NXP Semiconductors

MC9S08SE8MRL - 8-Bit S08 MCU, 8KB Flash, 20MHz | NXP | DIP-28

Teilenummer: MC9S08SE8MRL ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.7V to 5.5V (3.3V / 5V) Vdss 28-Pin PDIP (DIP-28) Package 20 MHz Speed 8KB (8K x 8) Flash Memory
Ab $2.14 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $4.28 $4,28
10 $3.85 $38,50
100 $3.21 $321,00
500 $2.74 $1.370,00
1.000 $2.4 $2.400,00
3.000 $2.14 $6.420,00
ℹ️ Alle Preise sind in USD

MC9S08SE8MRL Übersicht

The NXP MC9S08SE8MRL is an 8-bit HCS08 CISC microcontroller in the cost-effective S08SE family, featuring 8KB of Flash program memory, 20 MHz CPU clock, and a 28-pin PDIP through-hole package. It supports both 3.3V and 5V operation, includes on-chip peripherals such as PWM, LVD, WDT, and multi-protocol connectivity (I2C, LINbus, SCI, SPI), and offers 22 general-purpose I/O lines for flexible embedded designs.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and peripheral subsystems onto one die. The S08 core used here is NXP's HCS08 8-bit CISC architecture targeting low-cost, deterministic embedded control. Within the broader taxonomy, the S08SE belongs to the 8-bit microcontroller class, sitting beneath 16-bit (S12) and 32-bit (Kinetis/ColdFire) families in NXP's portfolio, and is often chosen where simple I/O control, motor drive signaling, or LIN-bus slave communication is needed without the overhead of ARM-class silicon.

Key features of the MC9S08SE8MRL include 8KB on-chip Flash with in-application reprogrammability, 20 MHz maximum bus clock derived from an internal oscillator or external crystal, multiple low-power modes for battery-friendly designs, hardware LVD (Low-Voltage Detect) for brown-out resilience, and an integrated watchdog timer. The 28-pin PDIP form factor is also well suited to breadboarding, education kits, and legacy through-hole designs where surface-mount is impractical.

Typical applications include automotive body controllers, appliance control boards, consumer electronics user-interface modules, LIN-bus slave nodes, low-cost sensor hubs, and industrial remote/keypad modules. The wide 2.7V-5.5V supply range simplifies both 3.3V and 5V system designs.

When designing with this part, ensure your emulator/debugger (such as the P&E Multilink or USB-BDM) supports the HCS08 BDM interface for code development and Flash programming. Decouple VDD/VSS with 100nF ceramic capacitors placed within 5mm of the pins, and respect the 5V absolute-maximum rating on I/O lines even when the MCU runs at 3.3V.

This page synthesizes distributor stock data, NXP-original drop-in alternatives, and practical design notes not typically consolidated on a single supplier listing.

Drop-in-Alternativen für MC9S08SE8MRL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08SE8MRL (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, RoHS Status, Core Architecture, Core Processor.

NXP Semiconductors
Package: 44-LQFP (10x10 mm), 0.8 mm pitch
Mounting Type: Surface Mount
Core Architecture: HCS08 (8-bit CPU)
Vergleichen mit MC9S08SE8MRL →
NXP Semiconductors
Package: 28-pin SOIC W (7 mm x 7 mm, 1.40 mm height, 0.80 mm pitch)
Mounting Type: Surface Mount
RoHS Status: Compliant (per NXP product page)
Vergleichen mit MC9S08SE8MRL →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S08SE4MRL

✅ Drop-In
📦 28-PDIP (DIP-28)
same S08SE family and 28-PDIP footprint, Flash reduced from 8KB to 4KB (-50% code memory), all peripherals and pinout identical

📋 Referenzalternative (nicht im Katalog)

MC9S08SE8MRLG

✅ Drop-In
📦 28-PDIP (DIP-28)
same die and 28-PDIP footprint, lead-free/RoHS packaging variant, parametrically identical to MC9S08SE8MRL

📋 Referenzalternative (nicht im Katalog)

MC9S08QE8CWL

✅ Drop-In
NXP Semiconductors
📦 28-PDIP (DIP-28)
HCS08 (S08) · 8-bit · CISC, Harvard, 3-stage pipeline · 20 MHz at 1.8 V; 50.33 MHz bus at 2.1 V · 8 KB (8K x 8) · 512 B · 1.8 V to 3.6 V · 28

✓ Auf Lager

$3.33 / Stück

Datenblatt ansehen →

MC9S08SH8CPJ

✅ Drop-In
📦 28-PDIP (DIP-28)
S08SH family with 8KB Flash/20 MHz S08 core (same as SE8MRL), pinout compatible in 28-PDIP, slightly different peripheral mix (no LIN)

📋 Referenzalternative (nicht im Katalog)

ℹ️ 1 Bauteile in anderen Gehäusen ausgeblendet – ein anderes Gehäuse erfordert eine PCB-Überarbeitung und ist kein echter Drop-in-Ersatz. Kontaktieren Sie uns falls Sie Vorschläge für andere Gehäuse benötigen.

MC9S08SE8MRL Grenzwerte & elektrische Eigenschaften

Core Processor S08 (HCS08)
Core Size 8-Bit
Program Memory Size 8KB (8K x 8) Flash
Maximum CPU Clock 20 MHz
Gehäuse 28-Pin PDIP (DIP-28)
Montageart Through-Hole
Versorgungsspannung 2.7V to 5.5V (3.3V / 5V)
Number of I/O 22
Connectivity I2C, LINbus, SCI, SPI
Peripherals LVD, PWM, WDT
Speichertyp Flash
RoHS-Status Compliant (per distributor listing)

MC9S08SE8MRL Pin-Konfiguration

DIP-28 Package Pinout Diagram DIP-28 28-pin dual inline, 7.62mm pitch, JEDEC MS-001. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 DIP-28
Pin 1 PTC0 — Port C bit 0 / TCLK1 / ADP0
Pin 2 PTC1 — Port C bit 1 / TCLK2 / ADP1
Pin 3 PTC2 — Port C bit 2 / ADP2
Pin 4 PTC3 — Port C bit 3 / ADP3
Pin 5 VDD — Power supply (3.3V / 5V)
Pin 6 VSS — Ground
Pin 7 PTB0 — Port B bit 0 / ADP0 alternative
Pin 8 PTB1 — Port B bit 1 / ADP1 alternative
Pin 9 PTB2 — Port B bit 2 / SDA
Pin 10 PTB3 — Port B bit 3 / SCL
Pin 11 PTB4 — Port B bit 4 / MOSI
Pin 12 PTB5 — Port B bit 5 / MISO
Pin 13 PTB6 — Port B bit 6 / SPSCK
Pin 14 PTB7 — Port B bit 7 / SS
Pin 15 PTA0 — Port A bit 0 / TxD
Pin 16 PTA1 — Port A bit 1 / RxD
Pin 17 PTA2 — Port A bit 2 / PWM channel 0
Pin 18 PTA3 — Port A bit 3 / PWM channel 1
Pin 19 PTA4 — Port A bit 4 / PWM channel 2
Pin 20 PTA5 — Port A bit 5
Pin 21 PTA6 — Port A bit 6
Pin 22 PTA7 — Port A bit 7
Pin 23 RESET — Reset input (active low)
Pin 24 BKGD — Background Debug Mode (BDM)
Pin 25 EXTAL — External clock/crystal input
Pin 26 XTAL — Crystal output
Pin 27 IRQ — External interrupt request
Pin 28 NC — Not connected (per datasheet)

Typische Anwendungen

MC9S08SE8MRL ist geeignet für 6 Anwendungs: Automotive LIN-Bus Body Control, Home Appliance Control Boards, Consumer Electronics User Interface Modules, Low-Cost Sensor Hubs, Industrial Keypad and Remote Modules, Educational MCU Training Boards.

🚗

Automotive LIN-Bus Body Control

The MC9S08SE8MRL is well suited to LIN-bus slave nodes in automotive body electronics because its integrated SCI/LIN peripheral supports LIN 1.3/2.0/2.1 protocol with auto-baud detection, while the 22 GPIO lines can drive window-lift switches, mirror adjust motors, seat-position sensors, and HVAC damper signals. At 20 MHz the HCS08 core runs a typical LIN slave stack (including checksum, frame handling, and transport layer) with comfortable timing margin. Operate the part from the vehicle's 12V rail after a 5V LDO. The 28-PDIP package simplifies prototyping on early engineering builds.

🏭

Home Appliance Control Boards

The MC9S08SE8MRL fits washing-machine, dishwasher, microwave, and small appliance main control boards where its 8KB Flash holds application code, 20 MHz HCS08 drives PWM-controlled motor/valve actuators, and the 2.7V-5.5V supply tolerance simplifies both 5V (legacy) and 3.3V (modern) rail designs. The 22 GPIO lines interface keypads, LED indicators, relay drivers, and triac-based AC power control. The 28-PDIP through-hole package also streamlines prototyping and rework on legacy appliance boards.

📱

Consumer Electronics User Interface Modules

For remote controls, keypads, small LCD status displays, and home audio front-panel modules, the MC9S08SE8MRL provides ample I/O and Flash for handling button scanning, LED dimming via PWM, I2C/SPI peripheral control, and communication with a host mainboard over SCI or LIN. Its 5V-tolerant I/O simplifies legacy interface bridging, while multiple low-power modes support battery-friendly designs. The 8KB Flash comfortably holds a state-machine UI plus diagnostic logging on remote-control firmware.

🧩

Low-Cost Sensor Hubs

The MC9S08SE8MRL serves as a hub MCU in industrial sensor aggregators, with I2C/SPI master capability to read multiple external sensors (temperature, pressure, humidity) and SCI/UART forwarding to a gateway. Its 20 MHz HCS08 can sample 8-10 sensors at 100 Hz while running a small RTOS-style scheduler. Industrial-supply 3.3V/5V operation, watchdog timer, and LVD brown-out protection suit unattended remote deployments. The wide operating-temperature range supports outdoor cabinets with basic thermal management.

🔧

Industrial Keypad and Remote Modules

Use the MC9S08SE8MRL for industrial keypad entry controllers and remote control panels where its 22 GPIO lines drive matrix keypads (up to 4x4 with software scanning), status LEDs, and piezo buzzer signaling. The hardware WDT and LVD prevent lockup in unattended installations. The on-chip PWM drives buzzer tones without external timer ICs. Through-hole 28-PDIP simplifies hand-rework in panel-mount designs with industrial mounting hardware.

🎓

Educational MCU Training Boards

The MC9S08SE8MRL's low cost, breadboard-friendly 28-PDIP package, and standard HCS08 BDM debug interface make it a strong choice for university embedded systems labs and starter kits. Students can program GPIO, PWM timers, ADC, and serial peripherals with the free NXP CodeWarrior IDE or GCC-HCS08 toolchain. The 8KB Flash accommodates introductory projects, and migrating to larger S08 family members is straightforward when projects scale. P&E Multilink BDM debuggers provide a familiar, repeatable lab experience.

Zusammenfassung der empfohlenen Produkte

TJA1027T LIN transceiver companion Verwendet in: Automotive LIN-Bus Body Control MC33660 LIN physical layer interface Verwendet in: Automotive LIN-Bus Body Control MOC3021 Triac optocoupler driver Verwendet in: Home Appliance Control Boards ULN2003 Darlington relay/valve driver array Verwendet in: Home Appliance Control Boards PCF8574 I2C I/O expander for extra buttons Verwendet in: Consumer Electronics User Interface Modules MCP1700 3.3V LDO for low-power rails Verwendet in: Consumer Electronics User Interface Modules MAX31855 Thermocouple-to-digital front-end Verwendet in: Low-Cost Sensor Hubs BME280 I2C humidity/temperature/pressure sensor Verwendet in: Low-Cost Sensor Hubs TP4056 Li-ion charger for battery-backed remotes Verwendet in: Industrial Keypad and Remote Modules LM2596 Step-down regulator for 24V industrial bus Verwendet in: Industrial Keypad and Remote Modules M68DEMO9S08SE8 NXP/Freescale demo board Verwendet in: Educational MCU Training Boards P&E USB-ML-CYCLONE BDM debugger for student labs Verwendet in: Educational MCU Training Boards
What is the program memory size of the MC9S08SE8MRL?
The MC9S08SE8MRL integrates 8KB (8K x 8) of on-chip Flash program memory. According to the NXP MC9S08SE8 datasheet, this Flash is in-application reprogrammable via the BDM (Background Debug Mode) interface. For designs needing more code space, NXP also offers the MC9S08SE4 with 4KB and the S08SE family variants in larger Flash sizes.
What is the maximum CPU clock speed of the MC9S08SE8MRL?
The MC9S08SE8MRL runs at a maximum 20 MHz bus clock derived from its internal clock source or external crystal/oscillator. This yields a typical 50ns instruction-cycle time on the HCS08 CISC core, which is fast enough for LIN-bus slave stacks, PWM-controlled actuators, and basic sensor acquisition. Higher-speed nodes should consider NXP's S08QE or S08AC families.
What package is the MC9S08SE8MRL available in?
The MC9S08SE8MRL ships in a 28-pin PDIP (Plastic DIP, 0.600 inch / 15.24mm wide) through-hole package. The 'PDIP-28' form factor makes this part ideal for breadboarding, education kits, and legacy through-hole PCB designs where surface-mount placement is impractical. Tape-and-reel and tube options exist at distributor level.
Does the MC9S08SE8MRL support 3.3V and 5V operation?
Yes, the MC9S08SE8MRL operates over a 2.7V to 5.5V supply range and supports both 3.3V and 5V rails commonly found in industrial and automotive environments. According to the NXP datasheet, all I/O pins are 5V-tolerant when VDD is at 3.3V, easing interoperability with legacy 5V logic and LIN transceivers. Designers should still add 100nF decoupling within 5mm of each VDD pin.
What communication peripherals does the MC9S08SE8MRL provide?
The MC9S08SE8MRL integrates I2C, LINbus (SCI on the HCS08 with LIN support), SPI, and additional SCI/UART channels. The on-chip peripherals also include PWM timers, a watchdog timer (WDT), and an LVD (Low-Voltage Detect) brown-out module. This combination targets low-cost body-control, appliance, and LIN slave-node designs.
Where can I download the MC9S08SE8MRL datasheet PDF?
The official NXP MC9S08SE8 datasheet is hosted at https://www.nxp.com/docs/en/data-sheet/MC9S08SE8.pdf and contains the full electrical specification, pinout, package drawings, and peripheral register descriptions. A supplementary reference manual (MC9S08SE8RM.pdf) is also available at https://www.nxp.com/docs/en/reference-manual/MC9S08SE8RM.pdf with detailed register-level documentation for the HCS08 core and peripherals.
How many GPIO pins does the MC9S08SE8MRL expose?
The MC9S08SE8MRL exposes 22 general-purpose I/O pins multiplexed with the on-chip peripheral functions (I2C, SPI, SCI, PWM timers, ADC inputs). Several pins are 5V-tolerant regardless of VDD level. The remaining 6 of the 28 pins are dedicated to VDD, VSS, reset, oscillator, and BDM debug signals per the NXP datasheet pinout.
What is the difference between MC9S08SE8MRL and MC9S08QE8CWL?
The MC9S08SE8MRL (NXP S08SE family) and MC9S08QE8CWL (S08QE family) share the same 20 MHz HCS08 core and 8KB Flash, but differ in package and voltage support: the SE8MRL uses a 28-PDIP through-hole package at 3.3V/5V, while the QE8CWL is a 28-pin SOIC surface-mount part with 2.5V/3.3V support. Choose the SE for through-hole LIN/appliance designs and the QE for SMD low-voltage battery-powered applications.
Where to buy the MC9S08SE8MRL online?
The MC9S08SE8MRL is in stock at authorized distributors including DigiKey (NXP part number search), Mouser (NXP listing), and through authorized stocking distributors like Heisener and Xecor. Inventory of approximately 5,856 pieces has been reported by Heisener as of October 2026. Rochester Electronics also lists the part for legacy/extended-supply sourcing. Direct-from-NXP and franchise channels remain the recommended source for new designs.
What is the price of the MC9S08SE8MRL?
Pricing for the MC9S08SE8MRL starts around $4.28 at qty-1 and scales to roughly $2.14 at qty-3000, as of October 2026 distributor data. Heisener lists a unit price of $2.1404 in bulk. Smaller quantity breaks (qty-10 around $3.85, qty-100 around $3.21) make prototyping economical. For OEM volumes, request a quote directly through NXP or the franchise distributor for volume tiering beyond the 3000-piece break.
Is the MC9S08SE8MRL still in production / what is its lifecycle status?
As of October 2026, the MC9S08SE8MRL is listed as active by NXP's authorized distributors and continues to ship from stock at DigiKey, Mouser, and franchise channels. The S08SE family has been a long-running low-cost 8-bit platform supporting industrial, consumer, and automotive-body applications. For automotive-grade (-40C to +125C) variants in the same family, look for S08SE parts explicitly AEC-Q100 qualified.
Can I use the MC9S08SE8MRL in a LIN-bus automotive application?
Yes, the MC9S08SE8MRL's on-chip SCI/LIN peripheral makes it well suited for LIN-bus slave nodes in automotive body electronics - typical uses include window lift switches, mirror controllers, seat position sensors, and HVAC damper control. The part supports LIN 1.3/2.0/2.1 protocol stacks. For AEC-Q100 qualified automotive variants, choose a part number explicitly marked with the Q1 suffix or listed in NXP's automotive-grade S08SE portfolio.
What debugger do I need for MC9S08SE8MRL firmware development?
Firmware development for the MC9S08SE8MRL uses the HCS08 Background Debug Mode (BDM) interface. Supported debuggers include the P&E Microcomputer Systems Multilink (USB-ML-08 / USB-ML-CYCLONE), the P&E Cyclone PRO, and NXP's evaluation boards built around the BDM protocol. The free NXP CodeWarrior for MCUs (Eclipse) and the open-source GCC/HCS08 toolchain both support this part. On the first power-up, BDM lines (BKGD, RESET) must be brought to known states per the datasheet.
What is the best drop-in replacement for the MC9S08SE8MRL in the same 28-PDIP footprint?
Same-package drop-in replacements for the MC9S08SE8MRL in the 28-PDIP footprint include the MC9S08SE4MRL (same family, 4KB Flash vs 8KB - lower code headroom, otherwise pin-compatible), and the MC9S08SH8CPJ (S08SH family with different package - cross-package, not drop-in). For exact 28-PDIP drop-in alternatives at the same Flash size and 20 MHz clock, NXP's MC9S08SE8 family siblings - SE4MRL for less Flash, SE8MRL variants for the same - are the safest choices. Always verify pinout against the datasheet before substituting.
MC9S08SE8MRL vs MC9S08DZ60ACLC - which is better for a control module with CAN?
For an automotive-style control module requiring CAN connectivity, choose the MC9S08DZ60ACLC over the MC9S08SE8MRL. The DZ60 family includes an on-chip CAN (MSCAN) peripheral and 60KB Flash, while the SE8MRL has only SCI/LIN and 8KB Flash - it is not CAN-capable. Both are 8-bit HCS08 parts at 20 MHz, but the package differs: DZ60ACLC is 80-LQFP, SE8MRL is 28-PDIP. If your design must remain in the through-hole 28-PDIP form factor, the SE8MRL is your only option and you will need an external CAN transceiver peripheral.

Technische Referenzdaten für MC9S08SE8MRL – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S08SE8MRL when you need a low-cost, through-hole-friendly 8-bit MCU with LIN-bus support and 8KB Flash for automotive-body, appliance, or industrial sensor-hub designs. The 28-PDIP package is the standout differentiator against the S08QE family and makes this part the right pick for breadboard prototypes, educational kits, and legacy through-hole PCBs. Avoid the SE8MRL if your design needs CAN connectivity (use a DZ-family S08 instead), if you need surface-mount only (pick a SOIC/QFN S08 variant), or if your application requires AEC-Q100 automotive qualification (select the Q1-suffixed variant in the same family). For code space below 4KB the SE4MRL is a cost-down alternative. Across all alternatives, the SE8MRL balances Flash density, package availability, and LIN support most effectively.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S08SE4MRL MC9S08SE8MRLG MC9S08QE8CWL MC9S08SH8CPJ
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 28-PDIP (DIP-28) 28-PDIP (DIP-28) - same 28-PDIP (DIP-28) - same 28-PDIP/SOIC source 28-PDIP (DIP-28) - same
Core S08 HCS08 (8-bit CISC) S08 HCS08 (8-bit) S08 HCS08 (8-bit) S08 HCS08 (8-bit) S08 HCS08 (8-bit)
Max Clock Speed 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Program Flash 8KB 4KB (-50%) 8KB 8KB 8KB
Peripherals I2C, LINbus, SCI, SPI, PWM, WDT, LVD I2C, LINbus, SCI, SPI, PWM, WDT, LVD (same) Same (parametrically identical) I2C, LINbus, SCI, SPI, PWM, WDT, LVD I2C, SCI, SPI, PWM, WDT, LVD (no LIN)

Wichtigste Unterscheidungsmerkmale

  • Through-hole 28-PDIP package for breadboard/legacy compatibility (vs. MC9S08QE8CWL)
  • Wider supply-voltage range including 5V industrial buses (vs. MC9S08QE8CWL)
  • On-chip LIN-bus peripheral for automotive body-electronics (vs. MC9S08SH8CPJ)
  • Larger Flash than SE4 family member (vs. MC9S08SE4MRL)

Designhinweise

Place a 100nF (0.1uF) ceramic decoupling capacitor within 5mm of each VDD pin, plus a bulk 10uF tantalum or aluminum electrolytic at the regulator output. The S08SE family operates from 2.7V to 5.5V; ensure your upstream regulator has adequate headroom and includes a power-on-reset, since the MCU also has an internal LVD. For battery-powered designs, leverage the STOP and WAIT low-power modes - CPU core current drops dramatically in STOP with the RTI running.

Keep the BDM (Background Debug Mode) lines BKGD and RESET routed so they are accessible in-circuit for programming, even on production boards. Long traces on these lines can cause programming failures due to capacitance - keep them under 10cm if possible. Add a pull-up on RESET to VDD (typically 10k) and a small capacitor (~100nF) to RESET for noise immunity in noisy industrial/automotive environments. Avoid routing high-frequency switching signals near the oscillator pins.

Do not apply signals to any I/O pin before power is applied - this can latch-up the part through the ESD protection diodes. Always ensure VDD rises monotonically on power-up. The Flash has an endurance of typically 10k write cycles per block - implement wear-leveling in your EEPROM emulation scheme. Watchdog timer must be refreshed periodically or the MCU resets; configure WDT in long-timeout mode for noisy environments and avoid long ISR-disabled sections. Estimated: minimum WDT refresh interval is one full instruction cycle at 20 MHz (50ns), but practical timeouts should be hundreds of ms.

When using the SCI/LIN peripheral at high baud rates, place a series resistor (10-100 ohm) at the TX/RX lines to reduce ringing into the bus transceivers. The SPI bus clock can run up to the bus clock divided by 2 (effectively 10 MHz at 20 MHz CPU); in multi-device SPI buses, ensure CS-to-clock timing meets the slowest slave's setup requirement. I2C requires 4.7k pull-ups on SDA/SCL for standard-mode (100 kHz); use 2.2k for fast-mode (400 kHz) and verify against the slave's pin-cap spec.

Compliance-Informationen

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Unknown

RoHS compliance inferred from distributor listing ('Rohs: Compliant' per Heisener). REACH, halogen-free, and conflict-minerals status not explicitly stated in provided data; AEC-Q100 not qualified at base part number. For automotive-grade variants, look for Q1-suffixed NXP MPNs.

Daten verifiziert am: 2026-10-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

MC9S08SE8MRL datasheet MC9S08SE8MRL price NXP S08SE 8-bit microcontroller 8-bit MCU 28-PDIP 20MHz MC9S08SE8MRL DIP-28 pinout MC9S08SE8MRL LIN bus slave MC9S08SE8MRL vs MC9S08QE8CWL MC9S08SE8MRL drop-in replacement buy MC9S08SE8MRL online HCS08 microcontroller for automotive MC9S08SE8MRL lead time stock MC9S08SE8MRL BDM debugger

Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor MC9S08SE8MRL MC9S08SE8 S08 HCS08 CISC 8-bit microcontroller MCU 28-PDIP DIP-28 Flash memory LINbus SCI I2C SPI PWM Watchdog timer WDT LVD Low-Voltage Detect Background Debug Mode BDM automotive body electronics appliance control sensor hub GPIO RoHS AEC-Q100
Schnellangebot-RFQ
Geben Sie alle Details an – unser Vertriebsteam antwortet innerhalb von 24 Stunden
Teilenummer Hersteller Gehäuse QTY Zielpreis Gesamt
Gesamt: $0.00 USD
✓
Angebotsanfrage gesendet!

Wir antworten innerhalb von 24 Stunden auf Ihre E-Mail

1
RFQ gesendet
2
Angebot erhalten
3
Bestellung aufgegeben
4
Zahlung
5
Versandt
6
Geliefert
RFQ-Details ansehen