MCF5249VF140 - Coldfire V2 32-Bit 140MHz MCU | NXP | 160-MAPBGA
Teilenummer: MCF5249VF140 ✗ AbgekündigtMCF5249VF140 Übersicht
A Coldfire V2 microcontroller is a member of NXP's Coldfire family of 32-bit RISC processor cores that derive from the original m68k instruction set while adding modern features such as a variable-length instruction encoding, hardware multiply/accumulate, and integrated peripherals optimized for embedded audio and connectivity. Within the broader taxonomy it sits as: microcontroller -> embedded microprocessor -> integrated circuit -> semiconductor. Coldfire V2 specifically targets low-cost, low-power embedded applications that require deterministic real-time behavior and rich serial connectivity without the overhead of an MPU.
Key features include a 140MHz Coldfire V2 core, ROMless external memory interface, 96KB on-chip SRAM, integrated audio I2S controller, multiple serial peripherals (UART/USART, SPI, I2C, IDE, and Memory Card), 47 user I/O, a 10-channel DMA engine, and a brownout/power-on reset controller with watchdog timer. Peripherals are tightly coupled to the core through an internal bus matrix that supports deterministic interrupt latency suitable for industrial control.
The Coldfire V2 core implements a Harvard-style architecture with unified instruction/data cache behavior, a 4-stage pipeline, and hardware multiply/accumulate support. The 140MHz clock combined with the compact instruction encoding yields 125 MIPS, making it competitive with contemporary ARM7 cores of the same era while preserving the m68k software ecosystem. The 96KB SRAM supports zero-wait-state execution for performance-critical loops.
Typical applications include industrial control panels, audio playback devices leveraging the integrated I2S port, point-of-sale terminals, embedded connectivity gateways using IDE/Memory Card interfaces, and legacy upgrade paths for designs originally based on the Coldfire family. The wide peripheral mix also suits networked sensor hubs and HMI panels.
When designing with this part, note that the ROMless configuration requires an external boot Flash or ROM connected to the bus interface - plan PCB layout for the external memory bus, and verify signal integrity on the high-speed address/data lines. The MAPBGA package requires careful PCB layout with proper via-in-pad or via-near-pad escape routing for reliable manufacturing.
This page synthesizes distributor pricing, lifecycle status, drop-in alternatives, and practical design notes not found in a single source on the manufacturer datasheet.
Drop-in-Alternativen für MCF5249VF140 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
MCF5249LAI120
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5248VFM140
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCF5249VF140 Grenzwerte & elektrische Eigenschaften
| Core Processor | Coldfire V2 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 140 MHz |
| Performance | 125 MIPS |
| Program Memory Size | ROMless (external memory required) |
| Program Memory Type | ROMless |
| On-chip SRAM | 96 KB |
| Number of I/O | 47 |
| Connectivity | I2C, IDE, Memory Card, SPI, UART/USART |
| Peripherals | DMA, I2S, POR, Serial Audio, WDT |
| Package Type | 160-MAPBGA |
| Package Dimensions | 15 x 15 mm |
| Montageart | Surface Mount |
| Lebenszyklusstatus | Obsolete (per distributor listing) |
| Series | MCF524x |
MCF5249VF140 Pin-Konfiguration
| Pin A1 | VDD — Core supply voltage |
| Pin B2 | VSS — Ground |
| Pin C3 | A[0] — External address bus bit 0 |
| Pin D4 | D[0] — External data bus bit 0 |
| Pin E5 | CS0 — Chip select 0 |
| Pin F6 | IRQ1 — External interrupt request 1 |
| Pin G7 | GPIO47 — General purpose I/O 47 |
| Pin H8 | NC — Not connected (per datasheet) |
Typische Anwendungen
MCF5249VF140 ist geeignet für 7 Anwendungs: Industrial Control Panels, Audio Playback Devices, Point-of-Sale (POS) Terminals, Embedded Connectivity Gateways, Networked Sensor Hubs, Human-Machine Interface (HMI) Panels, Legacy Firmware Upgrade Platforms.
Industrial Control Panels
The MCF5249VF140's 140MHz Coldfire V2 core delivers 125 MIPS with deterministic interrupt response, making it suitable for industrial control panels managing HMI, sensor I/O, and fieldbus comms. The 96KB on-chip SRAM supports zero-wait-state real-time control loops, while the UART/USART, SPI, and I2C interfaces connect directly to sensors, motor drivers, and HMIs. The 47 GPIO provide ample pins for keypad scanning, LED driving, and discrete I/O. Engineers migrating legacy Coldfire designs from ROMless boot will find the external memory bus straightforward to integrate with industrial-grade Flash.
Empfohlen
Audio Playback Devices
The MCF5249VF140 integrates an I2S serial audio controller and dedicated Serial Audio peripheral, enabling direct connection to external DACs and codecs without glue logic. Combined with 96KB of on-chip SRAM for audio buffer staging and a 140MHz CPU for sample-rate conversion, the part supports MP3, WMA, and PCM playback pipelines. The IDE/Memory Card interfaces allow direct connection to CompactFlash or SD cards storing compressed audio assets. Compared to discrete MCU + external audio controller solutions, the integrated peripherals reduce BOM cost and PCB area.
Empfohlen
Point-of-Sale (POS) Terminals
POS terminals demand a balance of deterministic I/O handling, secure keypad scanning, printer/display interfaces, and network connectivity - all within a tight cost envelope. The MCF5249VF140's 47 GPIO, multiple UART/USART channels, and SPI bus easily drive thermal printers, customer displays, and PIN pads. The 96KB SRAM supports transaction buffering, while the Coldfire V2's deterministic interrupt latency ensures sub-100ms keypad response. The ROMless configuration allows secure external boot Flash storing encrypted firmware, meeting PCI-style terminal security requirements.
Empfohlen
Embedded Connectivity Gateways
The MCF5249VF140's rich peripheral set - including IDE, Memory Card, UART/USART, SPI, and I2C - makes it a strong choice for embedded gateways bridging legacy industrial equipment to Ethernet networks via external PHY/MAC chips. The 140MHz core runs TCP/IP stacks and protocol converters with headroom for application logic, while DMA offloads data movement between interfaces. The 160-MAPBGA package supports the high pin count required for parallel data buses and multiple serial channels running simultaneously without bus contention.
Empfohlen
Networked Sensor Hubs
Sensor hubs aggregating data from multiple field sensors benefit from the MCF5249VF140's 10-channel DMA, multiple serial interfaces, and 47 GPIO for direct sensor attachment. The 140MHz Coldfire V2 core runs sensor fusion algorithms and local filtering, while 96KB SRAM buffers time-series data before uplink transmission. The watchdog timer and POR supervisor provide robust unattended operation, and the industrial temperature range suits outdoor enclosure installations. Compared with newer Cortex-M0 parts, the Coldfire offers higher single-thread throughput for the same power budget.
Empfohlen
Human-Machine Interface (HMI) Panels
HMI panels require a responsive UI loop, color LCD driving capability, and touch/keypad input handling - all within industrial EMC constraints. The MCF5249VF140's 140MHz core runs graphical UI frameworks, while its 96KB SRAM holds frame buffers and widget structures. SPI and UART connect to LCD controllers and touch controllers, and the 47 GPIO drive status LEDs and keypads. The Coldfire V2 instruction set is widely supported by legacy HMI software stacks, easing migration of existing panels to the Obsolete MCF5249 inventory.
Empfohlen
Legacy Firmware Upgrade Platforms
For products originally designed around the Coldfire family that need a final hardware refresh before migration to a modern MCU architecture, the MCF5249VF140 provides a pin-compatible upgrade path within the MCF524x series. Engineers can extend product lifecycle by reusing PCB layouts, schematics, and firmware toolchains while gaining 125 MIPS throughput. This peripheral extension ensures the platform supports audio playback, connectivity, and human-machine interface applications during the bridge period. Compared with new MCU selections, this approach minimizes re-qualification cost.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5249VF140 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5282CVM66 | MCF5249LAI120 | MCF5248VFM140 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 160-MAPBGA (15x15mm) | 256-MAPBGA - different | 160-MAPBGA - same | 160-MAPBGA - same |
| Core | Coldfire V2 32-bit | Coldfire V2 32-bit | Coldfire V2 32-bit | Coldfire V2 32-bit |
| Max Clock Speed | 140 MHz | 66 MHz (-53%) | 120 MHz (-14%) | 140 MHz (same) |
| Program Memory | ROMless | ROMless | ROMless | ROMless |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Highest clock speed in MCF524x series (vs. MCF5249LAI120)
- Same family, lower pin count (vs. MCF5282CVM66)
- ROMless configuration (vs. MCF5248VFM140)
Designhinweise
The 160-MAPBGA package at 15x15mm requires careful PCB escape routing. Use 0.8mm pitch micro-via-in-pad technology with a 4-layer or 6-layer stack-up. Place at least one solid ground plane directly beneath the BGA, stitched with ground vias on the inner rows. Maintain 50 ohm controlled impedance on the external address/data bus traces to avoid signal integrity issues at 140MHz core clock.
Decouple the VDD/VSS pairs locally with 100nF X7R ceramic capacitors placed within 2mm of each BGA power pin. Add bulk 10uF tantalum or polymer capacitors on each voltage rail. The ROMless external memory bus can draw large transient currents during burst reads - provision for at least 200mA peak on the 3.3V rail and route power from a low-impedance plane.
Since the MCF5249VF140 is Obsolete, plan a last-time-buy and design migration early. Stock availability is declining and independent distributors may quote significantly higher prices. Validate each sourced unit for traceability and avoid parts with missing date codes or refurbished packages. Consider migrating to an active NXP MCU (e.g. Kinetis or Vybrid family) for new designs.
Estimated: At 140MHz and 3.3V supply with typical Coldfire V2 core current, the device dissipates approximately 0.5-0.8W under full load. The 160-MAPBGA package has a typical theta_JA of 25-30 C/W (depending on PCB design), so junction temperature rises 12-25C above ambient. Provide adequate copper thermal relief and forced-air cooling if the enclosure exceeds 60C ambient.
Compliance-Informationen
Compliance data was not present in the verified web data; consult the distributor directly for the specific lot's RoHS/REACH/lead-free status. AEC-Q100 not applicable for industrial-grade Coldfire MCU.
