08GT32CFD Übersicht
In the system hierarchy, this part is an 8-bit microcontroller (MCU) belonging to the larger category of embedded microcontrollers, which in turn falls under the broader family of microprocessors and microcontrollers, then integrated circuits, and ultimately semiconductors. The "S08" prefix denotes the HCS08 CPU core, a successor to the long-standing HC08 core, offering improved instruction efficiency, better debug support (Background Debug Mode via the BKGD pin), and lower power consumption while preserving the HC08 instruction set for code compatibility.
Key features include 32 KB of Flash memory, 2 KB of RAM, integrated peripherals such as PWM, an analog-to-digital converter (ADC), a Low-Voltage Detect (LVD), Power-On Reset (POR), and a Watchdog Timer (WDT). Communication interfaces include one SPI, one I2C, and one SCI (UART) module. The device supports up to 32 interrupt/reset sources and provides software-selectable pullups on port pins when configured as inputs, plus an internal pullup on the RESET and IRQ pins to reduce external component count.
The HCS08 core architecture uses a 16-bit instruction set inherited from the HC08 with uprated internal datapath widths, enabling single-cycle execution of most instructions and deterministic interrupt response. The integrated Flash supports in-application reprogramming via the standard NXP BDM (Background Debug Mode) interface and through software routines.
Typical applications include automotive body electronics, industrial control, home appliances, sensor interfaces, motor control (using the PWM and ADC), and general-purpose embedded control where a low-cost, low-power 8-bit MCU is appropriate. The wide operating voltage range of 2.5 V to 3.3 V supports 3 V system designs.
When designing with this device, ensure that firmware is written using HC08/S08 instructions and the CodeWarrior Development Studio toolchain. The exposed thermal pad on the QFN-EP package must be soldered to the PCB ground plane for proper thermal dissipation and electrical performance; floating the pad can cause erratic behavior.
Drop-in-Alternativen für MC9S08GT32CFD – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
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MC9S08GT32ACFD
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MC9S08GT32ACFDE
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Datenblatt ansehen →MC9S08GT32CFBE
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MC9S08GT32CFD Grenzwerte & elektrische Eigenschaften
| Core Processor | S08 (HCS08) |
| Core Size | 8-Bit |
| Maximum CPU Clock | 40 MHz |
| Program Memory Size | 32 KB (32K x 8) Flash |
| RAM Size | 2 KB |
| Number of I/O Pins | 39 |
| Peripherals | LVD, POR, PWM, WDT |
| Connectivity | I2C, SCI, SPI |
| Operating Voltage | 2.5 V to 3.3 V (3V typical) |
| Gehäuse | 48-QFN-EP (7 mm x 7 mm) |
| Anzahl der Pins | 48 |
| Montageart | Surface Mount |
| Instruction Set | HC08 (with BGND instruction) |
| Number of Interrupt Sources | Up to 32 interrupt/reset sources |
| Pull-ups | Software-selectable on port inputs; internal pull-up on RESET and IRQ |
MC9S08GT32CFD Pin-Konfiguration
| Pin 1 | PTH — [DATA_NEEDED: specific pin function from datasheet] |
| Pin 2 | VREFH — ADC reference high |
| Pin 3 | VREFL — ADC reference low / GND |
| Pin 4 | PTC0 — Port C I/O |
| Pin 5 | PTC1 — Port C I/O |
| Pin 6 | PTC2 — Port C I/O |
| Pin 7 | PTC3 — Port C I/O |
| Pin 8 | PTC4 — Port C I/O |
| Pin 9 | PTC5 — Port C I/O |
| Pin 10 | PTC6 — Port C I/O |
| Pin 11 | PTC7 — Port C I/O |
| Pin 12 | PTD0 — Port D I/O / KBI |
| Pin 13 | PTD1 — Port D I/O / KBI |
| Pin 14 | PTD2 — Port D I/O / KBI |
| Pin 15 | PTD3 — Port D I/O / KBI |
| Pin 16 | PTD4 — Port D I/O |
| Pin 17 | PTD5 — Port D I/O |
| Pin 18 | PTD6 — Port D I/O |
| Pin 19 | PTD7 — Port D I/O |
| Pin 20 | VDD — Supply voltage (2.5V-3.3V) |
| Pin 21 | VSS — Ground |
| Pin 22 | BKGD/MS — Background Debug Mode / Mode Select |
| Pin 23 | RESET — Reset input (internal pull-up) |
| Pin 24 | IRQ — External interrupt (internal pull-up) |
| Pin 25 | PTA0 — Port A I/O |
| Pin 26 | PTA1 — Port A I/O |
| Pin 27 | PTA2 — Port A I/O |
| Pin 28 | PTA3 — Port A I/O |
| Pin 29 | PTA4 — Port A I/O |
| Pin 30 | PTA5 — Port A I/O |
| Pin 31 | PTA6 — Port A I/O |
| Pin 32 | PTA7 — Port A I/O |
| Pin 33 | PTB0 — Port B I/O |
| Pin 34 | PTB1 — Port B I/O |
| Pin 35 | PTB2 — Port B I/O |
| Pin 36 | PTB3 — Port B I/O |
| Pin 37 | PTB4 — Port B I/O |
| Pin 38 | PTB5 — Port B I/O |
| Pin 39 | PTB6 — Port B I/O |
| Pin 40 | PTB7 — Port B I/O |
| Pin 41 | PTE0 — Port E I/O / IRQ |
| Pin 42 | PTE1 — Port E I/O / IRQ |
| Pin 43 | PTE2 — Port E I/O |
| Pin 44 | PTE3 — Port E I/O |
| Pin 45 | PTE4 — Port E I/O |
| Pin 46 | PTE5 — Port E I/O |
| Pin 47 | PTE6 — Port E I/O |
| Pin 48 | PTE7 — Port E I/O |
| Pin 49 | EPAD — Exposed thermal pad - tie to GND |
Typische Anwendungen
MC9S08GT32CFD ist geeignet für 6 Anwendungs: Industrial Sensor Interface Board, Automotive Body Electronics (BCM), Home Appliance Control (Washing Machine / Dishwasher), Low-Cost BLDC / PWM Motor Drive, Battery-Powered IoT Sensor Node, Consumer Remote Control / HID Device.
Industrial Sensor Interface Board
The MC9S08GT32CFD's 40 MHz S08 core, 39 GPIOs and 2 KB SRAM make it well-suited to industrial 4-20 mA sensor conditioning boards. The 32 KB Flash comfortably stores Modbus RTU slave firmware, calibration constants, and lookup tables; the SCI peripheral drives RS-485 transceivers while I2C reads the local EEPROM for node configuration. The integrated 10-bit ADC samples bridge or shunt signals while the LVD/POR block ensures defined startup under noisy 24 V industrial rails stepped down to 3.3 V.
Empfohlen
Automotive Body Electronics (BCM)
Within an automotive body control module the MC9S08GT32CFD handles door locks, lighting PWM and switch-matrix decoding. Its PWM peripheral drives LED tail lamps and mirror-fold motors; the SPI port connects to a CAN-transceiver companion or local SBC; internal pull-ups on RESET and IRQ reduce BOM cost. Designers should note this part is obsolete for new automotive programs; existing service stock remains usable for aftermarket BCM repair.
Empfohlen
Home Appliance Control (Washing Machine / Dishwasher)
Washing-machine and dishwasher controllers benefit from the MC9S08GT32CFD's PWM channels, ADC inputs and WDT-protected 3 V operation. The 40 MHz core executes motor-control state machines, water-level sensing and user-interface scanning; the integrated POR/LVD monitors brown-outs during relay switching. The 48-QFN-EP package keeps the board footprint small enough for the cramped appliance chassis.
Empfohlen
Low-Cost BLDC / PWM Motor Drive
For hobby-grade BLDC drivers and small pumps, the MC9S08GT32CFD provides enough PWM channels and ADC channels for sensorless commutation at modest speeds. The S08 core runs the commutation interrupt service in well under 1 us at 40 MHz, leaving headroom for serial commands, current limiting and fault handling. Designers should add external gate drivers since the MCU pins cannot directly drive MOSFET gates above a few mA.
Empfohlen
Battery-Powered IoT Sensor Node
Although newer Cortex-M0+ parts dominate this segment, the MC9S08GT32CFD still serves in legacy battery-powered sensor hubs where firmware is frozen. The S08's STOP/WAIT low-power modes combined with the WDT wake-up allow months of operation from a small Li-ion cell. The I2C port reads environmental sensors, the SPI port drives an RF front-end, and the SCI port handles configuration via UART.
Empfohlen
Consumer Remote Control / HID Device
Remote controls, presentation clickers and USB HID dongles use the MC9S08GT32CFD for its small package, low cost and adequate Flash for HID descriptors. The S08 core handles USB low-speed interrupt service via bit-banging or an external USB transceiver, scans the keypad matrix via the GPIOs, and drives IR LEDs through the PWM. Its 2 KB SRAM is sufficient for HID report buffers and small protocol state machines.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08GT32CFD – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08GT32ACFD | MC9S08GT32ACFDE | MC9S08GT32CFBE |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) |
| Core | S08 (HCS08) 8-bit | S08 8-bit | S08 8-bit | S08 8-bit |
| Max CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB |
| Operating Voltage | 2.5 V - 3.3 V | 1.8 V - 3.6 V (wider) | 1.8 V - 3.6 V (wider) | 2.5 V - 3.3 V |
| Number of I/O | 39 | 39 | 39 | 39 |
| Connectivity | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI |
| Lifecycle Status | Obsolete | Active (newer AC generation) | Active (newer AC generation) | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Lowest-cost 8-bit MCU in S08 family with 32 KB Flash at 40 MHz (vs. Generic 16 KB S08 derivatives)
- On-chip 2 KB SRAM reduces external memory cost (vs. Older HC08 derivatives with 1 KB RAM)
- 48-QFN-EP compact package with thermal pad (vs. LQFP-48 alternatives)
Designhinweise
The 48-QFN-EP (7x7 mm) exposed thermal pad is the primary electrical ground and thermal path. Solder the pad directly to a ground pour with multiple thermal vias to the inner ground plane. Estimated: a 4x4 array of 0.3 mm vias on a 1.0 mm pitch under the pad reduces junction-to-ambient thermal resistance (theta_JA) from the no-via >70 C/W down to roughly 35 C/W. Without soldered EPAD, the part may behave erratically at temperature extremes.
The MC9S08GT32CFD uses NXP's Background Debug Mode (BDM) via the BKGD/MS pin, NOT JTAG or SWD. Connect a 4.7 kohm pull-up on RESET and a 4.7 kohm pull-up on IRQ to VDD - although the datasheet specifies internal pull-ups on these pins, an external pull-up improves noise immunity on cables and connectors. Do not apply voltage to any pin before VDD ramps, or latch-up may occur.
Add a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin pair, plus a 4.7 uF tantalum or ceramic bulk capacitor at the regulator output. The S08 core executes STOP and WAIT low-power modes; wake-up time from STOP is typically <10 us with the internal LVD enabled. Estimate: a typical active current of 8 mA at 40 MHz drops to <20 uA in STOP3 mode, enabling battery-powered sensor nodes.
Port pins used for the SPI bus should be routed as short matched traces (<25 mm) with a series 33 ohm resistor near the source. The I2C bus requires 4.7 kohm pull-ups to VDD - lower values (2.2 kohm) are recommended for 400 kbit/s Fast-Mode. The ADC inputs (PTB7-PTB0 on most S08 derivatives) should be bypassed with a 100 nF cap and routed away from PWM traces to avoid coupling.
Compliance-Informationen
RoHS, REACH and lead-free data were not present in the verified web data; consult NXP product page for the latest Material Composition Declaration
