MC9S12GC64MFUE - 16-bit HCS12 MCU, 64KB Flash, 50MHz | NXP
Teilenummer: MC9S12GC64MFUE ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.42 | $4.210,00 |
| 1.000 | $7.1 | $7.100,00 |
MC9S12GC64MFUE Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one silicon die. The 16-bit HCS12 family sits within NXP's S12 automotive MCU portfolio, which itself belongs to the broader embedded microcontroller category - a subclass of microprocessors and of integrated circuits (ICs). The S12 line targets body, chassis, and gateway automotive ECUs that require deterministic real-time response and a robust instruction set.
Key features of the MC9S12GC64MFUE include 60 programmable I/O lines, 2.35 V to 2.75 V core supply (with 5 V-tolerant I/O supported by the on-chip regulator from a 2.97 V to 5.5 V external source), 50 MHz maximum CPU/bus clock, 64 KB of on-chip Flash, an integrated phase-locked loop (PLL) for flexible clock generation, and an internal bandgap-based voltage regulator. The 80-QFP package provides ample I/O for body-controller class designs while remaining hand-solderable for prototype work.
The HCS12 core is a 16-bit CISC architecture with full 16-bit data paths, a large register file, and rich addressing modes suited to bit-oriented automotive body electronics. The PLL enables power and performance trade-offs by allowing the core to run slower when dormant and ramp up under interrupts. The integrated bandgap regulator reduces external component count versus discrete LDO designs.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, and CAN/LIN gateway nodes. The combination of 64 KB Flash, 50 MHz CPU, and 60 I/O lines suits moderate-complexity real-time control tasks. The wide 2.97 V to 5.5 V external supply tolerates cranking and load-dump events on 12 V automotive rails.
When designing with this MCU, budget PCB area for decoupling capacitors near each supply pin and ensure the BKGD pin is accessible for in-circuit debugging. Programming is performed via the standard BDM (Background Debug Mode) interface - leave the BKGD and MODC pins accessible for development and production flashing.
Drop-in-Alternativen für MC9S12GC64MFUE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12GC64MFUE (gleiche Bauform und Footprint) – abweichend in Package, Core, ADC, Core Architecture, Program Memory Size.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12GC128MFUE
✅ Drop-In✓ Auf Lager
$7.1 / Stück
Datenblatt ansehen →MC9S12GC64CFUE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12C64VFUE
✅ Drop-In✓ Auf Lager
$10.2 / Stück
Datenblatt ansehen →MCS12GC64CFUE
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S12E64MFUE
✅ Drop-In✓ Auf Lager
$9.2 / Stück
Datenblatt ansehen →MC9S12GC64MFUE Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Core | HCS12 (16-bit CISC) |
| Datenbusbreite | 16 bit |
| Program Memory Type | Flash |
| Program Memory Size | 64 KB (64K x 8) |
| Maximum CPU/Bus Clock | 50 MHz |
| Supply Voltage (External) | 2.97 V to 5.5 V |
| Core Supply Voltage | 2.35 V to 2.75 V (internal) |
| I/O Ports | 60 |
| I/O Supply | 5 V typical (with internal regulator) |
| Package Type | QFP-80 (14x14 mm, PQFP) |
| Montageart | Surface Mount |
| Terminal Form | Gull Wing |
| Temperature Grade | Automotive |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) |
| RoHS-Status | Compliant |
MC9S12GC64MFUE Pin-Konfiguration
| Pin 1 | PP0/KWP0 — Port P I/O / Keypad wake-up |
| Pin 5 | VDDR — External regulator supply (5 V) |
| Pin 10 | RESET — Reset input (active low) |
| Pin 15 | BKGD — Background Debug Mode |
| Pin 20 | VDD — Internal digital supply (decouple) |
| Pin 25 | VSS — Ground |
| Pin 30 | PA0 — Port A bit 0 |
| Pin 35 | PA7 — Port A bit 7 |
| Pin 40 | PB0 — Port B bit 0 |
| Pin 45 | PB7 — Port B bit 7 |
| Pin 50 | PE0/XIRQ — Port E bit 0 / Non-maskable interrupt |
| Pin 55 | PE7 — Port E bit 7 |
| Pin 60 | PK0 — Port K bit 0 |
| Pin 65 | PK7 — Port K bit 7 |
| Pin 70 | PT0 — Port T bit 0 (timer) |
| Pin 75 | PT7 — Port T bit 7 |
| Pin 78 | PS0/RXD0 — Port S bit 0 / SCI RX |
| Pin 80 | PS1/TXD0 — Port S bit 1 / SCI TX |
Typische Anwendungen
MC9S12GC64MFUE ist geeignet für 6 Anwendungs: Automotive Body Controller, Instrument Cluster, HVAC Control Module, Automotive Lighting Controller, CAN/LIN Gateway Node, Industrial Sensor Interface Module.
Automotive Body Controller
The MC9S12GC64MFUE's 60 I/O pins and 2.97 V to 5.5 V external supply range make it ideal for body controller modules that aggregate switches, lamps, and actuators on a 12 V automotive bus. Its on-chip bandgap regulator removes the need for an external LDO, and 64 KB Flash is sufficient for typical body-control firmware including CAN/LIN drivers and switch-matrix debouncing. The 50 MHz HCS12 core runs state-machine logic comfortably. The 80-QFP package offers generous I/O for lamp drivers, motor outputs, and switch inputs while keeping the BOM lean.
Empfohlen
Instrument Cluster
The MC9S12GC64MFUE's 50 MHz CPU clock and 16-bit data path suit instrument clusters driving segmented LCDs or stepper-motor gauges. The wide external supply (2.97 V to 5.5 V) tolerates cranking transients on 12 V automotive rails without brownout, and the 64 KB Flash hosts gauge calibration tables and warning-logic code. The 60 I/O lines accommodate gauge drive outputs, telltale LEDs, and CAN bus input from the vehicle network.
Empfohlen
HVAC Control Module
The MC9S12GC64MFUE serves HVAC control modules by combining 60 I/O for switches, blowers, and mode-door actuators with 64 KB Flash for control firmware. The internal bandgap regulator and 2.97 V to 5.5 V external supply simplify 12 V automotive power trees. The 50 MHz core executes PID blower/actuator control loops with comfortable headroom, and the HCS12 CISC instruction set handles bit-packed I/O efficiently.
Empfohlen
Automotive Lighting Controller
The MC9S12GC64MFUE's 60 I/O lines and 50 MHz HCS12 core suit lighting controllers for interior/exterior lamps, including LED drivers and turn-signal sequencing. The wide external supply tolerance (2.97 V to 5.5 V) absorbs load-dump events on 12 V automotive rails. The 64 KB Flash accommodates animated turn-signal, welcome-light, and dimming profiles while remaining NRND-tolerant for existing platforms.
Empfohlen
CAN/LIN Gateway Node
The MC9S12GC64MFUE acts as a low-cost gateway between CAN and LIN sub-networks in distributed automotive E/E architectures. Its 50 MHz core runs CAN/LIN stacks comfortably, and 64 KB Flash accommodates message-routing tables. The on-chip bandgap regulator simplifies the power tree for body-zone modules, and the 80-QFP package exposes both CAN and LIN channels plus the necessary I/O for diagnostic and wake-up signaling.
Empfohlen
Industrial Sensor Interface Module
Although designed for automotive, the MC9S12GC64MFUE's 2.97 V to 5.5 V supply and 60 I/O lines also suit industrial sensor-interface modules on 24 V rails (with external regulation). The 50 MHz HCS12 core runs Modbus or CANopen stacks, and 64 KB Flash holds protocol plus sensor calibration data. The QFP-80 package is hand-solderable for prototype builds, and the HCS12 BDM interface simplifies firmware iteration.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12GC64MFUE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12GC128MFUE | MC9S12GC64CFUE | MC9S12C64VFUE | MCS12GC64CFUE | MC9S12E64MFUE |
|---|---|---|---|---|---|---|
| Package | QFP-80 (14x14 mm) | QFP-80 (14x14 mm) - same | QFP-80 (14x14 mm) - same | QFP-80 - same | QFP-80 (14x14 mm) - same | QFP-80 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 (16-bit) | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same | HCS12 (16-bit) - same |
| Flash Memory | 64 KB | 128 KB (+100%) | 64 KB (same) | 64 KB (same) | 64 KB (same) | 64 KB (same) |
| Maximum CPU Clock | 50 MHz | 50 MHz (same) | 50 MHz (same) | 25 MHz (-50%) | 50 MHz (same) | 25 MHz (-50%) |
| External Supply Voltage | 2.97 V to 5.5 V | 2.97 V to 5.5 V (same) | 2.97 V to 5.5 V (same) | 2.97 V to 5.5 V (same) | 2.97 V to 5.5 V (same) | 3.13 V to 5.5 V |
| I/O Pins | 60 | 60 (same) | 60 (same) | 60 (same) | 60 (same) | 60 (same) |
| Lifecycle Status | NRND | NRND | Active | NRND | NRND | NRND |
| Temperature Grade | Automotive | Automotive | Automotive | Automotive | Automotive | Automotive |
Wichtigste Unterscheidungsmerkmale
- Direct upgrade path with 100% more Flash (vs. MC9S12GC128MFUE)
- Identical silicon with active lifecycle status (vs. MC9S12GC64CFUE)
- Lower CPU clock with identical footprint (vs. MC9S12C64VFUE)
- Wider external supply tolerance (vs. MC9S12E64MFUE)
Designhinweise
The MC9S12GC64MFUE accepts 2.97 V to 5.5 V on its VDDR pin and uses an on-chip bandgap regulator to derive the internal 2.35 V to 2.75 V digital supply. Place a 100 nF decoupling capacitor on each VDDR pin and a bulk 4.7 uF to 10 uF ceramic on the regulator output. On automotive 12 V rails add a reverse-battery and load-dump protection network upstream of VDDR to prevent exceeding the 5.5 V absolute maximum.
Use a four-layer PCB with continuous ground plane under the QFP-80 package to keep digital switching noise away from analog references. Route the BKGD and RESET traces first and keep them short; both are high-impedance during reset. Place the external crystal or resonator within 5 mm of the EXTAL/XTAL pins and guard the traces with ground to minimize EMI pickup that could destabilize the PLL.
Do not assume Flash endurance is unlimited - the S12GC Flash is rated for limited erase/program cycles. Implement wear-leveling in EEPROM-emulation schemes and avoid continuous background writes. Verify the device security bytes before locking; once secured the BDM interface is restricted. Also confirm the VDD/VSS pin pairs are all bonded and connected - some S12GC derivatives de-populate certain pins which affects layout reuse from similar parts.
Keep the BDM (Background Debug Mode) header accessible on production PCBs - even lockbits-secured devices often require factory programming via BDM. Route the MODC pin to a known state (typically grounded through a 10k resistor) to select normal single-chip mode at reset. Provide test points on BKGD, RESET, VDDR, and GND to simplify bench bring-up and production test fixtures.
Compliance-Informationen
AEC-Q100 qualified per NXP automotive-grade designation; RoHS compliant per NXP product page; REACH compliance per EU regulatory statements. Halogen-free status not explicitly stated in the verified web data.
