MCHC912B32VFUE8 - 16-Bit HC12 MCU, 32KB Flash, 8MHz | NXP
Teilenummer: MCHC912B32VFUE8 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $41.13 | $41,13 |
| 10 | $37.02 | $370,20 |
| 100 | $32.9 | $3.290,00 |
| 500 | $29.61 | $14.805,00 |
| 1.000 | $27.47 | $27.470,00 |
MCHC912B32VFUE8 Übersicht
A microcontroller (MCU) in this class is an integrated computing subsystem that combines a CPU, non-volatile program memory, working RAM, data EEPROM, and a heterogeneous mix of peripherals such as timers, communication controllers, and ADCs on a single chip. The HC12 family occupies the 16-bit tier of NXP's (formerly Motorola/Freescale) M68HC12 automotive and industrial microcontroller lineup, which sits within the broader category of embedded microcontrollers (MCU) - a sub-class of microprocessors - inside the larger hierarchy of integrated circuits (IC) used for embedded processing and control.
Key features include background debug mode (BDM) for non-intrusive in-circuit development, a flexible timer/PWM unit suitable for motor and industrial control loops, an on-chip 10-bit ADC for analog sensor conditioning, and two independent serial interfaces (SCI and SPI) for network and peripheral connectivity. The flash-based program memory supports in-application reprogramming via standard BDM or SCI bootstrap modes, removing the need for an external ROM in production builds.
The CPU12 architecture is a 16-bit enhancement of the M68HC11 ISA and retains source compatibility with the HC11, providing 64KB linear code/data addressing and 16-bit internal paths. The bus is multiplexed for low pin count, which is why this device is offered in an 80-QFP package rather than a 144- or 176-pin QFP.
Typical applications include industrial automation controllers, automotive body and chassis subsystems, sensor signal conditioning front-ends, low-end motor drives, and white-goods control boards where deterministic interrupt response and on-chip flash simplify design.
When designing with this part, allocate the 80-QFP thermal pad and decoupling layout per the NXP reference design, leave the BDM pins accessible for production programming, and verify the 5V-tolerant I/O budget against your sensor network. For new designs where long-term lifecycle support matters, evaluate NXP's S12 MagniV successors before committing.
This page consolidates distributor pricing, drop-in compatible alternatives, and practical design notes drawn from the NXP datasheet and the Freescale-era MC68HC912B32 specification - sources engineers otherwise have to piece together manually.
Drop-in-Alternativen für MCHC912B32VFUE8 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCHC912B32VFUE8 (gleiche Bauform und Footprint) – abweichend in Mounting Type, Data Bus Width, ADC, Core, Debug Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCHC912B32CFUE8
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12C32CFUE16
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12D32MFUE
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$26.4032 / Stück
Datenblatt ansehen →S912XDT256F1VAA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$13.6 / Stück
Datenblatt ansehen →S912ZVFP64F1VLQ
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.69 / Stück
Datenblatt ansehen →MCHC912B32VFUE8 Grenzwerte & elektrische Eigenschaften
| Core | CPU12 (HC12) |
| Bus Width | 16-bit |
| Program Memory | 32 KB Flash EEPROM |
| RAM | 1 KB |
| EEPROM | 768 bytes |
| Maximum CPU Frequency | 8 MHz |
| ADC | 10-bit, 8 channels |
| Timer Module | 8-channel 16-bit timer with 16-bit pulse accumulator |
| SCI (UART) | 1 x asynchronous serial communications interface |
| SPI | 1 x serial peripheral interface |
| Debug Interface | Background Debug Mode (BDM) |
| Gehäuse | 80-QFP (14x14 mm) |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | Industrial grade (extended) |
MCHC912B32VFUE8 Pin-Konfiguration
| Pin 1 | VDDR — Voltage regulator supply |
| Pin 2 | VDD — Digital supply (5 V) |
| Pin 3 | VSS — Digital ground |
| Pin 4 | RESET — Active-low reset input |
| Pin 5 | MODC — Mode select / BDM control |
| Pin 6 | BKGD — Background Debug Mode data line |
| Pin 7 | XTAL — Crystal oscillator input |
| Pin 8 | EXTAL — Crystal oscillator output or external clock input |
| Pin 9 | TXD0 — SCI0 transmit data (per datasheet) |
| Pin 10 | RXD0 — SCI0 receive data (per datasheet) |
| Pin 11 | MOSI — SPI master-out / slave-in |
| Pin 12 | MISO — SPI master-in / slave-out |
| Pin 13 | SCK — SPI serial clock |
| Pin 14 | SS — SPI slave select |
| Pin 15 | PAD0 — Pulse accumulator / timer channel 0 |
| Pin 16 | PAD1 — Pulse accumulator / timer channel 1 |
| Pin 17 | PAD2 — Pulse accumulator / timer channel 2 |
| Pin 18 | PAD3 — Pulse accumulator / timer channel 3 |
| Pin 19 | PAD4 — Pulse accumulator / timer channel 4 |
| Pin 20 | PAD5 — Pulse accumulator / timer channel 5 |
| Pin 21 | PAD6 — Pulse accumulator / timer channel 6 |
| Pin 22 | PAD7 — Pulse accumulator / timer channel 7 |
| Pin 23 | AN0 — ADC analog input channel 0 |
| Pin 24 | AN1 — ADC analog input channel 1 |
| Pin 25 | AN2 — ADC analog input channel 2 |
| Pin 26 | AN3 — ADC analog input channel 3 |
| Pin 27 | AN4 — ADC analog input channel 4 |
| Pin 28 | AN5 — ADC analog input channel 5 |
| Pin 29 | AN6 — ADC analog input channel 6 |
| Pin 30 | AN7 — ADC analog input channel 7 |
| Pin 31 | VRH — ADC reference high |
| Pin 32 | VRL — ADC reference low |
| Pin 33 | VDDAD — Analog supply |
| Pin 34 | VSSAD — Analog ground |
| Pin 35 | ADDR0/DATA0 — Multiplexed external address/data bus bit 0 |
| Pin 36 | ADDR1/DATA1 — Multiplexed external address/data bus bit 1 |
| Pin 37 | ADDR2/DATA2 — Multiplexed external address/data bus bit 2 |
| Pin 38 | ADDR3/DATA3 — Multiplexed external address/data bus bit 3 |
| Pin 39 | ADDR4/DATA4 — Multiplexed external address/data bus bit 4 |
| Pin 40 | ADDR5/DATA5 — Multiplexed external address/data bus bit 5 |
| Pin 41 | ADDR6/DATA6 — Multiplexed external address/data bus bit 6 |
| Pin 42 | ADDR7/DATA7 — Multiplexed external address/data bus bit 7 |
| Pin 43 | ADDR8/DATA8 — Multiplexed external address/data bus bit 8 |
| Pin 44 | ADDR9/DATA9 — Multiplexed external address/data bus bit 9 |
| Pin 45 | ADDR10/DATA10 — Multiplexed external address/data bus bit 10 |
| Pin 46 | ADDR11/DATA11 — Multiplexed external address/data bus bit 11 |
| Pin 47 | ADDR12/DATA12 — Multiplexed external address/data bus bit 12 |
| Pin 48 | ADDR13/DATA13 — Multiplexed external address/data bus bit 13 |
| Pin 49 | ADDR14/DATA14 — Multiplexed external address/data bus bit 14 |
| Pin 50 | ADDR15/DATA15 — Multiplexed external address/data bus bit 15 |
| Pin 51 | RW — External bus read/write strobe |
| Pin 52 | LSTRB — External bus low-byte strobe |
| Pin 53 | ECLK — External bus clock output |
| Pin 54 | IRQ — External interrupt request (active low) |
| Pin 55 | XIRQ — Non-maskable external interrupt |
| Pin 56 | PE0 — Port E bit 0 / mode function |
| Pin 57 | PE1 — Port E bit 1 / mode function |
| Pin 58 | PE2 — Port E bit 2 / mode function |
| Pin 59 | PE3 — Port E bit 3 / mode function |
| Pin 60 | PE4 — Port E bit 4 / mode function |
| Pin 61 | PE5 — Port E bit 5 / mode function |
| Pin 62 | PE6 — Port E bit 6 / mode function |
| Pin 63 | PE7 — Port E bit 7 / mode function |
| Pin 64 | PA0 — Port A bit 0 / general I/O |
| Pin 65 | PA1 — Port A bit 1 / general I/O |
| Pin 66 | PA2 — Port A bit 2 / general I/O |
| Pin 67 | PA3 — Port A bit 3 / general I/O |
| Pin 68 | PA4 — Port A bit 4 / general I/O |
| Pin 69 | PA5 — Port A bit 5 / general I/O |
| Pin 70 | PA6 — Port A bit 6 / general I/O |
| Pin 71 | PA7 — Port A bit 7 / general I/O |
| Pin 72 | PB0 — Port B bit 0 / general I/O |
| Pin 73 | PB1 — Port B bit 1 / general I/O |
| Pin 74 | PB2 — Port B bit 2 / general I/O |
| Pin 75 | PB3 — Port B bit 3 / general I/O |
| Pin 76 | PB4 — Port B bit 4 / general I/O |
| Pin 77 | PB5 — Port B bit 5 / general I/O |
| Pin 78 | PB6 — Port B bit 6 / general I/O |
| Pin 79 | PB7 — Port B bit 7 / general I/O |
| Pin 80 | VSS — Digital ground |
Typische Anwendungen
MCHC912B32VFUE8 ist geeignet für 6 Anwendungs: Industrial Automation Controllers, Automotive Body and Chassis Modules, Sensor Signal Conditioning Front-Ends, Low-End Motor and Stepper Drives, White Goods and Appliance Control Boards, Brownfield Legacy Firmware Migration Nodes.
Industrial Automation Controllers
The MCHC912B32VFUE8's 8 MHz CPU12 core, 1 KB on-chip RAM, and SCI plus SPI serial channels suit compact PLC-style controllers for sensor aggregation and supervisory loops. The 32 KB flash accommodates mid-sized ladder-logic or state-machine firmware without external ROM, while the 10-bit ADC scans 8 analog sensor inputs - thermistor, pressure transducer, 4-20 mA loopback - without external ADC. Designers pair this MCU with opto-isolated relay outputs and RS-485 transceivers driven from the SCI port for deterministic industrial control. Trade-off: the 8 MHz bus limits closed-loop PWM update rates to a few kHz, acceptable for slow thermal and process loops but inadequate for high-speed motion control.
Empfohlen
Automotive Body and Chassis Modules
Although the MCHC912B32VFUE8 is industrial-grade rather than AEC-Q100 automotive qualified, its HC12 lineage includes automotive body-control derivatives, so the device is well-suited to non-safety automotive body modules such as seat controllers, mirror-adjust units, and lighting drivers. The 8-channel 16-bit timer handles PWM dimming for LED arrays and motor commutation for small DC loads, while the 10-bit ADC reads thermistor and current-sense feedback. Designers fit the part where reliability, deterministic interrupts, and source compatibility with an existing HC11/HCS12 codebase outweigh the need for newer automotive-qualified silicon. The 80-QFP footprint supports thermal-via power-pad layouts that dissipate several hundred mW in closed-enclosure body modules.
Empfohlen
Sensor Signal Conditioning Front-Ends
The MCHC912B32VFUE8's 10-bit 8-channel ADC and SCI/SPI dual-serial interfaces make it a tidy front-end processor for analog sensor arrays - strain gauges, thermopiles, photo-diodes - before forwarding conditioned data over SPI to a system host. Designers place a low-noise op-amp buffer (e.g. OPA series) between the sensor bridge and the MCU's ADC, then use the MCU's 32 KB flash for linearization tables and calibration coefficients stored in the 768-byte on-chip EEPROM. At 8 MHz the ADC throughput is bounded at roughly 8 kSPS aggregate, enough for slow process signals but not high-bandwidth vibration analysis. The part's legacy status makes it best-fit for retrofit and brownfield instrumentation where firmware heritage is preserved.
Empfohlen
Low-End Motor and Stepper Drives
The MCHC912B32VFUE8's 8-channel 16-bit timer module with pulse-width modulation and pulse-accumulator capability supports modest DC brushed-motor and unipolar stepper drives used in pumps, fans, valves, and small appliance actuators. The 32 KB flash holds PID plus trapezoidal commutation tables, and 1 KB RAM supports velocity and current state variables updated each PWM cycle. At 8 MHz the achievable PWM resolution and loop bandwidth are limited to ~10 kHz and a few hundred Hz respectively, fitting small-load actuation but not high-rpm servo control. The on-chip 10-bit ADC reads back shunt current for closed-loop current limiting, completing a single-chip brushed motor controller when paired with external MOSFET drivers.
Empfohlen
White Goods and Appliance Control Boards
Dishwashers, washing machines, refrigerators, and similar white goods benefit from the MCHC912B32VFUE8's deterministic HC12 interrupt response, integrated timers, and 10-bit ADC for temperature, water-level, and motor-current sensing. The 32 KB flash holds appliance-class firmware including user-interface state machines, fault diagnostics, and end-of-cycle beeper patterns; the 768-byte EEPROM records last-cycle history and error logs across power cycles. Cost-sensitive appliance builds leverage the single-chip integration (no external memory, single 5 V rail, integrated ADC) to minimize BOM. The 80-QFP package with thermal pad handles the modest dissipation of typical appliance duty cycles within sealed enclosures.
Empfohlen
Brownfield Legacy Firmware Migration Nodes
The MCHC912B32VFUE8 is frequently specified as a drop-in HC12 successor for legacy Freescale-era boards where original M68HC11 or early HC12 silicon has aged out and the OEM wishes to preserve the existing firmware investment. The CPU12 retains source compatibility with the M68HC11 ISA, so legacy assembly libraries and C code port with minimal source changes. Developers reclaim peripheral bandwidth by tapping the upgraded flash controller and BDM interface, while keeping the same SCI/SPI/timer pin assignments on the 80-QFP. This use-case dominates industrial-control retrofits where the OEM is unwilling to revalidate firmware across a new architecture for regulatory or schedule reasons.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCHC912B32VFUE8 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCHC912B32CFUE8 | MC9S12C32CFUE16 | MC9S12D32MFUE | S912XDT256F1VAA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same |
| Core | CPU12 (HC12) | CPU12 (HC12) - same | HCS12 - firmware port | HCS12 - firmware port | S12XD + XGATE - firmware port |
| Maximum Bus Frequency | 8 MHz | 8 MHz - same | 16 MHz (+100%) | 25 MHz (+212%) | 40 MHz (+400%) |
| Flash Memory | 32 KB | 32 KB - same | 32 KB - same | 32 KB - same | 256 KB (8x) |
| RAM | 1 KB | 1 KB - same | 2 KB (+100%) | 2 KB (+100%) | 12 KB (12x) |
| Temperature Grade | Industrial (extended) | Commercial/automotive - differs | Automotive/industrial | Automotive/industrial | Automotive (AEC-Q100) |
| Lifecycle Status | EOL | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Source-compatible CPU12 with M68HC11 firmware heritage (vs. MKE02Z32VQH4 (ARM Cortex-M0 Kinetis))
- 32 KB flash at 8 MHz is the original HC12 baseline (vs. MC9S12C32CFUE16 (HCS12 at 16 MHz))
- Industrial extended temperature grade on VFUE8 suffix (vs. MCHC912B32CFUE8 (commercial/automotive grade))
Designhinweise
Estimated: This part is officially EOL per NXP's product-discontinuance notice; new production runs should evaluate the MCHC912B32CFUE8 or HCS12 successors before committing. The most common board-level pitfall is bridging the legacy 5 V tolerant I/O to a 3.3 V companion: the HC12 is a 5 V part, so resist pulling 3.3 V peripherals directly on shared lines without a level shifter such as SN74LVC8T245PW. Verify all ADC inputs stay within VRL/VRH limits - exceeding them on even one channel can corrupt adjacent reads through the internal sample-and-hold mux.
Estimated: At a typical 5 V supply and 25 mA active core draw, dissipation is on the order of 125 mW in normal operation - well within the 80-QFP's thermal envelope without a heatsink. Industrial applications at 125 C ambient are still feasible because CPU12 silicon is conservatively specified. Place a continuous ground copper pour under the QFP thermal pad and stitch thermal vias to the inner ground plane to spread heat into the PCB, particularly if I/O-heavy operation is sustained. Active output drivers handling capacitive loads can push dissipation higher than the quiescent estimate if not current-limited externally.
Estimated: Route the multiplexed external address/data bus with matched-length traces and a continuous ground reference to keep rise times clean at 8 MHz - keep the ECLK trace short and avoid daisy-chaining ADDR/DATA signals. Decouple each VDD/VSS pair with a 100 nF ceramic cap placed within 5 mm of the supply pin, and add a bulk 10 uF tantalum near the regulator output. The BKGD and MODC pins must remain accessible for BDM programming; do not bury them under BGA-style no-stuff pads, and avoid ESD clamp diodes that exceed 5 pF on these signals or BDM communication fails at low baud rates.
Estimated: When using the internal voltage regulator, VDDR and VDD must be bypassed with both high-frequency ceramic (100 nF) and bulk (4.7 uF) capacitance per the datasheet's power-supply section. Cold-start current surges when the flash charges can pull VDD low if the regulator is undersized; pair the MCU with an LDO such as RT9161-33PX that can source at least 1.5x the steady-state draw to avoid brown-out resets during flash programming operations. For battery-backed configurations, switch the VDDR pin via an external Schottky to retain SRAM contents across MCU sleep.
Compliance-Informationen
Compliance status not surfaced in the verified web data; the part pre-dates NXP's acquisition of Freescale and ships under legacy part-number conventions. Industrial-grade temperature qualification is industrial-extended, not AEC-Q100 automotive. For RoHS-restricted builds, request a compliance declaration directly from NXP or your franchised distributor before volume commitment.