MC9S08SH32CTG - 8-bit S08 MCU 32KB Flash 40MHz | NXP
Teilenummer: MC9S08SH32CTG ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.17 | $517,00 |
| 500 | $4.62 | $2.310,00 |
| 1.000 | $4.1 | $4.100,00 |
MC9S08SH32CTG Übersicht
An 8-bit microcontroller (MCU) is a small, self-contained computer built around an 8-bit data path. It integrates a CPU, non-volatile program memory (Flash), working memory (RAM), and a set of analog and digital peripherals onto a single silicon die. MCUs sit at the lowest layer of the embedded control hierarchy - from sensor/transducer through MCU and communications interface up to full system-on-modules. The S08 core is a CISC (Complex Instruction Set Computer) architecture that pairs compact instruction encoding with deterministic interrupt response.
Key features of the MC9S08SH32CTG include 32 KB of Flash organized as 32K x 8, an integrated single-wire background debug interface (BDI) for in-circuit programming and debugging, on-chip in-circuit emulation (ICE) with two comparators and nine trigger modes, and an eight-deep FIFO for storing change-of-flow addresses and event-only data. The 40 MHz bus speed supports fast interrupt-driven control loops, while the 5-volt-tolerant I/O allows direct interface to legacy industrial logic levels.
The S08SH architecture embeds a small set of production-grade analog and timer peripherals, allowing designers to reduce external component count for cost-sensitive motor control, lighting, sensor processing, and user-interface applications. The Flash is in-application programmable, enabling field firmware updates without removing the device from its target board.
Typical applications for the MC9S08SH32CTG include white goods and small appliance controllers, body electronics and lighting modules in vehicles, low-end industrial sensor and actuator nodes, and battery-operated portable systems where the wide supply range and integrated timers simplify power management. The 16-pin TSSOP footprint is small enough for compact PCB layouts while still exposing enough GPIO for typical control tasks.
When designing, observe the published supply, clock, and I/O derating limits; place the decoupling capacitor (typically 100 nF plus a bulk 10 uF) within a few millimetres of the VDD/VSS pair; and use the single-wire BDI interface for production flash programming and field debug.
This page synthesizes NXP datasheet specifications, distributor pricing, drop-in compatible alternatives, and practical design notes that complement the manufacturer documentation.
Drop-in-Alternativen für MC9S08SH32CTG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08SH32CTG (gleiche Bauform und Footprint) – abweichend in Debug Interface, Package, ADC, Core Processor, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08SH32CTL
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S08SH16CTG
⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.1511 / Stück
Datenblatt ansehen →MC9S08SH8CTG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.62 / Stück
Datenblatt ansehen →MC9S08SH4MTGR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08SG32E1CTGR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08SH32CTG Grenzwerte & elektrische Eigenschaften
| Core Architecture | S08 8-bit CISC |
| Program Memory | 32 KB Flash (32K x 8) |
| CPU Clock (Max) | 40 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Gehäuse | 16-pin TSSOP |
| Montageart | Surface Mount |
| GPIO Count (Max) | 16 |
| Datenbusbreite | 8 bit |
| AEC-Q100 Grade | Qualified |
| Debug Interface | Single-wire BDI |
| On-chip Emulation | Yes - 2 comparators, 9 trigger modes |
| Breakpoints (Debug) | 1 user breakpoint + 2 in on-chip debug module |
| Trace FIFO Depth | 8 entries (change-of-flow / event-only) |
| Betriebstemperatur | -40 C to +85 C (industrial) |
| RoHS-Status | Compliant |
| Tube Quantity | Per manufacturer standard packaging |
| In-application Programming | Yes (Flash self-programming) |
MC9S08SH32CTG Pin-Konfiguration
| Pin 1 | VDD — Power supply input (2.7 V to 5.5 V) |
| Pin 2 | VSS — Ground reference |
| Pin 3 | PTA0/TCLK1 — GPIO PTA0 / Timer 1 external clock input |
| Pin 4 | PTA1/TCLK2 — GPIO PTA1 / Timer 2 external clock input |
| Pin 5 | PTA2 — GPIO PTA2 |
| Pin 6 | PTA3 — GPIO PTA3 |
| Pin 7 | PTA4 — GPIO PTA4 |
| Pin 8 | PTA5 — GPIO PTA5 |
| Pin 9 | PTA6 — GPIO PTA6 |
| Pin 10 | PTA7 — GPIO PTA7 |
| Pin 11 | PTB0 — GPIO PTB0 |
| Pin 12 | PTB1 — GPIO PTB1 |
| Pin 13 | PTB2 — GPIO PTB2 |
| Pin 14 | PTB3 — GPIO PTB3 |
| Pin 15 | PTB4 — GPIO PTB4 |
| Pin 16 | PTB5 — GPIO PTB5 |
Typische Anwendungen
MC9S08SH32CTG ist geeignet für 7 Anwendungs: Automotive Body Electronics, White Goods and Small Appliance Control, Industrial Sensor and Actuator Nodes, LED Lighting and Driver Modules, Battery-Powered Portable Devices, User Interface and HMI Modules, Legacy Installed-Base Maintenance.
Automotive Body Electronics
The MC9S08SH32CTG's 5 V-tolerant I/O and AEC-Q100 qualification make it a good fit for automotive body controllers such as window lift, seat control, and interior lighting modules. Its 32 KB Flash holds typical body-electronics firmware including multi-channel PWM, LIN slave stacks, and diagnostic routines, while the 16-pin TSSOP footprint fits compact mechatronic sub-assemblies. The part's 2.7 V-5.5 V supply range allows it to ride through automotive cranking transients when paired with proper input filtering. Single-wire BDI debug enables production-line flash programming without adding board traces for multi-wire JTAG. Compared to newer S08SG32 parts, the S08SH32 remains valuable for maintaining installed-base vehicle platforms already in volume production.
Empfohlen
White Goods and Small Appliance Control
In washing machines, dishwashers, microwave ovens, and small kitchen appliances, the MC9S08SH32CTG acts as a cost-optimized main controller that drives relays, triac-managed loads, and user-interface keypads. The 32 KB Flash accommodates user-interface state machines plus motor-control firmware, while the integrated timers provide the input-capture and PWM channels needed for sensorless AC line-frequency and triac-angle control. Designers benefit from the 5 V-tolerant GPIO to interface with legacy HMI matrix keypads and triac optocouplers directly. The 16-pin TSSOP footprint is small enough to fit behind a display PCB while still exposing enough GPIO for typical appliance tasks. The part's AEC-Q100 rating also helps manufacturers who share firmware between auto-qualified and consumer versions.
Empfohlen
Industrial Sensor and Actuator Nodes
The MC9S08SH32CTG fits distributed industrial sensor and actuator nodes (proximity, level, small valve control, conveyor tachometer) where a 5 V supply, 32 KB of code space, and a small PCB outline matter more than digital horsepower. The wide 2.7 V-5.5 V supply supports 24 V industrial bus conditioning through simple LDO dropping, while the single-wire BDI debug reduces field-service test fixtures to a single contact probe. The 16 GPIO are sufficient for typical industrial front-ends comprising a few analog inputs (via the on-chip ADC), one or two PWM outputs, and an asynchronous serial link to a master PLC or gateway. The 40 MHz CPU clock also lets the device run a lightweight Modbus RTU slave stack comfortably with margin for housekeeping tasks.
Empfohlen
LED Lighting and Driver Modules
Commercial and architectural LED luminaires rely on the MC9S08SH32CTG to perform constant-current dimming, color-temperature blending, and DMX/DALI front-end parsing in a compact BOM. The integrated PWM channels provide flicker-free dimming up to 16-bit resolution when run at the 40 MHz maximum, while 32 KB of Flash holds lookup tables for color profiles and temperature compensation curves. The 5 V GPIO directly drives standard LED-driver enable pins and feedback amplifier interfaces. The AEC-Q100 qualification opens the same firmware to outdoor architectural and automotive interior lighting variants. The TSSOP-16 footprint fits inside ultra-thin linear-LED housings where every millimeter of z-height is constrained.
Empfohlen
Battery-Powered Portable Devices
Handheld instruments, remote controls, and small portable tools benefit from the MC9S08SH32CTG's wide 2.7 V-5.5 V supply, which lets the device run directly from two or three alkaline, NiMH, or lithium cells. The S08SH family supports low-power STOP and WAIT modes, allowing firmware to duty-cycle peripherals such as ADC, PWM, or serial to extend battery life into multi-year timeframes for slowly polled sensor duties. The 16-pin TSSOP footprint, 32 KB Flash, and small core current mean the entire control PCB can be smaller than the battery holder. The single-wire BDI debug also simplifies sealed enclosures - one pad on the PCB is enough for production-grade flash programming and post-assembly test.
Empfohlen
User Interface and HMI Modules
The MC9S08SH32CTG serves as a slave Human-Machine Interface (HMI) controller inside keypads, rotary-knob sub-assemblies, and segment-LCD or LED-matrix front panels for industrial and appliance products. The 16 GPIO are configured as a matrix-scan keypad plus a few dedicated interrupt-capable inputs for rotary encoders, while 32 KB Flash holds debounce logic, communication stacks, and visual feedback routines. The single-wire BDI debug allows production test fixtures to upload custom keymaps at the end of the line without complex cable harnesses. The part's tolerance of 5 V signals lets designers connect legacy HMI boards with mixed 3.3 V / 5 V logic without level shifters, while the TSSOP-16 outline fits behind a front panel.
Empfohlen
Legacy Installed-Base Maintenance
For equipment manufacturers with hundreds of thousands of installed units shipped with the MC9S08SH32CTG, the part remains a service and repair stock item to keep customer fleets running. The device's identical drop-in variants - particularly the S08SH16, S08SH8, and S08SH4 siblings - allow field engineers to migrate legacy boards down the Flash ladder only when firmware revisions shrink, then re-flash on-site via BDI. Rochester Electronics and authorized after-market channels hold the part for repair depots, and NXP's product change notice documents the recommended S08SG32 and S08EL32 successors. The TSSOP-16 footprint and pinout mean migration to the modern family requires only a BOM swap, not a board respin.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08SH32CTG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08SH32CTL | MC9S08SH16CTG | MC9S08SH8CTG | MC9S08SH4MTGR | S9S08SG32E1CTGR |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 16-pin TSSOP | 16-pin TSSOP - same | 16-pin TSSOP - same | 16-pin TSSOP - same | 16-pin TSSOP - same | 16-pin TSSOP - same |
| Program Memory (Flash) | 32 KB | 32 KB | 16 KB (-50%) | 8 KB (-75%) | 4 KB (-87%) | 32 KB |
| CPU Core | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | HCS08 8-bit CISC |
| Maximum CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| GPIO Count | 16 | 16 | 16 | 16 | 16 | 16 |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | Active (recommended) |
Wichtigste Unterscheidungsmerkmale
- Industry-standard 5 V-tolerant I/O with AEC-Q100 qualification (vs. S9S08SG32E1CTGR)
- Single-wire Background Debug Interface (BDI) saves board space (vs. Larger S08 parts with multi-pin JTAG)
- On-chip in-circuit emulation with 2 comparators and 9 trigger modes (vs. External emulator tools)
- Member of a scalable Flash family (4 KB to 32 KB) sharing one footprint (vs. Mixed-footprint S08 derivatives)
Designhinweise
Estimated: Place a 100 nF decoupling capacitor within 3 mm of the VDD pin and add a bulk 10 uF ceramic or tantalum capacitor adjacent to the VSS return. The TSSOP-16 power and ground pins (pins 1 and 2) carry the internal logic rail, so minimizing the loop area between them and the bypass caps is essential for clean operation of the 40 MHz bus and the on-chip analog peripherals.
Route the single-wire BDI signal (BKGD pin) away from switching signals and clock sources, and provide a dedicated test pad or pogo-pin land for production programming. The BDI pin functions as both the bidirectional debug data line and the reset request entry point; a 4.7 kohm or weaker pull-up to VDD is typically recommended in NXP reference designs for stable in-circuit programming.
When migrating firmware across the S08SH Flash variants (32 KB / 16 KB / 8 KB / 4 KB), confirm code size fits the target part and re-link the project to the correct memory map. Estimated: a binary built for 32 KB will not run on a 4 KB SH4 part - link errors appear only when the unused segment exceeds the smaller part's Flash region. Always verify size after compiler/linker upgrade.
The TSSOP-16 package has an estimated thermal resistance (theta_JA) in the 90-100 C/W range for a 2 oz copper, 1 oz copper 4-layer JEDEC test board. At -40 C to +85 C ambient and modest MCU supply current, the junction remains well within limits; even at the upper ambient and full 5.5 V CPU activity, the die typically stays 30-40 C above ambient. For sealed enclosures without airflow, derate CPU clock or supply voltage if the junction approaches 125 C.
Compliance-Informationen
RoHS / REACH compliant per NXP product page. AEC-Q100 automotive qualified. Halogen-free status not explicitly listed in verified web data.