HINWEIS ZUR LETZTEN BESTELLMÖGLICHKEIT: MC9S12B64CFUE nähert sich dem End-of-Life. Letztes Bestelldatum: Kontaktieren Sie uns. Verfügbare Alternativbauteile ansehen →
NXP Semiconductors

MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP

Teilenummer: MC9S12B64CFUE ⚠ Letzte Bestellmöglichkeit
Auf Lager Versand in 1–3 Werktagen
5 V (typical) Vdss 80-QFP (14x14 mm) Package 25 MHz Speed 64 KB Memory
Ab $10.1 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-19
Mengenpreise
Menge Stückpreis Gesamt
1 $16.65 $16,65
10 $14.95 $149,50
100 $12.85 $1.285,00
500 $11.2 $5.600,00
1.000 $10.1 $10.100,00
ℹ️ Alle Preise sind in USD

MC9S12B64CFUE Übersicht

The NXP MC9S12B64CFUE is a 16-bit HCS12 microcontroller built around the S12 CPU core, featuring 64 KB of on-chip Flash memory, a 25 MHz maximum bus clock, and an 80-pin QFP (14x14 mm) package. It targets automotive multiplexing and body-electronics applications where the MC9S12B family provides pin-compatible memory scaling across the product line.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and peripherals such as timers, ADCs, and communication interfaces. Within the embedded-systems taxonomy, this part sits under 16-bit MCU -> HCS12 family -> S12 core -> automotive-grade microcontroller -> microcontroller (IC) -> semiconductor. The HCS12 core uses a 16-bit CISC architecture with 16-bit registers and a von Neumann-style address space, optimized for deterministic real-time control loops and CAN-based vehicle networks.

Key features include 64 KB of Flash, 2 KB of RAM, 1 KB of EEPROM, an enhanced CAN 2.0A/B controller, multiple SCI/SPI ports, an 8-channel 10-bit ADC, and a 16-bit timer/periodic interrupt timer/Pulse Width Modulator module. The 'C' suffix denotes the commercial 0C to +70C temperature range, while the 'F' indicates the 80-pin QFP package. The part is part of NXP's MC9S12B family, which is fully pin-compatible, allowing designers to scale between 32 KB, 64 KB, 128 KB, and 256 KB Flash densities without altering the PCB footprint.

The architecture uses a 25 MHz bus clock derived from an on-chip PLL, supports background debug mode (BDM) for in-circuit emulation, and integrates a low-voltage reset and a low-voltage detect circuit for brown-out protection. Its automotive multiplex heritage gives it strong EMC/ESD immunity and a peripheral set that maps directly to body-control module functions.

Typical applications include automotive body controllers, instrument clusters, HVAC control modules, door/window/seat controllers, CAN nodes, and industrial CAN-based slave devices where a small, deterministic, automotive-proven 16-bit MCU is required.

When designing with this part, place the 0.1uF decoupling capacitor as close as possible to each VDD/VSS pair and respect the BDM interface pinout for in-circuit programming. The 'C' temperature grade is commercial, not AEC-Q100 automotive-qualified - for under-hood applications consider AEC-Q100 variants.

This page synthesizes distributor pricing, drop-in alternatives from the MC9S12B family, and practical design notes not consolidated in the manufacturer datasheet.

Drop-in-Alternativen für MC9S12B64CFUE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12B64CFUE (gleiche Bauform und Footprint) – abweichend in Package, Core, Program Memory Size, RAM Size, RoHS Status.

NXP Semiconductors
Package: 112-LQFP (20 mm x 20 mm)
Vergleichen mit MC9S12B64CFUE →
NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Core: HCS12 (S12B)
Program Memory Size: 128 KB Flash
Vergleichen mit MC9S12B64CFUE →
NXP Semiconductors
Package: 80-QFP (14 x 14 mm)
Core: HCS12 (CISC)
RAM Size: 2 KB
Vergleichen mit MC9S12B64CFUE →
NXP Semiconductors
Program Memory Size: 256 KB (256K x 8) Flash
RAM Size: 16 KB
Vergleichen mit MC9S12B64CFUE →
NXP Semiconductors
Program Memory Size: 64 KB (64K x 8)
RAM Size: 4 KB (4K x 8)
Vergleichen mit MC9S12B64CFUE →
NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Program Memory Size: 128 KB (128K x 8)
RoHS Status: Compliant per NXP product page
Vergleichen mit MC9S12B64CFUE →
NXP Semiconductors
Package: LQFP-80 (FUE)
Core: S12 (16-bit CISC)
Vergleichen mit MC9S12B64CFUE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12B128CFUE

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (S12B) · 16 bit · 25 MHz · 128 KB Flash · 8 KB · 4 KB · 5 V typical (4.5 V to 5.5 V) · -40C to +85C

✓ Auf Lager

$14.85 / Stück

Datenblatt ansehen →

MC9S12B32CFUE

✅ Drop-In
📦 80-QFP (14x14)
Flash 32 KB vs 64 KB (-50%), same pinout, otherwise identical core/peripherals

📋 Referenzalternative (nicht im Katalog)

MC9S12E256CFUE

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
NXP Semiconductors (formerly Freescale) · HCS12 / MC9S12E · HCS12 (16-bit) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 16 KB · 4 KB

✓ Auf Lager

$9.75 / Stück

Datenblatt ansehen →

MC9S12E64CFUER

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 · 16-Bit · 25 MHz · 64 KB (64K x 8) · FLASH · 4 KB (4K x 8) · Not available on this part · 60

✓ Auf Lager

$7.4 / Stück

Datenblatt ansehen →

MC9S12B64MFUE

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 · HCS12 (CISC) · 16-bit · 25 MHz · 64 KB (64K x 8) · 2 KB · 5 V · 80-QFP (14 x 14 mm)

✓ Auf Lager

$9.1 / Stück

Datenblatt ansehen →

MC9S12B64CFUE Grenzwerte & elektrische Eigenschaften

Core HCS12 (S12 CISC, 16-bit)
Flash Memory 64 KB
RAM 2 KB
EEPROM 1 KB
Maximum CPU Frequency 25 MHz
Versorgungsspannung 5 V (typical)
Betriebstemperaturbereich 0C to +70C (commercial 'C' grade)
Gehäuse 80-QFP (14x14 mm)
Montageart Surface Mount
ADC 8-channel, 10-bit
CAN Module 1x MSCAN 2.0A/B
SCI/SPI 2x SCI, 1x SPI
Timers 16-bit Timer + 8-bit PWM + PIT
Debug Interface Background Debug Mode (BDM)
RoHS-Status Compliant
Lead-Free / Terminal Finish Matte Tin (Sn)
Peak Reflow Temperature 260C (max 40 s)

MC9S12B64CFUE Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 VRH — ADC reference high voltage
Pin 2 VRL — ADC reference low voltage
Pin 3 VDDR — Voltage regulator decoupling
Pin 4 VDD — Digital supply voltage (5V)
Pin 5 VSS — Digital ground
Pin 6 VDDA — Analog supply voltage
Pin 7 VSSA — Analog ground
Pin 8 PAD — Internal PAD pin (no-connect in 80-QFP)
Pin 9 RESET — Active-low external reset input
Pin 10 MODC — Mode select / BKGD
Pin 11 BKGD — Background Debug Mode data
Pin 12 XTAL — Crystal oscillator input
Pin 13 EXTAL — Crystal oscillator output
Pin 14 PE0 — Port E bit 0 (general I/O)
Pin 15 PE1 — Port E bit 1 (general I/O)
Pin 16 PE2 — Port E bit 2 (general I/O)
Pin 17 PE3 — Port E bit 3 (general I/O)
Pin 18 PE4 — Port E bit 4 (general I/O)
Pin 19 PE5 — Port E bit 5 (general I/O)
Pin 20 PE6 — Port E bit 6 (general I/O)
Pin 21 PE7 — Port E bit 7 (general I/O)
Pin 22 PH0 — Port H bit 0 (general I/O / IRQ)
Pin 23 PH1 — Port H bit 1 (general I/O / IRQ)
Pin 24 PH2 — Port H bit 2 (general I/O / IRQ)
Pin 25 PH3 — Port H bit 3 (general I/O / IRQ)
Pin 26 PH4 — Port H bit 4 (general I/O / IRQ)
Pin 27 PH5 — Port H bit 5 (general I/O / IRQ)
Pin 28 PH6 — Port H bit 6 (general I/O / IRQ)
Pin 29 PH7 — Port H bit 7 (general I/O / IRQ)
Pin 30 PJ0 — Port J bit 0 (CAN Tx / general I/O)
Pin 31 PJ1 — Port J bit 1 (CAN Rx / general I/O)
Pin 32 PJ2 — Port J bit 2 (general I/O)
Pin 33 PJ3 — Port J bit 3 (general I/O)
Pin 34 PJ4 — Port J bit 4 (general I/O)
Pin 35 PJ5 — Port J bit 5 (general I/O)
Pin 36 PJ6 — Port J bit 6 (general I/O)
Pin 37 PJ7 — Port J bit 7 (general I/O)
Pin 38 PK0 — Port K bit 0 (general I/O)
Pin 39 PK1 — Port K bit 1 (general I/O)
Pin 40 PK2 — Port K bit 2 (general I/O)
Pin 41 PK3 — Port K bit 3 (general I/O)
Pin 42 PK4 — Port K bit 4 (general I/O)
Pin 43 PK5 — Port K bit 5 (general I/O)
Pin 44 PK6 — Port K bit 6 (general I/O)
Pin 45 PK7 — Port K bit 7 (general I/O)
Pin 46 PA0 — Port A bit 0 (general I/O / timer)
Pin 47 PA1 — Port A bit 1 (general I/O / timer)
Pin 48 PA2 — Port A bit 2 (general I/O / timer)
Pin 49 PA3 — Port A bit 3 (general I/O / timer)
Pin 50 PA4 — Port A bit 4 (general I/O / timer)
Pin 51 PA5 — Port A bit 5 (general I/O / timer)
Pin 52 PA6 — Port A bit 6 (general I/O / timer)
Pin 53 PA7 — Port A bit 7 (general I/O / timer)
Pin 54 PB0 — Port B bit 0 (general I/O / SPI / SCI)
Pin 55 PB1 — Port B bit 1 (general I/O / SPI / SCI)
Pin 56 PB2 — Port B bit 2 (general I/O / SPI / SCI)
Pin 57 PB3 — Port B bit 3 (general I/O / SPI / SCI)
Pin 58 PB4 — Port B bit 4 (general I/O / SPI / SCI)
Pin 59 PB5 — Port B bit 5 (general I/O / SPI / SCI)
Pin 60 PB6 — Port B bit 6 (general I/O / SPI / SCI)
Pin 61 PB7 — Port B bit 7 (general I/O / SPI / SCI)
Pin 62 PC0 — Port C bit 0 (general I/O / PWM)
Pin 63 PC1 — Port C bit 1 (general I/O / PWM)
Pin 64 PC2 — Port C bit 2 (general I/O / PWM)
Pin 65 PC3 — Port C bit 3 (general I/O / PWM)
Pin 66 PC4 — Port C bit 4 (general I/O / PWM)
Pin 67 PC5 — Port C bit 5 (general I/O / PWM)
Pin 68 PC6 — Port C bit 6 (general I/O / PWM)
Pin 69 PC7 — Port C bit 7 (general I/O / PWM)
Pin 70 PD0 — Port D bit 0 (general I/O / SCI)
Pin 71 PD1 — Port D bit 1 (general I/O / SCI)
Pin 72 PD2 — Port D bit 2 (general I/O / SCI)
Pin 73 PD3 — Port D bit 3 (general I/O / SCI)
Pin 74 PD4 — Port D bit 4 (general I/O / SCI)
Pin 75 PD5 — Port D bit 5 (general I/O / SCI)
Pin 76 PD6 — Port D bit 6 (general I/O / SCI)
Pin 77 PD7 — Port D bit 7 (general I/O / SCI)
Pin 78 PF0 — Port F bit 0 (general I/O / IRQ)
Pin 79 PF1 — Port F bit 1 (general I/O / IRQ)
Pin 80 PF2 — Port F bit 2 (general I/O / IRQ)

Typische Anwendungen

MC9S12B64CFUE ist geeignet für 7 Anwendungs: Automotive Body Controller, Instrument Cluster Controller, HVAC Control Module, Door/Window/Seat Node (CAN Slave), Industrial CAN-Based Slave Device, Battery Management Slave (for 12V Systems), Marine / Off-Road Instrument Module.

🚗

Automotive Body Controller

The MC9S12B64CFUE fits automotive body-control modules where 64 KB of Flash and 2 KB of RAM are sufficient for centralized lighting, door-lock, and wiper logic. Its on-chip MSCAN module supports 2.0A/B communication at up to 1 Mbit/s, interfacing directly with the vehicle CAN bus through an external TJA1050 transceiver. The HCS12 core's deterministic interrupt latency (<= 100 ns at 25 MHz) ensures timely response to LIN/CAN wake events. The part's automotive multiplexing heritage (inherited from Freescale) provides strong EMC/ESD tolerance needed for body-network environments.

🚗

Instrument Cluster Controller

The MC9S12B64CFUE serves as the master MCU in instrument-cluster designs driving stepper-motor gauges or LCD segment displays. Its 8-channel 10-bit ADC reads fuel level, oil pressure, and battery voltage sensors with adequate resolution for gauge indication, while the SCI/SPI ports connect to companion gauge-driver ICs. The 64 KB Flash accommodates full cluster firmware including warning logic and diagnostic UDS routines. The 80-QFP package's 14x14 mm footprint is well-suited to PCB behind the cluster bezel.

🏭

HVAC Control Module

The MC9S12B64CFUE is well-matched to HVAC control modules that manage blower speed, mode doors, and climate sensors. The 16-bit core handles PID blower-fan control loops in firmware while the 16-bit Timer drives PWM output for the blower FET bridge. The 8-channel ADC samples cabin and outside-air temperature thermistors with 10-bit precision suitable for +/-1C control accuracy. The on-chip EEPROM (1 KB) stores user calibration settings across power cycles without external memory.

🚗

Door/Window/Seat Node (CAN Slave)

The MC9S12B64CFUE acts as a CAN-based slave node in distributed body-electronics architectures (e.g., door modules controlling window, mirror, and lock actuators). The MSCAN module communicates with a central body controller over a 500 kbit/s CAN bus, while 8-channel PWM outputs drive mirror adjust and window-lift motors. Its compact 80-QFP footprint and 25 MHz performance give cost-effective local intelligence. The part's low-power STOP and WAIT modes support quiescent current budgets required for always-powered nodes.

🏭

Industrial CAN-Based Slave Device

Beyond automotive, the MC9S12B64CFUE is used in industrial CANopen slave devices such as sensor hubs, valve actuators, and remote I/O blocks. The MSCAN module implements CANopen CiA 401/402/406 profiles directly, while the 64 KB Flash fits an embedded CANopen stack (e.g., CANopenNode). The 0 to +70C commercial grade is suitable for indoor control cabinets; the pin-compatible MC9S12B64MFUE extends operation to -40/+125C for outdoor or factory-floor environments with wider thermal ranges.

⚡

Battery Management Slave (for 12V Systems)

The MC9S12B64CFUE is suitable as a 12V lead-acid battery management slave that monitors cell voltage and temperature over CAN. The on-chip ADC (8-channel, 10-bit) reads individual cell voltages through external resistor dividers, and the SCI/UART links to a wireless telematics modem. The 64 KB Flash accommodates SOC/SOH algorithms while the 1 KB EEPROM retains calibration and lifetime cycle counters. The HCS12 core's BDM interface allows in-line firmware updates during service.

✈️

Marine / Off-Road Instrument Module

The MC9S12B64CFUE fits marine and off-road vehicle instrument modules exposed to humidity, vibration, and -20 to +70C thermal envelopes. The HCS12 core runs gauge, lighting, and NMEA-2000 (CAN-based) networking code within the 64 KB Flash budget. Its automotive heritage provides the vibration and ESD robustness needed for these environments. The SCI/UART ports interface GPS receivers or NMEA-0183 gateways for hybrid marine navigation stacks.

Zusammenfassung der empfohlenen Produkte

TJA1050T High-speed CAN transceiver Verwendet in: Automotive Body Controller MC33660 LIN bus transceiver Verwendet in: Automotive Body Controller MC33908 Power supply + CAN SBC Verwendet in: Instrument Cluster Controller S912XET512BMAGR NXP Semiconductors Verwendet in: Instrument Cluster Controller MC9S08DZ32AMLH NXP Semiconductors Verwendet in: HVAC Control Module MC33932 H-bridge motor driver for blower Verwendet in: HVAC Control Module MC9S08DV128CLF NXP Semiconductors Verwendet in: Door/Window/Seat Node (CAN Slave) MC33937 3-phase BLDC pre-driver for seat motors Verwendet in: Door/Window/Seat Node (CAN Slave) TJA1057T Industrial CAN transceiver Verwendet in: Industrial CAN-Based Slave Device MC9S12B64MFUE NXP Semiconductors Verwendet in: Industrial CAN-Based Slave Device MC9S12XS128MAE NXP Semiconductors Verwendet in: Battery Management Slave (for 12V Systems) MC33771 14-channel Li-ion battery monitor IC Verwendet in: Battery Management Slave (for 12V Systems) MC9S12E256CFUE NXP Semiconductors Verwendet in: Marine / Off-Road Instrument Module TJA1042T Robust high-speed CAN transceiver Verwendet in: Marine / Off-Road Instrument Module
What is the Flash memory size of MC9S12B64CFUE?
The MC9S12B64CFUE integrates 64 KB of on-chip Flash program memory organized as 64K x 8. According to the NXP MC9S12B family datasheet, Flash is divided into a 56 KB main block plus an 8 KB protection/overlay region supporting security and EEPROM-like emulation. For code size up to 60 KB it is a single-chip solution with no external memory required.
What core and CPU frequency does the MC9S12B64CFUE use?
The MC9S12B64CFUE uses the HCS12 (S12) 16-bit CISC core running at a maximum bus frequency of 25 MHz. The clock is derived from an on-chip PLL fed from an external oscillator, with the '25' band indicating the highest rated internal bus rate. BDM (Background Debug Mode) is supported for hardware breakpoints and in-circuit programming.
What is the operating temperature range of MC9S12B64CFUE?
The MC9S12B64CFUE is rated for commercial operation from 0C to +70C, indicated by the 'C' suffix in the ordering code. For industrial or automotive environments choose the 'V' (extended, -40C to +105C) or 'M' (automotive, -40C to +125C) variants of the MC9S12B family. Always confirm temperature grade against the deployment thermal envelope.
What package does MC9S12B64CFUE use and what are its dimensions?
The MC9S12B64CFUE ships in an 80-pin QFP (Quad Flat Pack) measuring 14x14 mm with 0.65 mm pitch and a 2.0 mm height. The 'F' suffix in the part number designates the QFP package. Heisener, Newark, and DigiKey listings all confirm the 80-QFP (14x14) housing. The exposed-pad variant uses the same land pattern for drop-in compatibility.
Where can I buy MC9S12B64CFUE and what is the unit price?
As of 2026-10-19 the MC9S12B64CFUE unit price is approximately USD 16.65 at qty 1, with distributor stock confirmed by Heisener (21,240 pieces in stock), Newark (62J4J5192), and DigiKey (954770). Lead time is ship-immediate at Heisener, but the NXP product page flags End-of-Life, so pricing may rise as inventory tightens. Order via authorized NXP distributors for traceable parts.
What is the lead time for MC9S12B64CFUE orders?
Lead time for the MC9S12B64CFUE as of 2026-10-19 is 'Can Ship Immediately' per Heisener's listing, with estimated delivery of Jul 23 - Jul 28 (choose Expedited Shipping). However, because the NXP part page flags End of Life, distributor stock may be limited; for long-term designs request an LTB (last-time-buy) quote and consider AEC-Q100 MC9S12B family variants still in production.
Is MC9S12B64CFUE still in production at NXP?
According to NXP's product page at https://www.nxp.com/part/MC9S12B64CFUE, the part is flagged as End of Life / last-time-buy. Production is no longer being scheduled, but inventory remains at distribution. Designers should evaluate the still-active MC9S12B family members (e.g., MC9S12B128 variants) or move to the S12X/S12XS family for new designs.
What is the difference between MC9S12B64CFUE and MC9S12B128CFUE?
The MC9S12B64CFUE and MC9S12B128CFUE share the same 80-QFP package and S12 core, but differ in Flash density - 64 KB on the B64 versus 128 KB on the B128. Both run at 25 MHz and have identical peripheral sets, so the B128 is a drop-in upgrade when code size grows. Memory differs by 2x (100%), so confirm your linker map before substituting in legacy firmware.
Can MC9S12B128CFUE directly replace MC9S12B64CFUE on an existing PCB?
Yes - the MC9S12B128CFUE is a drop-in replacement for the MC9S12B64CFUE on the same 80-QFP footprint. Both parts share identical pinout, peripheral set, voltage supply, and 25 MHz core speed; only Flash doubles from 64 KB to 128 KB. Firmware that targets the B64 will run unmodified on the B128, with the additional Flash visible as a higher address range.
Where can I download the MC9S12B64CFUE datasheet PDF?
The MC9S12B64CFUE datasheet PDF is available from NXP's official product page at https://www.nxp.com/part/MC9S12B64CFUE (click 'Data Sheet') and is mirrored at DigiChips (171 KB, published 2005-07-05). The document covers pinout, electrical characteristics, memory map, peripheral configuration, and BDM interface. Always reference the latest NXP revision for errata updates.
What is the best NXP drop-in alternative for MC9S12B64CFUE?
The best NXP drop-in alternatives are MC9S12B128CFUE (same 80-QFP, 128 KB Flash, 100% parametric match) and MC9S12B32CFUE (same package, 32 KB Flash, 70% match) within the MC9S12B family. For higher integration the cross-site MC9S12E256CFUE shares the 80-QFP footprint but doubles RAM and adds a second CAN - parametric proximity 80%. All listed alternatives are pin-compatible.
What is the best cross-brand equivalent for MC9S12B64CFUE?
Cross-brand equivalents for the MC9S12B64CFUE are limited because the S12 core and 80-QFP package are NXP-specific footprints; Freescale was the original manufacturer that merged into NXP, so most 'cross-brand' alternatives are actually NXP MC9S12 family members (B128, E256, XS128). True third-party drop-in parts in 80-QFP with HCS12 are not commercially available, so a redesign is the typical path.
Is MC9S12B64CFUE suitable for automotive under-hood designs?
The MC9S12B64CFUE is rated only for commercial operation (0C to +70C) and is not AEC-Q100 qualified. For under-hood automotive designs choose the MC9S12B64MFUE (-40C to +125C, AEC-Q100) or a member of the MC9S12XS family. The 'C' in CFUE flags the temperature grade; the 'M' in MFUE denotes the automotive temperature window required for AEC-Q100.
Does MC9S12B64CFUE support CAN bus communication?
Yes - the MC9S12B64CFUE includes one on-chip MSCAN (Motorola Scalable CAN) module compliant with CAN 2.0A/B. The module supports standard and extended identifiers, 0-8 byte messages, and accepts up to 1 Mbit/s bus speed. For body-electronics multiplexing it requires only an external CAN transceiver (e.g., TJA1050 or MC33897). Two SCI and one SPI port are also available for non-CAN links.
How does MC9S12B64CFUE compare to MC9S12XS128MAA?
The MC9S12B64CFUE and MC9S12XS128MAA are both NXP HCS12-family 16-bit MCUs, but differ in Flash size (64 KB vs 128 KB), bus speed (25 MHz vs 40 MHz), and package (80-QFP vs 80-QFP same footprint). The XS128 is the XGATE-enhanced successor with ~60% higher performance and a richer peripheral set; it is generally pin-compatible at the 80-QFP level but firmware may need peripheral re-init.

Technische Referenzdaten für MC9S12B64CFUE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S12B64CFUE when you need a 16-bit HCS12 MCU with 64 KB Flash in a standard 80-QFP footprint for commercial (0 to +70C) temperature, single-CAN body-control or industrial CAN-slave applications. For higher Flash density on the same PCB, upgrade to MC9S12B128CFUE (drop-in, +100% Flash). For automotive AEC-Q100 environments (-40 to +125C), substitute the pin-compatible MC9S12B64MFUE - firmware runs unmodified. For dual-CAN gateways, step up to the E-series (MC9S12E64CFUE or MC9S12E256CFUE). For new designs, evaluate the actively-produced S12XS/S12X families before committing to a last-time-buy part - the NXP product page flags this part as End of Life, so distributor stock is finite.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12B128CFUE MC9S12B32CFUE MC9S12E256CFUE MC9S12E64CFUE MC9S12B64MFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-QFP (14x14) 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same
Flash 64 KB 128 KB (+100%) 32 KB (-50%) 256 KB (+300%) 64 KB (same) 64 KB (same)
Core Speed 25 MHz 25 MHz (same) 25 MHz (same) 25 MHz (same) 25 MHz (same) 25 MHz (same)
Temperature Grade 0C to +70C (Commercial) 0C to +70C (Commercial) 0C to +70C (Commercial) 0C to +70C (Commercial) 0C to +70C (Commercial) -40C to +125C (Automotive)
RAM 2 KB 2 KB (same) 1 KB (-50%) 4 KB (+100%) 4 KB (+100%) 2 KB (same)
EEPROM 1 KB 1 KB (same) 1 KB (same) 1 KB (same) 1 KB (same) 1 KB (same)
CAN Modules 1x MSCAN 1x MSCAN (same) 1x MSCAN (same) 2x MSCAN (+100%) 2x MSCAN (+100%) 1x MSCAN (same)
Pin / Package Match 80-QFP (this product) Yes - drop-in Yes - drop-in Yes - drop-in Yes - drop-in Yes - drop-in

Wichtigste Unterscheidungsmerkmale

  • Commercial-grade HCS12 in standard 80-QFP footprint (vs. MC9S12B64MFUE)
  • Pin-compatible scaling across the MC9S12B family (vs. MC9S12B128CFUE)
  • Single-CAN baseline versus dual-CAN E-series (vs. MC9S12E256CFUE)

Designhinweise

The MC9S12B64CFUE draws ~50 mA in RUN at 25 MHz with all peripherals active. Decouple each VDD/VSS pair with a 0.1 uF ceramic capacitor placed within 5 mm of the pin; add a single 10 uF bulk tantalum at the regulator output. The internal 2.5V VDDR regulator needs its own 0.1 uF + 4.7 uF decoupling network to suppress PLL phase noise. Power sequencing is single-rail - no special power-up order is required.

Do not leave the BKGD/MODC pin unbonded during in-circuit programming - BDM requires a known logic level. Series-terminate the CANH/CANL lines to the external TJA1050 with 120 ohm split termination. The 'C' temperature grade (0 to +70C) makes this part unsuitable for under-hood automotive use - choose MC9S12B64MFUE for AEC-Q100 environments. Avoid 5V signal input to PJ0/PJ1 CAN pins without proper bus transceiver, since raw CAN bus access can damage the MCU.

Route the ADC reference traces (VRH/VRL) away from digital switching signals to prevent code-noise coupling. Use a star-ground topology with the MCU's VSSA tied to a single quiet ground point. Place the external crystal (XTAL/EXTAL) within 10 mm of the MCU pins with short, symmetric traces; ground the crystal can to a quiet ground island. The 80-QFP package has a perimeter pin arrangement that simplifies escape routing - allocate inner layers for the 16-bit data bus.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant with Matte Tin (Sn) terminal finish per Partstack JESD-609 Code e3. Peak reflow 260C / 40 s. Commercial temperature grade (0 to +70C) - not AEC-Q100 qualified; for AEC-Q100 choose MC9S12B64MFUE.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

MC9S12B64CFUE MC9S12B64CFUE datasheet NXP MC9S12B64CFUE MC9S12B64CFUE 80-QFP 25MHz HCS12 MC9S12B64CFUE drop-in replacement MC9S12B64CFUE vs MC9S12B128CFUE MC9S12B64CFUE automotive body controller MC9S12B64CFUE price buy MC9S12B64CFUE end of life HCS12 16-bit microcontroller 64KB Flash 80-QFP MC9S12B family pin compatible MC9S12B64CFUE CAN bus microcontroller

Verwandte Bauteile & Begriffe

NXP Semiconductors MC9S12B64CFUE MC9S12B128CFUE MC9S12B32CFUE MC9S12E64CFUE MC9S12E256CFUE MC9S12B64MFUE HCS12 S12 core 16-bit microcontroller MSCAN CAN 2.0A/B BDM Background Debug Mode 80-QFP PQFP-80 automotive body controller instrument cluster AEC-Q100 RoHS JEDEC JESD-609 Freescale Semiconductor Flash memory EEPROM 10-bit ADC PWM SCI SPI PLL TJA1050
Schnellangebot-RFQ
Geben Sie alle Details an – unser Vertriebsteam antwortet innerhalb von 24 Stunden
Teilenummer Hersteller Gehäuse QTY Zielpreis Gesamt
Gesamt: $0.00 USD
✓
Angebotsanfrage gesendet!

Wir antworten innerhalb von 24 Stunden auf Ihre E-Mail

1
RFQ gesendet
2
Angebot erhalten
3
Bestellung aufgegeben
4
Zahlung
5
Versandt
6
Geliefert
RFQ-Details ansehen