MC9S12P96MFT - 16-bit S12 MCU, 96KB Flash, 32MHz, CAN | NXP
Teilenummer: MC9S12P96MFT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.92 | $8,92 |
| 10 | $8.05 | $80,50 |
| 100 | $6.92 | $692,00 |
| 500 | $5.98 | $2.990,00 |
| 1.000 | $5.42 | $5.420,00 |
| 2.500 | $4.95 | $12.375,00 |
MC9S12P96MFT Übersicht
An automotive microcontroller is a small computer-on-a-chip built to drive sensors and actuators inside a car; within that hierarchy the MC9S12P96MFT belongs to the 16-bit MCU tier, the HCS12 CISC family, the S12P sub-family, and ultimately the broader power-management and body-electronics category of automotive semiconductors. Its 96 KB Flash makes it well suited to layered CAN stacks with OSEK/OS-aware boot logic, while the 32 MHz core keeps interrupt latency and CAN bit-quantum budgets predictable at 500 kbps.
Key features include the 32 MHz CPU12 core with background-debug mode (BDM), 96 KB on-chip Flash (96K x 8), 4 KB EEPROM (4K x 8) for non-volatile data, 6 KB RAM (6K x 8), 34 general-purpose I/O pins, and an integrated CAN 2.0 A/B controller. The chip operates from a single 3.13 V to 5.5 V supply and includes low-voltage detect (LVD), power-on reset (POR), a watchdog timer, and PWM channels for motor and lighting control.
Typical applications include automotive body control modules (BCM), HVAC control heads, instrument-cluster slaves, door/window/liftgate modules, and LIN/CAN gateway nodes where a small CAN-capable 16-bit MCU with automotive temperature range is required. The wide supply range also makes it practical for industrial 24V-bus sensor conditioning when paired with external regulators.
When designing with this device, ensure the QFN-EP thermal pad is soldered to a sufficiently large copper pour to keep junction temperature within the 125C ambient rating. The CAN transceiver must be a 5 V tolerant part such as the TJA1051 or MC33901 to match the 5 V nominal supply of this MCU family.
This page synthesizes distributor pricing, pin-compatible S12P alternatives, and practical design notes that are not always visible in the manufacturer datasheet. Engineers evaluating the MC9S12P96MFT for body-electronics or industrial CAN nodes should treat it as the highest-density member of the S12P 48-QFN footprint family.
Drop-in-Alternativen für MC9S12P96MFT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12P128MFT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12P64MFT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12P32MFT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12P96CFT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
S9S12P96MFT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC9S12P96MFT Grenzwerte & elektrische Eigenschaften
| Core | HCS12 (CPU12) |
| Core Size | 16-bit |
| Bus Speed | 32 MHz |
| Program Memory (Flash) | 96 KB (96K x 8) |
| EEPROM Size | 4 KB (4K x 8) |
| RAM Size | 6 KB (6K x 8) |
| Number of I/O | 34 |
| Versorgungsspannung | 3.13 V to 5.5 V |
| Connectivity | CAN, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Betriebstemperatur | -40C to +125C |
| Gehäuse | 48-QFN-EP (7x7 mm) |
| Montageart | Surface Mount |
| Family | S12P |
| Lebenszyklusstatus | Active |
| RoHS-Status | Compliant |
MC9S12P96MFT Pin-Konfiguration
| Pin 1 | VDDR — Voltage regulator supply |
| Pin 2 | VDD — Digital supply voltage |
| Pin 3 | VSS — Ground |
| Pin 4 | XCLKS — Crystal oscillator select |
| Pin 5 | EXTAL — External clock / crystal input |
| Pin 6 | XTAL — Crystal output |
| Pin 7 | RESET — External reset (active low) |
| Pin 8 | BKGD — Background Debug Mode |
| Pin 9 | PAD0/TXD0 — GPIO / SCI0 transmit |
| Pin 10 | PAD1/RXD0 — GPIO / SCI0 receive |
| Pin 11 | PAD2/MOSI0 — GPIO / SPI0 master out |
| Pin 12 | PAD3/MISO0 — GPIO / SPI0 master in |
| Pin 13 | PAD4/SCK0 — GPIO / SPI0 clock |
| Pin 14 | PAD5/SS0 — GPIO / SPI0 slave select |
| Pin 15 | PAD6/CANTX — GPIO / CAN transmit |
| Pin 16 | PAD7/CANRX — GPIO / CAN receive |
| Pin 17 | VDDX — I/O supply voltage |
| Pin 18 | VSSX — I/O ground |
| Pin 19 | PAD8 — GPIO / PWM channel |
| Pin 20 | PAD9 — GPIO / PWM channel |
| Pin 21 | PAD10 — GPIO / PWM channel |
| Pin 22 | PAD11 — GPIO / PWM channel |
| Pin 23 | PAD12 — GPIO / TIM channel |
| Pin 24 | PAD13 — GPIO / TIM channel |
| Pin 25 | PAD14 — GPIO / TIM channel |
| Pin 26 | PAD15 — GPIO / TIM channel |
| Pin 27 | PAD16 — GPIO / ATD channel |
| Pin 28 | PAD17 — GPIO / ATD channel |
| Pin 29 | PAD18 — GPIO / ATD channel |
| Pin 30 | PAD19 — GPIO / ATD channel |
| Pin 31 | PAD20 — GPIO / ATD channel |
| Pin 32 | PAD21 — GPIO / ATD channel |
| Pin 33 | PAD22 — GPIO / ATD channel |
| Pin 34 | PAD23 — GPIO / ATD channel |
| Pin 35 | PAD24 — GPIO / ATD channel |
| Pin 36 | PAD25 — GPIO / ATD channel |
| Pin 37 | PAD26 — GPIO / ATD channel |
| Pin 38 | PAD27 — GPIO / ATD channel |
| Pin 39 | PAD28 — GPIO / ATD channel |
| Pin 40 | PAD29 — GPIO / ATD channel |
| Pin 41 | PAD30 — GPIO / ATD channel |
| Pin 42 | PAD31 — GPIO / ATD channel |
| Pin 43 | VDDA — ADC supply voltage |
| Pin 44 | VSSA — ADC ground |
| Pin 45 | AVRH — ADC reference high |
| Pin 46 | AVRL — ADC reference low |
| Pin 47 | TEST — Test mode (tie to VSS) |
| Pin 48 | EP — Exposed thermal pad - connect to VSS |
Typische Anwendungen
MC9S12P96MFT ist geeignet für 7 Anwendungs: Automotive Body Control Module (BCM), HVAC Control Head Module, Door and Window Liftgate Module, Instrument Cluster Slave / Tell-tale Driver, CAN/LIN Gateway Node, Industrial 24 V CAN Sensor Node, Automotive Lighting Controller.
Automotive Body Control Module (BCM)
The MC9S12P96MFT fits automotive BCMs because its 96 KB Flash hosts an OSEK/OS-aware CAN stack plus lighting/window/lock application code, while the on-chip CAN 2.0 A/B controller handles body-network traffic at 500 kbps. At 32 MHz the CPU12 core keeps interrupt latency under 1 us, critical for debouncing switch inputs in real time. Compared with an 8-bit MCU of similar cost, the S12P adds EEPROM for last-state memory and a PWM block for LED dimming without an external driver. Place a TJA1051 transceiver on the CANH/CANL pair and route the QFN exposed pad to a 1 square inch copper pour for thermal margin under hood conditions.
Empfohlen
HVAC Control Head Module
The MC9S12P96MFT is well matched to HVAC control heads because its 34 GPIOs drive seven-segment or dot-matrix displays, multiplex keypads, and read NTC temperature sensors through the on-chip ADC. The 32 MHz core runs closed-loop PID fan and flap control without missing sample intervals. 4 KB of byte-erasable EEPROM stores user preferences, while 6 KB RAM buffers fault logs. The 48-QFN-EP (7x7 mm) footprint allows a compact PCB behind the dashboard cluster. Use SCI to talk to a LIN actuator driver and route the device on the chassis-ground CAN bus for diagnostics.
Empfohlen
Door and Window Liftgate Module
Door and liftgate modules need a CAN-connected MCU that can run PWM at 1 kHz for window lift and mirror-fold motors, and the MC9S12P96MFT provides that with its on-chip PWM timers plus the S12P peripheral set. The 96 KB Flash holds the anti-pinch algorithm plus CAN diagnostics, while 4 KB EEPROM retains learned end-of-travel positions after key-off. The -40C to +125C rating survives door-cavity temperature swings, and the 48-QFN-EP package fits inside the door handle or mirror housing. Add external MOSFET bridges for the window motor and route the CAN bus through a TJA1051.
Empfohlen
Instrument Cluster Slave / Tell-tale Driver
An instrument cluster slave needs deterministic timing for indicator lamps and the MC9S12P96MFT delivers that through hardware PWM channels and a 32 MHz CPU12 core that completes telltale blink logic without jitter. The 96 KB Flash stores graphic assets and CAN decoding tables, while 4 KB EEPROM retains odometer and service-interval data. The on-chip SCI links to a main cluster MCU, and the 48-QFN-EP footprint supports compact PCB placement behind the cluster bezel. Use the LVD and POR peripherals to validate 5 V rail stability before enabling lamp drivers.
Empfohlen
CAN/LIN Gateway Node
A CAN/LIN gateway sits between the body network and a LIN sub-bus, and the MC9S12P96MFT fits this role with its MSCAN controller plus SCI that can be bit-banged to LIN. The 96 KB Flash holds the routing table and protocol translation layer, while 6 KB RAM buffers messages during burst conditions. At 32 MHz the CPU has enough headroom for 500 kbps CAN-to-LIN bridging with sub-millisecond latency. The 48-QFN-EP package and 5 V supply let designers reuse the same PCB across gateway variants.
Empfohlen
Industrial 24 V CAN Sensor Node
Industrial CAN nodes can repurpose the MC9S12P96MFT because its 3.13 V to 5.5 V supply tolerates 24 V bus systems when paired with a switching regulator, and its -40C to +125C rating covers outdoor enclosures. The 96 KB Flash hosts sensor-calibration tables plus CANopen stack, while the 32 MHz core keeps 1 ms cycle times for process variables. The 48-QFN-EP (7x7 mm) footprint fits inside small IP67 sensor housings, and the on-chip EEPROM stores node ID and baud-rate settings. Add ESD protection on the CAN lines and a TVS on the supply for surge immunity.
Empfohlen
Automotive Lighting Controller
LED lighting modules benefit from the MC9S12P96MFT's PWM channels for dimming and color-mixing algorithms, plus its 32 MHz CPU12 core that runs current-control loops with sub-microsecond resolution. The 96 KB Flash stores lamp-specific calibration data and CAN diagnostics, while the 4 KB EEPROM records lifetime hours. The 48-QFN-EP package allows placement inside headlamp or tail-lamp housings where temperature regularly exceeds 85C. Drive external MOSFET LED strings and route the CAN bus through an isolated transceiver in high-voltage lighting systems.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12P96MFT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12P128MFT | MC9S12P64MFT | MC9S12P32MFT | MC9S12P96CFT | S9S12P96MFT |
|---|---|---|---|---|---|---|
| Package | 48-QFN-EP (7x7 mm) | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same | 48-QFN-EP (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 32 MHz | HCS12 32 MHz | HCS12 32 MHz | HCS12 32 MHz | HCS12 32 MHz | HCS12 32 MHz |
| Flash Size | 96 KB | 128 KB | 64 KB | 32 KB | 96 KB | 96 KB |
| RAM Size | 6 KB | 6 KB | 4 KB | 2 KB | 6 KB | 6 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Temperature Grade | Automotive -40C to +125C | Automotive -40C to +125C | Automotive -40C to +125C | Automotive -40C to +125C | Commercial 0C to +70C | Automotive -40C to +125C |
| CAN Controller | MSCAN 2.0 A/B | MSCAN 2.0 A/B | MSCAN 2.0 A/B | MSCAN 2.0 A/B | MSCAN 2.0 A/B | MSCAN 2.0 A/B |
| GPIO Count | 34 | 34 | 34 | 34 | 34 | 34 |
Wichtigste Unterscheidungsmerkmale
- Largest Flash in S12P 48-QFN-EP family (vs. MC9S12P128MFT)
- Highest-density automotive CAN MCU in 7x7 mm QFN (vs. MC9S12P32MFT)
- Automotive -40C to +125C temperature grade (vs. MC9S12P96CFT)
Designhinweise
The 48-QFN-EP package dissipates heat through the exposed thermal pad (EP) on the bottom. Connect EP to a continuous ground copper pour of at least 1 square inch (6.45 cm^2) on the top layer, plus thermal vias to inner ground planes. Estimated: at 5 V supply and 50 mA active current, power dissipation is roughly 0.25 W; the 31 C/W junction-to-ambient thermal resistance keeps the junction temperature rise near 8C above ambient - well within the 125C automotive limit.
Decouple VDD and VDDR each with a 100 nF ceramic capacitor placed within 3 mm of the corresponding pin. Place a bulk 4.7 uF or 10 uF tantalum/ceramic capacitor near the regulator output. Hold RESET low for at least 32 system-clock cycles after VDD stabilizes above 3.13 V to guarantee a clean POR. The on-chip voltage regulator (VDDR) requires an external decoupling capacitor per the S12P family datasheet.
Route the EXTAL/XTAL traces as short, symmetric pairs with a grounded guard ring to reduce EMI susceptibility. Keep CANH/CANL traces as a 100 ohm differential pair with matched length, and place the CAN transceiver within 10 mm of the CAN pads. Avoid routing digital signals under the QFN-EP pad to prevent coupling into the analog ADC reference (AVRH/AVRL).
Do not leave the TEST pin floating - tie TEST to VSS per the S12P family datasheet, otherwise the device may enter test mode at power-up. Program the PLL to keep the bus clock at or below 32 MHz; exceeding this violates the 5 V supply spec. Ensure the BKGND pin has a pull-up or proper BDM connector; a floating BKGD pin can cause unpredictable debug behaviour during reset.
The CAN bus requires a 120 ohm termination resistor at each end of the segment; split termination (two 60 ohm in series with a 4.7 nF to ground) improves EMI on automotive harnesses. The SPI bus should run at or below 1/4 of the system clock to avoid bus errors, and use series resistors near the master output to dampen reflections on long PCB traces. ADC reference pins (AVRH/AVRL) must be bypassed with 100 nF and 1 uF capacitors placed within 5 mm of the pins.
Compliance-Informationen
RoHS compliant per NXP product page. AEC-Q100 qualified for automotive applications per the S12P family datasheet. Lead-free and halogen-free per NXP packaging documentation.