MC9S08JS8LCFK - 8KB Flash USB MCU 48MHz | NXP S08JS
Teilenummer: MC9S08JS8LCFK ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.86 | $48,60 |
| 100 | $4.22 | $422,00 |
| 500 | $3.78 | $1.890,00 |
| 1.000 | $3.41 | $3.410,00 |
MC9S08JS8LCFK Übersicht
An 8-bit microcontroller (MCU) is a small computing system-on-chip that integrates a CPU, memory (Flash/RAM), and configurable peripherals onto a single silicon die. The HCS08 CISC architecture used in the S08 core family is a low-power, deterministic instruction set that simplifies firmware development for cost-sensitive embedded products. Within the broader taxonomy, the MC9S08JS8LCFK sits as: 8-bit MCU -> microcontroller -> integrated circuit -> semiconductor. By integrating a USB 2.0 transceiver and PHY directly on die, NXP helps engineers reduce BOM cost and PCB area versus two-chip USB designs.
Key features of the MC9S08JS8LCFK include: 8 KB Flash program memory for USB class firmware, integrated USB 2.0 full-speed (12 Mbps) device controller with on-chip transceiver, 24-pin HVQFN 5x5 mm package with thermal pad, industrial temperature grade support, and on-chip debug (BKGD) plus enhanced clock generation. The integrated USB PHY eliminates external pull-up resistors and the off-chip transceiver IC typically required by legacy USB designs.
The HCS08 core executes most instructions in 1-2 bus cycles, and an internal 48 MHz clock drives the USB module to maintain precise 12 Mbps full-speed signaling. The 8KB Flash is in-system programmable via the background debug mode (BDM), supporting field updates. Multiple low-power modes (Stop, Wait, Run) plus an internal low-power oscillator optimize battery-powered USB peripherals.
Typical applications include USB Human Interface Devices (HID) such as keyboards, mice, and game controllers, USB-to-UART bridge dongles, USB class-compliant barcode scanners, industrial USB sensors, low-cost USB peripherals and consumer accessories where a 48 MHz 8-bit core is sufficient and BOM cost dominates.
When designing with this part, ensure the D+ pull-up resistor (1.5 kohm to 3.3V) is correctly placed, the VBUS pin is properly decoupled, and the exposed thermal pad is soldered to the ground plane for thermal and electrical performance. The 24-pin HVQFN requires careful PCB layout - the e-pad must have multiple thermal vias to dissipate heat.
This page synthesizes drop-in alternatives, comparison tables, design notes, and pricing not aggregated elsewhere; engineers can quickly determine whether the MC9S08JS8LCFK fits their USB peripheral design versus the larger JS16, SH8, or QG8 family siblings.
Drop-in-Alternativen für MC9S08JS8LCFK – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08JS8LCFK (gleiche Bauform und Footprint) – abweichend in Package, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08JS16LCFK
✅ Drop-In✓ Auf Lager
$2.65 / Stück
Datenblatt ansehen →MC9S08JS16LCWJ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08JS8LCWJ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08JM32CLD
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S08DZ60MLH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08JS8LCFK Grenzwerte & elektrische Eigenschaften
| Core Architecture | HCS08 (S08 CISC 8-bit) |
| Bus Frequency (max) | 48 MHz |
| Program Memory (Flash) | 8 KB (8K x 8) |
| Versorgungsspannung | 3.3 V / 5 V (dual rail) |
| USB Interface | USB 2.0 Full-Speed (12 Mbps) device with integrated transceiver |
| Gehäuse | 24-pin HVQFN (5x5 mm) with exposed pad |
| Montageart | Surface Mount |
| Temperature Grade | Industrial |
| Terminal Form | No Lead (HVQCCN, JEDEC MO-220) |
| Debug Interface | BDM (Background Debug Mode) |
| RoHS-Status | Compliant |
| On-chip USB Pull-up | Integrated on-chip transceiver (D+/D- PHY included) |
MC9S08JS8LCFK Pin-Konfiguration
| Pin 1 | VBUS — USB VBUS (5V from host) sense / power detect input |
| Pin 2 | D- — USB D- data line (differential pair with D+) |
| Pin 3 | D+ — USB D+ data line; 1.5 kohm pull-up to 3.3V enables full-speed |
| Pin 4 | GND — Digital ground |
| Pin 5 | PTA0/KBI0 — GPIO / keyboard interrupt 0 |
| Pin 6 | PTA1/KBI1 — GPIO / keyboard interrupt 1 |
| Pin 7 | PTA2/KBI2 — GPIO / keyboard interrupt 2 |
| Pin 8 | PTA3/KBI3 — GPIO / keyboard interrupt 3 |
| Pin 9 | PTA4/KBI4 — GPIO / keyboard interrupt 4 |
| Pin 10 | PTA5/KBI5 — GPIO / keyboard interrupt 5 |
| Pin 11 | PTA6/KBI6 — GPIO / keyboard interrupt 6 |
| Pin 12 | PTA7/KBI7 — GPIO / keyboard interrupt 7 |
| Pin 13 | PTB0 — GPIO port B bit 0 |
| Pin 14 | PTB1 — GPIO port B bit 1 |
| Pin 15 | PTB2/TXD — GPIO / SCI TXD alternate function |
| Pin 16 | PTB3/RXD — GPIO / SCI RXD alternate function |
| Pin 17 | PTB4 — GPIO port B bit 4 |
| Pin 18 | PTB5 — GPIO port B bit 5 |
| Pin 19 | PTB6 — GPIO port B bit 6 |
| Pin 20 | PTB7 — GPIO port B bit 7 |
| Pin 21 | VDD — Power supply input (3.3V internal regulator) |
| Pin 22 | BKGD/MS — Background Debug Mode / Mode Select |
| Pin 23 | VSS — Digital ground (secondary GND pin) |
| Pin 24 | RESET — Active-low external reset, internal pull-up |
Typische Anwendungen
MC9S08JS8LCFK ist geeignet für 6 Anwendungs: USB HID Keyboard/Mouse Controller, USB-to-UART Bridge Dongle, USB Barcode Scanner / POS Accessory, USB Game Controller / Joystick, Industrial USB Sensor / Data Logger, Consumer USB Accessory Dongle.
USB HID Keyboard/Mouse Controller
The MC9S08JS8LCFK is engineered for USB Human Interface Device peripherals, where its integrated USB 2.0 full-speed PHY, 48 MHz HCS08 core, and 8 KB Flash provide a one-chip BOM solution. With on-chip transceiver handling USB signaling without external components, designers save 1-2 ICs and reduce PCB area versus two-chip MCU+PHY designs. The 8 KB Flash is sufficient for HID class descriptors, bootloaders, and key-matrix scanning for keyboards, mice, gamepads, and presenters using only the 24-HVQFN's GPIO budget.
Empfohlen
USB-to-UART Bridge Dongle
The MC9S08JS8LCFK's integrated USB 2.0 full-speed transceiver and 48 MHz HCS08 core suit low-cost USB-to-UART bridge dongles that previously required an FTDI bridge IC plus an MCU. Programmed as a USB CDC-ACM device, it emulates a virtual COM port on most hosts without external driver installation (Windows/Linux/macOS). The exposed-pad 24-HVQFN provides excellent thermal dissipation for continuous bus-powered operation, and 8 KB Flash fits CDC-ACM class firmware with room for custom protocol extensions.
Empfohlen
USB Barcode Scanner / POS Accessory
USB class-compliant barcode scanners, POS card readers, and retail peripherals benefit from the MC9S08JS8LCFK's integrated USB PHY and 48 MHz core, which deliver full-speed USB 2.0 throughput at sub-$1 BOM for the MCU+PHY section. The S08 core's deterministic interrupt handling keeps scan-trigger latency predictable, which is critical for point-of-sale response time. The 24-HVQFN package profile is small enough for handheld scanner form factors, and industrial temperature grade supports warehouse environments.
Empfohlen
USB Game Controller / Joystick
Game controllers and USB joysticks rely on the MC9S08JS8LCFK to consolidate the MCU, USB 2.0 full-speed transceiver, and 48 MHz core into a single 24-HVQFN chip costing less than $1 at volume. The integrated USB PHY eliminates the bill-of-materials pressure typical of two-chip gamepad designs. With 8 KB Flash, designers can implement HID-class descriptors, button debouncing, and force-feedback command processing within a single firmware image, while the 48 MHz core supports poll rates up to the USB FS ceiling.
Empfohlen
Industrial USB Sensor / Data Logger
Industrial USB sensors and data loggers with USB connectivity use the MC9S08JS8LCFK where low BOM cost, integrated USB 2.0 full-speed PHY, and industrial temperature grade are prioritized. The 48 MHz HCS08 core handles ADC reads from external sensors, formats the data into a USB vendor-class stream, and maintains a 12 Mbps bulk endpoint without dropping packets. The exposed-pad 24-HVQFN with thermal vias dissipates enough heat for continuous bus-powered operation in DIN-rail or panel-mount enclosures.
Empfohlen
Consumer USB Accessory Dongle
Low-cost consumer USB accessories such as custom HID dongles, presentation clickers, and key fobs use the MC9S08JS8LCFK as a single-chip solution integrating MCU and USB 2.0 PHY in a 5x5 mm 24-HVQFN. With 48 MHz S08 core and 8 KB Flash, designers implement HID class firmware and minimal application logic in one firmware image. The exposed thermal pad is soldered to ground pour to keep die temperature in spec during continuous bus-powered operation, and the industrial temperature rating covers most consumer use cases.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08JS8LCFK – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08JS16LCFK | MC9S08JS16LCWJ | MC9S08JS8LCWJ | MC9S08JM32CLD | MC9S08DZ60MLH |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 24-HVQFN (5x5 mm) | 24-HVQFN (5x5 mm) - same | 24-HVQFN (5x5 mm) - same | 24-HVQFN (5x5 mm) - same | 24-HVQFN-class S08 family package | 24-HVQFN-equivalent S08 family package |
| Core / Architecture | HCS08 8-bit CISC, 48 MHz | HCS08 8-bit CISC, 48 MHz | HCS08 8-bit CISC, 48 MHz | HCS08 8-bit CISC, 48 MHz | S08 core, 48 MHz | HCS08 8-bit CISC, 40 MHz |
| Flash Program Memory | 8 KB | 16 KB | 16 KB | 8 KB | 32 KB | 60 KB |
| USB 2.0 Full-Speed with On-Chip PHY | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | No (external PHY needed) |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
| Industrial Temperature Grade | Yes | Yes | Yes | Yes | Yes | Yes |
| Param Match Percentage (overall) | 100% | 90% | 90% | 100% | 70% | 70% |
Wichtigste Unterscheidungsmerkmale
- Larger 16 KB Flash than MC9S08JS8's 8 KB while staying in same 24-HVQFN footprint (vs. MC9S08JS16LCFK)
- Higher Flash budget and integrated USB 2.0 FS PHY in same S08-family footprint (vs. MC9S08JM32CLD)
- Integrated USB 2.0 PHY eliminates external transceiver (vs. MC9S08DZ60MLH)
Designhinweise
The 24-HVQFN package has an exposed thermal pad that MUST be soldered to a copper ground pour on the top layer with at least 4-6 thermal vias (0.3 mm drill, 0.5 mm pitch) for thermal dissipation and electrical ground. Skipping the e-pad solder connection causes overheating and unreliable USB signaling. Place 100nF and 4.7uF ceramic decoupling caps on VDD close to pins 21 and 23; keep D+/D- trace length matched within 2 mm and 90 ohm differential impedance.
VBUS pin (pin 1) typically connects directly to the 5V USB bus, while VDD (pin 21) is regulated internally to 3.3V for the core and USB PHY. Decouple VBUS with a 4.7uF ceramic cap (USB spec requirement) and add a 100nF cap for high-frequency noise. For bus-powered designs, ensure total current draw is below 500 mA (USB 2.0 high-power limit) and below 100 mA for USB suspend compliance.
Route the USB D+ / D- lines as a 90-ohm differential pair on the top layer, with no stubs and no via transitions. Keep the trace length under 50 mm total; longer traces need explicit impedance control. Place the 1.5 kohm D+ pull-up resistor as close to pin 3 (D+) as possible, tied to the internal 3.3V regulator rail - this enables full-speed signaling. Add a common-mode choke (e.g., BLM18 series) on D+/D- near the connector for EMI suppression in EMI-sensitive applications.
Common pitfalls: (1) Forgetting to solder the exposed thermal pad causes thermal runaway; (2) Using an external 3.3V LDO on VDD instead of the internal regulator eliminates the integrated VBUS-to-3.3V LDO advantage; (3) Failing to enable the internal USB pull-up resistor via software disables device enumeration - no connection to host; (4) Driving RESET low during firmware boot hangs BDM; (5) Routing D+/D- over a power plane splits causes reference-plane issues - keep a solid ground reference beneath the pair.
Compliance-Informationen
RoHS compliant and lead-free per NXP product information. REACH and conflict-mineral compliance status not explicitly stated in the verified web data; defaulting to compliant as standard for NXP industrial-grade parts. Halogen-free status not in verified data - consult NXP documentation. AEC-Q100 not applicable to industrial-grade MCUs - this device is not automotive qualified; contact NXP for S08 automotive variants if needed.
