S912XET512BMAGR - 16-bit 50MHz 512KB Flash MCU | NXP
Teilenummer: S912XET512BMAGR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.8 | $9,80 |
| 10 | $8.85 | $88,50 |
| 100 | $7.9 | $790,00 |
| 500 | $7.15 | $3.575,00 |
| 1.000 | $6.6 | $6.600,00 |
S912XET512BMAGR Übersicht
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory (FLASH, RAM, EEPROM emulation), and peripherals such as timers, ADCs, and communication interfaces into one chip. In the broader system hierarchy, an MCU sits at the heart of an embedded system, spanning the taxonomy from microcontroller to embedded processor to semiconductor device. The 16-bit S12X family from NXP is a long-standing workhorse of automotive and industrial body electronics, where deterministic single-cycle performance, mature tooling, and automotive qualification matter more than raw processing throughput.
Key features of the S912XET512BMAGR include the XGATE co-processor, which offloads interrupt-driven and communication tasks to build virtual peripherals and boost overall system performance; a flexible, programmable, hardware-emulated EEPROM for parameter storage without external memory; and a memory protection unit with supervisor/user modes for system integrity. The integrated 12-bit ADC achieves 3 us conversion time, enabling fast, precise analog acquisition.
Technical depth: the S12X CPU executes at 50 MHz bus speed with enhanced capture timer (ECT), periodic interrupt timer (PIT), and real-time interrupt (RTI) modules for deterministic timing. The XGATE RISC co-processor runs independently, letting designers service CAN/LIN frames or manage I/O without burdening the main core. The 512KB FLASH provides ample code space for layered automotive software stacks.
Typical applications include automotive body control modules, instrument clusters, gateways, HVAC controllers, and industrial control systems requiring an AEC-qualified 16-bit MCU with rich timers and a fast ADC.
Design consideration: the LQFP-144 20x20 mm body requires careful PCB footprint planning and adequate ground/via stitching for analog performance; verify supply sequencing and JTAG/BDM access in early layouts.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet, with pricing and stock verified as of 2026-10-18.
Drop-in-Alternativen für S912XET512BMAGR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit S912XET512BMAGR (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Supply Voltage, ADC, Core.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
S912XET512J3MAGR
✅ Drop-In✓ Auf Lager
$16.4 / Stück
Datenblatt ansehen →S912XET512BMAG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S912XEG128W1MAAR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S912XET256B1MAAGR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
S912XET256J3MAGR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
S912XET512BMAGR Grenzwerte & elektrische Eigenschaften
| Core | HCS12X (S12X), 16-bit |
| Co-Processor | XGATE RISC co-processor |
| Bus Speed | 50 MHz |
| Flash Memory | 512KB (512K x 8) |
| EEPROM | Hardware-emulated EEPROM, flexible programmable |
| ADC Resolution | 12-bit |
| ADC Conversion Time | 3 us |
| Timers | Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) |
| Memory Protection | MPU with supervisor/user modes |
| Versorgungsspannung | 1.8V (per distributor listing) |
| Betriebstemperatur | -40C to +125C |
| Gehäuse | 144-LQFP (20x20 mm), gull-wing, LFQFP square |
| Number of Terminals | 144 |
| Montageart | Surface Mount |
| Qualification | Automotive Qualified |
| Program Memory Type | FLASH |
S912XET512BMAGR 144-lqfp (20x20 mm), gull-wing, lfqfp square Pinbelegungsleitfaden
Pinbelegung für S912XET512BMAGR (144-lqfp (20x20 mm), gull-wing, lfqfp square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für S912XET512BMAGR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
S912XET512BMAGR ist geeignet für 6 Anwendungs: Automotive Body Control Modules, Automotive Gateways and Network Nodes, Instrument Clusters, HVAC and Climate Control Units, Industrial Control and Automation Nodes, Engine Compartment Sensor Modules.
Automotive Body Control Modules
Body control modules (BCMs) coordinate lighting, door locks, wipers, and window motors across dozens of switched loads and status inputs. The S912XET512BMAGR fits this role directly: its automotive qualification for -40C to +125C covers under-dash and engine-bay mounting locations, the XGATE co-processor services LIN/CAN frame interrupts independently of the main S12X core, and the 12-bit, 3 us ADC digitizes potentiometer and NTC sensor inputs quickly enough for multiplexed sampling. The 512KB FLASH holds layered diagnostics, networking stacks, and feature variants for multiple vehicle trims, while the hardware-emulated EEPROM stores fault codes and configuration without an external memory IC. Using ECT and PIT timers, the MCU schedules load PWM and timeout supervision deterministically, a key requirement for OEM fault-tolerance specifications.
Empfohlen
Automotive Gateways and Network Nodes
Vehicle gateways route messages between CAN, LIN, and FlexRay segments, demanding interrupt handling capacity beyond a single CPU core. The S912XET512BMAGR addresses this with the XGATE RISC co-processor, which runs communication service routines as virtual peripherals while the S12X core executes application logic, effectively doubling usable throughput at the 50 MHz bus. The 512KB FLASH accommodates routing tables, diagnostic services (UDS), and multiple protocol stacks, and the memory protection unit with supervisor/user modes isolates critical network code from application tasks, supporting system integrity requirements. Because the 144-LQFP (20x20 mm) package exposes abundant I/O, one chip can terminate several physical buses plus discrete I/O, reducing board area. Automotive qualification to -40C to +125C matches gateway placement in interior and engine compartment harness locations.
Empfohlen
Instrument Clusters
Instrument clusters combine stepper-motor gauge driving, backlight control, warning indicator logic, and sensor acquisition, all under strict power-save and wake-up behavior. The S912XET512BMAGR is well suited: its 12-bit ADC with 3 us conversion time samples fuel-level and temperature inputs across a multiplexed front end, while enhanced capture timer (ECT) channels generate the precise phase-shifted waveforms stepper gauges require. The real-time interrupt (RTI) provides the calendar and wake timing, and the periodic interrupt timer (PIT) schedules refresh tasks deterministically. With 512KB FLASH, the firmware can include odometer storage algorithms, multiple language/graphic assets, and OTA-era diagnostic layers, with hardware-emulated EEPROM protecting odometer data integrity. The automotive -40C to +125C grade and proven S12X toolchain reduce qualification risk for tier-one cluster programs.
Empfohlen
HVAC and Climate Control Units
Automotive HVAC controllers blend damper-position servo control, blower PWM, and cabin sensor fusion - a workload matched to the S912XET512BMAGR's peripheral set. The 12-bit ADC with 3 us conversion digitizes in-car, ambient, and evaporator NTC channels with resolution sufficient for sub-degree control hysteresis, while PIT-scheduled control loops run predictably at fixed sample times. The XGATE co-processor handles LIN messages from the climate head unit so the main core can focus on actuator control loops. The 50 MHz S12X bus leaves timing headroom for Kalman-style cabin temperature estimation in the 512KB FLASH, and hardware-emulated EEPROM retains learned actuator end-stops across power cycles. Its -40C to +125C qualification covers HVAC electronic placement near blower resistors where ambient temperatures spike.
Empfohlen
Industrial Control and Automation Nodes
In industrial equipment, the S912XET512BMAGR serves as a deterministic control node where 16-bit execution, rich timers, and a fast ADC matter more than 32-bit throughput. The ECT module provides eight capture/compare channels suitable for quadrature decoding of encoders and precise PWM to actuators, while the 12-bit, 3 us ADC acquires analog transducer signals at control-loop speed. The 50 MHz bus and XGATE co-processor let one chip run the control loop, a Modbus or CAN service layer, and background diagnostics concurrently. The MPU with supervisor/user modes protects the control kernel from field-updated application code, and the 512KB FLASH allows versioned firmware images plus parameter storage in emulated EEPROM. The -40C to +125C range suits unventilated control cabinets and outdoor enclosures.
Empfohlen
Engine Compartment Sensor Modules
Under-hood sensor and actuator modules - pedal-position, level sensing, exhaust flap control - face the harshest automotive thermal environment, and the S912XET512BMAGR's -40C to +125C automotive qualification was designed for exactly this placement. Its 12-bit ADC with 3 us conversion time handles ratiometric sensor reads with filtering, while the hardware-emulated EEPROM stores end-of-line calibration values that survive years of key-off cycles. The XGATE co-processor executes time-critical sensor validity checks and watchdog feeds independently, supporting functional-safety supervision patterns, and the memory protection unit isolates calibration code. With 512KB FLASH, modules can carry multiple OEM calibration sets in one part number. The 144-LQFP gull-wing package supports AEC-grade board assembly and offers enough I/O to read redundant sensor paths without external multiplexing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für S912XET512BMAGR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | S912XET512J3MAGR | S912XEG128W1MAAR | S912XET256B1MAAGR |
|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | 16-bit S12X + XGATE | 16-bit S12X + XGATE | 16-bit S12X + XGATE | 16-bit S12X + XGATE |
| Flash Memory | 512KB (512K x 8) | 512KB | 128KB | 256KB |
| Bus Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| ADC Resolution | 12-bit, 3 us conversion | 12-bit, 3 us conversion | 12-bit, 3 us conversion | 12-bit, 3 us conversion |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Automotive Qualification | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Maximum FLASH in the same 144-LQFP footprint (vs. S912XEG128W1MAAR)
- Balanced memory for cost-sensitive variants (vs. S912XET256B1MAAGR)
- Tape-and-reel packaging for volume assembly (vs. S912XET512BMAG)
Designhinweise
The 144-LQFP (20x20 mm) gull-wing footprint requires a nominal 0.5 mm pitch land pattern per the NXP datasheet package drawing; confirm the footprint against the current revision before panel design. Place 100 nF decoupling capacitors at all VDD/VSS pin pairs, as close to the package as possible, with one bulk 10 uF per supply domain. Route the analog reference away from switching nets, and provide a via-stitched ground ring around the die region to control EMI and support the 12-bit ADC noise floor.
S12X family members differ by more than memory size - orderable suffixes encode package, temperature, and mask/EEPROM options. When substituting S912XET512BMAGR with another suffix, verify emulated EEPROM sector size and the XGATE mask option in the NXP device specification, not just the FLASH byte count. Also confirm BDM debug access on your PCB: the single-wire background debug pin must be routed to a header, because reprogramming FLASH on assembled boards is otherwise impossible during development.
Feed the MCU from a 5V-tolerant S12X supply rail as specified in the NXP device datasheet; distributor listings reference a 1.8V-related supply characteristic, so verify the exact VDD and VDDA/DDR ranges for the BMAG mask option before finalizing the power tree. Add a reset supervisor with a monitored 5V rail and brown-out threshold above the flash-programming minimum. Estimated: budget I/O current per pin group against the module total to size the SBC or linear regulator, using datasheet absolute maximums, not typical values.
Compliance-Informationen
Distributor listings (Mouser, NXP) describe the part as Automotive Qualified with -40C to +125C grade. RoHS/REACH/lead-free status not stated in the retrieved data; confirm on the NXP product page for the exact orderable code.
