MC9SDG256BCFUR2 - 16-Bit 50MHz 256KB Flash MCU | NXP
Teilenummer: MC9SDG256BCFUR2 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MC9SDG256BCFUR2 Übersicht
A microcontroller is a semiconductor device that integrates a processor core, memory, peripheral interfaces, and control logic into one package. In the hierarchy of electronic components, this CPU12 device belongs to the embedded-controller, microcontroller, and semiconductor categories. Its flash memory supports firmware storage, while its 16-bit CPU architecture and 50 MHz operating frequency provide a defined platform for real-time control, communication, timing, and peripheral-intensive products.
The verified data confirms the principal product attributes: 16-bit CPU12 architecture, 50 MHz operation, 256 KB flash memory, 256K x 8 organization, and an 80-QFP package measuring 14 x 14 mm. The same product is also described in one retrieved distributor result as a 25 MHz PQFP80 embedded microcontroller, creating a frequency discrepancy that requires confirmation against the manufacturer datasheet before design release. Other electrical ratings, pin functions, memory maps, peripheral resources, and environmental limits are not included in the supplied verified data.
MC9SDG256BCFUR2 is relevant to embedded automotive electronics, industrial controllers, communication modules, motor-control systems, and other products requiring a compact 80-lead microcontroller. The package size and pin count provide a defined PCB footprint, but exact pin assignments cannot be reproduced safely without the complete manufacturer pinout. Firmware developers should also verify clock, memory, peripheral, and electrical details against the official HCS12 documentation before selecting pull-ups, decoupling, external interfaces, or production test procedures.
The primary design consideration is source validation. Because the retrieved records disagree on operating frequency and do not provide a complete electrical specification table, engineers should confirm the authoritative datasheet, errata, and device qualification information for the exact ordering code. This page preserves supplied values exactly and identifies unavailable parameters rather than inferring them from related CPU12 devices.
This product data combines distributor identification, package information, sourcing context, and engineering caveats. It supports initial BOM research while explicitly separating verified facts from data needed for schematic design, firmware integration, PCB layout, and production qualification.
Drop-in-Alternativen für MC9SDG256BCFUR2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9SDG256BCFUR2 (gleiche Bauform und Footprint) – abweichend in Flash Organization, Package, Product Type, Flash Memory, Manufacturer.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernMC9SDG256BCFUR2 Grenzwerte & elektrische Eigenschaften
| Product Type | CPU12 microcontroller IC |
| Manufacturer Context | Freescale Semiconductor / NXP Semiconductors |
| CPU Architecture | 16-bit CPU12 |
| Operating Frequency | 50 MHz |
| Alternate Retrieved Frequency | 25 MHz |
| Flash Memory | 256 KB |
| Flash Organization | 256K x 8 |
| Package Type | 80-QFP |
| Package Dimensions | 14 x 14 mm |
| Lead Count | 80 leads |
MC9SDG256BCFUR2 14 x 14 mm Pinbelegungsleitfaden
Pinbelegung für MC9SDG256BCFUR2 (14 x 14 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9SDG256BCFUR2.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9SDG256BCFUR2 ist geeignet für 6 Anwendungs: Automotive Embedded Control, Industrial Motor-Control System, Communication Equipment, Sensor and Instrumentation Hub, Human-Machine Interface Controller, Battery-Powered Embedded Node.
Automotive Embedded Control
MC9SDG256BCFUR2 is a candidate for automotive embedded-control platforms because the verified data identifies a 16-bit CPU12 microcontroller with 256 KB of flash in an 80-QFP package. Its stored firmware can support control logic, diagnostics, and peripheral coordination when the exact electrical limits and automotive qualification are confirmed. The supplied records do not include an AEC-Q100 grade or temperature range, so those requirements must be verified before production use. Validate clocking, memory programming, reset behavior, and all external interfaces against the official datasheet.
Empfohlen
Industrial Motor-Control System
The 16-bit CPU12 architecture and 256 KB flash capacity make MC9SDG256BCFUR2 a possible fit for industrial motor-control logic, where deterministic firmware and local control functions are important. The verified data confirms processor width, memory, frequency listing, and package, but it does not confirm PWM channels, ADCs, timers, or motor-driver interfaces. Those peripherals must be checked in the manufacturer documentation before selecting it. A practical design would preserve deterministic timing paths, isolate analog and power sections, and verify thermal performance at the intended ambient temperature.
Empfohlen
Communication Equipment
MC9SDG256BCFUR2 may be used in communication equipment that needs a dedicated embedded controller for protocol handling, state management, and peripheral coordination. Its 256 KB flash allocation provides a documented basis for firmware storage, while the 80-QFP package offers a defined mechanical platform for PCB integration. The supplied data does not list CAN, SCI, SPI, USB, Ethernet, or other interfaces, so communication suitability cannot be assumed. Verify transceiver requirements, pin multiplexing, clock accuracy, and firmware-driver support against the authoritative device documentation.
Empfohlen
Sensor and Instrumentation Hub
The MCU can serve as the central controller in an instrumentation or sensor hub when the design requires local acquisition, filtering, status reporting, and configurable control behavior. The verified 16-bit CPU12 core and 256 KB flash are useful starting points for embedded software, but ADC resolution, sampling interfaces, sensor ports, and calibration storage are not supplied. Engineers should confirm analog and digital I/O counts and peripheral multiplexing before assigning sensors. A robust implementation should include defined reset behavior, brownout handling, watchdog provisions, and documented firmware update procedures.
Empfohlen
Human-Machine Interface Controller
MC9SDG256BCFUR2 is a plausible controller for an industrial human-machine interface because the verified data confirms a 16-bit CPU12 core, 256 KB flash, and compact 80-QFP package. Such a design could coordinate keypad or display events, indicators, alarms, and external control signals. The supplied data does not confirm display interfaces, USB, serial ports, or GPIO count, so the device should not be selected solely from the CPU and memory specifications. Validate electrical levels, ESD requirements, connector pinout, refresh timing, and enclosure temperature using the complete datasheet.
Empfohlen
Battery-Powered Embedded Node
MC9SDG256BCFUR2 can be evaluated for a battery-powered embedded node when local computation and firmware storage are more important than a fully specified low-power profile. The supplied data confirms 256 KB flash and a 16-bit CPU12 architecture, but does not provide sleep currents, active current, clock-tree details, or supply voltage. Power-budget decisions therefore require the manufacturer datasheet and a measured application profile. Engineers should compare wake-up behavior, peripheral leakage, regulator efficiency, and idle-mode support before committing to a design.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9SDG256BCFUR2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt |
|---|---|
| Package | 80-QFP (14 x 14 mm) |
| Brand | NXP Semiconductors / Freescale Semiconductor |
| CPU Architecture | 16-bit CPU12 |
| Operating Frequency | 50 MHz |
| Flash Memory | 256 KB |
| Flash Organization | 256K x 8 |
| Lead Count | 80 leads |
| Alternate Retrieved Frequency | 25 MHz |
Wichtigste Unterscheidungsmerkmale
- 16-bit CPU12 architecture (vs. No verified drop-in alternative)
- 256 KB flash storage (vs. No verified drop-in alternative)
- Compact 80-QFP mechanical format (vs. No verified drop-in alternative)
Designhinweise
Do not design the clock tree from distributor snippets alone. The principal retrieved DigiKey listing states 50 MHz, while another source states 25 MHz. Confirm the exact ordering code, maximum CPU frequency, oscillator requirements, reset pins, and timing specifications in the manufacturer datasheet. If the two documents are revised or if the device is being used in a legacy automotive design, record the selected datasheet revision and verify the programmed clock settings before release.
Treat the 80-QFP package as a controlled mechanical and electrical interface. Use the exact manufacturer land pattern, pin-1 orientation, lead pitch, solder-mask clearance, and paste volume; the supplied data confirms only the 14 x 14 mm package size and 80-lead count. Place decoupling, programming access, reset circuitry, and oscillator components according to the reference design or datasheet recommendations. Do not infer exposed-pad or thermal-pad details from a generic QFP library symbol.
Thermal design cannot be completed from the supplied snippets because supply voltage, operating temperature, package thermal resistance, and clock-dependent dissipation are absent. Before production, estimate junction temperature using the actual maximum clock, supply voltage, I/O loading, and ambient conditions, then compare the result with the manufacturer’s absolute maximum and operating limits. Validate the assembled board in its enclosure because copper area, airflow, and neighboring components can materially change junction temperature.
Compliance-Informationen
The supplied web results identify the device and sourcing pages but do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields require confirmation from the manufacturer or authorized supply documentation.